Upload
others
View
11
Download
0
Embed Size (px)
Citation preview
10/07/2017 V6.01
DATA SHEET :
PrimaxPlus100 InGaN White : PQW-SSG
All rights reserved. Product specifications are subject to change without notice.
Applications:
> Automotive Interior Lighting (Dome lamp, map lighting, and trunk lighting)> Industrial Illumination.> White Goods Lighting.
DOMINANTOpto TechnologiesInnovating Illumination
TM
Features:
> Super high brightness surface mount LED> 120° viewing angle.> Compact package outline (LxW) of 3.7 x 3.5 mm.> Ultra low height profile - 0.8mm.> Low thermal resistance.> Compatible to IR reflow soldering.> Environmental friendly; RoHS compliance.> Compliance to automotive standard; AEC-Q101.> Passed Corrosion Resistant Test. Appx. 4.1
PrimaxSynonymous with function and performance, enter the Primax, the new era of high intensity illumination in LED. With its high flux output and high luminous intensity, Primax transcends today LED lightings technology and how we perceive it. The small package outline and high intensity make it an ideal choice for backlighting, signage, exterior automotive lighting and decorative lighting.
10/07/2017 V6.02
Part OrderingNumber
Color ViewingAngle˚
Luminous Flux @ 100mA (lm) Appx. 1.2
PQW-SSG-QR3-1 White 120 30.6
Electrical Characteristics at Tj=250CVf @ If = 100 mA Appx. 3.1
3.1
Part NumberMin. (V) Typ. (V) Max. (V)
PQW-SSG 2.8 3.4
Unit
Absolute Maximum RatingsMaximum Value
DC forward current
Peak pulse current (tp ≤ 10ms, Duty cycle = 0.5)
Reverse voltage
ESD threshold (HBM)
LED junction temperature
Operating temperature
Storage temperature
Thermal resistance- Real Thermal Resistance Junction / ambient, Rth JA real (Typ = 90K/W) Junction / solder point, Rth JS real (Typ = 30K/W)(Mounting on DOMINANT standard PCB)
180
360
5
2000
150
-40 … +125
-40 … +125
12045
mA
mA
V
V
˚C
˚C
˚C
K/WK/W
Optical Characteristics at Tj=250C
Min. Typ. Max.
39.8 51.7
Vr @ Ir = 10uAMin. (V)
5
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Notes:1. High color rendering index (CRI). Minimum CRI of 80.
10/07/2017 V6.03
PQW-SSG, Color Grouping Appx. 2.1
Color Bin Structure
Bin0.29600.25900.291
0.26800.30450.27150.30050.28250.32880.30810.32880.32820.33860.32350.33860.34260.31000.29700.30700.3120
CxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCy
0.29100.26800.28500.27900.30050.28250.29600.29550.32880.32820.32880.34530.33860.34260.33860.35910.31970.31310.31890.3302
0.30050.28250.29600.29550.31000.29700.30700.31200.33860.34260.33860.35910.34840.35710.34840.37300.32050.29560.31970.3131
0.30450.27150.30050.28250.31300.28400.31000.29700.33860.32350.33860.34260.34840.33880.34840.35710.31300.28400.31000.2970
1 2 3 4
JK
JL
KK
KL
NK
NL
OK
OL
LK
LL
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
150 InGaN White: NAW-BHG
26/12/2012 V4.04
NAW-BHG, White Color Grouping
Chromaticity coordinate groups are measured with an accuracy of ± 0.01.
Bin
JK
JL
KK
KL
NK
NL
OK
OL
LK
LL
MK
ML
0.29600.25900.291
0.26800.30450.27150.30050.28250.32880.30810.32880.32820.33860.32350.33860.34260.31000.29700.30700.31200.31970.31310.31890.3302
Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy
0.29100.26800.28500.27900.30050.28250.29600.29550.32880.32820.32880.34530.33860.34260.33860.35910.31970.31310.31890.33020.32880.32820.32880.3452
0.30050.28250.29600.29550.31000.29700.30700.31200.33860.34260.33860.35910.34840.35710.34840.37300.32050.29560.31970.31310.32880.30810.32880.3282
0.30450.27150.30050.28250.31300.28400.31000.29700.33860.32350.33860.34260.34840.33880.34840.35710.31300.28400.31000.29700.32050.29560.31970.3131
1 2 3 4
White Bin Structure
DOMINANTOpto TechnologiesInnovating Illumination
TM
0.2300
0.2400
0.2500
0.2600
0.2700
0.2800
0.2900
0.3000
0.3100
0.3200
0.3300
0.3400
0.3500
0.3600
0.3700
0.3800
0.3900
0.2700 0.2800 0.2900 0.3000 0.3100 0.3200 0.3300 0.3400 0.3500 0.3600 0.3700
JL
JK
KL
KK
LL
LK
NK
NL
OL
ML
PL
PK
OK
MK
10/07/2017 V6.04
Bin0.31970.31310.31890.33020.34840.33880.34840.3571
CxCyCxCyCxCyCxCy
0.32880.32820.32880.34520.34840.35710.34840.3730
0.32880.30810.32880.32820.35820.37150.35820.3792
0.32050.29560.31970.31310.35820.35420.35820.3715
1 2 3 4
MK
ML
PK
PL
InGaN wavelength is very sensitive to drive current. Operating at lower current is not recommended and may yield unpredictable performance. Current pulsing should be used for dimming purposes.
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
10/07/2017 V6.05
Q2Q3R2R3
30.6 ... 34.834.8 ... 39.839.8 ... 45.245.2 ... 51.7
Brightness Group Luminous Flux (lm) Appx. 1.2
Luminous Intensity Group at Tj=250C
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Vf Binning (Optional)
Forward Voltage (V) Appx. 3.1Vf @ If = 100mA
V1
V2
V3
2.80 ... 3.00
3.00 ... 3.20
3.20 ... 3.40
Please consult sales and marketing for special part number to incorporate Vf binning.
10/07/2017 V6.06
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C
Forward Voltage VF (V)Forward Current IF (mA)
Forw
ard
Cur
rent
I F (m
A)
Rel
ativ
e Lu
min
ous
Flux
Фre
lFo
rwar
d C
urre
nt I F (
mA
)
Temperature T(°C)
Maximum Current Vs TemperatureIF=f(T)
Forward Current IF (mA)
Rel
ativ
e Lu
min
ous
Flux
Фre
l
Wavelength λ (nm)
∆Cx,
∆C
y
Allo
wab
le F
orw
ard
Cur
rent
I F( m
A )
Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10ms )
Duty Ratio, %
Chromaticity Coordinate Shift Vs Forward Current∆Cx, ∆Cy = f(IF);Tj = 25°C
Relative Spectral EmissionФrel = f(λ); Tj = 25°C; IF = 100mA
Relative Luminous Flux Vs Forward CurrentФV/ФV(100mA) = f(IF); Tj = 25°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 20 40 60 80 100 120 140 160 1800
20
40
60
80
100
120
140
160
180
2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4
Rel
ativ
e Lu
min
ous
Flux
Фre
l
Forw
ard
Cur
rent
I F
Forward Current IF (mA)
Relative Lumionous Flux Vs Forward CurrentФV/ФV(100mA) = f(IF); Tj = 25°C
Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C
Forward Voltage VF (V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
350 400 450 500 550 600 650 700 750 800 850
Rel
ativ
e Lu
min
ous
Flux
Фre
l
Relative Spectral EmissionФrel = f(λ); Tj = 25°C; IF = 100mA
Wavelength λ (nm)
Forw
ard
Cur
rent
I F(m
A)Maximum Current Vs Temperature
IF = f (T)
Temperature T(°C)
Allo
wab
le F
orw
ard
Cur
rent
I F( m
A )
Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10ms )
Duty Ratio, %
10
100
1000
0.1 1 10 100
Ta Ts
0
20
40
60
80
100
120
140
160
180
200
0 20 40 60 80 100 120 140
Ta = Ambient TemperatureTs = Solder Point Temperature
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 20 40 60 80 100 120 140 160 1800
20
40
60
80
100
120
140
160
180
2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4
Rel
ativ
e Lu
min
ous
Flux
Фre
l
Forw
ard
Cur
rent
I FForward Current IF (mA)
Relative Lumionous Flux Vs Forward CurrentФV/ФV(100mA) = f(IF); Tj = 25°C
Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C
Forward Voltage VF (V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
350 400 450 500 550 600 650 700 750 800 850
Rel
ativ
e Lu
min
ous
Flux
Фre
l
Relative Spectral EmissionФrel = f(λ); Tj = 25°C; IF = 100mA
Wavelength λ (nm)
Forw
ard
Cur
rent
I F(m
A)
Maximum Current Vs TemperatureIF = f (T)
Temperature T(°C)
Allo
wab
le F
orw
ard
Cur
rent
I F( m
A )
Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10ms )
Duty Ratio, %
10
100
1000
0.1 1 10 100
Ta Ts
0
20
40
60
80
100
120
140
160
180
200
0 20 40 60 80 100 120 140
Ta = Ambient TemperatureTs = Solder Point Temperature
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 20 40 60 80 100 120 140 160 1800
20
40
60
80
100
120
140
160
180
2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4
Rel
ativ
e Lu
min
ous
Flux
Фre
l
Forw
ard
Cur
rent
I F
Forward Current IF (mA)
Relative Lumionous Flux Vs Forward CurrentФV/ФV(100mA) = f(IF); Tj = 25°C
Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C
Forward Voltage VF (V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
350 400 450 500 550 600 650 700 750 800 850
Rel
ativ
e Lu
min
ous
Flux
Фre
l
Relative Spectral EmissionФrel = f(λ); Tj = 25°C; IF = 100mA
Wavelength λ (nm)
Forw
ard
Cur
rent
I F(m
A)
Maximum Current Vs TemperatureIF = f (T)
Temperature T(°C)
Allo
wab
le F
orw
ard
Cur
rent
I F( m
A )
Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10ms )
Duty Ratio, %
10
100
1000
0.1 1 10 100
Ta Ts
0
20
40
60
80
100
120
140
160
180
200
0 20 40 60 80 100 120 140
Ta = Ambient TemperatureTs = Solder Point Temperature
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 20 40 60 80 100 120 140 160 1800
20
40
60
80
100
120
140
160
180
2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4
Rel
ativ
e Lu
min
ous
Flux
Фre
l
Forw
ard
Cur
rent
I FForward Current IF (mA)
Relative Lumionous Flux Vs Forward CurrentФV/ФV(100mA) = f(IF); Tj = 25°C
Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C
Forward Voltage VF (V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
350 400 450 500 550 600 650 700 750 800 850
Rel
ativ
e Lu
min
ous
Flux
Фre
l
Relative Spectral EmissionФrel = f(λ); Tj = 25°C; IF = 100mA
Wavelength λ (nm)
Forw
ard
Cur
rent
I F(m
A)
Maximum Current Vs TemperatureIF = f (T)
Temperature T(°C)
Allo
wab
le F
orw
ard
Cur
rent
I F( m
A )
Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10ms )
Duty Ratio, %
10
100
1000
0.1 1 10 100
Ta Ts
0
20
40
60
80
100
120
140
160
180
200
0 20 40 60 80 100 120 140
Ta = Ambient TemperatureTs = Solder Point Temperature
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 20 40 60 80 100 120 140 160 1800
20
40
60
80
100
120
140
160
180
2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4
Rel
ativ
e Lu
min
ous
Flux
Фre
l
Forw
ard
Cur
rent
I F
Forward Current IF (mA)
Relative Lumionous Flux Vs Forward CurrentФV/ФV(100mA) = f(IF); Tj = 25°C
Forward Current Vs Forward VoltageIF = f(VF); Tj = 25°C
Forward Voltage VF (V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
350 400 450 500 550 600 650 700 750 800 850
Rel
ativ
e Lu
min
ous
Flux
Фre
lRelative Spectral Emission
Фrel = f(λ); Tj = 25°C; IF = 100mA
Wavelength λ (nm)
Forw
ard
Cur
rent
I F(m
A)
Maximum Current Vs TemperatureIF = f (T)
Temperature T(°C)
Allo
wab
le F
orw
ard
Cur
rent
I F( m
A )
Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10ms )
Duty Ratio, %
10
100
1000
0.1 1 10 100
Ta Ts
0
20
40
60
80
100
120
140
160
180
200
0 20 40 60 80 100 120 140
Ta = Ambient TemperatureTs = Solder Point Temperature
∆Cx
∆Cy
-0.04
-0.03
-0.02
-0.01
0.00
0.01
0.02
0.03
0.04
0 20 40 60 80 100 120 140 160 180-0.80
-0.60
-0.40
-0.20
0.00
0.20
0.40
0.60
0.80
0 10 20 30 40 50 60 70 80
Rel
ativ
e W
avel
engt
h λ r
el
Relative Wavelength Shift Vs Forward Current
Forward Current IF (mA)
∆Cx,
∆C
y
Chromaticity Coordinate Shift Vs Forward Current∆Cx, ∆Cy = f(IF);Tj = 25°C
Forward Current IF (mA)
10/07/2017 V6.07
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Radiation Pattern
Junction Temperature Tj(°C)
Rel
ativ
e Fo
rwar
d Vo
ltage
∆V F (
V)
Junction Temperature Tj(°C)
Rel
ativ
e Lu
min
ious
Flu
x Ф
rel
Junction Temperature Tj(°C)
∆Cx
, ∆C
yChromaticity Coordinate Shift Vs Junction Temperature
∆Cx, ∆Cy = f(Tj); IF = 100mA
0.270°
90°
80°
0
60°
50°
40°
30° 20°
0.6
0.4
1.0
0.8
10° 0°
-0.5
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
-50 -30 -10 10 30 50 70 90 110 130 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -30 -10 10 30 50 70 90 110 130 150
Rel
ativ
e Fo
rwar
d Vo
ltage
∆V F
(V)
Relative Forward Voltage Vs Junction Temperature
Junction Temperature Tj(°C)
Rel
ativ
e Lu
min
ious
Flu
x Ф
rel
Relative Luminious Flux Vs Junction TemperatureФV/ФV(25°C) = f(Tj); IF = 100mA
Junction Temperature Tj(°C)
-0.5
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
-50 -30 -10 10 30 50 70 90 110 130 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -30 -10 10 30 50 70 90 110 130 150
Rel
ativ
e Fo
rwar
d Vo
ltage
∆V F
(V)
Relative Forward Voltage Vs Junction Temperature
Junction Temperature Tj(°C)
Rel
ativ
e Lu
min
ious
Flu
x Ф
rel
Relative Luminious Flux Vs Junction TemperatureФV/ФV(25°C) = f(Tj); IF = 100mA
Junction Temperature Tj(°C)
Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF =100mA
Relative Luminous Flux Vs Junction TemperatureФV/ФV(25°C) = f(Tj); IF = 100mA
-10.0
-8.0
-6.0
-4.0
-2.0
0.0
2.0
4.0
6.0
8.0
10.0
-50 -30 -10 10 30 50 70 90 110 130 150
∆Cx
∆Cy
-0.05
-0.04
-0.03
-0.02
-0.01
0.00
0.01
0.02
0.03
0.04
0.05
-50 -30 -10 10 30 50 70 90 110 130 150
Rel
ativ
e W
avel
engt
h ∆λ
dom
(nm
)
Relative Wavelength Vs Junction Temperature∆λdom = λdom - λdom (25°C) = f(Tj); IF = 100mA
∆Cx,
∆C
yChromaticity Coordinate Shift Vs Junction Temperature
∆Cx, ∆Cy = f(Tj); IF = 100mA
Junction Temperature Tj(°C) Junction Temperature Tj(°C)
10/07/2017 V6.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
NiPdAu Plating
Note: This product is Pb free
14/06/2016 V3.08
PrimaxPlus • 180 InGaN White: MBWW-KZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone Resin
Au Plating
Note: This product is Pb free
180 InGaN White: MBWW-KZHGDOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
12/10/2016 V3.0
7
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14
PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx
Page 1 of 9
PRELIMINARY
UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to
change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG 31/05/2013 V1.0
7
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.0
8
PrimaxPlus 100 InGaN White: PQW-SSG Package OutlinesInGaN White: PQW-SSG
DOMINANT
Opto Technologies
Innovating IlluminationTM
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13
PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx
Page 1 of 14
PRELIMINARY
UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to
change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG08/12/2016 V7.0
10
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.0
6
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.0
7
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14
PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx
Page 1 of 9
PRELIMINARY
UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to
change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG 31/05/2013 V1.0
7
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.0
8
PrimaxPlus 100 InGaN White: PQW-SSG Package OutlinesInGaN White: PQW-SSG
DOMINANT
Opto Technologies
Innovating IlluminationTM
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13
PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx
Page 1 of 14
PRELIMINARY
UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to
change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG08/12/2016 V7.0
10
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.0
6
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Notes:Primary thermal path is through Cathode lead of LED package.General tolerance: +/- 0.1mm.
10/07/2017 V6.09
Recommended Solder Pad
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
10/07/2017 V6.010
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Taping and orientation
• Reels come in quantity of 1000 units.• Reel diameter is 180 mm.
10/07/2017 V6.011
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Packaging Specification
26/01/2015 V2.011
Packaging Specification
DOMINANTOpto TechnologiesInnovating Illumination
TM
350 InGaN White: MAW-YZHG
10/07/2017 V6.012
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Packaging Specification
Average 1pc PrimaxPlus 1 completed bag (1000pcs)
0.034 190 ± 10Weight (gram)
CardboardBox
Dimensions (mm) Empty BoxWeight (kg)
Super Small
Small
Medium
Large
For PrimaxPlus
Reel / BoxCardboard BoxSize
Weight (gram) 0.034 230 ± 10
DOMINANT TM
Moisture sensitivity level
Moisture absorbent material +Moisture indicator
The reel, moisture absorbent material and moisture indicator aresealed inside the moisture proof foil bag
Reel
Barcode label
Label
(L) Lot No : lotno
(P) Part No : partno
(C) Cust No : partno
(G) Grouping : group
(Q) Quantity : quantity
(D) D/C : date code
(S) S/N : serial no
DOMINANT Opto TechnologiesML TEMP2 260˚CRoHS Compliant
Made in Malaysia
325 x 225 x 190
325 x 225 x 280
570 x 440 x 230
570 x 440 x 460
0.38
0.54
1.46
1.92
7 reels MAX
11 reels MAX
48 reels MAX
96 reels MAX
10/07/2017 V6.013
Time (sec)0 50 100 150 200
300
250
225
200
175
150
125
100
75
50
25
275
Tem
pera
ture
(˚C
)Classification Reflow Profile (JEDEC J-STD-020C)
Ramp-up3˚C/sec max.
255-260˚C10-30s
60-150s
Ramp-down
6˚C/secmax.
Preheat 60-180s
480s max
217˚C
Recommended Pb-free Soldering Profile
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
10/07/2017 V6.014
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Appendix
1) Brightness:1.1 Luminous intensity is measured with an internal reproducibility of ± 8 % and an expanded uncertainty of ± 11 % (according to GUM with a coverage factor of k=3).1.2 Luminous flux is measured with an internal reproducibility of ± 8 % and an expanded uncertainty of ± 11 % (according to GUM with a coverage factor of k=3).
2) Color:2.1 Chromaticity coordinate groups are measured with an internal reproducibility of ± 0.005 and an expanded uncertainty of ± 0.01 (accordingly to GUM with a coverage factor of k=3).2.2 DOMINANT wavelength is measured with an internal reproducibility of ± 0.5nm and an expanded uncertainty of ± 1nm (accordingly to GUM with a coverage factor of k=3).
3) Voltage:3.1 Forward Voltage, Vf is measured with an internal reproducibility of ± 0.05V and an expanded uncertainty of ± 0.1V (accordingly to GUM with a coverage factor of k=3).
4) Corrosion Robustness:4.1 Test conditions: 40 °C / 90 % rh / 15 ppm H2S / 336 h. = Stricter than IEC 60068-2-43 (H2S) [25 °C / 75% rh / 10 ppm H2S / 21 days].
Revision History
NOTE
All the information contained in this document is considered to be reliable at the time of publishing. However, DOMINANT
Opto Technologies does not assume any liability arising out of the application or use of any product described herein.
DOMINANT Opto Technologies reserves the right to make changes to any products in order to improve reliability, function
or design.
DOMINANT Opto Technologies products are not authorized for use as critical components in life support devices or sys-
tems without the express written approval from the Managing Director of DOMINANT Opto Technologies.
Subjects
Initial release
Typo error on material
Typo error on weight per unit
Add FeaturesUpdate Peak Pulse Current
Update Real Thermal ResistanceUpdate Graph: Maximum Current Vs Temperature
Add Graph: Allowable Forward Current Vs Duty RatioAdd Appendix
Update Product PhotoUpdate Graph: Forward Current Vs Forward Voltage
Update Package OutlineUpdate Recommended Solder Pad
Add Notes: Minimum CRI of 80
Date of Modification
18 Apr 2016
10 May 2016
22 Jun 2016
19 Dec 2016
17 May 2017
10 Jul 2017
10/07/2017 V6.015
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Page
-
8
12
1, 2, 6, 7, 14
1, 6, 8, 9
2
About Us
DOMINANT Opto Technologies is a dynamic company that is amongst the world’s leading automotive LED manu-facturers. With an extensive industry experience and relentless pursuit of innovation, DOMINANT’s state-of-art manufacturing and development capabilities have become a trusted and reliable brand across the globe. More in-formation about DOMINANT Opto Technologies, a ISO/TS 16949 and ISO 14001 certified company, can be found under http://www.dominant-semi.com.
Please contact us for more information:
DOMINANT Opto Technologies Sdn. BhdLot 6, Batu Berendam, FTZ Phase III, 75350 Melaka, Malaysia.Tel: +606 283 3566 Fax: +606 283 0566E-mail: [email protected]
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM