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6500 Die Bonder
Precision Assembly Solutions
Precision Eutectic Die Bonder
6500 Die Bonder The right Die Bonder could determine
the future of your businessThe right Die Bonder could determine
the future of your business
© 2012 Palomar Technologies, Inc. 2www.palomartechnologies.com
6500 Die Bonder• Versatility• Flexible Work Area• Microsoft Windows• Multiple Configurations• Worldwide Technical
Support• Contract Assembly• Cost-Optimization• High Reliability
3© 2012 Palomar Technologies, Inc. www.palomartechnologies.com
6500 Die Bonder
• +/- 1.5 micron (3 sigma) Post-Eutectic Accuracy
• High Accuracy Pick and Place <7 Seconds• < +/- 0.1 Degree Post-Placement Rotation• <10 grams Touch Force, +/- 1 g (3 sigma)• 6 Position Tool Turret• Programmable Eutectic Pulse-Heating• Compact (<24 ft2 Footprint)
System Capabilities:
© 2012 Palomar Technologies, Inc. 4www.palomartechnologies.com
Ultra Fine-Pitch Hybrid Modules
Data Storage
Flip Chip on Glass
MEMS components
High Frequency RF Modules
VCSEL Modules
P-Side Down Laser Attachment
6500 Die Bonder Processes:
© 2012 Palomar Technologies, Inc. 5www.palomartechnologies.com
High Speed Linear Motors
6 tool Bi-Directional
turret
Compact Footprint
Large Work Area
Precision Eutectic Control
Data Mining and
RAM Statistics
DIFFERENTIATING FEATURES
© 2012 Palomar Technologies, Inc. 6www.palomartechnologies.com
Key Features
Advantage:
All pick tools needed are
changed ‘on the fly’. No need to dock/undock.
Benefit:
Faster Throughput.
© 2012 Palomar Technologies, Inc. 7www.palomartechnologies.com
Key FeaturesAdvantage:
System fits within 4x4 foot area
Benefit:
Reduced clean room
cost
Up to twice the UPH in ½ the linear dimensions !
“A”“C”
“D”
© 2012 Palomar Technologies, Inc. 8www.palomartechnologies.com
Key Features
Advantage:
Large 6x12 inch work area.
No need to purchase additional pick/place
heads.
Benefit:Reduced system cost.
© 2012 Palomar Technologies, Inc. 9www.palomartechnologies.com
Key FeaturesAdvantage:
Rapid Cycle Times on a frictionless surface.
Benefit:
Higher UPH, less maintenance, better Cost of Ownership (COO)
© 2012 Palomar Technologies, Inc. 10www.palomartechnologies.com
Key Features
Advantage:
Precise control and process tracking of
temperature profiles within 2
deg. C.
Benefit:
Higher Yield, reduced
development time.
© 2012 Palomar Technologies, Inc. 11www.palomartechnologies.com
Key Features
Advantage:
Automated tracking of
placement and Reliability,
Availablility, and Maintainability
(RAM) statistics.
Benefit:Higher Yield.
© 2012 Palomar Technologies, Inc. 12www.palomartechnologies.com
Key FeaturesAdvantage:
Multiple placement algorithms using
advanced COGNEX vision
systems
Benefit:
Higher Accuracy,
Higher Yield© 2012 Palomar Technologies, Inc. 13www.palomartechnologies.com
Automated Assembly LinesPalomar specializes in building customized automated packaging assembly lines fully integrating:1) Ultra high accuracy die and wire
bonders 2) Customized stages and tooling for
complex components3) Fluid dispensers4) Die ejectors 5) Wafer and magazine handlers 6) Upstream and downstream auer
boat conveyors 7) An array of test and measurement
equipment8) Computerized Paperless
Manufacturing Infrastructure that does data mapping and enables the user to solve problems quickly, closing the feedback loop and cutting cost
9) For factories overseas or away from management, remote access to bonders can be built. This enables management to monitor bonders and create work order flow tags for on-site engineers, operators and technicians
Ultra high accuracy pick and place line for LED print head assembly
Seamless production, improving yield and increasing throughput
6500 Die Bonder
Die Ejector
Fluid Dispenser
Inspector
Mag handler
© 2012 Palomar Technologies, Inc. 14www.palomartechnologies.com
Automated Assembly Lines
LED Print head using Epoxy Die Attach
© 2012 Palomar Technologies, Inc. 15www.palomartechnologies.com
Die Ejector with Wafer Handling
• Size Range: 0.5mm - 13mm• Thickness: 0.1mm - 1.2mm• Die Placement Accuracy:
+/-30um die presentation to 6500 with XY vision aided
• Wafer Input: 200mm, 300mm• Dimensions:
Length: 1.6m
Width: 1.70m
Height: 2.1m
Weight: 1500 kg
16© 2012 Palomar Technologies, Inc. www.palomartechnologies.com
Eutectic Stage• Stage Type
– 1.0 x 1.5 cm heated area, low thermal mass ceramic hot bar
• Ramp Times
- >100°/Sec, +/- 2° control through cycle
• Stage Control – Windows XP Graphical User
• Interface with up to 16 profiles per program
17© 2012 Palomar Technologies, Inc. www.palomartechnologies.com
Performance
• Cycle Times
-1200 UPH *process and material dependent
• Post-Placement Accuracy– 1.5 micron, 3-sigma
• Placement Force– 10-100g, +/- 2g at 3-sigma
18© 2012 Palomar Technologies, Inc. www.palomartechnologies.com
Applications
• P-Side Down Laser Diode Attachment• Silicon Bench (V-Groove) Placement• High Density RF Power Transistors• Ultra-Fine Pitch Hybrid Assemblies• MEMs Componets• VCSEL Modules• Data Storage• High Bright/High Power LED Arrays• Optoelectronic Packaging• LED Printhead Attachment
19© 2012 Palomar Technologies, Inc. www.palomartechnologies.com
6500 Die Bonder Resources
• 6500 Die Bonder data sheet• Pulsed Heat System data sheet• AuSi / AuSn Eutectic Die Attach Case Studies• Micron-Level Placement Accuracy for High Aspect Ratio Die in
Printing Products• Micron-Level Placement Accuracy for Optoelectronic Compone
nts• Micron-Level Placement Accuracy for Wafer Scale Packaging of
P-Side Down Lasers in Optoelectronic Components
www.palomartechnologies.com 21© 2012 Palomar Technologies, Inc.
Corporate Headquarters: +1-760-931-3600
APAC: +65-6686-3096
EMEA: +49-9131-48009-30
Palomar TechnologiesFor more information visit www.palomartechnologies.com
© 2012 Palomar Technologies, Inc. 22www.palomartechnologies.com
