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ISO/TC 213/WG 16 N 712
ISO/TC 213/WG 16Areal and profile surface texture
Email of convenor: [email protected] Convenorship: SIS (Sweden)
ISO_25178-70_PTB_Germany_Circular_Chirp
Document type: Other committee document
Date of document: 2017-08-29
Expected action: INFO
Background: Funded by the European Union’s Horizon 2020 research andinnovation programme the PTB colleagues have developed amaterial measure to characterize optical 3D microscopes, theinstrument transfer function and the topography fidelity. TheEuropean EMPIR project of the Horizon programme 14IND07-3D Stack includes a work package on roughness and surfacequality of silicon wafers. Working on this the PTB colleagues,Gaoliang Dai et al, have developed a chirp standard withconcentric circular structures with its profile in radial directionbeing a rectangular height signal with its lateral width sequenceaccording to a chirp frequency distribution.
This presentation to introduces Gaoliang Dai's circular chirpstandard as a candidate to be included into ISO 25178-70,Material measures. The presentation will be given under agendaitem 19 at the IOS/TC 213/WG 16 meeting in Tokyo September2017.
Committee URL: http://isotc.iso.org/livelink/livelink/open/tc213wg16
ISO/TC 213, Sep. 5-6 Tokyo, Japan
Development of a material measure to characterize instrument transfer function and topography fidelity
Gaoliang Dai, Benedikt Seeger, Thomas Weimann,
Rainer Tutsch, Dorothee Hüser, Ludger Koenders
1
14IND07-3D
Circular Chirp
Material measure to be specifiedin ISO 25178-70 between Section 8.7 and 8.8
Analysis of the material measure consistent withISO 25178-700 Annex D
Parameter to characterize isotropy vs. anisotropy of ISO 25178-2 to be used to characterize isotropy of detection
ISO/TC 213 WG16, Sept 5th-6th, Tokyo, Japan
Circular Chirp
concentric,circular rings of- same height- varying width- varying spacing
variation of widthand spacingaccording tochirp frequencydistribution
Circular Chirp
Zoom into part to show that the Moiré structure does not belong tothe object - limitation of display.
ISO/TC 213 WG16, Sept 5th-6th, Tokyo, Japan
Realised Circular Chirp standard at PTB
Optical view of the manufactured standard
SEM view of the detailed part of structure
[email protected]/TC 213 WG16, Sept 5th-6th, Tokyo, Japan
Measurement result of a confocal microscopy
Measurement result by
commercial confocal microscope
Size: 130 µm x 130 µm
Pixels: 1024 x 1024 pixels
A cross-sectional profile of the measured image
at the marked position
heig
ht / n
mh
eig
ht / n
m
position / µm
position / µm
ISO/TC 213 WG16, Sept 5th-6th, Tokyo, Japan
Reference measurement result by Met. LR-AFM
Measurement result by
PTB’s high speed metrological large range AFM
Size: 135 µm x 135 µm
Pixels: 1080 x 1080 pixels
(the pixel distance is set to the same
as that of the optical measurement device)
A cross-sectional profile of the measured image
at the marked position
0 20 40 60 80 100 120
heig
ht / n
m
-30
-20
-10
10
20
0
position / µm
heig
ht / n
m-30
-20
-10
20
30
0
10
70 80
position / µm50 60 90
[email protected]/TC 213 WG16, Sept 5th-6th, Tokyo, Japan
ITF
in d
B
Circular Chirp
Polar plot of instrument transfer function
fµm-1
[email protected]/TC 213 WG16, Sept 5th-6th, Tokyo, Japan
Circular Chirp
Angular Power Distribution
renameto powerdistributioninstead ofspectrum
ISO 25178-2
with this integration there is no spectrum
a function of angle s
[email protected]/TC 213 WG16, Sept 5th-6th, Tokyo, Japan
Circular Chirp
nm
confocal
Polar plot of angular power distribution
ISO/TC 213 WG16, Sept 5th-6th, Tokyo, Japan
Acknowledgments
The work has received funding from the EMPIR programme co-financed by the
Participating States and from the European Union’s Horizon 2020 research and
innovation programme, 14IND07-3D Stack.
ISO/TC 213 WG16, Sept 5th-6th, Tokyo, Japan
