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Measured Data for 112G Chip to

Module Channel Analysis

Nathan Tracy

1/18/18

TE Connectivity Confidential & Proprietary. Do not reproduce or distribute.

112G VSR Channels Have Been Built

8.5 inches

1.5 inches

Host connector

footprint

Thru vias Microvias

Layer stack-up10 inch overall channel

2

TE Connectivity Confidential & Proprietary. Do not reproduce or distribute.

Channel DetailsChannel-Board Layout

3

Micro-vias

2.4mm

connectors

154.4mils

(3.92mm)

12mil Vias 154.4mils

(3.92mm)

Host - 8.5” (215.9mm) 5.3-6.5-5.3 Trace

Module - 1.5” (38.1mm) 6.3mil SE Trace

3.75mil stub

Layer 02

Route

Layer 15 Route

Microvia channel

Thru via channel

Layer stack-up

TE Connectivity Confidential & Proprietary. Do not reproduce or distribute.

Channel Details

Host 2x Thru Measurement

4

-22.629dBDetails

- Microvia to Layer 2 Route

- 5.3 - 6.5 - 5.3 differential route

- 17.157” of trace

- *-1.32dB/in at 28GHz

*Additional loss reductions can be realized by using HVLP Cu for L1

TE Connectivity Confidential & Proprietary. Do not reproduce or distribute.

Channel Details

Module Thru Measurement

5

-1.98dB

Details

- AFR used on 2x Thru to remove

testpoint effects

- Microvia to Layer 2 Route

- 6.3mil SE Trace

- 1.46” of trace after AFR

- *-1.36dB/in at 28GHz

*Additional loss reductions can be realized by using HVLP Cu for L1

TE Connectivity Confidential & Proprietary. Do not reproduce or distribute.

Channel using 12mil vias L15 Route,

Bot Row VictimChannel using 12mil vias L15 Route,

Top Row Victim

Channel Results

Rx4

Rx3

Rx8

Rx7 Rx5

Rx6

8.5 inch Host + Conn + 1.5 inch Module

6

Channel using micro-vias L2 Route -15.55dB, 28GHz

Channel using 12mil vias L15 Route -15.79dB, 28GHz

Channel using micro-vias L2 Route,

Top Row Victim

Rx4

Rx3

Rx8

Rx7 Rx5

Rx6

Channel using micro-vias L2 Route,

Bot Row Victim

Tx7

Tx8

Tx3

Tx4 Tx6

Tx5 Tx7

Tx8

Tx3

Tx4 Tx6

Tx5

TE Connectivity Confidential & Proprietary. Do not reproduce or distribute.

Channel Results8.5 inch Host + Conn + 1.5 inch Module - S-Parameter files for long barrel via channels: tracy_100GEL_02_0118.zip- S-Parameter files for micro-via channels: tracy_100GEL_06_0118.zip

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Channel using micro-vias L2 Route

Channel using 12mil vias L15 Route

TE Connectivity Confidential & Proprietary. Do not reproduce or distribute.

Observations

8

• Microvias demonstrated improved performance over conventional vias

• Less roll off and more uniform loss

• Thru vias do provide a useable channel and shouldn’t be ruled out

• Reasonable chip to module channel performance (15 to 18 dB) has been

demonstrated over a 10 inch total length

• Layer 1 HVLP foil will improve throughput

• S-Parameter files for measurements can be found in S-Parameter files:

• Long barrel via channels: tracy_100GEL_02_0118.zip

• Micro-via channels: tracy_100GEL_06_0118.zip