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Disk testing - status. Disk Test Setup. we use similar setup as the one used for sector tests, only simplified (no C6F14 cooling system, no source test, no thermo cycling) it is based on TPLL, TPCC, SURF board, ISEG HV (8 channels) running TurboDAQ & Ambush - PowerPoint PPT Presentation
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Disk testing - status
Disk Test Setup
• we use similar setup as the one used for sector tests, only simplified (no C6F14 cooling system, no source test, no thermo cycling)
it is based on TPLL, TPCC, SURF board, ISEG HV (8 channels) running TurboDAQ & Ambush
• Power supplies are not GPIB controlled
• cable length of ~20ft (6m) does not cause any problem so far…
(TPCC-SURF board, LV, HV, USB)
• at this moment we test only 1 module on the sector but it could be
extended if more sophisticated cooling ensured (air flow fan-out)
First sector (9017) mounted on the disk
Air flow cooling – bottom view
Testing – reduced set of sector tests
Following tests have been used (so far):
• SRAM digital scan
• DFIFO digital scan
• Column pair digital scan
• Threshold scan (HV=150V)
• Threshold scan (antikill mode)
• Crosstalk scan
We skipped HV I-V scan, source scan,…
We use module configuration files created at significantly lower temp (~16 degr.C) and our tests are done at temperature ~28 degr.C however doesn’t seem to be a problem
NTC Temperature - Cooling of 1 powered module at the sector (no HV)
10
15
20
25
30
35
40
45
0 10 20 30 40 50 60Time [min]
Tem
p [d
egr.
C]
start-up (module configured)air flow 50ft3/h
flow reduced to 25ft3/h
valve closed
high current state after Th scan
IR1
IR2
NTC= 29 degr.C
IR1 image – cooling applied (air flow ~50ft3/h)
NTC= 35 degr.C
IR2 image – no cooling applied (valve closed)
Disc ID: TOP modules 20212000019017
Note Category Test Group Units
A
T (ºC) 16.8 15.6 28.0 16.5 16.7 28.0 18.5 16.8 28.0I (uA) 26.3 11.7 0.0 14.7 23.0 0.0 0.7 0.7 0.0
NTC T (ºC) 20.0 18.7 28.0 19.7 19.1 28.0 23.6 19.5 28.0Digital bad pixel No. 0 0 0 0 0 0 0 0 0ANA_BAD No. 6 6 6 45 45 45 52 55 57DISC_BAD No. 0 0 0 0 0 0 0 0 0XTALK_BAD No. 1 0 0 2 2 2 0 0 5
Analog bad pixel No. 7 6 6 47 47 47 52 55 62TOTAL BAD PIXELS No. 7 6 6 47 47 47 52 55 62Average noise e 194 194 196 198 198 200 193 194 195Threshold dispersion e 68 63 58 73 82 59 64 66 60
Qual Data Summary of Disk Assembly: Electrical Test
M3
510217AMS
M2
511494AMS
M1
510558AMS
B
BURN/LOAD/DISKC
Module ID
BURN/LOAD/DISK
Module Type (AMS / IZM)
Sensor I_ leakage @ 150 V
Disc ID:BOTTOM modules 20212000019017
Note Category Test Group Units
A
T (ºC) 16.7 16.6 28.0 16.8 18.8 28.0 16.6 16.1 28.0I (uA) 0.2 0.3 0.0 0.6 0.6 3.7 15.7 11.7 0.0
NTC T (ºC) 21.0 20.0 28.0 21.5 21.7 28.0 23.6 19.0 28.0Digital bad pixel No. 0 0 0 1 1 1 0 0 0ANA_BAD No. 0 0 0 109 109 109 3 4 4DISC_BAD No. 0 0 0 0 0 0 0 0 0XTALK_BAD No. 0 0 0 0 0 0 6 6 6
Analog bad pixel No. 0 0 0 109 109 109 9 10 10TOTAL BAD PIXELS No. 0 0 0 110 110 110 9 10 10Average noise e 204 202 202 198 198 200 190 189 192Threshold dispersion e 98 99 94 84 93 78 83 87 85
511448
M6
AMS
M4
511355IZM
M5
510648AMS
B
BURN/LOAD/DISKC
Module ID
BURN/LOAD/DISK
Module Type (AMS / IZM)
Sensor I_ leakage @ 150 V
Test results of sector 9017 (top and bottom modules separately)
Next steps
• air flow cooling seems to be sufficient way to keep modules at safe
temperature during testing however the cooling setup should be
improve to ensure operation without risk of module damage
• ISEG (HV PS) does not seem to be reliable – communication with
PC frequently hanging (fortunately HV stays ON), after restarting of
PC is needed…
• we have to check carefully HV current @150V (has not been done
due to ISEG problems)
• in principal, we are ready to move the setup to bldg.77 (clean room)