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ECE 3110: Introduction to Digital Systems. Introduction (Contd.). Previous class Summary. Digital devices Digital vs. analog Why digital. Digital Logic. Binary system -- 0 & 1, LOW & HIGH, negated and asserted. Basic building blocks -- AND, OR, NOT. Electronic aspect of digital design. - PowerPoint PPT Presentation
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ECE 3110: Introduction to Digital Systems
Introduction (Contd.)
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Previous class Summary
Digital devicesDigital vs. analogWhy digital
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Digital Logic
Binary system -- 0 & 1, LOW & HIGH, negated and asserted.
Basic building blocks -- AND, OR, NOT
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Electronic aspect of digital design
Digital abstraction
Range
Noise margin
Invalid range
Specifications
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Software aspect of digital design
Digital design need not involve any software tools.
But: modern design, software tools are essential. Examples:
Schematic entry, HDLs (platform compilers, simulators, synthesis tools), simulators, test benches, timing analyzers and verifiers, word processors, high-level languages, CAD
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Integrated Circuits (IC)
A collection of one or more gates fabricated on a single silicon chip. Wafer, die
Small-scale integration (SSI): 1-20 DIP: dual in-line-pin package Pin diagram, pinout
MSI: 20-200 gates LSI: 200-200,000
VLSI: >100,000, 50million (1999)
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DIP
pinout
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Programmable Logic Device (PLD)
ICs which Logic function can be programmed after manufacturing.
2-level AND-OR gates using user-programmable connections PLAs: programmable Logic Arrarys. PALs: programmable array logic devices Programmable logic devices (PLDs)
CPLD: complex PLD FPGA: Field-Programmable Gate Array
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CPLD vs FPGA
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Application-Specific ICs (ASIC)
Semi-custom IC: chips designed for a particular, limited product/application
Reducing chip count, size, power consumption Higher performance. NRE: nonrecurring engineering cost
Standard cells: library Gate array: an IC with internal structure as an array of
gates, unspecified interconnection
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Printed-Circuit Board
PCB or PWB (printed-wiring board)Mount ICs so that an IC can connect to
other ICs in a system.SMT: Surface-mount technologyMCM: multi-chip modules: high speed and
density.
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Summary
Electronics aspects of digital designIntegrated Circuits (wafer, die, SSI, MSI, LSI, VLSI)PLDs: PLAs, PALs, CPLD, FPGAASIC
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Next…
Number systems
Reading: Wakerly chapter 2