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1
Wafer Manufacturing
Reading Assignments:
Plummer, Chap 3.1~3.4
2
Periodic Table of the Elements
Roman letters give valence
3
Why Silicon?
• Abundant, cheap– 26% of earth’s crust vs. 1.8ppm of Germanium
• Stable dielectric for gate dielectric and doping mask– Silicon dioxide is very stable, strong dielectric, and it is easy to
grow in thermal process. Perfect interface with Silicon. Germanium oxide is not stable at >800oC and water soluble.
• Large band gap– Wide operation temperature and doping range. Higher breakdown
voltage.
First IC, T.I. Jack Kilby 1958First transistor, Shockley, Bardeen, Brattain1947
Made by Germanium
4
• Amorphous (no short/long-range order)• Poly-crystalline (short-range order, typically, 1nm - 50μm
range)• Crystalline (long-range order, irregularity treated as defects,
faults, stacked faults or line faults)
Structure of Solids
Amorphous Polycrystalline Crystal
Grain/domainGrain boundary
5
Crystal Structures (Crystallography)Example: Simple Cubic (SC)
Space lattice (SC) Basis (one atom) Crystal Structure
Example: Face-Centered Cubic (FCC)
There are total 14 distinct Bravais lattices.
NaCl
Na+
Cl-
a1
a2
a3
a1 a2 a3 : primitive translation vectors
6
Simple Cubic Crystal
7
Diamond Crystal Structure
8
•Diamond (covalent, Si, Ge, C, etc.) and Zinc-blend (ionic, GaAs, InP, etc.) consist of 2 interleaved FCC with 1/4 diagonal offset
Zincblende lattice cell(GaAs, AlAs, GaP, ZnS, etc.)
Diamond lattice cell(C, Si, Ge, etc.)
Diamond Crystal Structure
9
Crystal Planes/Direction
1 2
1
2
3
1
2
Plane (233)
x
y
zIndexing Procedure for Planes
1. Record where the plane intercepts the axes in the unit of the unit cell length. → 3, 2, 2
2. Invert the intercept values → 1/3, ½, ½
3. Convert to the smallest possible set of whole numbers → 2, 3, 3
4. Enclose the whole-number set in parentheses→ (233)Direction [100]
Direction [001]
10
Crystal Planes
(110) (111)
corner atom in FCCface atom in FCC
(100)
(200) (100)1
11
Use of Crystal Orientation• Electrical anisotropy: (100) has the
highest mobility, also scattering rates are slightly different
• Mechanical anisotropy: different surface has different modulus components (later)
• Chemical anisotropy: e.x., KOH will not etch (111), Etch rate (110)>(100)>(111). 54.74° V-groove etch on (100) plane.
• Angles: (100) vs. (110): 45°, 90 ° ; (100) vs. (111): 54.74°; (110) vs. (111): 35.26°, 90 ° or 144.74°
• Important for strain engineering
Newer wafers (8” and 12”) now use a groove to mark the orientation, instead of a cut to save some area for test structures
<110>
12
Newer wafers (8” and 12”) now use a groove to mark the orientation, instead of a cut to save some area for test structures.
Manufacturers Data of incoming wafers:orientation, thickness, doping type, resistivity.
Wafer Flat
Wafer flats in 4” and 6” silicon wafers
13
Defects in Crystals
0D
0D
1D
2D
3D
14
Commercial Silicon Wafer
100mm
150mm
200mm
300mm
150mm 200mm 300mm 450mm
15
Starting Material Cost
300mm bare silicon ~ $100/pcs
200mm bare silicon ~ $40/pcs
200mm ASP ~ $1000/pcs
16
Si + HCl
→ TCS Silicon Powder
Hydrochloride
FiltersCondenser
Purifier Pure TCS with 99.9999999%
Reactor, 300 °C
Heat (2000 ̊ C)
SiO2 + C → Si + CO2
Sand Carbon MGS Carbon Dioxide
Heat (2000 ̊ C)
SiO2 + C → Si + CO2
Sand Carbon MGS Carbon Dioxide
Silicon Purification
MGS: Metallurgical Grade Silicon, 98% pure, Major impurity Al and Fe
Heat (1100 ̊ C)
SiHCl3 + H2 → Si + 3HCl
TCS Hydrogen EGS Hydrochloride
Heat (1100 ̊ C)
SiHCl3 + H2 → Si + 3HCl
TCS Hydrogen EGS Hydrochloride
TCS: Trichlorosilane SiHCl3
EGS: Electronic Grade Silicon, 99.9999999% pure, impurity 1013-1014/cm3
MGS:
EGS:
17
Czochralski (CZ) Crystal Growth
Graphite Crucible
Single Crystal silicon Ingot
Single Crystal Silicon Seed
Quartz Crucible
Heating Coils1415 ˚C
Molten Silicon
Most common. Use in the large-diameter wafer manufacturing.The ingot diameter is determined by the pulling speed.The dislocation due to the thermal stress is terminated at the neck region.Impurities comes from crucibles (O; 1017-1018/cm3) and susceptors (C; 1015-1016/cm3)
18
Czochralski (CZ) Crystal Growth
Source: http://www.fullman.com/semiconductors/_crystalgrowing.html
19
Floating (FZ) Crystal Growth
Heating Coils
Poly Si Rod
Single Crystal Silicon
Seed Crystal
Heating Coils Movement
Molten Silicon
Local melting. No crucible needed.Low impurity. High resistive wafer possible.Hard to scale up.
20
Wafer Finishing
Flat, 150 mm and smaller Notch, 200 mm and larger
Flat, Notch
Orientation Notch
Crystal Ingot
Saw Blade
Diamond Coating
Coolant
Ingot Movement
Wafer Sawing
Wafer Wafer movement
Wafer Before Edge Rounding
Wafer After Edge Rounding
Wafer Rounding
Slurry
Polishing Pad
Pressure
Wafer HolderWafer
Surface Flatten
21
Surface Flatten
76 μm
914 μmAfter Wafer Sawing
After Edge Rounding76 μm914 μm
12.5 μm814 μm<2.5 μm750 μm
725 μmVirtually Defect Free
After Lapping
After Etch
After CMP
Etch-off 20-25μm (DS)
Polish away 25μm (SS)
Polish away 50μm (DS)
22
Resistivity and Mobility
Sheet resistance : Rs(Ω/□)= ρ(Ω.cm) / t (cm)
t
pn qpqn μμρ
+=
1
Four Point Probe
Jdrift = (qp μp +qn μn )F =σF