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Chalmers University of Technology FlexSoC Seminar Series – 2004-03-15 Page 1 Power Estimation FlexSoc Seminar Series – 2004-03-15 Daniel Eckerbert [email protected]

Chalmers University of Technology FlexSoC Seminar Series – 2004-03-15Page 1 Power Estimation FlexSoc Seminar Series – 2004-03-15 Daniel Eckerbert [email protected]

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Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 1

Power Estimation

FlexSoc Seminar Series – 2004-03-15

Daniel [email protected]

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 2

Outline

• Why power estimation?

• Power macromodeling

• Future directions for power estimation

Most pictures (non-Matlab-plots) are courtesy of Intel Corp.

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 3

Why Power Estimation? (Conference-Presentation Answer)

• Heat removal is expensive (fans, heat-sinks)

• Energy stored in battery is limited

• Power delivery is expensive (area, reliability, verification, packaging)

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 4

Why Power Estimation?(FlexSoC Answer)

• Compiler optimizations

• “Designing” range of chips for certain applications

• ??? You tell me!

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 5

Power Reduction Techniques

• Activity reduction• Supply voltage scaling• Leakage reduction (cut-off techniques, stacking

etc)

But, by how much does the power of a specific design needs to be reduced? And which power mechnism constitutes a problem?

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 6

Power Dissipation Basics

Chalmers University of Technology

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From Where Does thePower Increase Stem?

Chalmers University of Technology

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Increased Integration

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 9

Increased Integration

120 billion transistorsper wafer!!!

SRAM chips fabricatedon a 300mm wafer

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 10

Increased Density

Chalmers University of Technology

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Power Density

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 12

Heat Removal (die)

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 13

Heat Removal (package)

Chalmers University of Technology

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Power Macro Modeling

Chalmers University of Technology

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Architecture Level Power Macromodeling à la Wattch

• P=0.1*Psw(αmax)+Psw(α,state)

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 16

What Do We Want from aPower Estimation Methodology?

• Accurate

• Fast

• Provide information for power reduction

Chalmers University of Technology

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Levels of Power Estimation

Chalmers University of Technology

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Why Use Macro Models?

• Circuit simulations excessively time- and memory-consuming

• Designers need to run long traces to compare solutions (only possible using macro models)

Chalmers University of Technology

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Estimation Tool Run-Times

Run-time HSpice* PowerMill * Macro**

16b Han-Carlson

12d14h 8h49m(30x)

6m43s(2700x / 80x)

8b Multiplier 29d6h 17h37m(40x)

9m42s(4300x / 100x)

32b Multiplier N/A 14d10h 2h2m(N/A / 170x)

* Highly optimized code by team of software designers** Highly unoptimized C++ code by one overworked circuit designer

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 20

Precision

• Circuit simulations give full or close to full precision (depending on extraction)

• Macro modeling can give range of precision levels (with a maximum precision determined by methodology)

• Macro model precision is limited by the characterization

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 21

Power Estimation Flow

• Characterization– Requires lower level simulations– Has to support maximum precision– One-time only, can afford to be slow

• Estimation– Macro-model only– Can support multiple levels of precision– Frequently run, has to be fast

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 22

Characterization

Chalmers University of Technology

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Estimation

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 24

Switching Power(Circuit Level)

Chalmers University of Technology

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Switching Power(Early Power Macro Models)

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 26

Switching Power(VLSI Research Group Style)

Equation-based 0→1 tracking, even for intermediate nodes depending on accuracy

• Physical model based on nodal capacitances and voltage swings

• Enables semi-automatic characterization

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 27

Short-Circuit Power(Circuit Level)

Chalmers University of Technology

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Short-Circuit Power(Macro Model)

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 29

Interconnect Modeling

Chalmers University of Technology

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CRC

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 31

RLC

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 32

Subthreshold-Leakage Power

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 33

Subthreshold-Leakage Power(Circuit Level)

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 34

Subthreshold-Leakage Power

• Stacking effects

• Long settling times

• …?

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 35

Subthreshold-Leakage Power(Macro Model)

• Equation-based model considering on- and off-states of the transistors constituting the gate

• Enables semi-automatic characterization

• Possible extensions for stacking

• Possible extensions for multiple clock-cycle settling times

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 36

Gate-Leakage Power

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 37

Oxide Thickness

12 Å

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 38

Oxide Thickness

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 39

Gate-Leakage Power(Circuit Level)

• Enough equations and theory to use up the entire FlexSoC seminar series

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 40

Gate-Leakage Power(Macro Model)

• Equation-based model considering on- and off-states of the transistors constituting the gate

• Enables semi-automatic characterization

• Complications include leakage paths originating in one gate and ending up in another gate

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 41

Separating PowerDissipation Mechanisms

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 42

Leakage Power Increase

Chalmers University of Technology

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Active vs. Leakage Power

Chalmers University of Technology

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Separation of Mechanisms(Rise- and Fall-Times)

Chalmers University of Technology

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Separation of Mechanisms(Supply-Voltage Scaling)

Chalmers University of Technology

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Mismatch for Methodologies without a Leakage Component

Chalmers University of Technology

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Mismatch for Methodologies without Leakage or Dynamica Frequency and Supply Scaling

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 48

Added Complications

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 49

Complex Gates

• Most circuit-level models are only valid for a single transistor or an inverter

• Macromodels have to be able to account for large components, 32b multipliers etc

• Complexity increases super-linearly with the number of transistors in the component

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 50

Non-Conforming Components

There are classes of components which do not conform to the presented basic models:

• Clock generators

• Memories

• etc

Chalmers University of Technology

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Clock Generation (DLL)

Chalmers University of Technology

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Clock Generators (Delay Element)

Chalmers University of Technology

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Non-Linear Frequency Dependence for Certain Types of Components

Chalmers University of Technology

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Dynamic Precision

• Different architectures might impose different precision requirements for different components (static during estimation)

• Different operating modes might warrant different need for precision (changes during estimation)

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 55

Conclusions

• Power estimation is not simply about averaging the current through the supplies

• Circuit simulation is too slow

• A lot of research is needed to enable high-level power estimation for future designs: some in mechanism modeling but more importantly in the estimation framework

Chalmers University of Technology

FlexSoC Seminar Series – 2004-03-15 Page 56

Power estimation is not as easy as it looks