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Corporate Presentation 2020
Mechanical Division
Established
• Fabrication
Electronics
Library Team
Established
Northern California
PCB Layout Facility
Established
Southern California
PCB Layout Facility
Established
Established PCB
Division in
Taiwan
Established
PCB Division in
China
Flex & Rigid-
Flex PCBEstablished
Component
Division
Established
Component Division
Expanded
• High Speed I/O
• Push-Pull Circular Connector/
Snap Latch Series
Component Division
Expanded
• Interconnect Components
• Cable Assemblies
Component
Division Expanded
• Magnetics
Division
2012
19931997
2000 2002 2005
2006
20072011
2015 Packaging
Systems
Established
2016 2017 2018
Interconnect
Division
Established
2014
Component Division
Expanded
• Power Transformers
Mechanical Division
Expanded
• Design Capabilities
Milestone
2015
Circular Connectors
Expanded
• IP54 - IP68
• First Responder/ Law Enforcement
• Self-wiping Sockets
• Custom Disposable
2019
DivisionsPCB Layout PCB
Interconnect SolutionsComponents Mechanical
Packaging Systems
PCB Layout
→ Routing Service
→ Library Service
Cloud Library Management
Mechanical Design
Thermal Analysis
Quick Turn
High Mix Low Volume
Medium to High Volume
Multilayer/Buildup
Medical and Industry
High Speed I/O Connectors
QSFP28, SFP28, QSFP+
XFP, SFP+, SFP, MiniSAS HD
Push-Pull Connectors
Custom Cables
Turnkey Solution
USB, SATA, HDMI, BTB
HDMI/USB Cable Assemblies
RF, Memory Card, FPC, Power Cord
Planar Transformers
RJ45 W/ Magnetics
Power Transformers, LAN Magnetics
High Speed Module Systems
System SI/PI Modeling
Enhanced Thermal Packaging
Design & Fabrication Solutions
Plastic Injection
Die-Cast Molding
Sheet Metal Stamping
Screw Machine
Cable & Wire Harness
Spray Finishing
Technical Sales: 13
Corporate Offices / Design Center: 2
Inside Sales: 22, QA: 5
Engineer: 20
Regional Sales Locations: 36
Sales Representatives: 99
North America Sales Coverage
Mechanical Fabrication
Component Factories
PCB Factories
PalPilot Design Center & Alliance
Partners
Corporate Offices / Design Center: 2
Inside Sale: 20
SQI: 6
Regional Sales Locations: 6
Sales Representatives: 50
Asia Factory & Sales Coverage
Revenue Totals Based on all Combined PalPilot Business Units
North America Revenue / 2009-2020*
*Projected
*2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020
120 US$ Million
100 US$ Million
80 US$ Million
60 US$ Million
50 US$ Million
130 US$ Million
110 US$ Million
90 US$ Million
70 US$ Million
PCB Layout
PCB Design Services
PalPilot’s continuous resource-training and investments in state-of-the-art tools enable us to offer precision design services to meet the needs of today’s demanding product challenges.
• High-speed (>26Gbps/channel)• High Density• Highly Constrained• High-Layer (>40 layers)• 2000+ pin BGA• 0.35mm pitch• Controlled Impedance• Backdrill• Blind and Buried Vias• HDI• Via-in-pad
PCB Technologies• Veteran PCB Designers• Close Interaction• Anywhere, Anytime• Flexible Schedule• Industry Leading Software• Concurrent Engineering Collaboration• Around-The-Clock Routing Support
Key Features• SFP28, QSFP28• Infiniband• XAUI• PCle Gen 3, PCle Gen 4• Gigabit Ethernet• Fibre Channel• DDR3, DDR4• RF and Microwave• ATCA & Micro-TCA
Industry Applications
Cloud Library Management
Supported Platforms
Capabilities
• OrCAD CIS• Concept HDL• Cadence Allegro• Solidworks and STEP
• Schematic Symbol Creation• Footprint Creation
• IPC-7351, IPC-7251, JEDECStandards
• Custom Land Pattern – Z-Axis Dimension
• 3D CAD Models
Visit us:
PCB
Quick-Turn Prototype
Pre-ProductionVolume
Production
Complete Solution Throughout Product Life Cycle
Commitment to Quality
PCB FabricationQuick Turn, 5-10 Days from Asia
High Mix Low Volume
Medium to High Volume
Multilayer/Build up
Flex, Rigid-Flex
ULISO9001 (Quality System)IATF16949 (Automotive)ISO13485 (Medical)AS9100 (Aerospace)ISO14001 (Environmental)OHSAS18001 (Safety)
Certifications
PCB Fabrication Capabilities
RIGID BOARDS FLEX BOARDS
Layers 1 – 40L
Max Board Size 24” x 40”
Max Board Thickness .315”
Min. Board Thickness 4L – 16 mil, 6L – 24 mil,
8L – 40mil, 10L – 48 mil, 12-16L – 63 mil
HDI Boards Blind, Buried & Stacked Vias
Impedance Control ≤50 OHMS = ±5OHMS
>50 OHMS = ±10%
Aspect Ratio Mechanical 15:1 | 35:1 (ATE)
Min. Line Width 2.5 mil
Min. Line Space 2.5 mil
Min. Mechanical Drill / Pad 6 mil | 16 mil
Min Laser Drill / Pad 4 mil | 10 mil
PTH Dia. Tolerance ±3 mil
NPTH Dia. Tolerance ±1 mil
Hole Position Deviation ±3mil
Outline Tolerance ±4 mil
Solder mask Dams 3 mil
Aspect Ratio Laser 1:1
Flammability 94V-0
Layers 1 – 12L
Max Board Size 8.6” x 13.8”
Max Board Thickness .040” without stiffener
Min. Board Thickness 4 mil
Min. Line Width 3 mil
Min. Line Space 3 mil
Min. Mechanical Drill 4 mil
Outline (Laser) Tolerance ±2 mil
Cover Layer Dams 8 mil
Flammability 94V-0
Impedance Control ≤50 OHMS = ±5OHMS
>50 OHMS = ±10%
PCB Fabrication Capabilities
RIGID – FLEX METAL SUBSTRATE PCB
Layers 2 – 40L
Max Board Size 15.75” x 30.0”
Board Thickness .00788” - .1968”
Impedance Control ≤50 OHMS = ±5OHMS
>50 OHMS = ±10%
Min. Line Width 2.5 mil
Min. Line Space 2.5 mil
Min. Mechanical Drill / Pad 6 mil | 16 mil
Min Laser Drill / Pad 4 mil | 10 mil
Max Buried Via 8 Mil
PTH Dia. Tolerance ±3 mil
NPTH Dia. Tolerance ±2 mil
Hole Position Deviation ±3mil
Outline Tolerance ±4 mil
Solder Mask Dams 3 mil
Aspect Ratio Mechanical 20:1
Aspect Ratio Laser 1:1
Aluminum Substrate, Copper Subs, Aluminum Substrate and Copper Substrates
Metal-Substrate Control Depth capability (mm) ±0.05
Counter bore depth-controlled capability (mm) ± 0.10
Maximum copper weight (OZ) 12
Heat SinkViPPOResin Fill [Conductive and Non-Conductive]
Metal – Buried PCBEmbedded ResistanceEmbedded Capacitance
Hybrid LaminationMicro-Via Copper FillHeavy Copper UL – 6oz
SPECIAL PROCESSES
PCB Fabrication Capabilities
ATE / Burn-In Board
Layers 2 – 80L
Max Board Size 15.75” x 30.0”
Board Thickness .093” - .250”
DUT/Drill Pattern Pitch .0118” (.3mm) minimum
Min. Line Width 2.5 mil
Min. Line Space 2.5 mil
Min. Mechanical Drill / Pad 4 mil | 10 mil
Min Laser Drill / Pad 3 mil | 6 mil
Inner Layer Spacing Pad/Trace 1.5 mil
Aspect Ratio Mechanical 35:1
Stub Drilling Max Depth 0.30 (.3mm pitch) – 0.130 (.5mm pitch)
Stub Drill Diameter 0.0079 (.3mm pitch) – 0.01(.5mm pitch)
Surface Finish ENIG | ENIPIG | Hard Gold
Selective Gold | Flash Gold
Impedance Control ≤50 OHMS = ±5OHMS
>50 OHMS = ±10%
PCB Fabrication – Materials & Surface Finish
LAMINATE MATERIAL
SUPPLIERS
SURFACE
FINISHES
• Standard Tg FR-4
• Mid Tg FR-4
• High Tg FR-4
• High Speed Materials
• Mixed Dielectric Constructions
• Halogen Free
• High CTI
• Polyimide (adhesive, adhesiveless)
• PET / Polyester
• Metal Core
• Isola
• Sheng Yi
• ITEQ
• Ventec
• Nelco
• Panasonic
• Rogers
• Taconic
• Dupont
• Taiflex
• Leaded HASL
• Lead Free HASL
• Immersion Gold (ENIG)
• Immersion Gold (ENEPIG)
• Immersion Silver
• Immersion Tin
• Hard Gold (Fingers)
• Selective Hard Gold
• Wire Bondable Soft Gold
• Flash Gold
• OSP
• Carbon Ink
Packaging Systems
Packaging Systems IC Substrate
• Coreless laminate Substrate
• High Power Ceramic Substrate
• Thin Film Ceramic Substrate
• Glass Substrate Solutions (Development)
Package Assembly Systems
• Coreless Package Systems
• High Frequency LNA/PA
• Optical Package Solutions
• SiP, 2.5D & POP Assemblies
Substrate & Package Design Service
Packaging Systems
PCB & Substrate SI/PI Modeling & Measurement
• Insertion Loss
• Return Loss
• Eye Pattern Generation
• Cross Talk
Specialized Material Deployment
• Next Generation Polyimide Laminate Systems
• 25um via Generation, 25um L/S
• High Conductivity ITO Replacement
• High Transparency
• High Conductivity
• Low Cost
InterconnectSolutions
Plastic Push Pull
WatertightM12/ M8
Metal Push Pull
Disposable
Easy Clean
High VoltageCustom
Mixed Contacts
Sterilizable
Thread Locking
Bayonet Locking
Color Codes
Multiple Keying FeaturesPush Pull Latching
Touch Proof
Power & Signal Fast Data Transfer
IP68
High Mating Cycles
Interconnect
PCB Mount
Multiple Sizes
Break Away
EMI Protection
Plastic Connectors
• TOUCH PROOF
• LIGHT WEIGHT
• MIXED CONTACTS
• CUSTOM OPTIONS
• OZONE FREE
• STERILIZABLE
• DISPOSABLE
• BREAK AWAY
• METAL TO PLASTIC
• COLOR KEYING
• IP67 PROTECTION
• CUSTOM SOLUTIONS
PLASTIC CONNECTORS
Metal Shell Connectors
• HIGH MATTING CYCLES
• CUSTOM SLUTIONS
• 6 HOUSING STYLES
• UP T0 64 CONTACTS
• MIXED CONTACTS
• IP68 PROTECTION
• EASY CLEAN
• QUICK DE-MATING
• THREADED LOCKING
• RUGGED / ROBUST
• 90 DEGREE PCB
• 360 DEGRE SHIELDING
METALCONNECTORS
We utilize our standard Medical grade cable to meet long term and short builds. All our cables are designed to meet the medical criteria
and requirements within the specified fields of medicine .
Features
Medical GradeMixed ConductorsTwisted PairsShieldingSiliconeTPE & TPUCoaxialFiber OpticsJacket Color OptionsFlexible
Custom Cables Industrial & Medical Quality
Complete Solutions
Added Value
Over Molds
Devices
Raw Cable and Assemblies
Turnkey Solution Competitive Pricing
Manufacturing Expansion
• Molding Capabilities
• Full Assembly Process
• Self Contained Particle Monitoring
Features
Advantage
✓ Sterile Environment
✓ Medical Final Packaging
✓ Incoming Particulate Inspection
✓ Value Added in Medical Applications
Clean RoomClassification 8
Components
Connectors
USB Connectors RJ45
▪ USB 3.1
▪ USB 3.1 Type-C
▪ USB 3.0
▪ USB 2.0
▪ USB Type A
▪ USB Type B
▪ USB Type AB
▪ Mini USB
▪ Micro USB
▪ Type A (1.0 Spec)
▪ Type B (1.0 Spec)
▪ Type C (1.3 Spec)
▪ Type D (1.4
Spec)
▪ Type E (1.4 Spec)
▪ Mini-HDMI
▪ Micro-HDMI
HDMI
• 0.4 Pitch.
0.8H/0.9H/1.0H/1.5
/H2.0H.
• 10 Pin~60 Pin
• Designed to Prevent
Tin Wicking
• Narrow Design to
Reduce Space for
PCB
BTB
▪ 1x, 2x Series
▪ USB Combo
▪ LED Option
▪ EMI Shield Option
▪ Right Angle, Vertical
RF Connector Custom Memory Card
▪ 1.2H/1.5H/2.5H Plug and
Socket Series
0.81/1.00/1.13/1.32/1.37
Wire
▪ Supports Insert Molding
Process for Sealing
▪ Strong Chamber for
Better Molding and
Mating Guide
• Plastic Cover
• Stamping Contact
• Insert Molding
Mechanical
Structure
• 1.5/1.30H Push Pull Type
Micro SD
• Locking Feature for the
Design
• Anti Card Fast Eject Function
• Detection Switch Pin
Attached
• Low Profile Sim Card
FPC
• 0.3mm, 0.5mm Pitch
1.0H
• 6 Pin ~ 67 Pin
• Front and Backflip
Lock
• Designed to Prevent
Tin Wicking
• Superior Solder Peg
Connectors
Cable Assembly
HDMI USB RF
• Matches high
frequency
characteristics
• 1.2H/1.5H/2.5H plug
and socket series
0.81/1.00/1.13/1.32/
1.37 wire
• USB 2.0 A to B
• USB 3.0 to 3.1
• USB 3.1 Type-C
• Custom Design
• USB Committee
Member
• HMDI 19 Pin Male to Male
• HDMI 19 Pin Male to DVI-D
• Custom Design
• Low Noise
• High Volume Manufacturing
Capabilities
• Premium Certified 4K60
HDMI Cables / Smallest OD
Designs Available
Power Cord
• EU ROHS directive and EU REACH Regulation
• China ROHS directive; Norway PoHS directive
• California 65 proposal and HR4040
• PAHS ( polycyclic aromatic hydrocarbons ) control
• Adjacent benzene two formic acid salt control
USB Type-C Cable
RJ45 With Magnetics
10/100/1000 Base-T ǀ 10GBase-T ǀ RJ45 + USB Combo ǀ
PoE/PoE Plus with Internal Diode Bridge
TYPES
Single Port ǀ Multiple Port Stacked Port ǀ Low Profile ǀ
Vertical Custom Configurations ǀ Optional Emi Tabs
PACKAGES
FEATURES
Integrated Magnetics ǀ Tab Up or Tab Down ǀ LED Color
Options Surge Protection ǀ RoHS Compliant
Power Magnetics – LAN Magnetics
Power Transformers SMD & Wire Wound Inductors
LAN Magnetics
• 350μH OCL
• PoE rated at 350mA
• PoE+ rated 600mA
• 1500 Vrms Isolation
• 10/100/1000Base-T
• 10Gbase-T
• 2.5Gbase-T
• RoHS Compliant
• Low Profile
• Small Size
• Surface Mount
• High Current
• Low DCR
• High Energy Storage
• Low-Loss
• Magnetically Shielded
• RoHS compliant
• Planar Transformers up to 5000W
• High Frequency Transformers
• Laminated Transformers• Flyback Transformers• High Power Density• Step Up/Down• Build-to-print
• Custom Design Support
Current Sense Transformers
• Current range 0.01-300A• Frequency 50Hz — 400Hz• Accuracy 0.1, 0.2, 0.5, 1• Insulation 4000 VAC/1min• ANSI C57.13/IEC60044-1• Custom Turns-Ratio option
• RoHS compliant
Mechanical
Industrial Design Mechanical Design Prototyping
Soft Tooling Hard Tooling Production
Mechanical Solutions
✓ Design tools :
PRO/E Solidwork/ simulation tool / inspection and
verification tool design
✓ Mechanical design :
enclosure / transmission / structure system design
✓ DFM (Design for Manufacturing) :
plastic / sheet metal / die casting / extrusion
✓ Successful Projects :
scanner / printer / POS / E-bicycle / portable product
Design & Review Design Analyses Tooling Fabrication Mass Production
Mechanical Design Capabilities
Mechanical Fabrication Capabilities
Injection Molding
• Insert Molding
• High End & Super Slim Plastic Injection
• Gate Cut in Mold Technology
• Die-Casting: (High Pressure)Aluminum, Zinc
• Robotic Forming
• Stamping & Blanking Presses
• Training Certification for Welders
• Paint, Powder Coating, Silk Screening
Metal Stamping Surface Finish
• Fully Automatic Spray Painting Lines (8)
• Flat Bed, Manual, UV Spraying
• Anti-Finger Print Finish
• Soft Touch Finish
CNC & Extrusion
• Precise 1, 2, 3 Head CNC
• Surface treatments:Anodizing, Powder Coat
• Sandblasting, WiredrawingScreen/Pad Printing, Laser Carving, Etching
www.palpilot.com
