Upload
others
View
16
Download
0
Embed Size (px)
Citation preview
A member of
w
ww
.sti
gp
.co
m
SEMICONDUCTOR TECHNOLOGIES &
INSTRUMENTS
Wafer Inspection System for Frame & Whole Wafer
STI’s i Focus is a highly intelligent precision wafer inspection system that offers a comprehensive solution for the inspection of frame and/or whole wafer. Using STI’s proprietary On-The-Fly (OTFTM) vision, the i Focus can be configured to detect any type of micro defects arising from wafer processing, post dicing or packing. The OTFTM optical system encompasses pioneering technology in areas such as optics and illumination design, 2D, 3D and active die inspection algorithms. Patented Simultaneous Dual Illumination Image Capture Technology is used to eliminate escape and reduce overkill without compromising throughput.
Layout
i Focus Specifications
Sem
ico
nd
ucto
r T
ech
no
log
ies &
In
str
um
en
ts P
te L
td
Blk
25, K
alla
ng A
ve #
04-0
1, K
alla
ng B
asin
Industr
ial E
sta
te, S
ingapore
339416
Tel: 6
394 5
678
Fax: 6392 6
933 E
mail:
mark
etinggp@
astigp.c
om
U
RL:
ww
w.s
tigp.c
om
T
erm
s a
nd c
onditio
ns a
pply
. A
ctu
al specific
ations m
ay d
iffe
r
1
014
Wafer Type Wafer Size (in.) Wafer Thickness Material Handling Load Port UPH MTBA MTBF Options User Interface
Frame Whole 6, 8, 12 (Frame) 6, 8, 12 (Whole) 0.40 mm to 1.20 mm Standard cassette 6”, 8” or 12” cassette (frame) 6” or 8” open cassette (whole) SEMI compliant FOUP Autodoor FOSB 300 mm whole wafer 8” open cassette adaptor (optional) 2D OTF
TM : 30 WPH @2.5x magnification
3D OTFTM
: 10 WPH (Based on 200 mm wafer) > 6 hours > 1000 hours Real-time Statistical Process Control SECS/GEM Compatible Windows 7 platform with GUI Full machine diagnostics capability
FACILITIES AC Power Supply Air Supply Vacuum Environment Dimension Weight
230 VAC, 30 A, 50/60 Hz, one phase 0.49 MPa – 0.59 MPa, 300 l/min -60 kPa to -80 kPa, ≥ 20 l/min
15° - 30°C 50% - 70% relative humidity 2280 x 1780 x 2004 mm 1835 x 1360 x 2004 mm (without port) 2000 kg
i Focus
SPECIFICATIONS DETAILS
SPECIFICATIONS DESCRIPTION
2D OTF
TM
3D OTF
TM
Scratch Damage FM defects Edge chip out Corner chip out Saw offset cut Coplanarity Bump Height
INSPECTION DETAILS
2280 mm
1835 mm
1360 mm
1780 mm
2004 m
m
INSPECTION FRAME WAFER WHOLE WAFER FRAME/WHOLE WAFER
SYSTEM 100
SYSTEM 150
SYSTEM 300
SYSTEM 350
SYSTEM 500
SYSTEM 550
2D OTFTM
SYSTEM
3D OTF
TM SYSTEM