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Education and R&D oriented, Accurate Flip-Chip Bonder 3 µmThe ACCµRATM50 flip-chip bonder is a flexible and open platform for accurate placement and bonding. It supports a wide range of assembly applications.
It is particularly well-suited for Education, R&D laboratories and low volume production.
Applications• Micro assembly
• Laser diode, laser bar
• VCSEL, photo diode
• LED
• Flip-chip bonding
• Chip-to-chip, chip-to-substrate bonding
• MOEMS, MEMS, MCM packaging…
• 3D packaging
Highlights• Post-bonding accuracy* (± 3 µm)• Easy to use and very flexible• Quick set up of new applications• Cost-effective• Small footprint and compact design
*depending on configuration and application.
Semi-automatic
5 0Device Bonder
SET Corporation SASmart Equipment Technology
131 impasse Barteudet 74490 Saint-Jeoire - France • Ph: +33 (0)450 35 83 92 • Fax: +33 (0)450 35 88 01 • Email: [email protected]
www.set-sas.fr
Represented by:
SpecificationsMachine Footprint: 820 x 550 mm
Height: 890 mm
Weight: 70 kg
Component sizeChip(Upper die)
0,5 x 0,5 - 22 x 22 mmThickness: 0,3 to 3 mm
Substrate(Lower die)
0,5 x 0,5 - 100 x 200 mmThickness: 0,3 to 6 mm
Bonding armPost-bonding accuracy* ± 3 µm
Z resolution 0,1 µm
Force* 0,5 to 75 N
Bonding headsRoom temperature sq. 22 mm
Heating sq. 22 mm, 400°C
Ultrasonic 55 - 65 kHz, 40 W max
Optics
Digital camera resolution 2 independant cameras 0,44 x 0,34 µm per pixel
Field of view 280 x 200 µm
Automatic alignment Yes
OptionsDispenser Yes
UV Curing system Yes
Substrate chuckRoom temperature 100 x 200 mm
Heating sq. 22 or 50 mm, 400°C
Alignment stageXY stage Resolution 0,1 µm
Theta travel ± 90°, resolution 17 µrad
Data, design and specifications depend on individual process conditions and can vary according to equipment configurations. Not all specifications may be valid simultaneously. Illustrations, photos and specifications in this datasheet are not legally binding. Specifications are subject to change without prior notice.
*depending on configuration and application.
User benefits• Simple design associated to
a user-friendly interface result in quick set-up for new applications
• Ideal for universities and research laboratories
• The pattern recognition system eases low volume pre-production
Main bonding processes• Flip-chip bonding• Pick and place• Thermocompression• Thermosonic
• UV • Reflow• Gold, Gold/Tin, Indium, Copper, UV
or thermal cure adhesives, polymers…