DS90UH949-Q1EVM User's Guide

DS90Ux949EVM User's Guide

User's Guide

Literature Number: SNLU169December 2014

Contents

1 DS90Ux949EVM User's Guide ................................................................................................ 51.1 General Description ......................................................................................................... 51.2 Features....................................................................................................................... 51.3 System Requirements....................................................................................................... 61.4 Contents of the Demo Evaluation Kit ..................................................................................... 61.5 Applications Diagram........................................................................................................ 61.6 Typical Configuration ........................................................................................................ 71.7 Quick Start Guide ............................................................................................................ 81.8 Default Jumper Settings .................................................................................................... 91.9 Default Switch Settings ..................................................................................................... 91.10 Demo Board Connections................................................................................................. 101.11 ALP Software Setup ....................................................................................................... 13

1.11.1 System Requirements ........................................................................................... 131.11.2 Download Contents .............................................................................................. 131.11.3 Installation of the ALP Software ................................................................................ 131.11.4 Installation of the Device Profiles .............................................................................. 131.11.5 Startup - Software Description.................................................................................. 131.11.6 Information Tab................................................................................................... 151.11.7 HDMI Tab ......................................................................................................... 161.11.8 Pattern Generator Tab........................................................................................... 171.11.9 Registers Tab ..................................................................................................... 181.11.10 Registers Tab - Address 0x00 selected ..................................................................... 191.11.11 Registers Tab - Address 0x00 expanded.................................................................... 201.11.12 Scripting Tab .................................................................................................... 21

1.12 Troubleshooting ALP Software ........................................................................................... 221.12.1 ALP Loads the Incorrect Profile ................................................................................ 221.12.2 ALP does not detect the EVM .................................................................................. 24

1.13 Typical Connection and Test Equipment................................................................................ 261.14 Equipment References .................................................................................................... 271.15 Cable References .......................................................................................................... 27

2 Bill of Materials .................................................................................................................. 28A EVM PCB Schematics ......................................................................................................... 33B Board Layout ..................................................................................................................... 43Revision History.......................................................................................................................... 48

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List of Figures1-1. Applications Diagram........................................................................................................ 61-2. Typical Configuration ........................................................................................................ 71-3. Interfacing to the EVM ...................................................................................................... 81-4. Launching ALP ............................................................................................................. 141-5. Initial ALP Screen .......................................................................................................... 141-6. Follow-up Screen........................................................................................................... 151-7. ALP Information Tab ....................................................................................................... 151-8. ALP HDMI Tab.............................................................................................................. 161-9. ALP Pattern Generator Tab............................................................................................... 171-10. ALP Registers Tab ......................................................................................................... 181-11. ALP Device ID Selected................................................................................................... 191-12. ALP Device ID Expanded ................................................................................................. 201-13. ALP Scripting Tab .......................................................................................................... 211-14. USB2ANY Setup ........................................................................................................... 221-15. Remove Incorrect Profile .................................................................................................. 221-16. Add Correct Profile ......................................................................................................... 231-17. Finish Setup................................................................................................................. 231-18. ALP No Devices Error ..................................................................................................... 241-19. Windows 7, ALP USB Driver ............................................................................................. 241-20. ALP in Demo Mode ........................................................................................................ 251-21. ALP Preferences Menu.................................................................................................... 251-22. Typical Test Setup for Video Application................................................................................ 261-23. Typical Test Setup for Evaluation ........................................................................................ 26

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List of Tables1-1. Default Board Jumper Settings ............................................................................................ 91-2. Default Board Switch Settings ............................................................................................. 91-3. Power Supply ............................................................................................................... 101-4. FPD-Link III Output Signals P1........................................................................................... 101-5. Alternative FPD-Link III Output Signals ................................................................................. 101-6. HDMI Input Signals ........................................................................................................ 101-7. USB2ANY Connector ...................................................................................................... 101-8. I2C/CCI Interface Header J20 ............................................................................................ 101-9. GPIO/Audio Interface ...................................................................................................... 111-10. SPI/D_GPIO Interface ..................................................................................................... 111-11. MODE_SEL[1:0] Settings ................................................................................................. 111-12. Configuration Select (MODE_SEL0) -- SW-DIP8 - S2 ................................................................ 111-13. Configuration Select (MODE_SEL1) - SW-DIP8 - S6 ................................................................. 121-14. IDx SW-DIP8 - S3 ......................................................................................................... 122-1. Bill of Materials ............................................................................................................. 28

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Chapter 1SNLU169–December 2014

DS90Ux949EVM User's Guide

1.1 General DescriptionThe DS90Ux949-Q1EVM (Evaluation Module) converts HDMI to FPD-Link III. This kit will demonstrate thefunctionality and operation of the DS90Ux949-Q1. The DS90Ux949-Q1 is an HDMI to FPD-Link IIISerializer which, in conjunction with the DS90Ux940-Q1/DS90Ux948-Q1 Deserializers, takes the datafrom HDMI serial stream and translates it into either single- or dual-lane FPD-Link III interface. TheDS90Ux949-Q1 supports video resolutions up to WUXGA and 1080p60 with 24-bit color depth.

The FPD-Link III interface supports video and audio data transmission and full duplex control, includingI2C and SPI communication, over the same differential link. In backward compatible mode, the devicesupports up to WXGA and 720p resolutions with 24-bit color depth over a single differential link.

The device supports up to 7.1 audio channels. Audio data received from the HDMI stream is encrypted,serialized, and sent out on the FPD-Link III stream to a compatible deserializer. Up to 8-channel I2Sinterface with maximum bit rate of 192 kHz.

The demo board is not intended for EMI testing. The demo board was designed for easy accessibility todevice pins with tap points for monitoring or applying signals, additional pads for termination, and multipleconnector options.

1.2 Features• Supports Pixel Clock Frequency up to 170 MHz for WUXGA (1920x1200) and 1080p60 resolutions

with 24-bit Color Depth• HDMI Receiver to accept HDMI as input• Dual FPD-Link III output interface

– Single Channel: Up to 96 MHz Pixel Clock– Dual Channel: Up to 170 MHz Pixel Clock

• Up to 15 meters over Single-Ended Coaxial or Differential Shielded Twisted-Pair (STP) cable• Backwards Compatible to DS90Ux926Q-Q1, DS90Ux928-Q1, DS90Ux940-Q1, and DS90Ux948-Q1

FPD-Link III Deserializers• @Speed BIST• Supports 7.1 multiple I2S (4 data) channels• Single +12V power supply for EVM• 1.8V LVCMOS I/O interface• 1.8V or 3.3V compatible LVCMOS I2C interface• Automotive grade product: AEC-Q100 Grade 2 qualified

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FPD-Link III2 Lane

VDDIO(1.8V)

IDx

DOUT0+

DOUT0-

1.1V

IN_CLK-/+

HDMI

HPDDDCCEC

DOUT1+

DOUT1-

RIN0+

RIN0-

RIN1+

RIN1-

CLK1+/-

CLK2+/-

FPD-Link (Open LDI)

D0+/-

D1+/-

D2+/-

D3+/-

D4+/-

D5+/-

D6+/-

D7+/-

DS90Ux949-Q1

SerializerDS90Ux948-Q1

Deserializer

IDx

D_GPIO (SPI)

D_GPIO(SPI)

LVDS Display1080p60

or Graphic Processor

Mobile Device

or Graphics

Processor

IN_D0-/+

IN_D1-/+

IN_D2-/+

I2C

1.8V

VDDIO(3.3V / 1.8V)1.2V3.3V

I2C

System Requirements www.ti.com

1.3 System RequirementsIn order to demonstrate, the following is required:1. FPD-Link III compatible Deserializer

(a) DS90Ux940-Q1, DS90Ux948-Q1 up to 1080p60(b) DS90Ux926Q-Q1, DS90Ux928-Q1 up to 720p60

2. HDMI source3. Optional I2C controller4. Power supply for 12V @ 1A (required)

1.4 Contents of the Demo Evaluation Kit1. One EVM board with the DS90Ux949-Q1

1.5 Applications Diagram

Figure 1-1. Applications Diagram

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DS90Ux949

FPD-Link III Deserializer

Video Processor

Video Processor Board

Cluster, Head Unit

Dual FPD-LINK III

Display

(Video Data + Ctrl + PCLK)

(I2C)

(I2C)

(OpenLDI)

www.ti.com Typical Configuration

1.6 Typical Configuration

Figure 1-2. Typical Configuration

Figure 1-1 and Figure 1-2 illustrate the use of the chipset in a display application.



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DDCVDD_DDC

DDC_SCL

DDC_SDA

GND

APPLY

EXTERNAL

12V HERE

GND

1.8V

GND

3.3V

GND

1.1V

I2C extVDD_I2C

SCL

SDA

GND

APPLY

HDMI

INPUT

HERE

DOUT0+

DOUT0-

*DOUT1+

*DOUT1-

PDB

MomentaryPDB=L

PDB=H

VD

D_

DD

CV

TE

RM

c

I2C

1.8

V

1.8

V

3.3

VR

x_

5V

3.3

V

3.3

V

IDx

0x

20

0x

1C

0x

18

MODE_SEL1MODE_SEL0

KvoÇ�í��Á]��Z�^KE_��]u� KvoÇ�í��Á]��Z�^KE_��]u�KvoÇ�í��Á]��Z�^KE_��]u�

1

MSP430

(USB2ANY)

Connect to PC

for I2C register access

* Not populated

on 929 EVM

DS90Ux949

12

V

(5)

(4)

(3)

(2)

*

*

0x

24

0x

2C

0x

28

0x

34

0x

30

2345678 12345678

(1)

Quick Start Guide www.ti.com

1.7 Quick Start Guide1. Configure switches S2, S3, and S6 to set device’s operating modes

• S2: MODE_SEL0 = 1 (default factory setting)• S3: IDx = 0x18 (default factory setting)• S6: MODE_SEL1 = 1 (default factory setting)

2. Connect P1 (DOUT[1:0]+/-) to compatible Deserializer e.g. DS90Ux940-Q1/DS90Ux948-Q1 using STPcable (default)

3. Connect J36 to 12V.(a) Optional power options available (see Table 1-3)

4. Plug in HDMI source5. Connect J29 with miniUSB (5-pin_ to USB A (4-pin) cable to PC USB port

For details of pin-names and pin-functions, please refer to the DS90Ux949Q datasheet.

Figure 1-3. Interfacing to the EVM



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www.ti.com Default Jumper Settings

1.8 Default Jumper SettingsEnsure that the board has the default board jumper settings:

Table 1-1. Default Board Jumper Settings

Jumper Jumper SettingsJ3 Connect 2 and 3J14 Connect 2 and 3J17 Connect 1 and 2J18 Connect 2 and 3J22 Connect 1 and 2J33 Connect 1 and 2J37 Connect 2 and 3J40 Connect 2 and 3J41 Connect 2 and 3

1.9 Default Switch SettingsEnsure that the board has the default board switch settings:

Table 1-2. Default Board Switch Settings

Switch Switch SettingsS1 1 to 3 ONS2 1 ON, 2 to 8 OFFS3 1 ON, 2 to 8 OFFS5 All OFFS6 1 ON, 2 to 8 OFF



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Demo Board Connections www.ti.com

1.10 Demo Board Connections

Table 1-3. Power Supply

Designator Signal Description12V ±5% Main Power, Single +12V power connector that suppliesJ36 +12V power to the entire board.

J35.1 (Optional) +1.1V 1.1V ±5%, Alternative to Main Power. If used, remove R195.J39.1 (Optional) +1.8V 1.8V ±5%, Alternative to Main Power. If used, remove R204.J42.1 (Optional) +3.3V 3.3V ±5%, Alternative to Main Power. If used, remove R207.J33.2 (Optional) +5V 5V ±5%, Alternative to Main Power.

Table 1-4. FPD-Link III Output Signals P1

Designator Port SignalP1.1 DOUT0-

FPD-Link III Port 0P1.3 DOUT0+P1.2 DOUT1-

FPD-Link III Port 1P1.4 DOUT1+

Table 1-5. Alternative FPD-Link III Output Signals

Designator Port SignalJ11 DOUT0-

FPD-Link III Port 0J9 DOUT0+J13 DOUT1-

FPD-Link III Port 1J12 DOUT1+

Table 1-6. HDMI Input Signals

Designator Signal DescriptionJ10.12 IN_CLK- HDMI TMDS clock inputJ10.10 IN_CLK+J10.9 IN_D0- HDMI TMDS data0 inputJ10.7 IN_D0+J10.6 IN_D1- HDMI TMDS data1 inputJ10.4 IN_D1+J10.3 IN_D2- HDMI TMDS data2 inputJ10.1 IN_D2+

Table 1-7. USB2ANY Connector

Designator DescriptionJ29 mini USB 5 pin

Table 1-8. I2C/CCI Interface Header J20

Designator SignalJ20.1 VDDI2CJ20.2 SCLJ20.3 SDAJ20.4 GND



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www.ti.com Demo Board Connections

Table 1-9. GPIO/Audio Interface

Designator Signal DescriptionJ21.18 SDIN/GPIO0 Aux I2S Data Input / Remote or Local I/OJ21.20 SWC/GPIO1 Aux I2S Word Clock Output / Remote or Local I/OJ21.2 I2S_DC/GPIO2 I2S Data Input / Remote or Local I/OJ21.4 I2S_DD/GPIO3 I2S Data Input / Remote or Local I/OJ21.6 VDDIO GPIO Voltage Level 1.8V

I2S_DB/GPIO5_REJ21.8 I2S Data Input / Local only I/OGI2S_DA/GPIO6_REJ21.10 I2S Data Input / Local only I/OGI2S_WC/GPIO7_REJ21.12 I2S Word Clock Input / Local only I/OGI2S_CLK/GPIO8_REJ21.14 I2S Clock Input / Local only I/OG

J21.24 MCLK I2S System Clock Output

Table 1-10. SPI/D_GPIO Interface

Designator Signal DescriptionJ21.6 VDDIO GPIO Voltage Level 1.8VJ21.32 D_GPIO3/SS I/O in Dual FPD-Link III mode / Slave SelectJ21.30 D_GPIO2/SCLK I/O in Dual FPD-Link III mode / Serial ClockJ21.28 D_GPIO1/MISO I/O in Dual FPD-Link III mode / Master In, Slave OutJ21.26 D_GPIO0/MOSI I/O in Dual FPD-Link III mode / Master Out, Slave In

Configuration of the device may be done via the MODE_SEL[1:0]. These modes are latched into registerlocation during power-up:

Table 1-11. MODE_SEL[1:0] Settings

Mode Setting FunctionLook for remote EDID, if none found, use internal SRAM EDID. Can be

0 overridden from register. Remote EDID address may be overridden fromEDID_SEL: Display ID Select default 0xA0.

1 Use external local EDID.0 Disable.

AUTO-SS: Auto Sleep-State1 Enable.0 HDMI audio.AUX_I2S: AUX Audio

Channel 1 HDMI + AUX audio channel.0 Internal HDCP/HDMI control.EXT_CTL: External Controller

Override 1 External HDCP/HDMI control from I2C interface pins.0 Enable FPD-Link III for twisted pair cabling.

COAX: Cable Type1 Enable FPD-Link III for coaxial cabling.0 Use internal SRAM EDID.REM_EDID_LOAD: Remote

EDID Load 1 If available, remote EDID is copied into internal SRAM EDID.

Table 1-12. Configuration Select (MODE_SEL0) -- SW-DIP8 - S2 (1)

MODE # EDID_SEL AUTO_SS AUX_I2S1 0 0 02 0 0 1

(1) Only set one high.



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Table 1-12. Configuration Select (MODE_SEL0) -- SW-DIP8 - S2 (1) (continued)MODE # EDID_SEL AUTO_SS AUX_I2S

3 0 1 04 0 1 15 1 0 06 1 0 17 1 1 08 1 1 1

Table 1-13. Configuration Select (MODE_SEL1) - SW-DIP8 - S6 (1)

MODE # EXT_CTL COAX REM_EDID_LOAD1 0 0 02 0 0 13 0 1 04 0 1 15 1 0 06 1 0 17 1 1 08 1 1 1


The strapped values can be viewed and/or modified in the following locations:• EDID_SEL : Latched into BRIDGE_CTL[0], EDID_DISABLE (0x4F[0]).• AUTO_SS : Latched into Register 0x1[7], SOFT_SLEEP.• AUX_I2S : Latched into BRIDGE_CFG[1], AUDIO_MODE[1] (0x54[1]).• EXT_CTL: Latched into BRIDGE_CFG[7], EXT_CONTROL (0x54[7]).• COAX : Latched into DUAL_CTL1[7], COAX_MODE (0x5B[7]).• REM_EDID_LOAD : Latched into BRIDGE_CFG[5] (0x54[5]).

Table 1-14. IDx SW-DIP8 - S3 (1)

Designator 7-Bit Address 8-Bit AddressS1.1 (Default) 0x0C 0x18

S1.2 0x0E 0x1CS1.3 0x10 0x20S1.4 0x12 0x24S1.5 0x14 0x28S1.6 0x16 0x2CS1.7 0x18 0x30S1.8 0x1A 0x34




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1 3 42 A 1 2 3 4 MINI

www.ti.com ALP Software Setup

1.11 ALP Software Setup

1.11.1 System Requirements

Operating System: Windows 7 64-bitUSB: USB2ANYUSB2ANY Firmware Version: 2.5.2.0

1.11.2 Download ContentsTI Analog LaunchPAD can be downloaded from: http://www.ti.com/tool/alp.

Download and extract the “snlc048.zip” file to a temporary location that can be deleted later.

Make sure J29 on the DS90Ux949 is connected to a PC USB port with USB cable and power is applied tothe DS90Ux949 EVM.

The following installation instructions are for the Windows 7 64-bit Operating System.

1.11.3 Installation of the ALP SoftwareExecute the ALP Setup Wizard program called “ALPF_setup_v_x_x_x.exe” that was extracted to atemporary location on the local drive of your PC.

There are 7 steps to the installation once the setup wizard is started:1. Select the "Next" button.2. Select “I accept the agreement” and then select the “Next” button.3. Select the location to install the ALP software and then select the “Next” button.4. Select the location for the start menu shortcut and then select the “Next” button.5. There will then be a screen that allows the creation of a desktop icon. After selecting the desired

choices select the “Next” button.6. Select the “Install” button, and the software will then be installed to the selected location.7. Uncheck “Launch Analog LaunchPAD” and select the “Finish” button. The ALP software will start if

“Launch Analog LaunchPAD” is checked, but it will not be useful until the USB driver is installed andboard is attached.

Connect J29 USB jack of the DS90Ux949Q EVM board to a PC/laptop USB port using a Type A

to mini-B USB cable. Power the DS90Ux949Q EVB board with a 12 VDCpower supply. The “Found New Hardware Wizard” will open on the PC/laptop.

1.11.4 Installation of the Device ProfilesThere are 2 steps to add the DS90Ux949 profile:1. Contact TI for the DS90Ux949 profile2. Extract the “DS90Ux949.zip” to ALP’s profile folder. The profile folder can be found at: C:\Program

Files (x64)\Texas Instruments\Analog LaunchPAD vx.x.x\Profiles\

1.11.5 Startup - Software DescriptionMake sure all the software has been installed and the hardware is powered on and connected to the PC.Execute “Analog LaunchPAD” shortcut from the start menu. The default start menu location is under AllPrograms > Texas Instruments > Analog LaunchPAD vx.x.x > Analog LaunchPAD to start MainGUI.exe.



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ALP Software Setup www.ti.com

Figure 1-4. Launching ALP

The application should come up in the state shown in the figure below. If it does not, see Section 1.12,“Troubleshooting ALP Software”.

Under the Devices tab click on “DS90Ux949” to select the device and open up the device profile and itsassociated tabs.

Figure 1-5. Initial ALP Screen

After selecting the DS90Ux949, the following screen should appear.



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Figure 1-6. Follow-up Screen

1.11.6 Information TabThe Information tab is shown below. Please note the device revision could be different.

Figure 1-7. ALP Information Tab



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1.11.7 HDMI TabThe HDMI tab is shown below.

Figure 1-8. ALP HDMI Tab



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1.11.8 Pattern Generator TabThe SER Pattern Generator tab is shown below.

Figure 1-9. ALP Pattern Generator Tab



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1.11.9 Registers TabThe Registers tab is shown below.

Figure 1-10. ALP Registers Tab



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1.11.10 Registers Tab - Address 0x00 selected

Address 0x00 selected as shown below. Note that the “Value:” box, , will now show the hexvalue of that register.

Figure 1-11. ALP Device ID Selected



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1.11.11 Registers Tab - Address 0x00 expandedBy double clicking on the Address bar

or a single click on . Address 0x00 expanded reveals contents by bits. Any register address displayedcan be expanded.

Figure 1-12. ALP Device ID Expanded

Any RW Type register, , can be written into by writing the hex value into the “Value:” box,or putting the pointer into the individual register bit(s) box by a left mouse click to put a check mark(indicating a “1”) or unchecking to remove the check mark (indicating a “0”). Click the “Apply” button towrite to the register, and “refresh” to see the new value of the selected (highlighted) register.

The box toggles on every mouse click.



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1.11.12 Scripting TabThe Scripting tab is shown below.

Figure 1-13. ALP Scripting Tab

The script window provides a full Python scripting environment which can be for running scripts andinteracting with the device in an interactive or automated fashion.

WARNINGDirectly interacting with devices either through registermodifications or calling device support library functions can effectthe performance and/or functionality of the user interface and mayeven crash the ALP Framework application.



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Troubleshooting ALP Software www.ti.com

1.12 Troubleshooting ALP Software

1.12.1 ALP Loads the Incorrect ProfileIf ALP opens with the incorrect profile loaded the correct profile can be loaded from theUSB2ANY/Aardvark Setup found under the tools menu.

Figure 1-14. USB2ANY Setup

Highlight the incorrect profile in the Defined ALP Devices list and press the remove button.

Figure 1-15. Remove Incorrect Profile

Find the correct profile under the Select a Daughter Board list, highlight the profile and press Add.



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www.ti.com Troubleshooting ALP Software

Figure 1-16. Add Correct Profile

Select Ok and the correct profile should now be loaded.

Figure 1-17. Finish Setup



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Troubleshooting ALP Software www.ti.com

1.12.2 ALP does not detect the EVMIf the following window opens after starting the ALP software, double check the hardware setup.

Figure 1-18. ALP No Devices Error

It may also be that the USB driver is not installed. Check the device manager. There should be a “HID-compliant device” under the “Human Interface Devices” as shown below.

Figure 1-19. Windows 7, ALP USB Driver

The software should start with only “DS90UH947” in the “Devices” pull down menu. If there are moredevices then the software is most likely in demo mode. When the ALP is operating in demo mode there isa “(Demo Mode)” indication in the lower left of the application status bar as shown below.



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www.ti.com Troubleshooting ALP Software

Figure 1-20. ALP in Demo Mode

Disable the demo mode by selecting the “Preferences” pull down menu and un-checking “Enable DemoMode”.

Figure 1-21. ALP Preferences Menu

After demo mode is disabled, the ALP software will poll the ALP hardware. The ALP software will updateand have only “DS90UH947” under the “Devices” pull down menu.



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DIGITAL VIDEO GENERATOR

DIGITAL

VIDEO

GENERATOR

Digital Video Source

OpenLDI LVDS

HDMI/DP++

or

OpenLDI

Contents of Demo KitLogic Analyzer / Oscilloscope

DS90Ux949

EVM Board

Deserializer

Board

FPD-Link III

Display

HDMI/DP++or

OpenLDIGenerator

OpenLDILVDS

DS90Ux949EVM Board

Deserializer Board

FPD-Link III

Contents of Demo Kit

Graphics Controller / Video Processor Board

Typical Connection and Test Equipment www.ti.com

1.13 Typical Connection and Test EquipmentThe following is a list of typical test equipment that may be used to generate signals for the Serializerinputs:1. Digital Video Source – for generation of specific display timing such as Digital Video Processor or

Graphics Controller (GPU) with HDMI or OpenLDI output.2. Any other signal generator / video source - This video generator may be used for video signal sources

for DVI or DP++3. Any other signal / video generator that provides the correct input levels as specified in the datasheet.

The picture below shows a typical test set up using a Graphics Controller and display.

Figure 1-22. Typical Test Setup for Video Application

The picture below shows a typical test set up using a video generator and logic analyzer.

Figure 1-23. Typical Test Setup for Evaluation



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www.ti.com Equipment References

1.14 Equipment References

NOTE: Please note that the following references are supplied only as a courtesy to our valuedcustomers. It is not intended to be an endorsement of any particular equipment or supplier.

Digital Video Pattern Generator:Astrodesign

www.astro-americas.com

Logic Analyzer:keysight Technologies

www.keysight.com

Corelis CAS-1000-I2C/E I2C Bus Analyzer and Exerciser Products:www.corelis.com/products/I2C-Analyzer.htm

Aardvark I2C/SPI Host Adapter Part Number: TP240141www.totalphase.com/products/aardvark_i2cspi

1.15 Cable ReferencesFor optimal performance, we recommend Shielded Twisted Pair (STP) 100ohm differential impedance and24 AWG (or larger diameter) cable for high-speed data applications.

Leoni Dacar 538 series cable:www.leoni-automotive-cables.com

Rosenberger HSD connector:www.rosenberger.de/en/Products/35_Automotive_HSD.php



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Chapter 2SNLU169–December 2014

Bill of Materials

Table 2-1. Bill of Materials

Designator Description Part Number Manufacturer Package QtyReference

PCB1 Printed Circuit Board SV600978 Any 1C1, C9, C128 CAP, CERM, 0.01 µF, 100 06031C103JAT2A AVX 0603 3

V, +/- 5%, X7R, 0603C2, C5, C6, C10, C11, C13, CAP, CERM, 10 µF, 10 V, GRM21BR71A106KE51L MuRata 0805 13C83, C93, C106, C116, C123, +/- 10%, X7R, 0805C133, C137C3, C7, C12, C14, C81, C82, CAP, CERM, 0.1 µF, 16 V, GRM155R71C104KA88D MuRata 0402 30C84, C85, C89, C94, C95, +/- 10%, X7R, 0402C96, C97, C98, C104, C105,C107, C108, C110, C111,C113, C117, C121, C122,C126, C129, C131, C132,C135, C136C4, C8 CAP, TA, 1 µF, 16 V, +/- 293D105X9016A2TE3 Vishay- 3216-18 2

10%, 9.3 ohm, SMD SpragueC15, C25, C32, C39, C50, CAP, CERM, 4.7 µF, 16 V, GRM21BR71C475KA73L MuRata 0805 10C56, C120, C127, C130, +/- 10%, X7R, 0805C134C16, C18, C19, C26, C27, CAP, CERM, 0.01 µF, 100 06031C103KAT2A AVX 0603 15C44, C45, C46, C49, C53, V, +/- 10%, X7R, 0603C59, C60, C61, C62, C65C20, C29, C34, C35, C47, CAP, CERM, 0.1 µF, 25 V, 06033C104KAT2A AVX 0603 6C63 +/- 10%, X7R, 0603C21, C28, C33, C38, C42, CAP, CERM, 1 µF, 16 V, +/- C0603C105K4PACTU Kemet 0603 6C64 10%, X5R, 0603C24, C30, C40, C57 CAP, CERM, 10 µF, 10 V, C0805C106K8PACTU Kemet 0805 4

+/- 10%, X5R, 0805C73, C74, C76, C78 CAP, CERM, 0.1 µF, 50 V, C1005X7R1H104K TDK 0402 4

+/- 10%, C0G/NP0, 0402C77 CAP, CERM, 0.012 µF, 16 GRM155R71C123KA01D MuRata 0402 1

V, +/- 10%, X7R, 0402C87, C88, C90, C91, C92 CAP, CERM, 4.7 pF, 25 V, GRM1555C1E4R7CA01D MuRata 0402 5

+/- 5%, C0G/NP0, 0402C99, C103 CAP, CERM, 220 pF, 50 V, 06035A221FAT2A AVX 0603 2

+/- 1%, C0G/NP0, 0603C100, C101 CAP, CERM, 30 pF, 100 V, GRM1885C2A300JA01D MuRata 0603 2

+/- 5%, C0G/NP0, 0603C102 CAP, CERM, 2200 pF, 50 V, C0603X222K5RACTU Kemet 0603 1

+/- 10%, X7R, 0603C109 CAP, CERM, 0.47 µF, 16 V, GRM188R71C474KA88D MuRata 0603 1

+/- 10%, X7R, 0603C112 CAP, CERM, 10 pF, 50 V, GRM1555C1H100JA01D MuRata 0402 1

+/- 5%, C0G/NP0, 0402C114 CAP, TA, 100 µF, 16 V, +/- T495D107M016ATE100 Kemet 7343-31 1

20%, 0.1 ohm, SMDC115 CAP, CERM, 47 µF, 16 V, GRM32ER61C476ME15L MuRata 1210 1

+/- 20%, X5R, 1210

28 Bill of Materials SNLU169–December 2014Submit Documentation Feedback



www.ti.com Cable References

Table 2-1. Bill of Materials (continued)Designator Description Part Number Manufacturer Package Qty

ReferenceC118 CAP, CERM, 3300 pF, 50 V, GRM155R71H332KA01D MuRata 0402 1

+/- 10%, X7R, 0402C119 CAP, CERM, 1 µF, 16 V, +/- C1608X7R1C105K TDK 0603 1

10%, X7R, 0603C124 CAP, TA, 22 µF, 25 V, +/- 293D226X0025D2TE3 Vishay- 7343-31 1

20%, 0.7 ohm, SMD SpragueC125 CAP, TA, 2.2 µF, 25 V, +/- 293D225X9025A2TE3 Vishay- 3216-18 1

10%, 6.3 ohm, SMD SpragueD1, D2, D4 LED, Green, SMD LTST-C190GKT Lite-On 1.6x0.8x0.8 3

mmD3 LED, Orange, SMD LTST-C190KFKT Lite-On 1.6x0.8x0.8 1

mmD8 Diode, Schottky, 40 V, 1 A, 1N5819HW-7-F Diodes Inc. SOD-123 1

SOD-123F1 Fuse, SC Protector, 12A 429007 Littlefuse 1206 1FID1, FID2, FID3 Fiducial mark. There is N/A N/A Fiducial 3

nothing to buy or mount.H1, H2, H5, H6 Standoff, Hex, 0.5"L #4-40 1902C Keystone Standoff 4

NylonJ1 Audio Jack, 3.5mm, Stereo, SJ-3523-SMT CUI Inc. Audio Jack 1

R/A, SMT SMDJ2, J4, J5, J6, J7, J8, J15, Header, 100mil, 2x1, Gold, 5-146261-1 TE Connectivity Header, 2x1, 21J16, J17, J19, J22, J26, J27, TH 100milJ30, J32, J34, J35, J39, J42,J43, J44J3, J14, J18, J33, J37, J40, Header, 100mil, 3x1, Gold, TSW-103-07-G-S Samtec 3x1 Header 7J41 THJ9, J11, J12, J13 Connector, End launch SMA, 142-0701-851 Emerson SMA End 4

50 ohm, SMT Network Power LaunchJ10 Connector, HDMI, 19-Pos 1747981-1 TE Connectivity 15.0x6.08x1 1

Recept, SMT 1.55mmJ20, J24 Header (friction lock), 0022112042 Molex Header 4x1 2

100mil, 4x1, Gold, TH keyedJ21 Header, 100mil, 16x2, Gold, TSW-116-07-G-D Samtec 16x2 Header 1

THJ23 Header, 100mil, 8x2, Gold, TSW-108-07-G-D Samtec 8x2 Header 1

THJ25 Header, 100mil, 4x1, Gold, TSW-104-07-G-S Samtec 4x1 Header 1

THJ28 Header (shrouded), 100 mil, SBH11-PBPC-D07-ST-BK Sullins 7x2 1

7x2, Gold, TH Connector ShroudedSolutions Header

J29 Connector, Receptacle, Mini- 1734035-2 TE Connectivity USB Mini 1USB Type B, R/A, Top Type BMount SMT

J31 Header, 100mil, 7x2, Tin, TH PEC07DAAN Sullins Header, 7x2, 1Connector 100mil, TinSolutions

J36 Connector, DC Jack 2.1X5.5 PJ-102A CUI Inc. POWER 1mm, TH JACK,

14.4x11x9mm

J38 Header, 100mil, 4x2, Gold, TSW-104-07-G-D Samtec 4x2 Header 1TH

L1, L2, L12, L13 1.5A Ferrite Bead, 330 ohm BLM18SG331TN1D MuRata 0603 4@ 100MHz, SMD

29SNLU169–December 2014 Bill of MaterialsSubmit Documentation Feedback


http://www.ti.com


Cable References www.ti.com


ReferenceL3, L5 Ferrite Bead, 1000 ohm @ BLM21AG102SN1D Murata 0805 2

100 MHz, 0.5 A, 0805L4, L6, L8 Ferrite Bead, 120 ohm @ BLM18SG121TN1D MuRata 0603 3

100 MHz, 3 A, 0603L7 Ferrite Bead, 1000 ohm @ BLM21AG102SN1D Murata 0805 1

100 MHz, 0.3 A, 0805L10, L11 Coupled inductor, 0.22 A, DLW21SN261XQ2L MuRata Inductor, 2

0.59 ohm, SMD 1.2x1.2x2.0mm

L14 Inductor, Shielded Drum 7440650047 Wurth WE-TPC- 1Core, Ferrite, 4.7uH, 4.2A, Elektronik XLH20.02 ohm, SMD eiSos

P1 Right Angle Plug for PCB, D4S20G-400A5-Z Rosenberger HSD 1TH connector,

WaterblueQ1, Q2, Q3, Q4 MOSFET, N-CH, 50 V, 0.22 BSS138 Fairchild SOT-23 4

A, SOT-23 SemiconductorR1, R2 RES, 100, 1%, 0.063 W, CRCW0402100RFKED Vishay-Dale 0402 2

0402R3, R7, R9, R10, R11, R12, RES, 0, 5%, 0.063 W, 0402 ERJ-2GE0R00X Panasonic 0402 77R13, R14, R15, R16, R21,R22, R23, R25, R26, R28,R30, R31, R32, R33, R34,R35, R36, R37, R38, R39,R40, R41, R42, R43, R106,R107, R108, R110, R113,R115, R117, R119, R120,R121, R125, R126, R127,R128, R129, R132, R133,R134, R135, R136, R137,R138, R139, R141, R142,R145, R146, R147, R148,R149, R150, R151, R152,R153, R154, R155, R156,R157, R158, R159, R160,R161, R162, R163, R198,R203, R206R4, R5, R6, R8, R103, R116, RES, 10.0 k, 1%, 0.063 W, CRCW040210K0FKED Vishay-Dale 0402 18R122, R164, R165, R166, 0402R167, R168, R169, R170,R171, R181, R184, R194R17 RES, 49.9, 1%, 0.063 W, CRCW040249R9FKED Vishay-Dale 0402 1

0402R19 RES, 4.70 k, 1%, 0.1 W, ERJ-2RKF4701X Panasonic 0402 1

0402R27, R123, R124 RES, 4.7 k, 5%, 0.063 W, CRCW04024K70JNED Vishay-Dale 0402 3

0402R49, R58, R85 RES, 118 k, 1%, 0.063 W, CRCW0402118KFKED Vishay-Dale 0402 3



0402R52, R61, R88 RES, 82.5 k, 1%, 0.063 W, CRCW040282K5FKED Vishay-Dale 0402 3



0402



http://www.ti.com


www.ti.com Cable References


ReferenceR55, R64, R91 RES, 13.3 k, 1%, 0.063 W, CRCW040213K3FKED Vishay-Dale 0402 3








0402R102 RES, 1.00 k, 1%, 0.1 W, ERJ-2RKF1001X Panasonic 0402 1

0402R111 RES, 1.0 k, 5%, 0.063 W, CRCW04021K00JNED Vishay-Dale 0402 1

0402R130, R131 RES, 47 k, 5%, 0.063 W, CRCW040247K0JNED Vishay-Dale 0402 2

0402R140 RES, 27 k, 5%, 0.063 W, CRCW040227K0JNED Vishay-Dale 0402 1

0402R172 RES, 330, 5%, 0.063 W, CRCW0402330RJNED Vishay-Dale 0402 1

0402R173, R174, R175 RES, 470, 5%, 0.063 W, CRCW0402470RJNED Vishay-Dale 0402 3

0402R176, R177 RES, 33, 5%, 0.063 W, 0402 CRCW040233R0JNED Vishay-Dale 0402 2R178, R185, R186 RES, 1.5 k, 5%, 0.063 W, CRCW04021K50JNED Vishay-Dale 0402 3

0402R179, R182 RES, 33 k, 5%, 0.063 W, CRCW040233K0JNED Vishay-Dale 0402 2

0402R180 RES, 1.2 M, 5%, 0.1 W, CRCW06031M20JNEA Vishay-Dale 0603 1

0603R183 RES, 200, 5%, 0.063 W, CRCW0402200RJNED Vishay-Dale 0402 1

0402R187 RES, 124 k, 1%, 0.063 W, CRCW0402124KFKED Vishay-Dale 0402 1

0402R188 RES, 22.1 k, 1%, 0.063 W, CRCW040222K1FKED Vishay-Dale 0402 1

0402R189, R195, R204, R207 RES, 0, 5%, 0.1 W, 0603 CRCW06030000Z0EA Vishay-Dale 0603 4R193, R196, R200, R205 RES, 100 k, 5%, 0.063 W, CRCW0402100KJNED Vishay-Dale 0402 4






0402

31SNLU169–December 2014 Bill of MaterialsSubmit Documentation Feedback


http://www.ti.com


Cable References www.ti.com


ReferenceS1 Switch, Slide, SPST 3 poles, 219-3LPST CTS 3 poles 1

SMT Electrocompon SPSTents Switch

S2, S3, S6 Switch, Slide, SPST 8 poles, 219-8MST CTS Switch, 3SMT Electrocompon 8Pos,

ents 21.8x3.8x6.7mm

S4, S7, S9 SWITCH TACTILE SPST- EVQ-PAD04M Panasonic 6x4.3x6mm 3NO 0.02A 15V, TH

S5 DIP Switch, 4 position slide A6S-4104-H Omron SMT DIP 1actuator, SPST, SMD Electronic switch

ComponentsSH-J3, SH-J14, SH-J17, SH- Shunt, 2mm, Gold plated, 2SN-BK-G Samtec 2mm Shunt, 9J18, SH-J22, SH-J33, SH- Black Closed TopJ37, SH-J40, SH-J41U1 SINGLE-ENDED, ANALOG- PCM1808PWR Texas PW0014A 1

INPUT 24-BIT, 96-kHz InstrumentsSTEREO A/D CONVERTER,PW0014A

U2 1080p HDMI to FPD-Link III DS90UH949TRGCRQ1 Texas RGC0064K 1Bridge Serializer, InstrumentsRGC0064K

U3 Socket, DIP-8, Sleeve Pin, 110-13-308-41-001000 Mill-Max DIP-8, Body 12.54 mm Pitch 10.16x10.16

mm, Pitch2.54mm

U4 Socket, 20pin DIP STD STD DIP20 1U5 ESD-Protection Array for TPD4E004DRYRG4 Texas DRY0006A 1

High-Speed Data Interfaces, Instruments4 Channels, -40 to +85degC, 6-pin SON (DRY),Green (RoHS & no Sb/Br)

U6 Mixed Signal MSP430F5529IPN Texas PN0080A 1MicroController, PN0080A Instruments

U7 TCA9406 Dual Bidirectional TCA9406DCUR Texas DCU0008A 11-MHz I2C-BUS and SMBus InstrumentsVoltage Level-Translator,1.65 to 3.6 V, -40 to 85degC, 8-pin US8 (DCU),Green (RoHS & no Sb/Br)

U8 IC, 6-BIT BIDIRECTIONAL TXB0106PWR TI TSSOP 1VOLTAGE-LEVELTRANSLATOR

U9 IC, 4.5V-18V Input, 2-A TPS54225PWP TI PWP20 1Sync. Step-Down SWIFTConverter

U10 IC, 1.5A LDO Regulator with TPS74701DRC TI SON-10 1Soft-Start

U11 IC, Dual 1-A Low-Dropout TPS767D3xxPWP TI PWP28 1Regulator

Y1 Oscillator, ECS-8FA3-xxx-TR ECS 0.551 x 10.386 inch

Y3 Crystal, 24.000MHz, 20pF, ECS-240-20-5PX-TR ECS Inc. Crystal, 1SMD 11.4x4.3x3.8

mmC17, C41, C43, C58 CAP, CERM, 0.047 µF, 16 GRM188R71C473KA01D MuRata 0603 0

V, +/- 10%, X7R, 0603C22, C23, C31, C37, C48, CAP, CERM, 4.7 µF, 16 V, GRM21BR71C475KA73L MuRata 0805 0C51, C52, C55 +/- 10%, X7R, 0805



http://www.ti.com



ReferenceC36, C54 CAP, CERM, 0.47 µF, 16 V, GRM188R71C474KA88D MuRata 0603 0

+/- 10%, X7R, 0603C75, C79 CAP, CERM, 12 pF, 25 V, GRM1555C1E120JA01D MuRata 0402 0

+/- 5%, C0G/NP0, 0402C80 CAP, CERM, 0.012 µF, 16 GRM155R71C123KA01D MuRata 0402 0

V, +/- 10%, X7R, 0402C86 CAP, CERM, 0.1 µF, 16 V, GRM155R71C104KA88D MuRata 0402 0

+/- 10%, X7R, 0402R18, R20, R44, R45, R46, RES, 0, 5%, 0.063 W, 0402 ERJ-2GE0R00X Panasonic 0402 0R47, R48, R56, R57, R65,R73, R74, R82, R83, R84,R92, R100, R101, R143,R144, R209, R210, R211,R212R24, R29, R104, R105 RES, 10.0 k, 1%, 0.063 W, CRCW040210K0FKED Vishay-Dale 0402 0

0402R109, R112, R114, R118 RES, 49.9, 1%, 0.063 W, CRCW040249R9FKED Vishay-Dale 0402 0

0402S8 Switch, Slide, SPST 8 poles, 219-8MST CTS Switch, 0

SMT Electrocompon 8Pos,ents 21.8x3.8x6.7

mmY2 Crystal, SMT Quart Crystal ATSxxxSM CTS 0.484 x 0

0.190 inchH3, H4, H7, H8 Machine Screw, Round, #4- NY PMS 440 0025 PH B&F Fastener Screw 4

40 x 1/4, Nylon, Philips Supplypanhead

Appendix ASNLU169–December 2014

EVM PCB Schematics

33SNLU169–December 2014 EVM PCB SchematicsSubmit Documentation Feedback



1

1

2

2

3

3

4

4

5

5

6

6

D D

C C

B B

A A

2 10Block Diagram

10/27/2014

SV600978A_BlockDiagram.SchDoc

Sheet Title:

Size:

Mod. Date:

File:Sheet: of

B http://www.ti.comContact: http://www.ti.com/support

DS90UB949-Q1EVMProject Title:Designed for: Public Release

Assembly Variant: 004

© Texas Instruments 2014

Drawn By:Engineer:

Ryan BaileyTran Dam

Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.

Not in version controlSVN Rev:SV600978Number: Rev: A

Revision History

Revision Notes

DS90Ux9x9-Q1HDMI

FPD3

FPD3

MODE_SEL

IDx

REF OSC

USB-2-ANYEDID

DDC

I2C

SPI/D_GPIO

GPIO

I2S

INTB

USB

Power

HDMI

EXT CONN

3.3V

1.8V

1.1V

Power

LEDs

Audio ADC

5V

EXT UC

Appendix A www.ti.com

34 EVM PCB Schematics SNLU169–December 2014Submit Documentation Feedback


http://www.ti.com


1

1

2

2

3

3

4

4

5

5

6

6

D D

C C

B B

A A

4 10

11/3/2014

SV600978A_DS90UB949.SchDoc

Sheet Title:

Size:

Mod. Date:

File:Sheet: of





Drawn By:Engineer: Tran Dam



GND

10µFC30

4.7µFC31DNP

1µFC28

0.01µFC26

0.1µFC29

0.01µFC27

0

R11

0

R12

0

R15

0

R20DNP

0

R23

0

R25

0

R26

0

R28

0

R30

0

R31

0

R33

0

R35

0

R36

0

R37

0

R38

0

R39

0

R41

0

R43

0

R40

0

R42

0

R21

0

R22 0

R18DNP0

R16

IN_CLK_P

IN_D0_N

IN_D0_P

IN_D1_N

IN_D1_P

IN_D2_N

IN_D2_P

IN_CLK_N

CEC

DDC_SCL

DDC_SDA

RX_5V

HPD

VDDIO

VDD18

VTERM

I2S_CLK/GPIO8_REG

I2S_WC/GPIO7_REG

I2S_DA/GPIO6_REG

I2S_DB/GPIO5_REG

I2S_DC/GPIO2

I2S_DD/GPIO3

SDIN/GPIO0

SWC/GPIO1

SCLK

MCLK

D_GPIO0/MOSI

D_GPIO1/MISO

D_GPIO2/SPLK

D_GPIO3/SS

GND

VDDT11

VDDL11

VDDR11

SDA

SCL

IDx

MODE_SEL0

MODE_SEL1

INTB

PDB

VDD11

4.7µFC48DNP

0.01µFC49

4.7µFC50

4.7µFC51DNP

0.01µFC44

10µFC40

0.01µFC45

0.01µFC46

0.1µFC47

0.047µFC41DNP

1µFC42

0.047µFC43DNP

GND

0.1µFC63

1µFC64

0.01µFC65

0.01µFC60

10µFC57

0.01µFC61

0.01µFC62

0.047µFC58DNP

0.01µFC59

GND

4.7µFC22DNP

4.7µFC23DNP

10µFC24

0.01µFC19

0.01µFC16

0.1µFC20

1µFC21

0.047µFC17DNP

0.01µFC18

GND

VDD1V8

4.7µFC37DNP

1µFC38

0.1µFC35

1µFC33

0.47µFC36DNP

0.1µFC34

GND

4.7µFC55DNP

0.47µFC54DNP

0.01µFC53

GND

VTERMc

1000 ohm

L3

1000 ohm

L5

1000 ohm

L7

VDDIO

VTERM

VDD18120 ohm

L4

120 ohm

L6

120 ohm

L8

VDDL11

VDDR11

VDDT11

49.9

R17

DOUT0_P

DOUT0_N

DOUT1_P

DOUT1_N

VDDIO

4.7k

R27

0

R340

R32

0

R13

0

R14

12

Y2 ATSxxxSM

DNP

GND

RES0_0

RES0_1

4.7µFC56

4.7µFC39

4.7µFC25

4.7µFC52DNP

4.7µFC32

4.7µFC15

TP1TP2

GND

10.0k

R24DNPDNP

10.0k

R29DNPDNP

GND

0

R44DNP

0

R45DNP

0

R46DNP

0

R47DNP

12pF

C75

DNP

12pF

C79

DNP

0.1µF

C73

0.1µF

C74

0.1µF

C76

0.1µF

C78

0.012µF

C77

0.012µFC80DNP

IN_D1_PIN_D2_N

IN_D1_NIN_D0_P

IN_D0_N

IN_CLK_P

IN_CLK_N

IN_D2_P

DOUT0_A_PDOUT0_A_N

DOUT1_B_P

DOUT1_B_N

DOUT0_P

VDD18

VDDIO

VTERM

VDDL11

VDDR11

VDDT11

DOUT0_N

DOUT1_P

DOUT1_N

GND

1 2

J45-146261-1

CEC1

RES02

VDDIO3

SDIN/GPIO04

SWC/GPIO15

SCLK/I2CSEL6

VDDL117

D_GPIO0/MOSI8

VDDA119

D_GPIO1/MOSO10

D_GPIO2/SPLK11

D_GPIO3/SS12

INTB13

SDA14

SCL15

MCLK16

VDDP1117

MODE_SEL018

IDX19

LFT20

VDDHS1121

DOUT1-22

DOUT1+23

VDD1824

VDDS1125

DOUT0-26

DOUT0+27

VDDHS1128

RES129

RES230

PDB31

MODE_SEL132

I2S_WC/GPIO7_REG33

I2S_CLK/GPIO8_REG34

I2S_DA/GPIO6_REG35

I2S_DB/GPIO5_REG36

I2S_DC/GPIO237

I2S_DD/GPIO338

X139

RES340

VDDL1141

HPD42

RX_5V43

DDC_SDA44

DDC_SCL45

VDDIO46

NC047

NC148

IN_CLK-49

IN_CLK+50

VDD1851

VDDHA1152

RES453

VDDHA1154

IN_D0-55

IN_D0+56

VTERM57

VDDHA1158

IN_D1-59

IN_D1+60

VDDHA1161

IN_D2-62

IN_D2+63

VDD1864

DAP65

U2

DS90UH949TRGCRQ1

4.70kR19

VDDIO

www.ti.com Appendix A



http://www.ti.com


1

1

2

2

3

3

4

4

5

5

6

6

D D

C C

B B

A A

1 1

11/4/2014

SV600978A_MSP430F5529.SchDoc

Sheet Title:

Size:

Mod. Date:

File:Sheet: of








24MHz

12

Y3ECS-240-20-5PX-TR

GPIO11/VEREF+

GPIO10/VEREF-

GND

GND

DP

PUR

DM

VUSB

V18

GPIO1/I2C(SCL)

GPIO0/I2C(SDA)

GPIO7/PWM0

GPIO3/PWM2

SDABRD

SCLBRD

AIN_B_0

AIN_B_1

GPIO9/ADC2

GPIO8/ADC3

30pF

C100

30pF

C101

2200pFC102

GND

33k

R182

GND

GND

GND

GND

GND

BSL

DM

DP

PUR

V18

33R177

33

R176

GND

1.2M

R180

GND

33k

R179

GND

220pFC103

GND

1.5k

R185

1.5k

R186

0.47µFC109

0.1µFC108

0.1µFC104

0.1µFC105

Green

12

D4

200

R183

GND

1

2

J30

5-146261-1

VDD33330 ohm

L13 VDD33_UC

VDD33_UC

VDD33_UC

VDD33_UC

0.1µFC107

10µFC106

SDA_B1

GND2

VCCA3

SDA_A4

SCL_A5

OE6

VCCB7

SCL_B8

U7

TCA9406DCUR

GND

10.0k

R184

0.1µFC110

0.1µFC111

VDD33_UC

VDD_I2C

A11

VCCA2

A23

A34

A45

A56

A67

OE8

GND9

B610

B511

B412

B313

B214

VCCB15

B116

U8

TXB0106PWR

GND

GPIO5/SPI(SOMI)/UART(RXD)

GPIO4/SPI(SIMO)/UART(TXD)

GPIO2/SPI(SCLK)

GPIO6/PWM1/SPI(CS)

INTB_CTRL

PDB_CTRL

GND

0.1µFC96

0.1µFC97

VDD33_UC

10.0k

R181

SOMI

SIMO

SCLK

CS

0.1µFC98

INTB

INTBINTB

220pFC99

GND

VUSB

41

32

S9

EVQ-PAD04M

1 2

J43

5-146261-1

1

2

J44

5-146261-1

PDB

VDDIO

CS

SCLK

SIMO

SOMI

1 2F1

429007

VBUS

VBUS

PDB

2

3

4

1

5

J29

1734035-2

1.5k

R178

1

23

Q4

12

34

56

78

910

11

12

13

14

J31

IO1

1

IO2

2

GND

3IO3

4

IO4

5VCC

6

U5

P6.4/CB4/A41

P6.5/CB5/A52

P6.6/CB6/A63

P6.7/CB7/A74

P7.0/CB8/A125

P7.1/CB9/A136

P7.2/CB10/A147

P7.3/CB11/A158

P5.0/A8/VREF+/VEREF+9

P5.1/A9/VREF-/VEREF-10

AVCC111

P5.4/XIN12

P5.5/XOUT13

AVSS114

P8.015

P8.116

P8.217

DVCC118

DVSS119

VCORE20

P1.0/TA0CLK/ACLK

21

P1.1/TA0.0

22

P1.2/TA0.1

23

P1.3/TA0.2

24

P1.4/TA0.3

25

P1.5/TA0.4

26

P1.6/TA1CLK/CBOUT

27

P1.7/TA1.0

28

P2.0/TA1.1

29

P2.1/TA1.2

30

P2.2/TA2CLK/SMCLK

31

P2.3/TA2.0

32

P2.4/TA2.1

33

P2.5/TA2.2

34

P2.6/RTCCLK/DMAE0

35

P2.7/UCB0STE/UCA0CLK

36

P3.0/UCB0SIMO/UCB0SDA

37

P3.1/UCB0SOMI/UCB0SCL

38

P3.2/UCB0CLK/UCA0STE

39

P3.3/UCA0TXD/UCA0SIMO

40

P3.4/UCA0RXD/UCA0SOMI41

P3.5/TB0.542

P3.6/TB0.643

P3.7/TB0OUTH/SVMOUT44

P4.0/PM_UCB1STE/PM_UCA1CLK45

P4.1/PM_UCB1SIMO/PM_UCB1SDA46

P4.2/PM_UCB1SOMI/PM_UCB1SCL47

P4.3/PM_UCB1CLK/PM_UCA1STE48

DVSS249

DVCC250

P4.4/PM_UCA1TXD/PM_UCA1SIMO51

P4.5/PM_UCA1RXD/PM_UCA1SOMI52

P4.6/PM_NONE53

P4.7/PM_NONE54

P5.6/TB0.055

P5.7/TB0.156

P7.4/TB0.257

P7.5/TB0.358

P7.6/TB0.459

P7.7/TB0CLK/MCLK60

VSSU

61

PU.0/DP

62

PUR

63

PU.1/DM

64

VBUS

65

VUSB

66

V18

67

AVSS2

68

P5.2/XT2IN

69

P5.3/XT2OUT

70

TEST/SBWTCK

71

PJ.0/TDO

72

PJ.1/TDI/TCLK

73

PJ.2/TMS

74

PJ.3/TCK

75

RST/NMI/SBWTDIO

76

P6.0/CB0/A0

77

P6.1/CB1/A1

78

P6.2/CB2/A2

79

P6.3/CB3/A3

80

U6

MSP430F5529IPN




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1

2

2

3

3

4

4

5

5

6

6

D D

C C

B B

A A

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Sheet Title:

Size:

Mod. Date:

File:Sheet: of








VDD1V8

0.1µFC94

GND

1

2

3

4

5

6

7

8

9

10 11

12

13

14

15

16

17

18

19

20

U4

SOCKET_20P_DIP

GND

SDA

SCL0

R155

0

R157

INTB

0

R1530

R1510

R1490

R147

0

R161

0

R163

0

R162

0

R1580

R1560

R1540

R1520

R1500

R1480

R146

SW1

SW2

SW3

SW0 SW4

SW5

SW6

SW7

D_GPIO0/MOSI

D_GPIO1/MISO

D_GPIO2/SPLK

D_GPIO3/SS

TEST

RST

0

R159

0

R160

0

R145

10.0k

R171

10.0k

R170

10.0k

R169

10.0k

R168

10.0k

R167

10.0k

R166

10.0k

R165

10.0k

R164

SW0SW1SW2SW3SW4SW5SW6SW7

12

34

56

78

910

1112

1314

J28

SBH11-PBPC-D07-ST-BK

GND

RST

10µFC93

TEST

330

R172

GND

1

2

J27

5-146261-1

330 ohm

L12 VDD_UC

VDD_UC

VDD_UC

0.1µF

C95

1

2

3

4

5

6

13

14

15

16

7

12

89

10

11

DNPS8

219-8MST

DNP

GND

41

32

S7

EVQ-PAD04M




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1

1

2

2

3

3

4

4

5

5

6

6

D D

C C

B B

A A

6 10

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Size:

Mod. Date:

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MODE_SEL0

MODE_SEL1

IDx

VDD1V8

0

R48DNP

GNDGND

VDD1V8

0

R84DNP

GNDGND

VDD1V8

GNDGND

1 2 3 4 5 6 7 8

1 2 3 4 5 6 7 8

0x18

0x1C

0x20

0x24

0x28

0x2C

0x30

0x34

0x0C

0x0E

0x10

0x12

0x14

0x16

0x18

0x20

7'b

8'b

I2C Address Select (IDx)Mode Select 0 (MODE_SEL0)

Mode Select 1 (MODE_SEL1)

631

8

27 5

4

S5A6S-4104-H

GND

10.0k

R102

10.0k

R104DNP

DNP

10.0k

R105DNP

VDDIO

PDB

INTB

Mode Switches

0.1µFC84

0.1µFC81

GND

GND

0.1µFC82

GND

GND

0

R92DNP

0

R101DNP

0

R100DNP

0

R56DNP

0

R74DNP

0

R73DNP

0

R57DNP

0

R65DNP

0

R83DNP

0

R82DNP

SCLK

0

R107

10µFC83

GND

0

R106

10.0k

R103

PDB

INTB

SCLK

RES

1 2 3 4 5 6

13

14

15

16

7

12

8910

11

S6219-8MST

1 2 3 4 5 6

13

14

15

16

7

12

8910

11

S2219-8MST

1 2 3 4 5 6

13

14

15

16

7

12

8910

11

S3219-8MST

41

32

S4

EVQ-PAD04M

1

2

J5

5-146261-1

1

2

J6

5-146261-1

1

2

J7

5-146261-1

1

2

J8

5-146261-1

118kR49

1

118kR85

118kR58

1

30.9kR67

30.9kR76

30.9kR94

107kR50

107kR86

107kR59

51.1kR68

51.1kR77

51.1kR95

113kR51

113kR60

113kR87

88.7kR69

88.7kR96

88.7kR78

82.5kR52

82.5kR61

82.5kR88

102kR70

102kR79

102kR97

68.1kR62

68.1kR53

68.1kR89

137kR71

137kR80

137kR98

56.2kR54

56.2kR63

56.2kR90

210kR72

210kR81

210kR99

40.2kR66

40.2kR75

40.2kR93

13.3kR55

13.3kR64

13.3kR91

Assembly NoteZZ13

For S2 activate switch between pins 1 and 16

Assembly NoteZZ14


Assembly NoteZZ15





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1

1

2

2

3

3

4

4

5

5

6

6

D D

C C

B B

A A

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SV600978A_CONNECTORS.SchDoc

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Mod. Date:

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1

2345

J11142-0701-851

1

2345

J12142-0701-851

1

2345

J13142-0701-851 GND GND

GNDGND

DOUT0_P

DOUT0_N

DOUT1_P

DOUT1_N

49.9

R118DNP

49.9

R114DNP

49.9

R112DNP

49.9

R109DNP

GND

GND

IN_CLK_P

IN_D0_N

IN_D0_P

IN_D1_N

IN_D1_P

IN_D2_N

IN_D2_P

IN_CLK_N

CEC

DDC_SCL

DDC_SDA

RX_5V

HPD

GND GND

VDD_DDC

0.1µFC85

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

J23

TSW-108-07-G-D

0

R132

0

R135

0

R137

0

R138

0

R139

0

R141

0

R143DNP

0

R144DNP

PDB

D_GPIO0/MOSI

D_GPIO1/MISO

D_GPIO2/SPLK

D_GPIO3/SS

INTB

SDA

SCLGPIO1/I2C(SCL)

GPIO0/I2C(SDA)

GPIO2/SPI(SCLK)

GPIO6/PWM1/SPI(CS)

GPIO4/SPI(SIMO)/UART(TXD)

GPIO5/SPI(SOMI)/UART(RXD)

PDB_CTRL

INTB_CTRL

0

R113

0

R115

0

R117

0

R119

0

R120

0

R121

0

R125

0

R128 4

1

2

3

J20

0022112042

4

1

2

3

J24

0022112042

1

2

J26

5-146261-1

GND

GND

GND

4.7pFC88

4.7pFC87

4.7pFC90

4.7pFC91

4.7pFC92

0

R142

0

R134

0

R136

0

R126

0R127

CEC

DDC_SCL

DDC_SDA

SDA

SCL

1

2

J17

5-146261-1

1

2

J22

5-146261-1

VDD_I2C

VDD_DDC

0.1µFC86DNP

0.1µFC89

GND

GND

RES0_0

RES0_1

GND

GND

GND

I2S_CLK/GPIO8_REG

I2S_WC/GPIO7_REG

I2S_DA/GPIO6_REG

I2S_DB/GPIO5_REG

I2S_DC/GPIO2

I2S_DD/GPIO3

VDDIO

SDIN/GPIO0

SWC/GPIO1

SCLK

MCLK

0

R133

D_GPIO0/MOSI

D_GPIO1/MISO

D_GPIO2/SPLK

D_GPIO3/SS

1

2

J15

5-146261-1

INTB

GND

0

R129

0

R108

0

R110

TP3

1

2

J19

5-146261-1

RX_5V

GND

1

2

J16

5-146261-1

HPD

GND

4

1

2

3

J25

TSW-104-07-G-S

DAOUT

BCK

LRCK

SCKIN

4.7k

R124

4.7k

R123

47k

R130

47k

R131

27k

R140

VDD33

10.0k

R116

10.0k

R122

1

2

3

J14

TSW-103-07-G-S

1

2

3

J18

TSW-103-07-G-S

VDDIO

VDDIO

1.0k

R111

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15

17

19

21

23

25

27

29

31

16

18

20

22

24

26

28

30

32

J21

TSW-116-07-G-D

IN_CLK_N

IN_CLK_P

IN_D0_N

IN_D0_P

IN_D1_N

IN_D1_PIN_D2_N

IN_D2_P

DOUT1_N

DOUT1_P

DOUT0_N

DOUT0_P

J10_12_N

J10_12_P

J10_9_N

J10_9_P

J10_6_N

J10_6_PJ10_3_N

J10_3_P

1 234

L10DLW21SN261XQ2L

1 234

L11

DLW21SN261XQ2L

1

2

23

21

20

22

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

J101747981-1

1

2345

J9142-0701-851

GND

SMAD0_NSMAD0_P

SMAD1_NSMAD1_P

SMAD0_N

SMAD0_P

SMAD1_N

SMAD1_P

0

R209DNP

0

R210DNP

0

R211DNP

0

R212DNP

SH-J14

SH-J17

SH-J18

SH-J22

2

1

4

3

PAIR A1

PAIR A2

EMITTER

P1D4S20G-400A5-Z

1

2

3

4 5

6

7

8

U3

Assembly NoteZZ5

Jumper SH-J14 connects Pin 2 and 3 for Header J14

Assembly NoteZZ6


Assembly NoteZZ7


Assembly NoteZZ8





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1

1

2

2

3

3

4

4

5

5

6

6

D D

C C

B B

A A

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Mod. Date:

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GND

Green

12

D2

GND

INTB

RX_5V

HPD

Green

12

D1

GND

VDD5V

470

R173

470

R174

470

R175

H4

NY PMS 440 0025 PH

H7

NY PMS 440 0025 PH

H8

NY PMS 440 0025 PH

H2

1902C

H5

1902C

H6

1902C

FID2

FID1

FID3

SV600978

A

PCB Number:

PCB Rev:

Label Assembly NoteZZ1

This Assembly Note is for PCB labels only

Assembly NoteZZ2

These assemblies are ESD sensitive, ESD precautions shall be observed

Assembly NoteZZ3

These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.

Assembly NoteZZ4

These assmblies must comply with workmanship standards IPC-A-610 Class 2, unless otherwise specified.

Board Silkscreen Label: "Not for EMI Testing"

LOGOPCB

Texas Instruments

Orange

12

D3

H1

1902CH3

NY PMS 440 0025 PH

LOGOPCB

Pb-Free Symbol

LOGOPCB

FCC disclaimer

1

23

Q1

1

23

Q2

1

23

Q3




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1

1

2

2

3

3

4

4

5

5

6

6

D D

C C

B B

A A

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Sheet Title:

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Mod. Date:

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3

1

2

J1

SJ-3523-SMT

10µFC11

10µFC6

0.1µFC7

0.1µFC12

GND

GND

10µFC2

0.1µFC3

VDD33

10µFC10

10µFC5

330 ohm

L1

330 ohm

L2

VDD5V

GND

0.01µFC9

100

R2

100

R1

GND

GND

16 S1A

219-3LPST

25

S1B

219-3LPST34

S1C219-3LPST

GND

10.0k

R5

10.0k

R6

10.0k

R4

VDD33

FMT

MD1

MD0

FMTMD1MD0

0

R7

0

R9

0

R3

0.1µFC14

GND 123J3

TSW-103-07-G-S0

R10

DAOUT

BCK

LRCK

SCKIN

10.0k

R810µFC13

TRI-ST1

GND

2

OUT3V

DD

4 Y1ECS-8FA3-xxx-TR GND

1

0.01µFC1

1µF

C4

1µF

C8

1

2

J2

5-146261-1

SH-J3

VREF1

AGND2

VCC3

VDD4

DGND5

SCKI6

LRCK7

BCK8

DOUT9

MD010

MD111

FMT12

VINL13

VINR14

U1

PCM1808PWR

Assembly NoteZZ16





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1

1

2

2

3

3

4

4

5

5

6

6

D D

C C

B B

A A

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Size:

Mod. Date:

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1

3

2

J36

PJ-102A

GND

0.1µFC126

GND

1 2

3 4

5 6

7 8

J38

GND

GND

VDD33

VDD_EXT

GND

0.1µFC121

GND

4.7µFC120

0.1µFC122

GND

4.7µFC127

0.01µFC128

TP10100k

R196

0

R198

0.1µFC129 4.99k

R199

1.87k

R197

VDD11VDD5V

U11

TPS767D3XXPWP

GND

GND

GND

100k

R200

100k

R205

TP12

TP15

TESTPOINT

TP16

TP13

0

R203

0

R206

12.1k

R202 GND23.2k

R201

0.1µFC131

4.7µFC130

0.1µFC135

4.7µFC134

10µFC123

10µFC133

0.1µFC132

GND

10µFC137

0.1µFC136

GND

VDD5V

VDD33

VDD1V8

100k

R193

GND

3300pFC118

1µFC119

10.0k

R194

4.7µH

L14

7440650047

10pF

C112

10µFC116

0.1µFC117

GND

VDD5V

GND

TP14

TP17

TP7

TP5

VDD_EXT

TP9

1

2

J34

5-146261-1

GND

1

2

3

J37

TSW-103-07-G-S

VDD_I2C

1

2

3

J41

TSW-103-07-G-S

VDD_DDC

RX_5V

1

2

3

J40

TSW-103-07-G-S

VTERMc

VDD33

VDD33

VDD1V8

VDD1V8

VDD33

1

2

3

J33

TSW-103-07-G-S

1

2

J35

5-146261-1

0

R195

0

R204

0

R207

1

2

J42

5-146261-1

1

2

J39

5-146261-1

1

2

J32

5-146261-1

0

R189

0.1µF

C113

124k

R187

22.1k

R188

GND

3.24kR208

100µFC114

1

47µFC115

22µFC124

2.2µFC125

D8

1N5819HW-7-F

VBUS

SH-J33

SH-J37

SH-J40

SH-J41

VOUT1

VFB2

VREG53

SS4

GND5

PG6

EN7

PGND18

PGND29

SW110

SW211

VBST12

VIN13

VCC14

PWPD

15

U9

TPS54225PWP

IN1

IN2

PG3

BIAS4

EN5

GND6

SS7

FB8

OUT9

OUT10

PWPD

11

U10

TPS74701DRC

Assembly NoteZZ9


Assembly NoteZZ10


Assembly NoteZZ11


Assembly NoteZZ12





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Appendix BSNLU169–December 2014

Board Layout

Board Layers

43SNLU169–December 2014 Board LayoutSubmit Documentation Feedback



Appendix B www.ti.com

44 Board Layout SNLU169–December 2014Submit Documentation Feedback


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www.ti.com Appendix B



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Appendix B www.ti.com

46 Board Layout SNLU169–December 2014Submit Documentation Feedback


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www.ti.com Appendix B



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Revision History www.ti.com

Revision HistoryNOTE: Page numbers for previous revisions may differ from page numbers in the current version.

DATE REVISION NOTESDecember 2014 * Initial release

48 Revision History SNLU169–December 2014Submit Documentation Feedback


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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or

documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.Acceptance of the EVM is expressly subject to the following terms and conditions.1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility

evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are notfinished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. Forclarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditionsset forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or productionsystem.

2 Limited Warranty and Related Remedies/Disclaimers:2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software

License Agreement.2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM

to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatmentby an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in anyway by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications orinstructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or asmandated by government requirements. TI does not test all parameters of each EVM.

2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during thewarranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects torepair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shallbe warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) daywarranty period.

3 Regulatory Notices:3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kitto determine whether to incorporate such items in a finished product and software developers to write software applications foruse with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unlessall required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not causeharmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit isdesigned to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority ofan FCC license holder or must secure an experimental authorization under part 5 of this chapter.3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTIONThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may notcause harmful interference, and (2) this device must accept any interference received, including interference that may causeundesired operation.Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority tooperate the equipment.

FCC Interference Statement for Class A EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment isoperated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if notinstalled and used in accordance with the instruction manual, may cause harmful interference to radio communications.Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required tocorrect the interference at his own expense.

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FCC Interference Statement for Class B EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residentialinstallation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordancewith the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interferencewill not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, whichcan be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or moreof the following measures:

• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210

Concerning EVMs Including Radio Transmitters:This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:(1) this device may not cause interference, and (2) this device must accept any interference, including interference that maycause undesired operation of the device.

Concernant les EVMs avec appareils radio:Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationest autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doitaccepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna typeand its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary forsuccessful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna typeslisted in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.

Concernant les EVMs avec antennes détachablesConformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type etd'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillageradioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotroperayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Leprésent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans lemanuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antennenon inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation del'émetteur

3.3 Japan3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certifiedby TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law ofJapan to follow the instructions below with respect to EVMs:1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal

Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule forEnforcement of Radio Law of Japan,

2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect toEVMs, or

3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japanwith respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please notethat if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

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http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page


【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けていないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用

いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・イ

ンスツルメンツ株式会社東京都新宿区西新宿６丁目２４番１号西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

SPACER4 EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOTLIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handlingor using the EVM, including without limitation any warning or restriction notices. The notices contain important safety informationrelated to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user

guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable andcustomary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to inputand output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, orproperty damage. If there are questions concerning performance ratings and specifications, User should contact a TIfield representative prior to connecting interface electronics including input power and intended loads. Any loads appliedoutside of the specified output range may also result in unintended and/or inaccurate operation and/or possiblepermanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting anyload to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuitcomponents may have elevated case temperatures. These components include but are not limited to linear regulators,switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using theinformation in the associated documentation. When working with the EVM, please be aware that the EVM may becomevery warm.

4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with thedangers and application risks associated with handling electrical mechanical components, systems, and subsystems.User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronicand/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safelylimit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility andliability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors ordesignees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes allresponsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility andliability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and localrequirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurateas possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites asaccurate, complete, reliable, current, or error-free.

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SPACER6. Disclaimers:

6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THEDESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHERWARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANYTHIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS ANDCONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANYOTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRDPARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANYINVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OFTHE EVM.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITSLICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANYHANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATIONSHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANYOTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,

INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESETERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HASBEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITEDTO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODSOR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALLBE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATIONARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVMPROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDERTHESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCEOF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS ANDCONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not ina resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicableorder, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating tothese terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive reliefin any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2015, Texas Instruments Incorporated

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IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products ApplicationsAudio www.ti.com/audio Automotive and Transportation www.ti.com/automotiveAmplifiers amplifier.ti.com Communications and Telecom www.ti.com/communicationsData Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computersDLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-appsDSP dsp.ti.com Energy and Lighting www.ti.com/energyClocks and Timers www.ti.com/clocks Industrial www.ti.com/industrialInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Security www.ti.com/securityPower Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defenseMicrocontrollers microcontroller.ti.com Video and Imaging www.ti.com/videoRFID www.ti-rfid.comOMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.comWireless Connectivity www.ti.com/wirelessconnectivity

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Documents

DS90UH949-Q1EVM User's Guide