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Chip PCBChip PCB
08 Journal of the HKPCA / Issue No. 41 / 2011/ Q3
Technical Paper
Chip PCB
1.
2+HDI PCB GME
SMT
PP
PP
FR4
Plasma
Set unit Fiducial Mark
0201
34000 Dppm 990
Dppm PCB 36.7% 94%
III 2200 486
13 PCB 50%
30%
PCB
Integrated Passive
Embedded Passive Technology
FR4
PCB
Patent Ohmega-
ply Buried Resistor BR
Samina Buried Capacitor BC
10~20%
Chip
5%
PCB
GME
PoP Package on Package
1
PoP 3D
PoP
PoP
09
Technical Paper
www.hkpca.org
PCB
2 PoP
Package
PCB
2+4+2 HDI
L4/5 L4 L5
3
2. PCB
1
L3/4 L5/6
L3/4
L5/6 2+2
86 22 /Unit
PCB
Solder Mask
2
2
3
UV OSP
SMT
3
4
5
80%
1
L5
0.35mm L45
0.40~0.5mm
2
Cavity
Panel 16 X 18 6sets/PNL
12units/set 7776 /Pnl
PCB
6X 260
20s
10 Journal of the HKPCA / Issue No. 41 / 2011/ Q3
Technical Paper
1
4
3.
3.1
0.2~0.5kgf
2
1) + 2) 3)
Mylar
Mylar 4) 5) 6) U V 7)
4
0201
PCBA PCBA
PCB
DI
Cl <4.5ug/inch
1
0.23~0.35mm
0.3mm
PP IR
Reflow 6
- 2
3.2
3.3
5
6 +PP
11
Technical Paper
www.hkpca.org
2
PP 7
7 PP
3.4
0201
PP 4-6cm
8
9
8
1~2cm
9
12 Journal of the HKPCA / Issue No. 41 / 2011/ Q3
Technical Paper
3.5
4.1 :
4.
1
2 ( 10) L4
OSP
Reflow
DI Plasma PP
L3/4+L5/6
L4 SMT
1.2mm
2+HDI
( )
Unit 36.7% 1 Unit 108
unit
11
sets units /
units (per units) /
83 996 476 3690 3.43%47.8%
22ohm
4700ohm
10
13
Technical Paper
www.hkpca.org
Cpk
+/-3%
10000ohm
11
220nF
+/-20% +/-10%
PCB
288 10s Solder Float
13:
4.2
Tg
14
6600nF
12
13
14
Plasma PP Reflow
Tg
CTE
14 Journal of the HKPCA / Issue No. 41 / 2011/ Q3
Technical Paper
1.
2. Line mask
PP
+/-3% +/-
20%
15
PTH
Panel Form
4.3
15
R35 R34
short
R57 /
PTH
C22 C23 C22
SMT
1) 6set/Panel 16" X 18"
14 X 16
2)
3) unit Fiducial Mark
Unit Unit Mark
4
5
16
)
)
15
Technical Paper
www.hkpca.org
0201
0201
6
0.005
0.008 1.1
7 10Kohm 0402
IVH 0.15
2.5mil
2+HDI
+/-2.5mil
0201 10Kohm
0.2mm 5.5mil
)
)
8 SMT)
4.4 8 3 L4
16
17
Panel
547 DPPM
3 X-out 16.3%
94% 64 Sets
fail rate( by set) 68 13 19.12%
fail rate( by unit) 813 18 2.21%
fail rate( by component) dppm 87804 48 547
1 LOT 2 LOT 3 LOT
(108 ) (108 ) (108 )
PCB board yield 78.20% 97.20% 98%
rate (by unit)
Components yield 61.11% 81.70% 91.88%
rate (by unit)
Failed components 3.40% 1.36% 0.099%
rate (by qty)
Failed components 34000 13600 990
DPPM
st nd rd
Total yeild rate 49.10% 78.90% 94%
16 Journal of the HKPCA / Issue No. 41 / 2011/ Q3
Technical Paper
18
4.5
PCB
4 Reflow
+/-5% +/-20%
5X 4X 6X 10X Reflow
SMT
5. Chip PCB
1. PCB
Build-up
2. 0201 0402 Chip
IC
3. Through Via,
IVH, BVH and ALV/ViP inter-connections
HDI Rigid-flex
19
6.
PoP
---
2005.2
OKI
DNP Embedded Passive Device B2it PCB