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KSC ENGINEER/NG~ANO TECHNOL.OGY
Development of Meandering WindingMagnetometer (MWM®) Eddy Current Sensors for
the Health Monitoring} Modeling and DamageDetection of High Temperature Composite Materials
Rick Russell, NASA KSC
Dr. David Jablonski, Dr. Andy Washabaugh,
Dr. Yanko Sheiretov, Mr. Christopher Martin
and Dr. Neil Goldfine, JENTEK Sensors, Inc.
32nd HIGH TEMPLE Workshop
February 2, 2012
Palm Springs, CA
https://ntrs.nasa.gov/search.jsp?R=20120004241 2018-11-12T12:17:18+00:00Z
----------------- --
... -,> .
KSC ENGINEERING~ANO TECHNOLOGY
Agenda
• Overview of MWM@ Technology
• Historical application - Space Shuttle RCC
• Recent Developments for COPVs
- Health Monitoring
- NDE
• High Temperature Development
KSC ENGINEERING~ANa TECHNOLOGY
MWM@ Technology
• What is a Meandering Winding Magnetometer (or MWM)?
Primary winding is a linear construct that can be aligned with fibers
Secondary windings for sensing the response
Fabricated on thin flexible substrate creating a conformable sensor
Can be manufactured in various array configurations
Depth of penetration varies with sensor wavelength (spacing) andfrequency
Vendor has capability to perform computer simulations
0.1 ""----'-~'_I..I.I.L___'___J.... ...............L__....L..__'__'__I..Ju..u..L__....L..'__'__'__I..Ju..WI'
l~ 1~ 1~ 1~ 1~
Frequency (Hz)
SeconjaryWindings
ES 2 10.2 mm spatial wavelength
.<:a.~ ' 9C 8o 7.~ 6 3.8 mm spatial wavelength
a; 5
a5 •0..
For a nonmagnetic material withelectrical conductivity of 0.02 %IACS ,10
87
•5
.,• -..f .
_MWM® Arrays and Grid MethodsKSC ENGINEERINGAND TECHNOLOGY
MWM FS36
1 :Ir---- 1.00 ---
1.40-_
11 mm=O.04in.
t U Primary0.25 mm 1 mm
.036 in.
.0875 in.
.050 In.FarChannels
Scan Path Width
MWM-Array
Drive lftftlllltttl!~! Near~Windin JJJl I I nel
, ll~
FA41 A::: 480/190 FA28 A::: 150 mils FS36 A::: 400.0
JE TEKGrid ethods
••
_MWM Sensor SelectionKSC ENGINEERINGAND TECHNOLOGY
• Magnetic field Decays exponentially with distance away from the sensor
• Decay rate determined by skin depth at higher frequencies and sensordimensions at lower frequencies
• Higher frequencies needed to induce significant eddy currents
• Large dimensions needed for thick composites
f..-/4
D~D~
D~D~
D~C~
-w
scanDfrection
..I
Skin depth: 0 =~v~2
105
10e
107
Frequency (Hz)10·
2
3
• 81__-r--;-'t'1'"'M'1m--;-;-""tTt"t~--r-t--rtT1""t"tt"---;---,r-t"""t"1......----;-r-r-r-t"ttft"""----.--r-r-r-n1t1r7, 3
e i.:ih~iirffi~~Ifff\:-:.::i-:----"""-,:::,:~ &. :· L.
3 ;!"", !.... ,I ','" 100
,b---.i:A24!I.&~4..l;",,=. i '- i • . g"2 (basedrosel:lse pasili: r'-":..:.: \'-':'~ :..:--: -'01 8 ~
I I I .... 'I \ .' 7 (1)i i . 'l. ' , . e :;-:: ~"r'" '. II>! ! . ' ,... .:. e e.
---...-.----....~..----...-- -t------------r···- ..-.....---~-._~' ------t-~:.:~.--_···-- .. giii I I 0
I ! ! !'! .~~ 3 (J)
I~----~,-----t-r+,---+~ I -u.::-~._.~,.~. ':"'.: ·'1, ~': I ......... ~ ..... t 2
WM-Anay I '-'-I' '.i! : :~,
: increacl:ing A I, i,' "
I r I I 10.. 10I I I I'" 9
! ! EIectricaJ Conductivity! "8
i i (kSlm) 100 '\ ~" ,I I I 5
0.1 __1---l--'U-U.lU---l--l--U-l-I-I-ll--4.--!-...w..u-l-U--~_l_W..uu_~W-4-J-UU-~-l-U.u.ulI.
103
Application: Space Shuttle Orbiter RCC PanelsKSC ENGINEERING~AND TECHNOLOGY
• Foam wheels protect surface• Manual scanning for complex surfaces• C-Scan images of wide areas
built from multiple passes• Adapts automatically to variedcurvatures
Application: Space Shuttle Orbiter RCCKSC ENGINEERING~ PaneIsAND TECHNOLOGY
Blind Test Rec Sample Provided by NASA Langley Research Center
• Scan width = 3- sen ing element = 3. in.• Scans perfOlmed at 1 in.! ec.
Lift-Off Image
Throu2hput: 3.7 in. x 12 in. 'can in 12 econds = 3.7 sq. in. "ec
....KSC ENGINEERINGANO TECHNOLOGY
COPV Testing - Effect of FiberOrientation
0_08"AI Liner
12 .. 10'
11
11
'-0
, aDe 09
08 0.9
15.84 MHz - Magnitude va. X axis
05 0.6 07XUls{deQ)
a.
O' 0.5 06 07Xllll(ls(de~
02 0.30100
0623
062'
0627
oem
0629
0622
0"'"
-30
-25
-20
• Multiple fiber orientations in several different layers
• Orientation measurements with FS33
- 15.8 MHz data indicated
• Limited penetration depth of MWM so outermost hoop (900) layer barely visible
~KSC ENGINEERINGAND TECHNOLOGY
COPV - Health MonitoringProof of Concept Coupon Testing
Stresses produced by compressive loading oftapered wedges
• Coupon cut from center section ofCOPV (""4// wide)
• Two test fixtures designed
• Due to cutting only hoop directioncould be measured
• Several different sensor designs andorientations were tested
Stresses produced by tensileloading of specially design test
fixture
1.0025
1.0020
1.0015
:0-1.0010Q)
J:!IVE 1.0005~
~ 1.0000Q)
-g.-t:::: 0.9995CC)IV:;: 0.9990
0.9985
0.99800 20 40 60 80 100 120 140 160 180 200
Set Number
Example of results from compressiveloading of tapered wedges test 9
......
KSC ENGINEERING ......AND TECHNDLOGY
COPV - Health MonitoringProof of Concept Hydrostatic Test
• Full COPV tested hydrostatically at KSC on February 5, 2011
• Vessel cycled to 8,000 psi and back to zero stopping at 2,000 psi increments
- Pressure chosen to mimic MEOP
- Estimated design burst pressure of COPV is 16,000 psi
• Based on coupon tests 3 sensor configurations were chosen
- Different wavelength to obtain various depth of penetration
• Tests were performed with 3 sensor orientations
- 90Q, 60Q and 17Q to align sensor drive with fiber orientations
-------------------------------------------------------_. --------------
COPV - Health Monitoring~,eg~~gk'XF&~~~~roof of Concept Hydrostatic Test
""(A_til..
1.0'1"
Ion:s... I .
eC)III
::EQ.08" '1:l ,~
CI
.. Q.l!25'" ~
.. 0.05'" E~
0 0"0.05'" Z
I.. 0.05'"
.. 0.1125" !
~ 10 ., Zl
Pressurization IntervalAxial strain
...
20
-.....-------,
o uPressurization Interval
5
I17·SensorOrientalion60· SensorOrientalion90· Sensor Orientationo."'~
o
4)on~ 1.Dl»8cC)
::Eon1liiiE0oZ
""'II
Hoop strain
• <......
KSC ENGINEERING~AND TECHNOLOGY
COPV NDE
• Four COPVs selected from NASA White Sandsinventory
• Scanned via MWM before and after impact testing
KSC ENGINEEA/NG ....AND TECHNOLOGY
Rotation Scans
FA28 W ..Array Scan
" :7, , ~
•
Jest setup for hoop oriented fibersKSC ENGINEERING.allUn Ttt:r-WllUn, ,..,,..,v
.-~
~KSC ENGINEERINGAND TECHNOLOGY
Lift-Off Image Low Frequency
Before Impact Damage
axial • •
After Impact Damage Baseline Subtracted Preliminary Filtering
• Sample AC5250-030; 90 0 Sensor drive orientation• Higher impact energy results in larger dents in the aluminum liner• Sensor: MWM-Array FA24• 50.11 kHz
• y .."
KSC ENGINEERING~AND TECHNOLOGY
Lift-Off Image High Frequency
Before Impact Damage
axial • ~
After Impact Damage
........-------~.
Baseline Subtracted Preliminary Filtering
• Sampte AC5250-030; 900 Sensor drive orientation• Sensor: MWM-Array FA24• 5.011 MHz
......."
KSC ENGINEERING~ANO TECHNOL.OGY
Scan of COPV with Insulation Blanket
Lift-off C-scan for COPY AC5251-005 without an MLilayer (50 kHz)
Test Setup
Lift-off C-scan for COpy AC5251-005 with a conductiveMLI layer placed over the COPY (50 kHz)
"
.,.,-.
KSC ENGINEERING ......AND TECHNOLOGY
Composite Structure Impact Damage
Detection
Composite Specimen withImpact Damage on Scanning Bed
Specimen provided by Lockheed Martin 15.84MHz image taken withscanning MWM-Array for
effective conductjvity
Proximity
MWM-Array imageof proximity to first
fiber layer
.. ..~.
KSC ENGINEEA/NG~AND TECHNOLOGY
Composite Property Variation withStress
PerpendicularParallel-45
•Bending Strain Direction
FA28 orientation tosurface fibers: +45
FA28. onentation to surface fibers:- .... - parallel (with 8 mR shim)-+- perpendicular (with 8 mil shim)..•. -45
-. 45
"
'.
--------------.--------------..
...•.'"
'"
6
4
2
o ...........•...
-2
-4
•...... ....
OAO0.350.20 0.25 0.30
Strain %0.15010
-6O::-__-!--_---.J~_ __4.__~___l____l___ _____.:I:I
0.05
.... ' ......
High TemperatureMWM-Array Sensor
Room TemperatureMWM-Array Sensor
Development of a High Temperature~f!&g f.'lgkl\ffcfll!l~l~ -- M W MArray 5ens0 r
• Designed for continuous use at1000° C by proper selection ofhigh temperature materials.
• Ceramic substrate and hightemperature metal depositedconductive winding constructs.
• Prototype 7-channel MWM-Arraysensor built and tested at 850° Cwith no degradation observed.
• Demonstrated crack detectionwith prototype high temperaturesensor.
• High temperature cabling issuesrequire further development