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Thin-Film Manufacturing & Product Operation Modeling DAVIS HEMENWAY DIRECT-ENGINEERING AND COLORADO STATE UNIVERSITY

Direct Engineering Thin Film Presentation

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Page 1: Direct Engineering Thin Film Presentation

Thin-Film Manufacturing & Product Operation

ModelingDAVIS HEMENWAY

DIRECT-ENGINEERING AND COLORADO STATE UNIVERSITY

Page 2: Direct Engineering Thin Film Presentation

Outline

Manufacturing Overview Processing Hardware

Modeling Approach Design Improvements and Results

Continuing Work

Product Prototype Operation Design Evaluation and Results Conclusion

Page 3: Direct Engineering Thin Film Presentation

Manufacturing Overview

Thin-film CdTe Photovoltaic (PV) device

TCO front contact

CdS window layer

CdTe absorber layer

Metallic back contact

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Manufacturing Overview

In-line deposition process

Multiple processing stations

3 x 3” PV cell created in under one hour

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Processing Hardware Process stations are graphite crucibles Sublimation used to deposit material

Benefits: High material utilization Moderate temperatures and vacuum

levels required High quality films produced rapidly

Challenges: Film uniformity driven by thermal

uniformity and hardware geometry Deposition hardware costly to machine

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Modeling ApproachThin-Film Processing Hardware

Fluid volume within the source modeled initially Multi-zone mesh created with 160k elements

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Modeling ApproachThin-Film Processing Hardware

Modeling Difficulties: Deposition and condensation surface chemistry Low pressure physics must be accounted for at 40mTorr Flow at walls require special consideration

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Sublimation and condensation are the two dominant reactions that take placeArrhenius rate equation used by Fluent

Sc: Sticking coefficient Calculated after experiments

A: Pre-exponential factor Calculated for each reaction

EA: Activation energy

β: Temperature exponentR: Universal gas constantT: Temperature

Modeling ApproachThin-Film Processing Hardware

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Modeling ResultsThin-Film Processing Hardware

Cd gas molar fraction in the pocket Cd growth rate on the substrate (kg/m2s)

Vapor distribution and film uniformity can be analyzed

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Modeling ResultsThin-Film Processing Hardware

Simulation-based engineering analysis provides otherwise unobtainable insight

Flow lines colored by Cd molar fraction

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Experimental ValidationThin-Film Processing Hardware

Results validated by comparing modeled and deposited film thicknesses

Scanning White Light Interferometry

Sticking coefficient applied from initial experiments

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Experimental ResultsThin-Film Processing Hardware

Modeled film thickness correlates strongly with experimental results

Validated model used to improve new source design before production

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Hardware Design Improvement

Model used to predict film growth Same equations and boundary conditions Different geometry

Improved film uniformity Deeper pocket Shallower wells Gen 1 Gen 2

1st Generation

2nd Generation

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Hardware Redesign Results

The model predicts that the 2nd Generation source should produce more uniform films

1st Generation

Contours of CdS film thickness: Each line represents a 1% change in thickness

2nd Generation

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Hardware Redesign Results

Film uniformity experimentally matches predicted values Uniformity improved by over 70% with one design iteration

1st Generation 2nd Generation

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Continuing Work

Modeling different thin-film material evaporation processes

CdS

CdTe

CuCl

CdCl2

Deposition Rates in (nm/s)

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Continuing Work

Deposition system thermal performance Shielding and temperature control optimization

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Thin Film Product Operation

New thin-film PV module design:

Designed for UV and moisture resistance

No lamination or batching required

Small factory footprint Patent pending

Source: Nordson.com

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Prototype Architecture

Two panes of custom made glass 1200 x 600 x 3.2mm each

2+ encapsulating polymers with additives

Air gap between glass panes

3μm thick semiconductor film

Top Glass

Bottom Glass

Silicone PIB Low cost polymer / desiccant

CdTe Film

Desiccated gap

X-section of module edge

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Modeling ApproachThin Film Product Operation

Over 3 million elements used

Convection boundary conditions obtained from 2D model

Film represented as surface

Wind velocity(m/s)

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Modeling ApproachThin Film Product Operation

Radiation heat transfer must be considered

Real world solar spectrum used

Unique, wavelength-based quantum efficiency of the device accounted for

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Prototype and industry-standard devices modeled and compared

Numerous convection and radiation conditions queried

Operating matrix created to analyze thermal response trends

Modeling ResultsThin Film Product Operation

Film temperature (K)

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Experimental ResultsThin Film Product Operation

Both devices thermal response observed

Real-world solar and wind conditions measured at nearby station

Experimental conditions input as boundary conditions for model

Experimental results match modeled values

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Conclusion

Method for modeling thin-film processing demonstrated

Method can be used to improve hardware before manufacturing

Thin-film product operation in real-world conditions modeled

Simulation is valuable for thin-film processing and product design before manufacturing

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Questions?