Dis

asse

mbl

y

Ove

rvie

w2

-1

2.Disassembly

Cha

pter

2: D

isas

sem

bly

This

cha

pter

pro

vide

s st

ep-b

y-st

ep in

stru

ctio

ns f

or d

isas

sem

blin

g th

e X7

200

serie

s no

tebo

ok’s

par

ts a

nd s

ubsy

stem

s.W

hen

it co

mes

to re

asse

mbl

y, re

vers

e th

e pr

oced

ures

(unl

ess o

ther

wis

e in

dica

ted)

.

We

sugg

est y

ou c

ompl

etel

y re

view

any

pro

cedu

re b

efor

e yo

u ta

ke th

e co

mpu

ter a

part.

Proc

edur

es su

ch a

s upg

radi

ng/re

plac

ing

the

RA

M, o

ptic

al d

evic

e an

d ha

rd d

isk

are

incl

uded

in th

e Use

r’s M

anua

l but

are

repe

ated

her

e fo

r you

r con

veni

ence

.

To m

ake

the

disa

ssem

bly

proc

ess

easi

er e

ach

sect

ion

may

hav

e a

box

in th

e pa

ge m

argi

n. In

form

atio

n co

ntai

ned

unde

rth

e fig

ure

# w

ill g

ive

a sy

nops

is o

f the

sequ

ence

of p

roce

dure

s inv

olve

d in

the

disa

ssem

bly

proc

edur

e. A

box

with

a

lists

the

rele

vant

par

ts y

ou w

ill h

ave

afte

r the

dis

asse

mbl

y pr

oces

s is c

ompl

ete.

Not

e: T

he p

arts

list

ed w

ill b

e fo

r the

dis

-as

sem

bly

proc

edur

e lis

ted

ON

LY, a

nd n

ot a

ny p

revi

ous d

isas

sem

bly

step

(s) r

equi

red.

Ref

er to

the

part

list f

or th

e pr

evi-

ous d

isas

sem

bly

proc

edur

e. T

he a

mou

nt o

f scr

ews

you

shou

ld b

e le

ft w

ith w

ill b

e lis

ted

here

als

o.

A b

ox w

ith a

w

ill a

lso

prov

ide

any

poss

ible

hel

pful

info

rmat

ion.

A b

ox w

ith a

c

onta

ins w

arni

ngs.

An

exam

ple

of th

ese

type

s of b

oxes

are

show

n in

the

side

bar.

Dis

asse

mbl

y

2-

2O

verv

iew

2.Disassembly

NO

TE:

All

disa

ssem

bly

proc

edur

es a

ssum

e tha

t the

syst

em is

turn

ed O

FF, a

nd d

isco

nnec

ted

from

any

pow

er su

pply

(the

batte

ry is

rem

oved

too)

.

The

follo

win

g to

ols a

re re

com

men

ded

whe

n w

orki

ng o

n th

e no

tebo

ok P

C:

Con

nect

ions

with

in th

e co

mpu

ter a

re o

ne o

f fou

r typ

es:

Lock

ing

colla

r soc

kets

for r

ibbo

n co

nnec

tors

To re

leas

e the

se co

nnec

tors

, use

a sm

all f

lat-h

ead

scre

wdr

iver

toge

ntly

pry

the

lock

ing

colla

r aw

ay fr

om it

s bas

e. W

hen

repl

ac-

ing

the

conn

ectio

n, m

ake

sure

the

conn

ecto

r is

orie

nted

in th

esa

me

way

. The

pin

1 si

de is

usu

ally

not

indi

cate

d.

Pres

sure

sock

ets f

or m

ulti-

wire

con

nect

ors

To r

elea

se th

is co

nnec

tor

type

, gra

sp it

at i

ts h

ead

and

gent

lyro

ck it

from

sid

e to

sid

e as

you

pul

l it o

ut. D

o no

t pul

l on

the

wire

s th

emse

lves

. Whe

n re

plac

ing

the

conn

ectio

n, d

o no

t try

tofo

rce

it. T

he so

cket

onl

y fit

s one

way

.

Pres

sure

sock

ets f

or ri

bbon

con

nect

ors

To re

leas

e th

ese

conn

ecto

rs, u

se a

smal

l pai

r of n

eedl

e-no

se p

li-er

s to

gen

tly li

ft th

e co

nnec

tor a

way

from

its

sock

et. W

hen

re-

plac

ing

the

conn

ectio

n, m

ake

sure

the

conn

ecto

r is

orie

nted

inth

e sa

me

way

. The

pin

1 sid

e is

usu

ally

not

indi

cate

d.

Boa

rd-to

-boa

rd o

r mul

ti-pi

n so

cket

sTo

sep

arat

e th

e bo

ards

, gen

tly r

ock

them

fro

m s

ide

to s

ide

asyo

u pu

ll th

em a

part.

If th

e co

nnec

tion

is v

ery

tight

, use

a s

mal

lfla

t-hea

d sc

rew

driv

er -

use

just

eno

ugh

forc

e to

star

t.

Dis

asse

mbl

y

Ove

rvie

w2

-3

2.Disassembly

The

follo

win

g pr

ecau

tions

are

a re

min

der.

To a

void

per

sona

l inj

ury

or d

amag

e to

the

com

pute

r whi

le p

erfo

rmin

g a

re-

mov

al a

nd/o

r rep

lace

men

t job

, tak

e th

e fo

llow

ing

prec

autio

ns:

1.D

on't

drop

it. P

erfo

rm y

our r

epai

rs a

nd/o

r upg

rade

s on

a s

tabl

e su

rface

. If t

he c

ompu

ter f

alls

, the

cas

e an

d ot

her

com

pone

nts

coul

d be

dam

aged

.2.

Don

't ov

erhe

at it

. Not

e th

e pr

oxim

ity o

f any

hea

ting

elem

ents

. Kee

p th

e co

mpu

ter o

ut o

f dire

ct s

unlig

ht.

3.Av

oid

inte

rfer

ence

. Not

e th

e pr

oxim

ity o

f any

hig

h ca

paci

ty tr

ansf

orm

ers,

ele

ctric

mot

ors,

and

oth

er s

trong

mag

-ne

tic fi

elds

. The

se c

an h

inde

r pro

per p

erfo

rman

ce a

nd d

amag

e co

mpo

nent

s an

d/or

dat

a. Y

ou s

houl

d al

so m

onito

r th

e po

sitio

n of

mag

netiz

ed to

ols

(i.e.

scr

ewdr

iver

s).

4.K

eep

it dr

y. T

his

is a

n el

ectri

cal a

pplia

nce.

If w

ater

or a

ny o

ther

liqu

id g

ets

into

it, t

he c

ompu

ter c

ould

be

badl

y da

mag

ed.

5.B

e ca

refu

l with

pow

er. A

void

acc

iden

tal s

hock

s, d

isch

arge

s or

exp

losi

ons.

6.Pe

riphe

rals

– T

urn

off a

nd d

etac

h an

y pe

riphe

rals

.7.

Bew

are

of s

tatic

dis

char

ge. I

Cs,

suc

h as

the

CPU

and

mai

n su

ppor

t chi

ps, a

re v

ulne

rabl

e to

sta

tic e

lect

ricity

. B

efor

e ha

ndlin

g an

y pa

rt in

the

com

pute

r, di

scha

rge

any

stat

ic e

lect

ricity

insi

de th

e co

mpu

ter.

Whe

n ha

ndlin

g a

prin

ted

circ

uit b

oard

, do

not u

se g

love

s or

oth

er m

ater

ials

whi

ch a

llow

sta

tic e

lect

ricity

bui

ldup

. We

sugg

est t

hat

you

use

an a

nti-s

tatic

wris

t stra

p in

stea

d.8.

Bew

are

of c

orro

sion

. As

you

perfo

rm y

our j

ob, a

void

touc

hing

any

con

nect

or le

ads.

Eve

n th

e cl

eane

st h

ands

pro

-du

ce o

ils w

hich

can

attr

act c

orro

sive

ele

men

ts.

9.K

eep

your

wor

k en

viro

nmen

t cle

an. T

obac

co s

mok

e, d

ust o

r oth

er a

ir-bo

rn p

artic

ulat

e m

atte

r is

ofte

n at

tract

ed

to c

harg

ed s

urfa

ces,

redu

cing

per

form

ance

.10

.K

eep

trac

k of

the

com

pone

nts.

Whe

n re

mov

ing

or re

plac

ing

any

part,

be

care

ful n

ot to

leav

e sm

all p

arts

, suc

h as

sc

rew

s, lo

ose

insi

de th

e co

mpu

ter.

Do

not a

pply

cle

aner

dire

ctly

to th

e co

mpu

ter,

use

a so

ft cl

ean

clot

h.D

o no

t use

vol

atile

(pet

role

um d

istil

late

s) o

r abr

asiv

e cl

eane

rs o

n an

y pa

rt of

the

com

pute

r.

Dis

asse

mbl

y

Rem

ovin

g th

e B

atte

ry2

-5

2.Disassembly

1.Tu

rn th

e co

mpu

ter o

ff, a

nd tu

rn it

ove

r.2.

Loos

en s

crew

s -

(Fig

ure

1a)a

nd c

aref

ully

lift

the

batte

ry

up

(Fig

ure

1b).

3.R

emov

e th

e ba

ttery

fr

om th

e ba

ttery

bay

(Fig

ure

1c).

a.

4

b.

23

1

c.

4

Figu

re 1

Bat

tery

Rem

oval

Dis

asse

mbl

y

2-

12R

emov

ing

the

Key

boar

d

2.Disassembly

1.Tu

rn o

ff th

e co

mpu

ter a

nd re

mov

e th

e ba

ttery

(pag

e 2

- 5).

2.R

emov

e sc

rew

s -

from

the

botto

m o

f the

com

pute

r (Fi

gure

8a)

.3.

Turn

the

com

pute

r ove

r, op

en th

e Li

d/LC

D, a

nd c

aref

ully

(a c

able

is c

onne

cted

to th

e un

ders

ide

of th

e LE

D c

over

m

odul

e) u

nsna

p up

the

LED

cov

er m

odul

e fro

m p

oint

o

n th

e rig

ht (F

igur

e 8b

).4.

Dis

conn

ect c

able

a

nd re

mov

e th

e LE

D c

over

mod

ule

(Fig

ure

8c).

Figu

re 8

Key

boar

d R

emov

al

a. b.

23

4

1

c.

5

5

6

6

Dis

asse

mbl

y

Rem

ovin

g th

e K

eybo

ard

2-

13

2.Disassembly

5.R

emov

e sc

rew

s -

from

the

keyb

oard

(Fig

ure

9d).

6.C

aref

ully

lift

the

keyb

oard

up,

bei

ng c

aref

ul n

ot to

ben

d th

e ke

yboa

rd ri

bbon

cab

le

. D

isco

nnec

t the

key

boar

d rib

bon

cabl

e fr

om th

e lo

ckin

g co

llar s

ocke

t (F

igur

e 9e

).7.

Rem

ove

the

keyb

oard

(F

igur

e 9f

).

d.f.

e.

78

9

Keyb

oard

Tab

s

(f)

Figu

re 9

Key

boar

d R

emov

al

(con

t’d.)

Dis

asse

mbl

y

2-

14R

emov

ing

the

Key

boar

d

2.Disassembly

8.R

emov

e sc

rew

s -

from

the

keyb

oard

shi

eldi

ng p

late

(F

igur

e 10

g).

9.Li

ft th

e ke

yboa

rd s

hiel

ding

pla

te u

p in

the

dire

ctio

n of

the

arro

w

(Fig

ure

10h)

.10

.R

emov

e th

e ke

yboa

rd s

hiel

ding

pla

te

(Fig

ure

10i).

g.h.

2 1 i.

Figu

re 1

0K

eybo

ard

Rem

oval

(co

nt’d

.)

Dis

asse

mbl

y

Rem

ovin

g th

e K

eybo

ard

2-

15

2.Disassembly

1.W

hen

re-in

serti

ng th

e ke

yboa

rd s

hiel

ding

pla

te

mak

e su

re y

ou in

sert

it by

slid

ing

it in

to p

ositi

on a

t an

angl

e as

ill

ustra

ted

by a

rrow

b

elow

, and

pre

ss it

dow

n in

to p

ositi

on (F

igur

e 11

a).

2.S

ecur

e th

e pl

ate

with

scr

ews

- (F

igur

e 11

b).

Figu

re 1

1K

eybo

ard

Shie

ldin

g Pl

ate

Inse

rtio

n

14

2

3

5

a.b.

Dis

asse

mbl

y

2-

18R

emov

ing

the

Syst

em M

emor

y (R

AM

)

2.Disassembly

The

com

pute

r has

thre

e m

emor

y so

cket

s for

204

pin

Sm

all O

utlin

e D

ual I

n-lin

e M

emor

y M

odul

es (S

O-D

IMM

) sup

port-

ing

DD

R3

1066

/133

3MH

z. T

he m

ain

mem

ory

can

be e

xpan

ded

up to

12G

B. T

he S

O-D

IMM

mod

ules

sup

porte

d ar

e10

24M

B, a

nd 2

048M

B a

nd D

DR

III M

odul

es. T

he to

tal m

emor

y siz

e is a

utom

atic

ally

det

ecte

d by

the P

OST

rout

ine o

nce

you

turn

on

your

com

pute

r.

1.Tu

rn o

ff th

e co

mpu

ter,

rem

ove

the

batte

ry (p

age

2 - 5

) and

the

keyb

oard

(pag

e 2

- 9).

2.Th

e R

AM

mod

ules

will

be

visi

ble

at p

oint

s -

(Fig

ure

14a)

.3.

Gen

tly p

ull t

he tw

o re

leas

e la

tche

s (

- ) o

n th

e si

des

of th

e m

emor

y so

cket

in th

e di

rect

ion

indi

cate

d by

the

arro

ws

(Fig

ure

14b)

.4.

The

RA

M m

odul

e w

ill p

op-u

p (F

igur

e 14

c), a

nd y

ou c

an th

en re

mov

e it.

Figu

re 1

4 R

AM

Mod

ule

Rem

oval

a.

24

1

b.

3

5

6 7

8 9

c.

Dis

asse

mbl

y

Rem

ovin

g th

e Sy

stem

Mem

ory

(RA

M)

2-

19

2.Disassembly

5.P

ull t

he la

tche

s to

rele

ase

the

seco

nd a

nd th

ird m

odul

es if

nec

essa

ry.

6.In

sert

a ne

w m

odul

e ho

ldin

g it

at a

bout

a 3

0° a

ngle

and

fit t

he c

onne

ctor

s fir

mly

into

the

mem

ory

slot

.7.

The

mod

ule’

s pi

n al

ignm

ent w

ill a

llow

it to

onl

y fit

one

way

. Mak

e su

re th

e m

odul

e is

sea

ted

as fa

r int

o th

e sl

ot a

s it

will

go.

DO

NO

T FO

RC

E th

e m

odul

e; it

sho

uld

fit w

ithou

t muc

h pr

essu

re.

8.P

ress

the

mod

ule

in a

nd d

own

tow

ards

the

mai

nboa

rd u

ntil

the

slot

leve

rs c

lick

into

pla

ce to

sec

ure

the

mod

ule.

9.R

epla

ce th

e ba

y co

ver a

nd s

crew

s (m

ake

sure

you

reco

nnec

t the

fan

cabl

e be

fore

scr

ewin

g do

wn

the

bay

cove

r).

10.

Res

tart

the

com

pute

r to

allo

w th

e B

IOS

to re

gist

er th

e ne

w m

emor

y co

nfig

urat

ion

as it

sta

rts u

p.