LevioContactless pick & place machine

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Die ejection module

The die ejection module implemented in

Levio allows for completely contactless

die ejection of dies from adhesive tape.

Die ejection is one of the process steps

where defects can mostly arise. With

contactless technology you can

completely avoid contact-induced

imperfections.

Available for wafer sizes from 4’’ to 12’’

with multiple substrate materials and

thickness possible.

Technical information is subject to change without prior notice

Contactless process

Levio allows to perform a complete

process, from wafer to carrier or from

carrier to carrier, completely contactless.

The component can be picked up from a

wafer or input carrier, inspected and

placed into a wide range of output

carriers. All of this while never touching

the upper surface.

This allows for a cleaner process with a

sensibly higher yield and quality.

Technical information is subject to change without prior notice

Pick up

contactless

Contactless

Transport Autocenter and

Place

Completely contactless handling

Touchless Automation novel technlogy

allows for contactless manipulation of

components of any material.

Thanks to its combination of air

streams and pressure, it can levitate

components and manipulate them with

the utmost care.

Discover more on the technology on

touchless-automation.ch

Technical information is subject to change without prior notice

Autocentering

The contactless technology allows to

center the component to the tip of the

handling tool automatically, without the

need for mechanical tools or expensive

vision modules. The reason behind lies

in the very physical phenomena being

exploited.

Inspection and placing can be

performed in a quicker and more reliable

way.

Technical information is subject to change without prior notice

Multiple input and output modules

Your process could lead to many

different paths and your components

would need to be handled with many

different carriers.

For this reason Levio was designed with

multiple input and output to better fit with

your existing facilities, machines and

suppliers.

Special input and output carriers could

be implemented upon request.

Technical information is subject to change without prior notice

Multiple applications

Touchless Automation technology has

been able to succesfully manipulate

components of any material and a wide

range of shapes.

This capability, together with Aatec

expertise in process development and

automation, allows Levio to be easily

implemented in your already existing

process and evolve it.

Imaging Sensors

LEDLenses

VCSEL Laser diodes

MEMS

Technical information is subject to change without prior notice

Touchless Automation GmbH

Rue David Moning, 8

2504 Biel/Bienne, Switzerland

Your direct contact

Maurizio Migliore, COO

Mobile: +41 (0) 78 405 63 31

Fax: +41 (0) 32 343 60 39

Email: maurizio.migliore@touchless-automation.ch

www.smt-equipment.com www.touchless-automation.ch

•Welded Frame/Base plate with safety

protection and electronic cabinet

•Doors on both side

• Touch screen HMI

•Die ejection module with xy dynamic

•Contactless pick up head

•High precision motion control/positioning

•CE Marking

•UPH: 1000-1500 parts/hour

Base equipment

• Inputs:

Wafer from 4’’ to 12’’

Up to 6 waffle trays 4’’

Up to 20 waffle trays 2’’

2 Jedec trays

•Outputs:

Up to 6 waffle/Gel Pak trays 4’’

Up to 20 waffle/Gel Pak trays 2’’

2 Jedec trays

Tape & Reel module (optional)

• Flip module (optional)

• Vision inspection module (top/bottom)

Features

• Any size from 0.5x0.5mm to 10x10mm

• Any material (GaAs, GaN, Glass, …)

•Delicate surfaces and MEMS

Components

• Voltage 220-240 VAC / 12A Max

• Air pressure 6 Bars max

• Dimensions:

o L = 1200mm

o W= 1150mm

o H = 1700mm

•Weight: 600 kg

Dimension and requirements