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PAGE 1 Design-for-Si Initiatives - Process-Design Integration - M Nowak / Riko R March 2007

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M Nowak / Riko R March 2007. Design-for-Si Initiatives - Process-Design Integration -. Demo at 65 Deploy at 45. Design–for–Si Initiatives for Post Design-Rule Era. Its the Process-Design Integration, Stupid !!! - PowerPoint PPT Presentation

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Page 1: Design-for-Si Initiatives - Process-Design Integration -

PAGE 1

Design-for-Si Initiatives - Process-Design Integration -

M Nowak / Riko R March 2007

Page 2: Design-for-Si Initiatives - Process-Design Integration -

2Riko R

D

emo

at 65

Dep

loy at 45

D

emo

at

45

Dep

loy

at ?

-3-3

-4-4

-2-2

-1-1

Design–for–Si Initiatives for Post Design-Rule Era

Its the Process-Design Integration, Stupid !!! Improve product cost-performance by alignment of process and design sweet spots

Yield & LayoutYield & LayoutIts the DFM Simulators !

Yield & LayoutYield & LayoutIts the DFM Simulators !

Variability & CornersVariability & CornersIts Geometry Aware

Timing !

Variability & CornersVariability & CornersIts Geometry Aware

Timing !

Physical Design & CostPhysical Design & CostIts the RDR Opportunity !

Physical Design & CostPhysical Design & CostIts the RDR Opportunity !

Architecture Design & CostArchitecture Design & Cost

Its VAM & VSP !

Architecture Design & CostArchitecture Design & Cost

Its VAM & VSP !NOW-ishNOW-ish

Page 3: Design-for-Si Initiatives - Process-Design Integration -

3Riko R

1 : Zero Physical DFM Margin

Use “DFM ECO” Loop to add the DFM Pad only

where it may be necessary. Use the DFM

Simulators to identify where are the opportunities

Value Proposition : Smaller Die with Managed Functional Yield Risk

P&RP&R

SPICEmodelSPICEmodel

ECOECO

IPIP

Constra

ints

Constra

ints

CellSwapCell

Swap

LPCpoly

LPCpoly

LPCmodelLPC

model LPCmetal

LPCmetal

LibraryVariantsLibraryVariants

DaughterCell

DaughterCell

LayoutFix

LayoutFix

CMPCMPCMPmodelCMP

model

FilldepopFill

depop

FillFill

DRCDRC

XTXT

T/ OT/ O

CAACAACAAmodelCAA

modelD

FM E

CO

Loop

DFM

ECO

Loop

DFM

Desi

gn K

it (

DD

K)

CAACAA

LPCpoly

LPCpoly

DFM ECO LoopDFM ECO Loop

Start with an Aggressive Library that excludes (most

of ) DFM Rule padding

Its all about Layout Its all about Layout Polishing Polishing

Page 4: Design-for-Si Initiatives - Process-Design Integration -

4Riko R

Shapesim

Shapesim

model

model

GDSGDS

LPEdeckLPEdeck

SPICESPICE

BSimBSim

.lib.libNLNL

RTLRTL

Library / IP Flow

XTXTPDPD

STASTA

t/ ot/ o

RCxRCx

Chip Flow

LithomodelLithomodel

Shapesim

Shapesim

model

model

LithomodelLithomodel

CMPmodelCMP

model

Thick.sim

Thick.sim

GDSGDS

Pcorners

Pcorners

LPELPE

-1 ECO-1 ECO-1 ECO-1 ECO

Strainsim

Strainsim

StrainmodelStrainmodel

Mismatchmodel

Mismatchmodel

OCVmodelOCV

model

Tighten corners to exclude Shape

Tighten corners to

exclude Shape,

Thickness, OCV

ECO to correct

impact of block level

interactions on yield or performance

DFM LPE to account for non-

litho systematics

OCV to account for

global systematics

used in SSTA

Tighten corners to exclude Thickness

& Shape

2 : Zero Electrical DFM Margin

Value Proposition : Tighter Margins with Managed Parametric Yield Risk

Its all about Its all about Geometry Geometry

Awareness in the Awareness in the Timing FlowTiming Flow

Page 5: Design-for-Si Initiatives - Process-Design Integration -

5Riko R

3 : Correct by Construction Layout [= RDR ??] Not a new concept

Rigorous gridded design has been around for a while Traditionally it cost area vs. more flexible rules

– Hence rejected in 65 and 45 (so far) – especially by volume shops Reason for this (inevitable) conclusion

– Comparison based on same set of Design Rules

– Comparison based on same Design Methodology

New RDR (Compelling ? ) Drivers Some say RDR is inevitable – question is when (32 ?)

– But then that is what they said about it at 65 and 45 and …

– Dual Exposure Demands Design Fragmentation ?

– EUV Negates -29% / year Cost / Gate Reduction ?

– Strain Variability Management ?

New RDR Proposition (s) Negate area loss through better yield, or Tighter lay out rules, or Better design methodologies

Establishing

Collaborative

efforts with

select supply

chain partners

to explore

trade-offs

Value Proposition : DFM-Correct by Construction Layout

It (should be) all It (should be) all about about

manufacturable manufacturable topographiestopographies

Page 6: Design-for-Si Initiatives - Process-Design Integration -

6Riko R

4 : Holistic Process-Design Co Optimization Our Strategy : IFM

Fabless entities tend to Have an Intrinsic Disadvantage in this Arena – Less intimate with the process world

Morph the fabless model to address the challenge : Integrated Fabless Manufacturer– Necessary at the bleading edge

Requirement : A Structured Methodology for Co-Optimization Analyses To steer the design To steer the process

Two Exploratory Co-Optimization Initiatives In Parametric Domain :

– Performance vs power vs variability In Area (Cost) Domain :

– Area vs Yield vs Design Content ….

L - 1

N+2Process Options

N+2DesignOptions

Future product Concept

N+2Process Options

N+2DesignOptions

Future product Concept

L - 2 L0

“Holistic Pathfinding”

TECHNOLOGY DEVELOPMENT PHASES

PoR

Process

Design

Value Proposition : Optimized Process & Design “Sweet Spot” Alignment

It (should be) all It (should be) all about about

manufacturable manufacturable architecturesarchitectures

Page 7: Design-for-Si Initiatives - Process-Design Integration -

7Riko R

Restricted Design Rules = Designability Risks

Must manage via use of pushed rules or custom techniques to negate area loss

ADVANTAGE : better manufacturability and yields, and easy design interface

DISADVANTAGE : Cost Benefits vs Process Maturity

RDR Challenges DesignabilityDesignability

Cell Area Routability

ProcessabilityProcessability New Features Pushed Rules Interfaces & Transitions Redundancy

Quantified BenefitsQuantified Benefits Yield vs Process Maturity Area vs Process Cost Performance vs DFM Sim

Challenges

FEOL Litho Effects Variability due to printability corners+ DFM_LPE+dummy poly

CMP Polishing Effects Variability due to polishing density based look up tables

Strain Effects Variability in energy bands corners + DFM_LPE

BEOL Litho Effects Variability in wire width use average value

Challenges

FEOL Litho EffectsFEOL Litho Effects Variability due to printability corners+ DFM_LPE+dummy poly

CMP Polishing EffectsCMP Polishing Effects Variability due to polishing density based look up tables

Strain EffectsStrain Effects Variability in energy bands corners + DFM_LPE

BEOL Litho EffectsBEOL Litho Effects Variability in wire width use average value

3 : DFM Junction in the Road ? Flexible Design Rules = Manufacturability

Risks Must manage via Use of DFM Rules or DFM

Simulators & Models to “Polish” the Layout

ADVANTAGE : Minimum overhead for Area or margin for Performance

DISADVANTAGE : it is complex and carries overhead in the design flow

Product Specific Cost-Benefit Trade Off Analyses

DFM Solutions

Shape Simulation : Model “Contours” Modulate L & W in LPE

Thickness Simulation Simulate Cu/ ILD Thickness Modulate Extracted R&C

Strain Simulation Model Strain Driven E-k Curve Modulate mobility in LPE

BEOL Litho Effects Model Contours Modulate Extracted R&C

DFM Solutions

Shape Simulation :Shape Simulation : Model “Contours” Modulate L & W in LPE

Thickness SimulationThickness Simulation Simulate Cu/ ILD Thickness Modulate Extracted R&C

Strain SimulationStrain Simulation Model Strain Driven E-k Curve Modulate mobility in LPE

BEOL Litho EffectsBEOL Litho Effects Model Contours Modulate Extracted R&C

RDR Solutions

YIE

LD

time

YIE

LD

timetime

Pushed RulesPushed Rules a la RAMs ?

Complex MacrosComplex Macros a la Custom Design

Benefit ?Benefit ? Performance Spread Yield AREA