BSMS/2 Systems with ELCB Technical Manual › nmr › downloads › bruker › en-US › pdf › z10802… · For further technical assistance on the BSMS/2 Systems with ELCB, please

Version

Innovation with Integrity

BSMS/2 Systems with ELCB

006

NMR Spectroscopy

Technical Manual

Copyright© by Bruker Corporation

All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form, or by any means without the prior consent of the publisher. Product names used are trademarks or registered trademarks of their respective holders.

This manual was written by

Rolf Hensel, Christoph Schumacher, Marcel Wattinger,

Martin Zellweger, Michael Schenkel, Christian Ebi

© May 24, 2012: Bruker Biospin AG

Fällanden, Switzerland

P/N: Z108028

DWG-Nr.: Z4D10209E

For further technical assistance on the BSMS/2 Systems with ELCB, please do not hesitate to contact your nearest BRUKER dealer or contact us directly at:

Bruker BioSpin AG Industriestr. 268117 FällandenSwitzerlandPhone:+41 (44) 825 91 11Fax:+41 (44) 825 96 96Email:[email protected]:www.bruker.com

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Table of Contents

Contents
1 About ............................................................................................................17
1.1 This Manual.......................................................................................................... 17

1.2 Policy Statement .................................................................................................. 17

1.3 Symbols and Conventions.................................................................................... 17

2 Introduction..................................................................................................192.1 Limitation of Liability ............................................................................................. 19

2.2 Before You Begin ................................................................................................. 19

2.3 Minimum Qualifications for Operating Personnel ................................................. 20

2.4 The Bruker Service............................................................................................... 20

2.5 Transport to Manufacturer.................................................................................... 20

3 Safety............................................................................................................213.1 Intended Use ........................................................................................................ 21

3.2 Owner‘s Responsibility ......................................................................................... 22

3.3 Personnel Requirements...................................................................................... 24

Qualifications................................................................................................... 24

Unauthorized Persons..................................................................................... 24

3.4 Personal Protective Equipment ............................................................................ 24

3.5 Position of the Safety Devices.............................................................................. 24

3.6 Important Safety Considerations .......................................................................... 25

Field Exchangeable Units ............................................................................... 28

3.7 Technically Qualified Personnel Only................................................................... 29

3.8 Basic Dangers ...................................................................................................... 30

General Workplace Dangers........................................................................... 30

Dangers from Gases Under Pressure............................................................. 31

Dangers from Radiation .................................................................................. 32

Environmental Protection ................................................................................ 33

3.9 Spare Parts .......................................................................................................... 34

4 Technical Data .............................................................................................354.1 General Information.............................................................................................. 35

4.2 Connection Values ............................................................................................... 35

4.3 Operating Conditions............................................................................................ 36

5 Transport, Packaging and Storage ............................................................375.1 Symbols on the Packaging................................................................................... 37

5.2 Inspection at Delivery ........................................................................................... 38

5.3 Packaging............................................................................................................. 38

5.4 Storage................................................................................................................. 39

6 Installation and Initial Commissioning......................................................41

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6.1 Installation and Preparation for Use ..................................................................... 41

Mains Selection and Fuses ............................................................................. 41

Check / Download Firmware ........................................................................... 42

Calibration and System Configuration Overview............................................. 43

Establishing the Service Engineer Access Level ............................................ 44

Lift and Spin Calibration .................................................................................. 46

Helium Level Measurement Calibration .......................................................... 46

Auto Lock Calibration ...................................................................................... 47

Setup of the Pulse / Signal Polarities .............................................................. 47

Final Steps of an Installation ........................................................................... 47

7 Operation......................................................................................................497.1 General Operating Guidelines.............................................................................. 49

Operator Protection ......................................................................................... 49

8 BSMS/2 System with ELCB ........................................................................518.1 Introduction........................................................................................................... 51

Subunits in the ELCB Based BSMS................................................................ 51

Accessing the ELCB Based BSMS ................................................................. 52

8.2 Configurations ...................................................................................................... 53

Configuration with LTX / LRX .......................................................................... 53

Configuration for non-BOSS1 with LTX / LRX................................................. 54

Configurations with GAB ................................................................................. 55

Configurations with L-TRX .............................................................................. 56

8.3 Configurations with SPB(-E) and VPSB ............................................................... 57

8.4 System Architecture / Overview ........................................................................... 59

8.5 BSMS/2 Rack ....................................................................................................... 61

8.6 Service Web ......................................................................................................... 63

IP Address of the BSMS/2............................................................................... 63

Main Service Page .......................................................................................... 64

8.7 AC / DC Wiring ..................................................................................................... 66

8.8 DC Power Distribution .......................................................................................... 67

8.9 Backplane............................................................................................................. 68

9 Power Supplies............................................................................................75

10 ELCB.............................................................................................................7910.1 Introduction........................................................................................................... 79

10.2 Lock Parameters and Technical Data .................................................................. 79

10.3 Configuration and Wiring...................................................................................... 81

10.4 System Architecture / Overview ........................................................................... 82

Protection ........................................................................................................ 83

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Lock Software Architecture ............................................................................. 83

Lock Control State Machine ............................................................................ 84

Handling of High Gradient Rates for Auto Shim and Drift Compensation....... 85

Measurements Provided for Diagnostic .......................................................... 85

Calibration ....................................................................................................... 86

Front Panel - LED‘s during Start Up................................................................ 86

10.5 Bus Interface ........................................................................................................ 86

Backplane Connector (User Bus).................................................................... 87

Front Connectors ............................................................................................ 88

10.6 Service Software .................................................................................................. 88

Lock Service Web ........................................................................................... 89

Lock Parameters and Commands................................................................... 90

Lock Configuration .......................................................................................... 92

Diagnostic and Trouble Shooting .................................................................... 93

11 SCB20 ...........................................................................................................9511.1 Introduction........................................................................................................... 95

11.2 Technical Data ..................................................................................................... 96

11.3 Configurations ...................................................................................................... 97

BOSS1 Configuration...................................................................................... 97

Configuration for BOSS2, 3 and WB............................................................... 98

Overview of all Shim Adapters ........................................................................ 99

11.4 System Architecture / Overview ......................................................................... 100

Shim Coil Identification.................................................................................. 101

Protection ...................................................................................................... 101

Measurements Provided for Diagnostic ........................................................ 101

Calibration ..................................................................................................... 102

Front Panel - Connectors and LED‘s ............................................................ 103

11.5 Bus Interface ...................................................................................................... 105

Backplane Connector (User Bus).................................................................. 105

11.6 Service Software ................................................................................................ 105

Shim Service Web......................................................................................... 106

Setup the Shim Functions ............................................................................. 107

View and Modify the Shims........................................................................... 108

Diagnostic and Trouble Shooting .................................................................. 109

No BOSS File for Currently Installed Shim System? .................................... 110

12 GAB/2..........................................................................................................11512.1 Introduction......................................................................................................... 115

12.2 Technical Data ................................................................................................... 115

12.3 Configurations .................................................................................................... 116

Preemphasis ................................................................................................. 117

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Protection ...................................................................................................... 119

Status LED‘s on the Front Panel ................................................................... 119


GAB/2 Control State Machine ....................................................................... 120

Front Panel - Connectors .............................................................................. 121

12.5 Bus Interface ...................................................................................................... 122

Backplane Connector (User Bus).................................................................. 122

12.6 LVDS Interface Specification.............................................................................. 123

12.7 Web Interface ..................................................................................................... 125

GAB/2 Service Web ...................................................................................... 125

Offset Re-Calibration in the Field .................................................................. 126

Preemphasis Setting by Service Web ........................................................... 126

Trouble Shooting ........................................................................................... 127

13 L-TRX / L-19F .............................................................................................13113.1 Introduction......................................................................................................... 131


Function Description...................................................................................... 134

Protection ...................................................................................................... 135

Internal Diagnostics....................................................................................... 136

Technical Data BSMS/2 Lock Transceiver.................................................... 137

Technical Data BSMS/2 19F Lock Transceiver 300-1000 ............................ 138

2H Lock with L-TRX Internal Power Amplifier ............................................... 139

2H Lock with Additional, External 2H Power Amplifier .................................. 140

13.3 AVANCE III MicroBay/OneBay/TwoBay Configurations..................................... 141

Installation ..................................................................................................... 141

Settings ......................................................................................................... 142

Wiring ............................................................................................................ 142

13.4 Front Panel - Connectors and LED‘s.................................................................. 146

BSMS/2 Lock Transceiver............................................................................. 146

BSMS/2 19F Lock Transceiver 300-1000 ..................................................... 150

13.5 Web Interface ..................................................................................................... 153

Service Web .................................................................................................. 153

Trouble Shooting ........................................................................................... 160

L-TRX Specific Error Messages .................................................................... 162

13.6 System Requirements ........................................................................................ 163

Power Supply ................................................................................................ 163

Lock Control Board........................................................................................ 163

TopSpin Software.......................................................................................... 163

Related Units and Accessories ..................................................................... 163

13.7 Ordering Information .......................................................................................... 165

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14 SLCB/2 & SLCB/3 ......................................................................................16714.1 Introduction......................................................................................................... 167

14.2 Configurations .................................................................................................... 167

14.3 Technical Data ................................................................................................... 168



14.5 Function Description........................................................................................... 176

Liquid Helium Level Measurement................................................................ 176

Liquid Nitrogen Level Measurement (SLCB/3 only) ...................................... 178

Sample Down and Sample Up Detection...................................................... 179

Version of the Shim Upper Part .................................................................... 179

Sample Changer Interface ............................................................................ 180

Calibration ..................................................................................................... 180

14.6 Bus Interface ...................................................................................................... 182

14.7 Service ............................................................................................................... 184



15 PNK Modules .............................................................................................18515.1 Introduction......................................................................................................... 185

15.2 Technical Data ................................................................................................... 186


15.4 General Installation Hints ................................................................................... 188

15.5 Module Drawings................................................................................................ 189

15.6 PNK3S Description............................................................................................. 192

Emergency Lift Functional Description.......................................................... 192

PNK3S Additional Installation Hints .............................................................. 193

Front Panel - Connectors .............................................................................. 194

15.7 Bus Interface ...................................................................................................... 197

15.8 Service ............................................................................................................... 198

Sample Handling Service Web ..................................................................... 198




16 BSVT Introduction & Configurations.....................................................20116.1 Introduction......................................................................................................... 201

16.2 BSVT Hardware ................................................................................................. 202

16.3 BSVT Software and Features............................................................................. 203

16.4 BSVT Specifications........................................................................................... 204

16.5 Basic BSMS/2 BSVT Configuration.................................................................... 206

16.6 Basic BSMS/2 BSVT Configuration with VT System Option .............................. 207

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16.7 Support for Nitrogen Level Sensor ..................................................................... 207

16.8 Required Cable Sets for VT Pptions .................................................................. 209

16.9 BSVT Probe Adaptation ..................................................................................... 211

HR RT Probes (Thermocouple Type T) ........................................................ 211

CryoProbes ................................................................................................... 213

Solids Probes (2 Thermocouple Type T)....................................................... 214

16.10 BSVT and Heater Accessory (Power Booster)................................................... 216

16.11 BSVT and HT Accessory (High Temperature) ................................................... 217

16.12 BSVT and VT Gas Cooling Accessory Adaptation............................................. 218

BSCU05 / BSCUX COOLING UNIT .............................................................. 218

BCU05 / BCU-X COOLING UNIT.................................................................. 219

BVTL3200 N2 EXCHANGER ........................................................................ 220

BVTL3200 N2 EVAPORATOR...................................................................... 221

16.13 BSVT and FlowProbe Adaptation (FLOW-NMR)................................................ 222

17 BSVT Concept............................................................................................22517.1 Plug and Play Concept ....................................................................................... 225

17.2 Control Logic of the BSVT.................................................................................. 225

State Off / Standby ........................................................................................ 226

State On / Operating ..................................................................................... 227

State Sensor Error......................................................................................... 227

State Gas Flow Error..................................................................................... 227

State Self Test............................................................................................... 227

17.3 Specific Configurations....................................................................................... 228

BSVT with CryoProbes.................................................................................. 228

MAS Probes with Tempered Bearing Gas (VTN / WVT)............................... 229

BSVT with Booster ........................................................................................ 230

17.4 Frequently Asked Questions .............................................................................. 231

18 SPB .............................................................................................................23318.1 Introduction......................................................................................................... 233

18.2 Configurations .................................................................................................... 233

18.3 Technical Data ................................................................................................... 235


Protection ...................................................................................................... 242

Measurements Provided for Diagnostics....................................................... 242

Calibration ..................................................................................................... 243

Front Panel - Connectors and LED‘s............................................................. 244

18.5 Function Description........................................................................................... 247

Liquid Helium Level Measurement ................................................................ 247

Analog Liquid Nitrogen Level Measurement (SPB-E only)............................ 248

Sample Down and Sample Up Detection ...................................................... 248

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Version of the Shim Upper Part .................................................................... 249

Sample Changer Interface ............................................................................ 250

Control Output for BSMS/2 Variable Power Supply Board ........................... 251

Auxiliary Bus Connector (VT Accessory, SPB-E) ......................................... 253

Pneumatics ................................................................................................... 254

18.6 Bus Interface ...................................................................................................... 256

18.7 Service ............................................................................................................... 257

SPB Service Web.......................................................................................... 257




19 VPSB...........................................................................................................26119.1 Introduction......................................................................................................... 261

19.2 Configurations .................................................................................................... 261

19.3 Technical Data ................................................................................................... 262

Technical Data, Environment and Norms ..................................................... 262

Electrical Specification .................................................................................. 262


Control FPGA................................................................................................ 264

Triple Power Supply and Output Power Control ........................................... 264

Output Power Connector............................................................................... 265

Auxiliary Bus Connector (VT Accessory) ...................................................... 266

Protection ...................................................................................................... 266


Calibration ..................................................................................................... 267

Bus Interface ................................................................................................. 268


19.5 Service ............................................................................................................... 272

VPSB Service Web ....................................................................................... 272




20 VTA .............................................................................................................27520.1 Introduction......................................................................................................... 275

20.2 Configurations .................................................................................................... 276

20.3 Technical Data ................................................................................................... 277


Protection ...................................................................................................... 285


Calibration ..................................................................................................... 286

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Connectors and LED‘s .................................................................................. 286

20.5 Service ............................................................................................................... 288

VTA Service Web .......................................................................................... 288




21 Nitrogen Level Sensor ..............................................................................29121.1 Introduction......................................................................................................... 291

21.2 Configurations and Installation ........................................................................... 291

Installation ..................................................................................................... 291

Digital Configuration (BSMS/2 with BSVT).................................................... 292

Analog Configuration (BSMS/2 with SLCB/3) ............................................... 293

Protection ...................................................................................................... 293


Calibration ..................................................................................................... 294


21.3 Service ............................................................................................................... 298

Service Web .................................................................................................. 298




22 Radiation Shield Temperature Control (MAG-RS)..................................29922.1 Introduction......................................................................................................... 299

22.2 Configurations and Installation ........................................................................... 299

Installation ..................................................................................................... 299

Connection to the Console (BSMS/2 with BSVT).......................................... 300

Protection ...................................................................................................... 301

Measurements Provided for Diagnostics....................................................... 301

Calibration ..................................................................................................... 301


22.3 Service ............................................................................................................... 301

Service Web .................................................................................................. 301

Diagnostics and Trouble Shooting ................................................................ 302



23 Maintenance...............................................................................................30323.1 Safety and Function Protection .......................................................................... 303

23.2 Replacing boards ............................................................................................... 304

23.3 Fans ................................................................................................................... 305

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Fan Repair Procedure................................................................................... 306

24 Troubleshooting ........................................................................................30724.1 Diagnostic and Trouble Shooting ....................................................................... 307

25 Dismantling and Disposal.........................................................................30925.1 Safety ................................................................................................................. 309

25.2 Dismantling......................................................................................................... 310

25.3 Disposal Intructions ........................................................................................... 310

A Appendix ....................................................................................................311A.1 Warning Signs .................................................................................................... 311

A.2 Figures ............................................................................................................... 313

A.3 Tables................................................................................................................. 319

A.4 Index................................................................................................................... 323

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Table of Contents

1 About ............................................................................................................17

2 Introduction..................................................................................................19

3 Safety............................................................................................................21

4 Technical Data .............................................................................................35

5 Transport, Packaging and Storage ............................................................37

6 Installation and Initial Commissioning......................................................41

7 Operation......................................................................................................49

8 BSMS/2 System with ELCB ........................................................................51

9 Power Supplies............................................................................................75

10 ELCB.............................................................................................................79

11 SCB20 ...........................................................................................................95

12 GAB/2..........................................................................................................115

13 L-TRX / L-19F .............................................................................................131

14 SLCB/2 & SLCB/3 ......................................................................................167

15 PNK Modules .............................................................................................185

16 BSVT Introduction & Configurations.....................................................201

17 BSVT Concept............................................................................................225

18 SPB .............................................................................................................233

19 VPSB...........................................................................................................261

20 VTA .............................................................................................................275

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21 Nitrogen Level Sensor ..............................................................................291

22 Radiation Shield Temperature Control (MAG-RS)..................................299

23 Maintenance...............................................................................................303

24 Troubleshooting ........................................................................................307

25 Dismantling and Disposal.........................................................................309

A Appendix ....................................................................................................311

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Contact

Manufacturer:

Bruker BioSpin AG

Industriestrasse 26

CH-8117 Fällanden

Switzerland

Phone: +41 44 825 9111http://www.bruker-biospin.com

NMR Hotlines

Contact our NMR service centers.

Bruker BioSpin NMR provide dedicated hotlines and service centers, so that our special-ists can respond as quickly as possible to all your service requests, applications ques-tions, software or technical needs.

Please select the NMR service center or hotline you wish to contact from our list avail-able at: http://www.bruker-biospin.com/hotlines_nmr.html

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http://www.bruker-biospin.com/hotlines_nmr.html

http://www.bruker-biospin.com

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1 About

1.1 This Manual

This manual is intended to be a reference guide for operators and service technicians. It provides detailed information about the user level maintenance and service and overall use of the BSMS/2 system.

The figures shown in this manual are designed to be general and informative and may not represent the specific Bruker model, component or software/firmware version you are working with. Options and accessories may or may not be illustrated in each figure.

Carefully read all relevant chapters before working on the device!

This manual describes parts and procedures relevant to the device version it is delivered with. For older hardware, please refer to the manual supplied at the time.

1.2 Policy Statement

It is the policy of Bruker to improve products as new techniques and components become available. Bruker reserves the right to change specifications at any time.

Every effort has been made to avoid errors in text and figure presentation in this publica-tion. In order to produce useful and appropriate documentation, we welcome your com-ments on this publication. Support engineers are advised to regularly check with Bruker for updated information.

Bruker is committed to providing customers with inventive, high quality products and ser-vices that are environmentally sound.

1.3 Symbols and Conventions

Safety instructions in this manual are marked with symbols. The safety instructions are introduced using indicative words which express the extent of the harzard.

In order to avoid accidents, personal injury or damage to property, always observe safety instructions and proceed with care.

DANGER

This combination of symbol and signal word indicates an immediately hazardous sit-uation which could result in death or serious injury unless avoided.

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About

i This symbol highlights useful tips and recommendations as well as information designed to ensure efficient and smooth operation.

WARNING

This combination of symbol and signal word indicates a potentially hazardous situa-tion which could result in death or serious injury unless avoided.

CAUTION

This combination of symbol and signal word indicates a possibly hazardous situation which could result in minor or slight injury unless avoided.

NOTICE

This combination of symbol and signal word indicates a possibly hazardous situation which could result in damage to property or the environment unless avoided.

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2 Introduction

This manual is intended to be used by trained device users. It contains information about the device: operation, safety, maintenance, etc..

2.1 Limitation of Liability

All specifications and instructions in this manual have been compiled taking account of applicable standards and regulations, the current state of technology and the experience and insights we have gained over the years.

The manufacturer accepts no liability for damage due to:

• Failure to observe this manual

• Improper use

• Deployment of untrained personnel

• Unauthorized modifications

• Technical modifications

• Use of unauthorized spare parts

The actual scope of supply may differ from the explanations and depictions in this man-ual in the case of special designs, take-up of additional ordering options, or as a result of the latest technical modifications.

The undertakings agreed in the supply contract as well as the manufacturer's Terms and Conditions and Terms of Delivery and the legal regulations applicable at the time of con-clusion of the contract shall apply.

2.2 Before You Begin

This user manual contains information and safety information that are necessary for the safe operation of the BSMS/2 system.

Any user maintenance and repairs are to be accomplished using the information in this manual.

Consider all safety references!

Information for ordering spare parts is available in the spare parts section for from the Bruker Service Center (see contacts).

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2.3 Minimum Qualifications for Operating Personnel

EXAMPLE:

2.4 The Bruker Service

Our customer service division is available to provide technical information. See "Con-tact" on page 15 for contact details.

In addition, our employees are always interested in acquiring new information and expe-rience gained from practical application; such information and experience may help improve our products.

2.5 Transport to Manufacturer

When the BSMS/2 system or sub-units must be returned to the manufacturer for a major repair, use the original packaging for transportation.

Include a good description of the problem.

Type of Task Personnel Training and Experience

Transportation No speical requirements. No special.

Installation Bruker certified personnel only. Technically skilled, with a good knowledge of the application field.

Routine Use Appropriately certified and experienced personnel, famil-iar with use of computers and automation in general

Laboratory technicians or equiva-lent. Training is usually done in-house. Familiar with MS Win-dows® environment.

Daily Maintenance

Setup and optimization of program

Bruker certified personnel only. Experienced laboratory techni-cian. High degree of knowledge of the relevant application field.

Preventive Maintenance Bruker certified personnel only. Technically skilled with a basic understanding of the application.

Servicing Bruker certified personnel only. Background and experience in electronics/mechanics with com-puter knowledge.

Table 2.1 Overview Installation and Operation Requirements for Personnel

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3 Safety

This section provides an overview of all the main safety aspects involved in ensuring optimal personnel protection and safe and smooth operation.

Non-compliance with the action guidelines and safety instructions contained in this man-ual may result in serious hazards.

User interface, system messages, and manuals require a good understanding of the English language.

3.1 Intended Use

The BSMS/2 system has been designed and constructed solely for the intended use described here. The BSMS/2 system is dedicated only for the specific NMR purpose of being used as the electronics system of the AVANCE III spectrometers of BRUKER.

Intended use also includes compliance with all specifications in this manual.

Any use which exceeds or differs from the intended use shall be considered improper use.

No claims of any kind for damage will be entertained if such claims result from improper use.

WARNING

Do not use the BSMS/2 system for a purpose other than the described “Intended Usage”.

N'employez pas le système BSMS/2 pour un but autre que celui prévu.

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3.2 Owner‘s Responsibility

Owner

The term 'owner' refers to the person who himself operates the device for trade or com-mercial purposes, or who surrenders the device to a third party for use/application, and who bears the legal product liability for protecting the user, the personnel or third parties during the operation.

Owner‘s Obligations

The device is used in the industrial sector, universities and research laboratories. The owner of the device must therefore comply with statutory occupational safety require-ments.

In addition to the safety instructions in this manual, the safety, accident prevention and environmental protection regulations governing the operating area of the device must be observed.

In this regard, the following requirements should be particularly observed:

• The owner must obtain information about the applicable occupational safety regula-tions, and - in the context of a risk assessment - must determine any additional dan-gers resulting from the specific working conditions at the usage location of the device. The owner must then implement this information in a set of operating instructions governing operation of the device.

• During the complete operating time of the device, the owner must assess whether the operating instructions issued comply with the current status of regulations, and must update the operating instructions if necessary.

• The owner must clearly lay down and specify responsibilities with respect to installa-tion, operation, troubleshooting, maintenance and cleaning.

WARNING

Operation of the BSMS/2 chassis in a manner not consistent with ’Nor-mal Operation’ as described and recommended in this document may expose the user to unsafe conditions and may result in damage to the instrument. Service calls that arise from a failure to observe these rec-ommendations are NOT covered by the instrument warranty

L'utilisation du châssis BSMS/2 non conforme avec l’usage normal décrit et recommandé dans ce document peut exposer l'utilisateur à des conditions dangereuses et pourrait conduire à la destruction de l'instrument. Des interventions qui résultent d’une inobservance de ces recommandations ne sont pas couvertes par la garantie.

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Safety

• The owner must ensure that all personnel dealing with the device have read and understood this manual. In addition, the owner must provide personnel with training and hazards information at regular intervals.

• The owner must provide the personnel with the necessary protective equipment.

• The owner must warrant that the BSMS/2 system is operated by trained and autho-rised personnel as well as all other work, as transportation, mounting, start-up, the installation, maintenance, cleaning, service, repair and shutdown, that is carried out on the device.

• All personnel who work with, or in the close proximity of the BSMS/2 system, need to be informed of all safety issues and emergency procedures as outlined in this user manual.

• The owner must document the information about all safety issues and emergency procedures in a laboratory SOP (Standard Operating Procedure). Routine briefings and briefings for new personnel must take place.

• The owner must ensure that new personnel must be supervised by experienced personnel. It is highly recommended to implement a company training program for new personnel on all aspects of product safety and operation.

• The owner must ensure that personnel is regularly informed of the potential hazards within the laboratory. This is all personnel that work in the area, but in particular lab-oratory personnel and external personnel such as cleaning and service personnel.

• The owner is responsible for taking measures to avoid inherent risks in the handling of dangerous substances, preventing industrial disease, and providing medical first aid in emergencies.

• The owner is responsible for providing facilities according to the local regulations for the prevention of industrial accidents and generally accepted safety regulations according to the rules of occupational medicine.

• All substances needed for operating and cleaning the device samples, solvents, cleaning agents, gases, etc. have to be handled with care and disposed of appropri-ately. All hints and warnings on storage containers must be read and adhered to.

• The owner must ensure that the work area is sufficiently illuminated to avoid reading errors and faulty operation.

• The owner must ensure that the laboratory is equipped with an oxygen warning device, in case the device is operated with nitrogen.

Furthermore, the owner is responsible for ensuring that the device is always in a techni-cally faultless condition. Therefore, the following applies:

• The owner must ensure that the maintenance intervals described in this manual are observed.

• The owner must ensure that all safety devices are regularly checked to ensure full functionality and completeness.

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3.3 Personnel Requirements

3.3.1 Qualifications

i Note: Only trained Bruker personnel are allowed to mount, retrofit, repair, adjust and dis-mantle the unit!

3.3.2 Unauthorized Persons

3.4 Personal Protective Equipment

Personal protective equipment is used to protect the personnel from dangers which could affect their safety or health while working. The personnel must wear personal pro-tective equipment while carrying out the different operations at and with the device.

This equipment will be defined by the head of laboratory. Always comply with the instruc-tions governing personal protective equipment posted in the work area.

3.5 Position of the Safety Devices

The mains switch on the BSMS/2 chassis back provides the EMERGENCY OFF func-tion. Under normal conditions, this switch is used for both, power up and shut down of the system.

WARNING

Risk to life for unauthorized personnel due to hazards in the danger and working zone!

Unauthorized personnel who do not meet the requirements described in this manual will not be familiar with the dangers in the working zone. Therefore, unauthorized per-sons face the risk of serious injury or death.

Unauthorized persons must be kept away from the danger and working zone.

If in doubt, address the persons in question and ask them to leave the danger and working zone.

Cease work while unauthorized persons are in the danger and working zone.

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Safety

3.6 Important Safety Considerations

These safety instructions refer to the whole BSMS/2 system including its subunits.

The BSMS/2 system can be damaged by inappropriate usage. In this case, it is neces-sary to check the equipment by the service before it can be used again.

The user should inspect the equipment at regular intervals for correct operation. In case of any damage, wear or abnormal behavior, the user is expected to inform the service immediately.

HIGH VOLTAGE

Do not loosen, connect or touch any cable during lightning.

Do not use a cable that shows signs of damage or that have been stressed and could be damaged.

Do not open the power supply modules. There may be dangerous volt-ages present.

Ne détendez, ne reliez ou ne touchez aucun câble pendant un orage (foudre). N'employez pas un câble endommagé.

N'ouvrez pas les modules d'alimentation. Ils peuvent être sous tension.

WARNING

Heavy equipment:

At least two people are needed to lift the BSMS/2 chassis.

Équipement lourd:Au moins deux personnes sont nécessaires pour soulever le châssis BSMS/2.

DANGER

Do not use the equipment and inform the service staff, if you are in doubt about the correct state of any component.

N'utilisez pas l'équipement et informez le personnel de service, si vous suspectez un défaut .

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Safety

In the unlikely case of one of the following, stop using the equipment, interrupt the cur-rent supply, disclose this circumstance to the service staff and ask for instructions:

• The power cord, power plug or power supply are cracked, brittle or damaged

• Signs of excessive heat appear

• There is evidence or suspicion that a liquid has intruded into any enclosure

• The power cord or the power supply have been in contact with any liquid

• The BSMS/2 system has been damaged in any way

• The equipment does not work correctly

As a general rule, servicing must be performed by BRUKER qualified personnel. How-ever, there are several BSMS/2 sub-assemblies that can be replaced or installed by the customer.

Before maintenance or repair always switch off and unplug the power cable. Under cer-tain conditions dangerous voltages may exist even with the power cable removed. To avoid injuries, always disconnect power and discharge circuits before touching them.The BSMS/2 chassis has been designed to provide maximum safety for the User. Under nor-mal operation, the BSMS/2 chassis requires NO user access to the inner components of the unit.

DANGER

Do not try to service the equipment by yourself, unless you are specifi-cally asked to do so and are given instructions by the service staff. In case of questions or problems, please contact your nearest BRUKER office or representative.

N'essayez pas d’entretenir l'équipement par vous-mme, à moins que vous soyez invité à le faire ainsi et instruit par le personnel de service. En cas de questions ou de problèmes, prenez contact avec le plus proche représentant de BRUKER svp.

DANGER

Instructed operating personnel must not remove chassis covers except as described in this manual. Do not replace BSMS/2 units with mains switch turned on.

Le personnel de service ne doivent pas enlever les couvercles de châs-sis excepté comme décrit dans ce manuel. Ne remplacez pas les unités BSMS/2 tandis que l'interrupteur principal est mis en circuit

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Safety

WARNING

All electrical connectors must be used as supplied by BRUKER. Do not substitute them by other types.

Seules les prises électriques fournies par BRUKER doivent être utili-sées. Ne les substituez pas par d'autres types.

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Safety

3.6.1 Field Exchangeable Units

The BSMS/2 system has many Field Exchangable Units located at the front and back of the chassis (mainframe). Basically all units in slide-in module style can be exchanged in the field. Types and position in the chassis are highly dependent on the configuration of the spectrometer.

Field Exchangable Units should only be replaced according to the configurations chapter in this manual. Make sure that the new units are inserted at their designated location in the chassis.

In case of the AQS IPSO unit, the replacement should be left to qualified service person-nel.

WARNING

Before a unit can be unplugged for exchange, the BSMS/2 must be com-pletely switched off and the cables to the unit must be disconnected. ESD precautions must be observed for handling.

Avant qu'une unité puisse être débranchée pour l'échange, le BSMS/2 doit être complètement hors tension et le câble de réseau doit être débranché.Il faut observer des précautions d'ESD pour la manipulation.

WARNING

Any EN61010 safety relevant items such as (but not limited to) the mains inlet module, mains wiring and main transformer in the chassis must not be removed from the chassis. Do not attempt to replace this unit in the field!In case of failure replace the mainframe as a whole. An exchange of safety relevant units requires a mandatory safety retest as defined by the EN61010 Annex F, Routine Tests.

Aucun dispositif approprié de la sécurité EN61010 tel que (mais non limité) le module “systéme d'alimentation principal de forces”, le câblage des forces et le transformateur principal dans le châssis ne doi-vent pas être enlevé du châssis. N'essayez pas de remplacer cet dis-positif chez le client!Seulement remplacez l’unité entiére avec toutes les despositifes.

Un échange des dispositifes appropriées de sécurité demande une véri-fication de sécurité obligatoire comme défini par EN61010 l'annexe F, vérification individuels de série.

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Safety

3.7 Technically Qualified Personnel Only

WARNING

Service on electrical or other components should be performed only by a qualified Bruker Service Representative or similarly trained and authorized person. Always disconnect the mains power cord before servicing. Under certain conditions danger-ous voltages may exist even with the power cable removed. To avoid injuries, always disconnect power and discharge the circuits before touching them.

L'installation et la maintenance ou le service des composants électriques doivent être faites seulement par le personnel qualifié de Bruker. Déconnectez toujours le câble d’alimentation secteur avant tout entretien. Dans certaines conditions l’installation peut rester sous tension même si le cable d’alimentation secteur est déconnecté. Pour éviter des dommages, toujours déconnectez l’alimentation et déchargez les cir-cuits avant de toucher.

WARNING

Operating personnel must not remove chassis covers except as described in this manual. Do not replace BSMS/2 sub-assembly units without the mains switch turned OFF and the mains cord disconnected.

Le personnel de service ne doivent pas enlever les couvercles de châssis excepté comme décrit dans ce manuel. Ne remplacez pas les unités BSMS/2 tandis que l'interrupteur principal est mis en circuit.

WARNING

DO NOT attempt to make adjustments, replacements or repairs to the instrument except as described in the accompanying user documentation. Only a Bruker Service Representative or similarly trained and authorized person should be permitted to ser-vice the instrument.

N'essayez pas de dépanner, d’ajuster ou de remplacer l’instrument ou ses parties excepté ce qui est décrit dans la documentation de l’utilisateur.Seulement un technicien de Bruker ou une personne qualifiée et autorisée sont auto-risés à entretenir l'instrument.

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3.8 Basic Dangers

The following section specifies residual risks which may result from using the device and have been established by means of a risk assessment.

In order to minimize health hazards and avoid dangerous situations, follow the safety instructions specified here as well as in the following chapters of this manual.

3.8.1 General Workplace Dangers

Dirt and Scattered Objects

Working in Heights

CAUTION

Danger of injury from tripping over dirt and scattered objects!

Dirt and scattered objects may cause people to slip or trip. A fall may result in inju-ries.

Always keep the work area clean.

Remove objects which are no longer required from the work area and particularly-from the floor.

Indicate unavoidable hazards using marking tape.

CAUTION

Accident hazard from falling from ladder!

It is possible to fall from a ladder when it is used to reach the device on some mag-nets.

Do not use a ladder.

Use an approved platform to reach the device on the magnet.

Wear non-slip shoes.

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Safety

Software Error

Genuine Samples

3.8.2 Dangers from Gases Under Pressure

Pneumatics

NOTICE

Material damage due to a software error!

Samples or device may be damaged due to a software error causing malfunction of the control system. Users may also be shocked by abrupt malfunction or unexpected system start.

Dummy samples must be used during installation and service.

Personnel should be alerted to unexpected malfunctions.

NOTICE

Material damage due to the use of genuine samples during installation and maintenance!

Using genuine samples during installation and maintenance may result in material damage.

Use only dummy samples during installation and maintenance.

WARNING

Danger of injury due to movements caused by stored pneumatic forces!

Pneumatically driven components may move unexpectedly due to stored residual forces, causing serious injuries.

Work on the pneumatics system must only be carried out by trained pneumatics technicians.

Before starting work on the pneumatics system, ensure that it has been com-pletely depressurised. The pressure accumulator must be completely relieved.

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Suffocation

3.8.3 Dangers from Radiation

Strong Magnetic Fields

i Note: The magnetic field of the device does not cause any personal injuries or property damage. For further information see the manual of the magnet used.

WARNING

Accident hazard from asphyxiation!

A break in the pneumatic hose may result in the uncontrolled exit of nitrogen into the laboratory.

An oxygen warning device should be present in the laboratory if the device is operated with nitrogen.

WARNING

Danger to life from strong magnetic fields!

Strong magnetic fields may cause serious injuries or death and significant damage to

property.

Persons fitted with heart pacemakers must be kept away from the appliance. The functionality of the heart pacemaker could be compromised.

Persons with metal implants must be kept away from the appliance. Implants may heat up or be subject to magnetic attraction.

Ferromagnetic materials and electromagnets must be kept away from the ma netic source. Such materials could be subject to magnetic attraction and may fly around the room, injuring or killing people. Minimum distance 3 meters.

Remove magnetic items (jewelry, watches, pens etc.) before carrying out maint nance work.

Keep electronic equipment away from the magnetic source. Such equipment could be damaged.

Keep storage media, credit cards etc. away from the magnetic source. Data could be erased.

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Safety

3.8.4 Environmental Protection

The following pollutants are used in context with the NMR console:

Helium inert gas

Helium inert gas may cause suffocation at high concentrations. Disposal of the empty gas cylinders must be performed by a specialist disposal company.

Nitrogen gas

Nitrogen gas may cause suffocation at high concentrations. Disposal of the empty gas cylinders must be performed by a specialist disposal company.

Coolants

When released, coolants develop decomposition products which are hazardous to the environment. Maximum care and caution are required when handling coolants. Always observe the safety data sheet issued by the manufacturer. Ensure that personnel han-dling coolants are regularly informed about potential dangers and are instructed in the safe handling of coolants.

Cleaning liquids

Cleaning liquids incorporating solvents contain toxic substances. They must not be allowed to escape into the environment. Disposal must be carried out by a specialist dis-posal company.

NOTICE

Danger to the environment from incorrect handling of pollutants!

Incorrect handling of pollutants, particularly incorrect waste disposal, may cause seri-ous damage to the environment.

Always observe the instructions below regarding handling and disposal of pollut-ants.

Take the appropriate actions immediately if pollutants escape accidentally into the environment. If in doubt, inform the responsible municipal authorities about the damage and ask about the appropriate actions to be taken.

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3.9 Spare Parts

i Loss of guaranteeIf non-approved spare parts are used the manufacturer's guarantee is invalidated

Purchase spare parts from authorised dealers or directly from the manufacturer. See "Contact" on page 9 for manufacturer's address.

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4 Technical Data

4.1 General Information

4.2 Connection Values

Electrical

Pneumatic

i Please refer to the User Manual Site Planning for AVANCE Systems 300-750 MHz(UM) Z31276

BSMS / 2 technical data

General Height 310 mm Chassis dimensions

Width 485 mm

Depth 482 mm

Weight 32 kg Approx. weight with atypical configuration

Front Rack

Board Height 233.35 mm

Board Length 220 mm

Back Rack

Board Height 233.35 mm

Board Length 220 mm

Table 4.1 Technical Data of BSMS/2 Chassis

BSMS / 2 technical data

AC Input Voltage 187-223 Vrms Mains selector range

201-239 Vrms

212-253 Vrms

Frequency 50 / 60 Hz

Input Current max. 4 Arms

Table 4.2 Technical Data of BSMS/2 Chassis

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Technical Data

4.3 Operating Conditions

Environment

i The BSMS/2 system is designed as a subsystem of the spectrometer. For further envi-ronmental conditions outside the cabinet please refer to the User Manual Site Planning for AVANCE Systems 300-750 MHz, Bruker P/N Z31276

Data Value Unit

Temperature range (operation) 5 to 35 °C

Temperature range (storage) 5 to 40 °C

Permissible altitude (above see level) < 2000 m

Relative humidity at 31 °C, maximum < 80 %

Decreasing linear till relative humidity < 50% at 40 °C, maximum

Table 4.3 Operating Environment

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5 Transport, Packaging and Storage

5.1 Symbols on the Packaging

The following symbols are affixed to the packaging material. Always observe the sym-bols during transport and handling.

Top

Fragile

Protect Against Moisture

The arrow tips on the sign mark the top of the package. They must always point upwards; otherwise the content may be dam-aged.

Marks packages with fragile or sensitive contents.Handle the package with care; do not allow the package to fall and do not allow it to be impacted.

Protect packages against moisture and keep dry.

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Transport, Packaging and Storage

Component Sensitive to Electrostatic Charge

5.2 Inspection at Delivery

Upon receipt, immediately inspect the delivery for completeness and transport damage.

Proceed as follows in the event of externally apparent transport damage:

• Do not accept the delivery, or only accept it subject to reservation.

• Note the extent of the damage on the transport documentation or the shipper's delivery note.

• Initiate complaint procedures.

i Issue a complaint in respect to each defect immediately following detection. Damage compensation claims can only be asserted within the applicable complaint deadlines.

5.3 Packaging

About Packaging

The individual packages are packaged in accordance with anticipated transport condi-tions. Only environmentally friendly materials have been used in the packaging.

The packaging is intended to protect the individual components from transport damage, corrosion and other damage prior to assembly. Therefore do not destroy the packaging and only remove it shortly before assembly.

Handling Packaging Materials

Dispose of packaging material in accordance with the relevant applicable legal require-ments and local regulations.

The packaging contains components which are sensitive to an electrostatic charge.Only allow packaging to be opened by trained personnel. Establish potential equalisation before opening.

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5.4 Storage

Storage of the Packages

Store the packages under the following conditions:

• Do not store outdoors.

• Store in dry and dust-free conditions.

• Do not expose to aggressive media.

• Protect against direct sunlight.

• Avoid mechanical shocks.

• Storage temperature: 15 to 35 °C.

• Relative humidity: max. 60%.

If stored for longer than 3 months, regularly check the general condition of all parts and the packaging. If necessary, top-up or replace preservatives.

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6 Installation and Initial Commissioning

i Installation, initial commissioning, retrofitting, repairs, adjustments or dismantling of the device must only be carried out by employees of the manufacturer or persons authorised by the manufacturer.

6.1 Installation and Preparation for Use

The BSMS/2 mainframe must be installed at it‘s designated position in the electronics cabinet to ensure proper air ventilation for the cooling fans. The position may vary in dif-ferent cabinet types and sizes.

The chassis must be secured with at least 4 screws in the cabinet. The power cable is included in the cabinet wiring.

6.1.1 Mains Selection and Fuses

Prior to the first power-up of the BSMS/2 mainframe, it must be ensured that the mains selection switch is in the correct position (see selector on the back side of the BSMS/2). Make sure that the mains cable is disconnected for adjusting the voltage selector.

In general, the mains voltage selection switch should be set to the matching range; how-ever, if the mains power is weak, the next lower range should be chosen despite the greater power dissipation in the power supply modules.

For example:

• 230 V stable mains power => choose the 212 - 253 VAC position

• 230 weak / unstable mains power => choose the 201 - 239 VAC position

The BSMS/2 is protected by two fuses as specified on the power supply nameplate. The fuses are located in a removable fuse holder next to the AC power connector (use 5 Amps time-lag fuse types).

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Installation and Initial Commissioning

6.1.2 Check / Download Firmware

With every TopSpin installation there are also the necessary firmware files installed on the workstation. In addition, the latest firmware versions can be downloaded from the Swiss ftp server. The actual download to the hardware has to be performed by the cus-tomer or by a service engineer. This ensures that there is no accidental overwriting of currently loaded firmware versions.

1. One has to make sure that the file „BsmsCheckDownload.txt“ is up to date - if nec-essary, this file can be downloaded from the Swiss ftp server.

2. The file „BsmsCheckDownload.txt“ has to be transmitted to the BSMS/2.

3. According to the „BsmsCheckDownload.txt“ file and the hardware codes of the con-nected subsystems the required firmware versions are evaluated and displayed - outdated or incompatible versions are marked as „not ok“ and a related error mes-sage is issued.

4. Missing firmware files can be downloaded from the Swiss ftp server. When all the necessary files are available on the local hard disk, the outdated firmware compo-nents (marked as „not ok“) have to be installed on the corresponding BSMS/2 sub-systems.

Note 1): When a new ELCB or SCB20 firmware is being loaded, the Shim currents are ramped down slowly before the hardware reset - in order to minimize eddy currents in the magnet. After restart (or after power up), the Shims are started up softly as well. The timing of the Shim ramp can be adjusted in the Shim Configuration submenu (Shim Soft Start/Shut Down Duration).

Figure 6.1 Principle of firmware upgrading

LocalHarddisk

Swissftp-Server

slcb_firmware_....hex

scb20_fpga_..-…-...bit

gab2_fpga_..-...-...bit

BsmsCheckDownload.txt

1. Get the fileBsmsCheckDownload.txt

2. Download ofBsmsCheckDownload.txt

BSMS/2 - ELCB

3. Evaluate the requiredfirmware versions

HW-Codes

HW-CodesHW-Codes

4. Get the required firmwarefrom the ftp Server - the linksare automatically generated

elcb_firmware_....gz

5. Download thenew firmware

ftp.bruker.ch

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In addition to the firmware information, there is also the hardware configuration dis-played on the „Setup“ screen: In our example, it is a 600 MHz configuration with two SCB20 providing maximum 40 Shims (BOSS2 / 3 / WB ..), GAB/2, SLCB with PNK5 and the 19F Lock Option installed. The new boards provide the BIS information, including Serial Number and the ECL.

6.1.3 Calibration and System Configuration Overview

The Web page „Main“ -> „Calibration“ provides the links to the individual necessary cali-bration / system configuration procedures.

Figure 6.2 Setup of the BSMS/2 firmware

1

2

3

4

1) Shims will be ramped down prior to reset

1)

1)

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6.1.4 Establishing the Service Engineer Access Level

Some of the calibration procedures can be done by the customer. However, there are critical settings such as the Helium Level Measurement Calibration, which needs to be executed by a service engineer. It is necessary to have the according access rights to manipulate these parameters.

The access rights for service engineers can be obtained on the Web page „Main“ -> „Service“ (user name and password required, see below) - they expire after one hour.

Figure 6.3 Calibration and System Configuration

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Type in your user name (example „hen“) and the four digit service access code (last four digits of the BSMS keyboard password). Depress the button „Login“.

When you have successfully logged in, then there are additional buttons available (e. g. Installation Default: Button „Save To NVM“).

Figure 6.4 Log in as service engineer

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6.1.5 Lift and Spin Calibration

The procedures for Lift and Spin calibration are available on the corresponding Web pages. Basically, the procedures are similar to the former BSMS/2 calibrations (see also in the SLCB manual). However, the handling by the service tool has been improved and simplified - the necessary actions can be initiated by simply select the appropriate but-tons, and each step of the calibration is listed / described on the Web page.

For systems with BSMS/2 SPB, the spin calibration (needle valve) is no longer neces-sary.

6.1.6 Helium Level Measurement Calibration

Similar to the former Helium Level Measurement Calibration (see also in the SLCB man-ual) there is an improved and simplified version provided by the Service Web. It is nec-essary to have service engineer access rights to perform this calibration. Each step of the calibration is listed / described on the Web page.

Figure 6.5 Service Page after successful service engineer registration

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6.1.7 Auto Lock Calibration

The „Auto Lock“ feature is based on performing a simple 2H experiment on the solvent (see also in the former Lock manual). According to the peak frequency of the resulting FID either the H0 field (normal case) or the shift (optional) are adjusted.

The relation factor between frequency and H0 field is influenced by the Shim System (there are different factors for standard, wide bore and super wide bore magnets) and may additionally vary slightly between different exemplars. Therefore there is a calibra-tion procedure provided for perfect adjustment of this factor. It is necessary to have a sample inserted (with any solvent of the specific nucleus). The calibration can be exe-cuted simply by depressing a button - the procedure takes about one minute. After a successful calibration, the Auto Lock is able to lock in even if the field has drifted very far away from the correct value.

6.1.8 Setup of the Pulse / Signal Polarities

The polarities of the trigger signals (Lock Hold, TP-F0 for the Lock Transmitter path and the external synchronization signals for RCP shimming) can be set according to the con-nected hardware. It is necessary to have service engineer access rights to modify these values.

6.1.9 Final Steps of an Installation

Once the installation has been completed successfully, a backup of the resulting config-uration can be saved on the nonvolatile memory (NVM). This fail-safe configuration can be re-activated later for switching back to a known state.

The sub-chapter „Installation Default“ on the Web page „Main“ -> „Service“ provides the button „Load from NVM“ for re-activation of these installation settings (available for all users).

The button „Save to NVM“ in the same sub-chapter is reserved for service engineers (login required) and provides storing a backup of the installation settings onto the non-volatile memory.

Additionally, it is possible to transfer the complete BSMS/2 configuration to the worksta-tion, where it can be stored as a text file - this function is available for all users, under the sub-chapter „Active User Configuration / Parameters“.

For logged in service engineers it is possible to retrieve a configuration from the worksta-tion and re-activate its settings.

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7 Operation

7.1 General Operating Guidelines

Prior to the first use after installation, make sure that the BSMS/2 system is properly con-figured. Please refer to the chapters "Installation and Initial Commissioning" on page 123 in this manual.

The only user operations permitted are:

• Starting up and shutting down the BSMS/2 system

• Operating the users software interface

• Connecting signal and data interface cables that are accessible outside of the BSMS/2 system

• Replacing or installing field exchangable units (by instructed operating or service personal)

7.1.1 Operator Protection

The electronic circuitry of BSMS/2 system is operating with low and safe voltages, except for the power supply and its connection to mains. Nevertheless, any electrical equipment can become a source of danger under extreme conditions.

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8 BSMS/2 System with ELCB

8.1 Introduction

Since 1998 when the BSMS/2 mainframe was introduced into market several minor extensions and adaptations have taken place.

With the introduction of the AVANCE II NMR system in 2005, a major modernization has taken place by enabling the BSMS/2 to be operated via ethernet TCP/IP communication and WEB based control.

At this time several classic BSMS/2 boards have been modernized in order to replace the former up to 15 years old board like CPU/3, the LCB and the various SCB7 and SCB13 shim current boards. All these units have been replaced by higher integrated boards providing better performance, higher resolution and increased stability.

In 2010 the Variable Temperature System has been integrated into the BSMS/2. With this step the former family of BVT3000 and BVT3200 units and the former pneumatic units PNK3, PNK3S and PNK5 as well as the SLCB/2 and SLCB/3 boards were replaced by the new Sensor & Pneumatics Board (SPB) and the Variable Power Supply Board (VPSB).

Note that the BSMS/2 chassis must have at least ECL 02.00 for supporting the all new boards available since 2005.

8.1.1 Subunits in the ELCB Based BSMS

Shim

The SCB20 (Shim Current Board) provides the required precision for all existing types of shim systems and can therefore replace any variant of former SCB7 and SCB13. Con-nectivity to the different Shim Systems is provided by a set of various adapters.

Lock

The ELCB (Ethernet based Lock Control Board) incorporates the lock functions like the lock control algorithm and the H0 current source. In addition this ELCB acts as commu-nication gateway between the workstation and the various subunits inside of the BSMS/2. The BSMS/2 can now be directly accessed with a standard Internet browser via ether-net TCP/IP protocol or allows hardware independent communication with TopSpin 2.0 and higher by using a CORBA interface.

In late 2008 the new L-TRX board has started to replace the former L-TX, L-RX and par-tially the BSMS/2 2H-TX unit. This highest integrated RF unit provides a more digital integrated lock RF and includes all what is necessary to allow gradient shimming on 2H.

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BSMS/2 System with ELCB

Gradient amplifier

With the introduction of the AVANCE III in 2007, the GAB has been replaced with a GAB/2, which provides AVANCE III compatible control (LVDS48) and has now built-in preemphasis capability as standard feature.

Variable temperature control, sample handling and level monitoring

Most recently in 2010 there has been made a higher integration of the pneumatic func-tions for sample handling (lift, spin), the variable temperature control (power supply and various sensor interfacing, gas flow controls) and fill level monitoring for the magnet (helium and nitrogen level). These functions are now provided by the new SPB / SPB-Eand VPSB boards, which replace the former SLCB and PNK, the built in BVT3200 (with corresponding power supply) or any of the stand alone BVT3000 variants. With the intro-duction of these boards, the VME part of the BSMS has become obsolete.

In 2011 a new digital nitrogen level sensor has been introduced together with the ASCEND family of magnet systems.

8.1.2 Accessing the ELCB Based BSMS

All subunits may be accessed by a Web-based service tool, making service handling much easier and comprehensive. The former BSMS Tool (console program using the RS232 connection) is obsolete and should no longer be used in connection with the ECLB based BSMS/2.

Note: The additional RS232 communication capability of the ELCB has been foreseen for intermediate control the ELCB with TopSpin 1.3. This is not anymore required since TopSpin 2.0 is available.

SaveConfig is no longer used, as the new ELCB has an automatic save configuration mechanism and stores all the parameters (e. g. for Lock, Shim, Lift, HE-Level measure-ment) within its nonvolatile memory (NVM). In order to be able to switch back to a known state, a saved configuration from the installation may be restored later on - this fail-safe configuration can be re-activated by any user.

All activities of the new BSMS/2 and the data exchange with the TopSpin application are logged by the ELCB software. This information is accessible by the service tool and, additionally, it is periodically transferred to the workstation in order to keep a detailed long term history for trouble shooting. It is configurable how detailed the activities are logged.

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8.2 Configurations

In the following sub chapters, there are the various standard configurations described in detail. The units are marked in a specific color, according to the date of introduction:

• orange: Units that existed before 2005

• blue: Units that were introduced 2005 with the ELCB

• green: L-TRX and the related power supply introduced in 2008

• pink: Units for variable temperature control, sample handling and magnet fill level monitoring with related power supply introduced in 2010

8.2.1 Configuration with LTX / LRX

The diagram below shows a typical AVANCE III - BOSS1 configuration. The Gradient Amplifier (GAB/2) and the 2HTX are optional, depending on the application. For specific applications (e. g. solids configuration) the RF boards (L-TX and L-RX) may be missing. The new SCB20 provides a 50 pin connecter compatible with „plug“ Shim systems. Older style Shim systems may also be connected by using an appropriate adapter (see also chapter SCB20).

i Important: Note the position of the SCB20 for BOSS1 systems!

Note: The GAB/2 can be controlled by both, the IPSO gradient controller in AVANCE III spectrometers (large LVDS interface) or by the former GCU/3 (small LVDS interface).

The power supplies at the rear side (PSB1 and PSB2) for the new boards in configura-tion with L-TX / L-RX are the same as for the former CPU based BSMS configurations.

Figure 8.1 BOSS1 configuration with LTX / LRX (front)

CP

U (

obso

lete

)

SLC

B/2

Op

tiona

l: G

AB

/2 =

Z10

484

4

SC

B20

= Z

1029

30

ELC

B =

Z10

0818

L-T

X

L-R

X

Opt

iona

l: 2H

TX

BSMS/2 1

0

SLCB1 GAB1 SCB1 LCB1..

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8.2.2 Configuration for non-BOSS1 with LTX / LRX

Non-BOSS1 Systems requiring more than 20 Shim currents need a second SCB20. Similar to the former BSMS/2 systems, the Shim cables „A“ and „B“ have to be con-nected from right to left.

Figure 8.2 Power supplies for any non-L-TRX configuration (rear side)

PSB2 / PSB5 PSB1 / PSB7 VTCB / VPSBPSB VTCB / VPSB PNK / SPB

PS

B 2

PS

B 1

NOTICE

This power supply configuration has to be changed for configurations with L-TRX and for configurations with SPB / SPB-E:

L-TRX: Replace PSB2 by a PSB5

SPB / SPB-E: Replace PSB1 by a PSB7

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8.2.3 Configurations with GAB

ELCB based BSMS/2 can also run with the former GAB. The gradient controller is auto-matically detected by the driver software running on the ELCB.

Note: The former GAB provides only the large parallel interface for gradient pulse con-trol. Make sure that your gradient controller is compatible (TCU / FCU / GCU systems).

The example diagram below shows the variant for non-BOSS1 configurations. If a BOSS1 system is connected then the right hand SCB20 is not installed.

Figure 8.3 Configuration for BOSS2, BOSS3 and BOSS-WB

CP

U (

obso

lete

)

SLC

B/2

Opt

iona

l: G

AB

/2 =

Z10

484

4

SC

B2

0 =

Z10

2930

ELC

B =

Z10

0818

L-T

X

L-R

X

Opt

iona

l: 2H

TX

BSMS/2 1

0


SC

B20

= Z

1029

30

SCB3

Shi

ms

A

Shi

ms

B

Figure 8.4 AVANCE II - configurations with GAB

CP

U (

obso

lete

)

SLC

B/2

Op

tiona

l: G

AB

= Z

002

764

SC

B2

0 =

Z10

2930

ELC

B =

Z10

0818

L-T

X

L-R

X

Opt

iona

l: 2H

TX

BSMS/2 1

0


Non

BO

SS

1:se

cond

SC

B2

0 =

Z1

0293

0

SCB3

55 28_00_06


8.2.4 Configurations with L-TRX

The new L-TRX is installed in the former LTX slot, and former LRX slot is covered by a blind plate 8TE (Z14118).

For gradient shimming, the L-TRX has a built in 5 Watt 2H amplifier, replacing the for-merly used 2HTX.

Figure 8.5 Configuration with L-TRX (example with GAB/2)

CP

U (

ob

sole

te)

SLC

B/2

Ob

sole

te

Op

tiona

l: G

AB

/2 =

Z1

0484

4

SC

B2

0 =

Z10

293

0

EL

CB

= Z

100

818

L-T

RX

2H

TX

: Ob

sole

te

BSMS/2 1

0

SLCB1 GAB1 SCB1 LCB1..SCB3

No

n B

OS

S1:

seco

nd

SC

B2

0 =

Z1

0293

0

L-19

F (

Opt

ion

al)

Figure 8.6 Power supplies for L-TRX (rear side)


PS

B 5

PS

B 1

56 Z108028_00_06

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19F option for L-TRX

Requires the optional unit BSMS/2 19F Lock Transceiver 300 - 1000 MHz (Z120014).

8.3 Configurations with SPB(-E) and VPSB

The SPB (or SPB-E) provides all functions of the former SLCB/2 (helium level supervi-sion, BST sensors) and the corresponding PNK board (lift, sample rotation). These two boards are therefore no longer needed in new configurations.

Both, the SPB(-E) and VPSB are plugged from the rear side. A second VPSB can be installed as an option (SPB-E required for connectivity).

NOTICE

For operation of the L-TRX in a BSMS/2 chassis, the formerly used PSB2 has to be replaced by the new PSB5.

Figure 8.7 Configuration with L-TRX and optional L-19F unit (example with GAB/2)

CP

U (

obso

lete

)

SL

CB

/2 O

bso

lete

Opt

iona

l: G

AB

/2 =

Z10

484

4

SC

B20

= Z

1029

30

ELC

B =

Z10

0818

L-T

RX

2HT

X: O

bso

lete

BSMS/2 1

0


No

n B

OS

S1:

seco

nd S

CB

20

= Z

102

930

L-1

9F

(O

ptio

nal

)

57 28_00_06


st

nd

Note: The optional second VPSB is marked in gray color. If it is not installed then the empty slot has to be covered with a blind plate.

Figure 8.8 SPB(-E), VPSB(´s) and power supply (rear side)


PS

B 5

PS

B 7

1

2

NOTICE

For operation of the SPB(-E) in a BSMS/2 chassis, the formerly used PSB1 has to be replaced by the new PSB7 and the SLCB/2 removed.

58 Z108028_00_06

Z1080


5

8.4 System Architecture / Overview

The following diagram shows the functional system architecture from the User Interface (TopSpin and Keyboard, standard web browser for the service engineer) across the BSMS down to the specific hardware subsystems.

Firmware:

• BsmsCheckDownload.txt contains the information about all required firmware ver-sions for all installed sub units in a BSMS

• ELCB firmware provides all functions for the ELCB (mainly lock control), and in addition the control logic and driver functions for all the installed sub units.

Figure 8.9 System Architecture / Overview

WEBServer

CORBAServer

TopSpin ApplicationVersion 2.0 or higher

TopSpinVersion 1.3

BSMSKeyboard

StandardWeb Browser

CORBAClient

CORBAClient

CORBAClient

SBSBTS1.3

SBSBKeyboard

Flash FileSystem

Lock Shim

SBSBConverter

SpecificFunctions

RS232 RS48

GradientSample

HandlingVar. Temp.

ControlCryoLevel

LTX/LRXL-TRX SCB20

GAB/2 GAB

SLCB

SPB / -E VPSB

PNK

L19F

SSRB1SSRB2VME

Lock Bus

SSRB1-R

Commonconnector

VTA

BFB

Configuration and Control Logic

NitrogenLevel

59 28_00_06


• FPGA-Design (field downloadable) is required for L-TRX, SCB20, GAB/2, SPB(-E), and VPSB

• Additional controller software is installed on the various VT-Adapters, BSCU type cooling units and digital nitrogen level sensors, which are also connected over the BFB (Bruker Field Bus1).

• There is no firmware required for LTX, LRX, 2H-TX, GAB and PNK

1. This peripheral bus has been introduced 2010 together with the BSVT system. Connectors can be found on BSMS/2 VPSB (see page 296) and SPB-E boards (page 266)

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8.5 BSMS/2 Rack

The back plane combines the VME bus and the user bus and provides access from the front and rear side.

There is an equally spaced raster for the connectors at the front side, however some positions are empty. Since some slots (user bus part) provide specific power supply volt-ages or control signals, the subsystem boards have to be plugged in a well defined order into the BSMS/2.

Note[1]: The slot numbers (1 to 16) are encoded by 4 user bus lines, starting with a 0 for Slot 1 (GND / GND / GND / GND) and ending with 15 for Slot 16 (VCC / VCC / VCC / VCC).

Note[2]: There are two different power supplies in the BSMS/2. Both have - in addition to the general supply voltages for the subsystem - a symmetrical high power output (VPWR_P / VPWR_GND / VPWR_N). One (PSB1) provides at maximum 3.5 Amps for the GAB / SCB20 board in slot 11 / 12, the other (PSB2) supplies the remaining GAB / SCB20 boards (up to three boards in slot 5 to 10) with a maximum current of about 6 Amps (total for all boards).

Note[3]: At the rear side, there are the two additional „slots“ number 18 and 19 for the two power supplies. PSB1 is used in systems with SLCB / PNK, whereas PSB7 in sys-tems with SPB(-E). PSB2 is used in systems with LTX / LRX, whereas PSB5 in systems with L-TRX.

Note[4]: The pneumatic control board is plugged in the right most slot at the rear side (PNK variant in connection with SLCB or SPB(-E) for temperature control).

Note[5]: Slot 17 is foreseen for the probe temperature control.

Figure 8.10 The BSMS/2 rack with the specific slots

VMEBus

USERBus

BSMS/2

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

emp

ty

2H

TX

(op

tion

al)

SL

CB

/ S

LC

B/2

GA

B/2

or

GA

B

ELC

B

LR

X

empt

y

SC

B2

0

SC

B2

0

VPWR2 VPWR1< 6 Amps < 3.5 Amps

Slot number

L-T

RX

/ L

TX

61 28_00_06


Figure 8.11 Front View of BSMS/2 Rack

Figure 8.12 Rear View of BSMS/2 Rack

PSB5 (L-TRX)

PSB1 (SLCB / PNK)

Mains Selector

orPSB2 (LTX/LRX)

orPSB7 (SPB/-E)

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8.6 Service Web

All operational functions for NMR application are provided by the CORBA interface, as described before. An additional set of operations is reserved for service engineers, e. g. for downloading new firmware, calibration and diagnostics. These functions are only available on the Service Web, which is the successor of the former BSMS tool. It is no longer necessary to use a specific client software for service access (any Web browser can be used), the new concept provides a graphical user interface and is therefore much easier and comprehensive.

8.6.1 IP Address of the BSMS/2

In typical TopSpin 1.3 configurations (no DHCP server in the spectrometer network) the BSMS/2 has the fixed IP address 149.236.99.20.

If there is a DHCP server, which is installed with TopSpin 2.0 or later, then there is dynamically assigned an IP address to the BSMS/2. This IP address remains as long as there is no change of the hardware (ELCB / workstation). The dynamic IP address can be obtained by running TopSpin 2.0 or later and typing „ha“. After scanning of the spec-trometer network, which takes several seconds, all connected IP devices are listed in a dialog (e. g. the BSMS).

In order to provide correct DHCP address assignment, it is necessary to start up the workstation before the BSMS/2 is switched on.

If it is not possible to reach the BSMS/2 by the Web browser (e. g. if a non TopSpin DHCP server has assigned an unknown IP address to the BSMS/2) then the BSMS/2 can be started with unplugged Ethernet cable, which forces the BSMS/2 to keep its fixed IP address. After booting, the Ethernet can be plugged and the BSMS/2 should be accessible at its fixed address.

63 28_00_06


8.6.2 Main Service Page

1. Service Page: Access to the logging information and configuration of the logging. A service engineer can log in on this page (in order to get access to the extended functions / parameters).

2. Device Setup: Shows the hardware configuration (connected subsystems, hard-ware codes), the versions of the actually loaded firmware and the required firmware versions. This page provides also the links to the specific firmware download pages (see later on).

3. Calibration: Links to the different specific calibration routines that are necessary upon installation of a spectrometer (e. g. for Helium level measurement, air pres-sure for lift, and so on).

4. Variable temperature control (if SPB / -E is installed): Information, activation and configuration (setting of aimed temperatures, temperature and power limits, aimed

Figure 8.13 BSMS/2 Main Service Page

64 Z108028_00_06

Z1080


VT gas flow, regulation settings, and so on).

5. He- and N2-level: Monitoring of cryo levels in the magnet. The N2 level monitoring requires a SLCB/3, VPSB or SPB-E.

6. Sample Handling: Commands and configuration of sample lift, sample rotation and sample mail (extended sample transport - related hardware needs to be installed for this feature).

7. Shim: Commands and configuration of Shim system (e. g. download of BOSS file) and diagnostic functions for trouble shooting.

8. Lock: Commands and configuration of NMR Lock (optional 19F lock if this feature is installed) and diagnostic functions / self tests for trouble shooting. This section pro-vides also access to the lock RF board(s) LTX/LRX or L-TRX.

9. Gradient: Information and configuration of gradient amplifier if this board is installed (GAB or GAB/2).

10. 2H-TX control: 2H router address setting if 2H-TX is installed.

11. ELCB info: Detailed info about ELCB, including ethernet info and configuration.

65 28_00_06


8.7 AC / DC Wiring

Figure 8.14 AC / DC wiring and power supplies

66 Z108028_00_06

Z1080


ire

VM

EU

ser

Bu

s co

mm

on

t

8.8 DC Power Distribution

The diagram below shows the DC power distribution for the different slots. All slots except 15 and 16 are connected with the VME bus (and therefore with the corresponding supply). There is a set of common supply voltages provided by the user bus (VDD / AGND / VSS ... XGND), which are assigned identically to the connector pins in the differ-ent slots (see also in the detailed user bus connector description).

Additionally, there are individual power supply voltages for some slots (e. g. X10V, X10VGND, ...) that are accessible via the user bus connector and by an extra power connector as well. It is therefore possible to configure the backplane by interconnecting extra power connectors of different slots (e. g. providing the voltages X10V and X10VGND of slot 1 also for the slot 2).

On the other hand, it is possible to disable certain individual power voltages by cutting the corresponding wire bridge (possible for VPWR_P2 / VPWR_GND2 / VPWR_N2 in slot 5 .. 9, VPWR_P1 / VPWR_GND1 / VPWR_N1 for slot 11). As a further option, the power pins cut from the original voltages can then be supplied externally / from another slot by the extra power connector.

Note: There is a common neutral point for the different ground levels (AGND, DGND and GND28) which is joined by a 22 uH inductance with the frame ground.

Figure 8.15 Power distribution by BSMS/2 backplane

VDD12

VSS12

VCCDGND

VDD

AGND

VSS

VDD28GND28

VCC

DGND

X5V

XGND

em

pty

2H

TX

(opt

ion

al)

SL

CB

/ S

LC

B/2

GA

B /

SC

B2

0

EL

CB

L-T

RX

/ L

TX

em

pty

GA

B /

SC

B2

0

em

pty

VP

WR

_P1

VP

WR

_GN

D1

VP

WR

_N

1

VP

WR

_P

2V

PW

R_G

ND

2V

PW

R_

N2

slot 12slot 10slot 9*slot 8*slot 7*slot 6*slot 5*

slot 11*

X1

0V

X1

0VG

ND

HE

_P

HE

_G

ND

PN

EU

_G

ND

PN

EU

_2

4V

HE

AT

_P

HE

AT

_G

ND

PN

EU

_G

ND

PN

EU

_24

V

slot 1 slot 2 slot 3 slot 4

H0

_P

H0

_G

ND

H0

_N

slot 12 slot 14 slot 15

LO

CK

_P

15V

LO

CK

_A

GN

DL

OC

K_

N1

5V

LO

CK

_P

3V6

/ P

5VL

OC

K_

DG

ND

LO

CK

_N

5V

(on

ly L

TX

)

LR

X

slot 16

LO

CK

_P

15V

LO

CK

_A

GN

DL

OC

K_

N1

5V

LO

CK

_P

5VL

OC

K_

DG

ND

LO

CK

_N

5V

* The individual power supplies in these slots can be disabled by cutting the related w

Individualfor each slo

67 28_00_06


8.9 Backplane

Figure 8.16 Backplane - Slot 1 to 4

68 Z108028_00_06

Z1080



69 28_00_06


Figure 8.18 Backplane - Slot 9 and 10

70 Z108028_00_06

Z1080



71 28_00_06


Figure 8.20 Backplane - Slot 15, 16 and 17

72 Z108028_00_06

Z1080


Figure 8.21 Backplane - Slot 18 and 19

73 28_00_06


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Z1080

9 Power Supplies

There are two different type of power supply boards that are plugged from the rear side into the backplane - PSB5 or PSB2 at the left side, PSB1 or PSB 7 at the right side.

Behind each LED (indicating that the according voltage is available) there is the corre-sponding fuse (which can be exchanged without plugging out the PSB).

Voltage Name (LED)

Reference Voltage @ rated load

Current @ rated

load

Volt. ripple

Fuse

VCC DGND 5 +/- 0.1 V 5.0 A 20 mV 6.3 AT

VDD12 DGND 12 +/- 0.7 V 2.5 A 30 mV 3.15 AT

VSS12 DGND -12 +/- 0.7 V 2.5 A 30 mV 3.15 AT

HE_P HE_GND 35 .. 42 V 0.4 A 1 V 0.63 AT

PNEU_24V PNEU_GND 21 .. 27 V 1.0 A 1.5 V 1.25 AT

VDD AGND 15 +/- 0.6 V 1.0 A 20 mV 1.25 AT

VSS AGND -15 +/- 0.6 V 1.0 A 20 mV 1.25 AT

VPWR_P2(a) VPWR_GND2 20 .. 25 V 6.0 A 1 V 8.0 AT

VPWR_N2(a) VPWR_GND2 -20 .. -25 V 6.0 A 1 V 8.0 AT

Table 9.1 PSB1 Electrical Characteristics (SLCB / PNK configurations)

Voltage Name (LED)


Current @ rated

load

Volt. ripple

Fuse

VDD28 GND28 27.8 +/- 1.1 V 2.0 A 20 mV 2.5 AT

H0_P H0_GND 29.5 +/- 1.8 V 0.5 A 20 mV 0.63 AT

H0_N H0_GND -29.5 +/- 1.8 V 0.5 A 20 mV 0.63 AT

LOCK_P5V LOCK_DGND 5 +/- 0.25 V 1.0 A 20 mV 1.25 AT

LOCK_N5V LOCK_DGND 5 +/- 0.25 V 1.0 A 20 mV 1.25 AT

X10V X10VGND 8.5 .. 11.5 V 1.5 A 0.8 V 3.15 AT

X5V XGND 5 +/- 0.3 V 1.0 A 20 mV

LOCK_P15V LOCK_AGND 15 +/- 0.6 V 1.0 A 20 mV 1.25 AT

LOCK_N15V LOCK_AGND -15 +/- 0.6 V 1.0 A 20 mV 1.25 AT

VPWR_P1(a) VPWR_GND1 20 .. 24 V 3.5 A 0.8 V 4.0 AT

VPWR_N1(a) VPWR_GND1 -20 .. -24 V 3.5 A 0.8 V 4.0 AT

Table 9.2 PSB2 Electrical Characteristics (LTX / LRX configurations)

7528_00_06

Power Supplies

Note(a): In contrast to the power supply naming, VPWR_P2 / GND2 / N2 belong to the power supply PSB1/PSB7 whereas PWR_P1 / GND1 / N1 belong to the power supply PSB2 or PSB5 respectively.

Note(b): This voltage is generated by a DC/DC converter from VDD28.

Note(c): In addition to this current, the supply current for the DC/DC converter (LOCK_P3V6) has to be considered as well.

Note: The shaded rows indicate that the referred voltages are non-regulated.

Voltage Name (LED)


Cur-rent @ rated load

Volt. ripple

Fuse

VDD28 GND28 27.8 +/- 1.1 V 2.0 A(c) 20 mV 4.0 AT

H0_P H0_GND 29.5 +/- 1.8 V 0.5 A 20 mV 1.0 AT

H0_N H0_GND -29.5 +/- 1.8 V 0.5 A 20 mV 1.0 AT

LOCK_P3V6(b) LOCK_DGND 3.6 +/- 0.1 V 2.0 A 20 mV -

X10V X10VGND 8.5 .. 11.5 V 1.5 A 0.8 V 4.0 AT

X5V XGND 5 +/- 0.3 V 1.0 A 20 mV

LOCK_P15V LOCK_AGND 15 +/- 0.6 V 1.0 A 20 mV 2.0 AT

LOCK_N15V LOCK_AGND -15 +/- 0.6 V 1.0 A 20 mV 2.0 AT

VPWR_P1(a) VPWR_GND1 20 .. 24 V 3.5 A 0.8 V 6.3 AT

VPWR_N1(a) VPWR_GND1 -20 .. -24 V 3.5 A 0.8 V 6.3 AT

Table 9.3 PSB5 Electrical Characteristics (L-TRX configurations)

Voltage Name (LED)


Current @ rated

load

Volt-age rip-

ple

Fuse

VCC DGND 5 +/- 0.1 V 5.0 A 20 mV 6.3 AT

VDD12 DGND 12 +/- 0.7 V 2.5 A 30 mV 3.15 AT

VSS12 DGND -12 +/- 0.7 V 2.5 A 30 mV 3.15 AT

HE_P HE_GND 35 .. 42 V 0.4 A 1 V 0.63 AT

PNEU_24V PNEU_GND 24 +/- 0.3 V 1.0 A 20mV 1.25 AT

VDD AGND 15 +/- 0.6 V 1.0 A 20 mV 1.25 AT

VSS AGND -15 +/- 0.6 V 1.0 A 20 mV 1.25 AT

VPWR_P2(a) VPWR_GND2 20 .. 25 V 6.0 A 1 V 8.0 AT

VPWR_N2(a) VPWR_GND2 -20 .. -25 V 6.0 A 1 V 8.0 AT

Table 9.4 PSB 7 Electrical Characteristics (BSVT configurations)

76 Z108028_00_06

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Power Supplies

The PSB1, PSB5 and PSB7 are similar - they are based on the same printed circuit lay-out, but with different components on it.

Figure 9.1 View of a PSB2 module

LED‘s thatare visiblefrom therear side

Fuses

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Power Supplies

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Z1080

10 ELCB

10.1 Introduction0 The Extended Lock Control Board (ELCB) combines two former boards, the CPU and the LCB. Therefore it provides two main functions - the Digital Lock (as it is described in the Deadalus Lock Manual) and the control of the complete BSMS/2, (e. g. Shim, Lift, Gradient Amplifier). The latter functions are described in the BSMS/2 mainframe and related subunit chapters.

All former Lock functions have been adapted to the new hardware platform. The analog design of the current source is basically the same as on the LCB, however some of the former components have been replaced by modern ones. Therefore, the electrical per-formance could be improved in parts.

Using the same algorithm for evaluation of the closed loop Lock regulation, the new ELCB is fully compatible with the LCB. It has the same or a better performance for NMR experiments. Both, the new L-TRX and all former L-RX / L-TX board versions (including the 19F options) are supported by the new ELCB.

Since the new DSP has a much higher performance, it provides faster handling of real time Lock Hold pulses, which now may range down to a length of 100 microseconds.

Additionally, it was possible to implement a more sophisticated method for locking in, which is now very reliable. While the Lock is sweeping, the „wiggles“ of the Lock signal are now analyzed. This provides a simple and fast lock in. The Auto-Lock functions have been optimized as well.

10.2 Lock Parameters and Technical Data

Parameter Min Factory Default

Max Unit Notes

Lock Field (H0) -9999-170

+5000 +9999+170

Field UnitsmA

Lock Regulator -99-1.70

0 +99+1.70

Field UnitsmA

Sweep Amplitude 0 100400068.0

100400068.0

Sweep UnitsField UnitsmA

Sweep Rate 0.01 2.00 5.00 Hz

Lock Phase 0.0 180.0 359.9 Degrees 1)

Lock Power -50.0-60.0-60.0

0.00.00.0

+10.0+0.0+10.0

dBdBdB

2)

Table 10.1 Parameter and Technical Data

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ELCB

General Note: Any of the values listed above may change without notice.

1. Values from -1000.0 to + 1000.0 degrees are accepted, however the actual phase is evaluated modulo 360 degrees.

2. The actual range depends on the hardware code and on the frequency: The first series of RF boards (HW code 0) had a range from -50 to +10 dB, the next following series (HW code 1 and higher) had a range from -60 to +0 dB. For frequencies of 600 MHz and above, this range has been extended (-60 dB to +10 dB) on the hard-ware versions 6 and higher.

3. This value is used for static drift compensation with manual evaluation / definition of the drift rate (called „Manual Drift Compensation“, e. g. in solids configuration). Static / manual drift compensation is active while the lock is not sweeping.

4. Maximum Noise between 0.01 Hz and 10 Hz

5. Minimum range of -3dB point

Lock RF Gain 2HLock RF Gain 19F

75.055.0

120.0120.0

155.0135.0

dBdB

Lock Shift -200.0 0.0 200.0 ppm

Lock Drift -2000.0 0 2000.0 Field Units / 24 hours

3)

Current Noise 400 nA (pp) 4)

Current Source Bandwidth

600 Hz 5)

Lock Hold active 100 us

Lock Hold inactive 100 us

Lock Hold latency 100 us

Parameter Min Factory Default

Max Unit Notes

Table 10.1 Parameter and Technical Data

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ELCB

10.3 Configuration and Wiring

The drawing below shows the front panel of an ELCB with the LED‘s and connectors. For TopSpin 2.0 at least the Ethernet, the 10 MHz reference clock and the RCP input have to be connected accordingly.

There is a dedicated connector for the optional Keyboard, and in a TopSpin 1.3 (or simi-lar) configuration, the two TTY links have to be connected for communication with the former SBSB protocol and for sending the Lock Display data over RS232.

Figure 10.1 ELCB front panel with LED‘s and connectors

RS485Keyboard

External 10 MHzClock (Coax)

External 10MHzClock active Ethernet

RS232 CCU (TS1.3 only):TTY3 (Lock Display)

RS232 CCU (TS1.3 only):TTY2 (Control Path)

RCP: Lock Hold,INT_A, INT_B

TCU / IPSO

Int Power

Ext Power

H0 Current

Error

Ready

Heart Beat (slow)DHCP search (fast)

LAN TX

LAN RX

RCP active(e. g. Lock Hold)

TTY1

TTY2

Spectrometer Network(Switch)

AQS Reference Board

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ELCB


The processor board (DSP Ethernet Board DEB) is a separate board plugged onto the base board. It contains a TI signal processor with memory, Flash and the electronics that provides access to the ethernet.

A central control FPGA handles the access to the peripheral hardware - new BSMS/2 boards (e. g. SCB20, GAB/2, b, VPSB) communicate over SSRB, whereas the former SLCB/2 is controlled over the VME bus. There are three RJ45 connectors, two of them are TTY ports, which provide access for TopSpin 1.3 (and similar). Real time signals (INT_A and INT_B for RCP-Shimming, Lock Hold) are now connected with the ELCB. The 2H-TX - or alternatively the RCB - is no longer needed for this purpose, and real time signals that are routed to the 2H-TX have no effect in an ELCB based BSMS/2.

The Keyboard support, which has formerly been implemented in the CPU, is now pro-vided by the ELCB (see also description in the overview chapter).

Figure 10.2 Functional system architecture

Power Supply

SSRB1

ControlFPGA

Bac

kpla

ne C

onne

ctor

CTRL-DAC

DA

Field-DAC

DA

Poweramplifier

Shunt resistor

ControlFPGA

RCP signals (INT_A, INT_B)

LAN TX

LAN RX

Flash

DSP

Memory

LAN

DEB Board

24 bit [-9999 .. 9999 FU’s](16 bit + dithering)

16 bit [-99 .. 99 FU’s]

Weight = 1

Weight = 100

+

ERRINT

RDYEXT

SIGH0

POWER STATE

H0 Current

RS232

RS485

INT_A, INT_B, Lock HoldTTY2TTY1

Keyboard

Bac

kpla

ne C

onne

ctor

VME

SSRB2(L-TRX)

Digital Ctrl(LTX/LRX)

82 Z108028_00_06

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ELCB

10.4.1 Protection

The power amplifier providing the Lock current for the H0 coil is protected against short circuits (limiting the output current) and over temperature.

10.4.2 Lock Software Architecture

Only the Lock relevant part of the software is described in the following sub chapters. The description of the overall architecture and the drivers for the other subsystems can be found in the related chapters.

One part of the Lock software runs in „real time“ mode: An interrupt service routine is called every 75 microseconds. This routine reads the L-RX data and evaluates the cor-responding Ctrl-DAC and Field-DAC values, which are applied by the Control FPGA to the hardware. The typical delay time from arrival of the L-RX data to the completion of the DAC write cycle is less than 25 micro seconds.

On the other hand, there is a more abstract part, modelling the Lock behavior and con-trolling higher level functions, e. g. locking in, selecting the appropriate set of Regulator Coefficients, compensating the drift and so on. This part of the software is connected with the CORBA interface - it handles requests from the TopSpin application and notifies about state changes (e. g. Lock Hold). It is non real time and may react with a delay of several milliseconds.

The Lock Hold signal affects directly the regulator, which guarantees extremely short reaction times. An external Lock Hold Observer examines every 20 milliseconds the Lock Hold state. If the regulator runs in Lock Hold mode or if a short Lock Hold pulse has been active in the mean time („Lock Hold Escaped“) then the Lock Hold Observer updates the Lock Control State Machine and notifies the registered clients - even the

Figure 10.3 Abstract control domain and real time domain

Pending (locking in)Locking (steady state)Fading from Pending toLockingHold (keep value)Off (value = 0)

Lock Regulator(different sets of coefficients)

SweepingUpdated by Drift CompensationOff (value = specific Field)

H0 Control

CTRL-DAC

DA

Field-DAC

DA

+ Weight = 100Weight = 1

H0 Coil

Data from L-RX Lock Hold

Lock HoldLock ReleaseLock Hold Escaped

Lock Hold Observer

Lock Off (Sweep Off)Lock Off (Sweep On)Lock PendingLock OnLock Hold

Lock ControlState Machine

OffManualAuto

Drift Compensator

IdleAuto LockAuto GainAuto PowerAuto PhaseAuto H0 Calibration

Auto Lock ControlState Machine

Real Time World(75 us cycle time, typ < 25 us latency)

Abstract World

CORBA access (control and status)

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shortest Lock Hold pulses are indicated on the Keyboard (if connected) and in the Top-Spin application.

10.4.3 Lock Control State Machine

The Diagram below shows the Lock Control State Machine, which handles the requests from the CORBA or Web interface and controls the transitions between the different lock states. The lock in strategy has been improved compared to the former LCB. Neverthe-less, the new procedure is fully compatible with the various TopSpin operations access-ing the Lock (e. g. GradShim, TopShim).

While switched off, the Lock may be sweeping or not, depending on the parameter „Sweep“. When the Lock is switched on, then it starts by searching signal (while sweep-ing) and enables the Regulator as soon as the Lock Signal has fulfilled the necessary criterion. If the Lock In trial succeeds then the state machine steps through „Try To Lock“, „Temporary Locked“ and reaches in the end the state „Steady Locked“. When the lock signal gets lost in the mean time, the state machine steps back and restarts search-ing signal.

Lock Hold is normally issued by the Lock Hold Observer on detection of a Lock Hold pulse coming from the hardware. Alternatively, this signal can be set by the CORBA interface (intended for test purpose). The Lock Hold state can be left either by de-activat-ing the Lock Hold signal or by switching the Lock on or off. The Lock Hold Pulse is intended to be activated when the Lock is locked in. However, the ELCB tolerates Lock Hold Pulses in any state - it returns to the original state when the Lock Hold pulse becomes inactive.

Figure 10.4 Lock state machine

SearchSignal

Tryto Lock

Retryto Lock

TemporaryLocked

SteadyLocked

Regenerateafter Hold

IndicateLock Hold

Lock Hold(unlocked)

Sweep Off Sweep On

Sweep Off

Sweep On

Lock OnLock On

Signalfound

LockFailed

Signal okfor a specific time

Signal okfor a specific time

LockLost

After 7 sec

Final RegulatorCoefficients

Lock Hold

Short Lock Hold(Pulse escaped)

Lock Hold released /Lock Hold escaped

After 3 sec

Lock Off

Lock Off

Lock On

Lock On

Lock = Hold Lock = Off

Lock = Pending

Lock = OnLockHold

ReducedPower

Sweeping

LockLost

Analysis ofthe „wiggles“

RegulatoractiveDifferent

coefficientsets

Regulatorhold

Field doesnot change

Lock Hold

Lock Off

Lock HoldReleased

From anyunlocked State

Back tooriginal State

Regulator Modes:

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10.4.4 Handling of High Gradient Rates for Auto Shim and Drift Compensation

Auto Shim and Drift Compensation handles Gradient pulses at high rates similar to the LCB - if necessary, the Lock level is sampled at the optimum time.

The Auto Shim has been improved so that it is no longer necessary to adapt the Auto Shim interval to the pulse program (timing of the Gradient pulses). The ELCB guaran-tees now automatically the specified time interval between setting of a new Shim and the measurement of the resulting Lock level, regardless of the pulse program.

Automatic Drift compensation is hold by the Lock Hold pulse as well. However, drift com-pensation is evaluated every second and it is not affected by Gradient pulses shorter than 1 second.

10.4.5 Measurements Provided for Diagnostic

When the ELCB is started up, the following tests are performed:

H0 Current Measurement:

For detection of correct H0 coil connection, it is possible to measure the current that actually flows through the shunt resistor. If the H0 coil is not properly connected, an error message is issued by the TopSpin application / Keyboard.

RF Board Tests (LTX / LRX):

The same set of RF board tests that were provided by the former LCB are now executed on power up by the ELCB. An additional test checks for correct connection of the 10 MHz reference signal at the L-TX board. In case of a failed test, an error message is issued by the TopSpin application / Keyboard.

It is possible to invoke these tests manually by the Service Web.

RF Board Tests (L-TRX):

The new L-TRX provides a larger set of test functions, which are run automatically after power up and can be invoked manually by the Service Web for diagnostics (see also "Diagnostic Functions" on page 157).

History of Lock Regulator and Drift Compensator:

There is a history of the Lock Regulator and the Drift Compensator available on the ELCB (5 minutes with 1 entry per second, 5 hours with one entry per minute and 1 week with one entry per hour). The data is volatile and can be accessed by the Service Web.

Display / Download of the Latest FFA:

While locking in initiated by Auto Lock, the Lock performs a simple 2H experiment (alter-

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natively 19F). The resulting FID can be visualized (graph of the spectrum) and / or down-loaded (as text) by the Service Web.

10.4.6 Calibration

It is user selectable whether the Lock adjusts the Field (default) or the Shift (optional) for locking in by the Auto Lock procedure. The relation between the frequency and the field depends on the Shim System (different for standard bore, wide bore and super wide bore magnets), which is defined in the BOSS file. This value may deviate additionally between different individuals of the same type.

In the Service Web there is a „push button“ calibration of this relation. The calibration needs a sample containing a lock relevant solvent.

10.4.7 Front Panel - LED‘s during Start Up

The diagram below shows a typical behavior during start up. The „heart beat“ LED shows correct operation of the ELCB - if this LED does not blink any longer then the ELCB application has been blocked and needs to be restarted (if the watchdog is enabled, this is performed automatically).

10.5 Bus Interface

Since the ELCB is the new master of the BSMS/2, it controls both busses of the back-plane, the VME (upper connector) and the User Bus (lower connector). In addition, the lower connector provides access to a local control bus to the LTX (for setting up the RF parameters) and to a local data bus from the LRX (for receiving the demodulated 2H data).

Figure 10.5 LED‘s indicating different states during start up

1: Power Up2: Start Up

ELCB Firmware3: DHCPsearch

4: InitializeBSMS

Subsystems

5: BSMSis ready

fast

Once persecond

Heart Beat whileBSMS is alive

Default application running(if there is no valid ELCB

application available)

Onceper second

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10.5.1 Backplane Connector (User Bus)

Note: The signals indicated with a gray pattern are not actually used - they are reserved for future extension.

A B C

1 LRX:HWCODE +15V LRX:TYPE

2 LTX:HWCODE +15V LTX:TYPE

3 LRX:OPTION AGND -15V

4 LTX:OPTION AGND -15V

5 X10V X10V X10V

6 X10VGND X10VGND X10VGND

7 24V 24V 24V

8 24VGND 24VGND 24VGND

9 COMPCURR_P COMPCURR_P -

10 LTRX-SSRB2: /SINTR other: /BP_RCP0

/BP_RCP1 -

11 GPIO1 SLOT_ID[0] GPIO2

12 GPIO0 SLOT_ID[1] /RNEXT

13 /SYS_RESET SLOT_ID[2] RCLK

14 SSRB1:SCLK SLOT_ID[3] SSRB1:STXD

15 SSRB1:SRXD LTRX-SSRB2: SRXDLTX:CTRL_DATAR

SSRB1:/SINTR

16 H0+ H0+ H0+

17 H0- H0- H0-

18 LTX:/CTRL_WR LTX:CTRL_A[0] LTX:CTRL_A[1]

19 /BP_RCP2 LTX:CTRL_A[2] LTX:CTRL_A[3]

20 5V 5V 5V

21 DGND DGND DGND

22 LRX:FSR LTRX-SSRB2: SCLKLTX:CTRL_CLK

LTRX-SSRB2: STXDLTX:CTRL_DATA

23 X5V X5V X5V

24 X5VGND X5VGND X5VGND

25 LRX:SRD LRX:RP1_C LRX:SCK

26 / 27 H0_P H0_P H0_P

28 .. 30 PWGND PWGND PWGND

31 / 32 H0_N H0_N H0_N

Table 10.2 User Bus Back Plane Connector

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10.5.2 Front Connectors

Both TTY RJ45 connectors are wired according to the 9 pin RS232 standard connector layout, with identical enumeration of their 8 signals (e. g. pin 2 = Transmit Data, pin 3 = Receive Data). The 9th signal (Ring Indicator) is not used and left open.

An additional RJ45 connector provides the RCP inputs, according to the figure below. The LED near the connector is active when a RCP signal is actually handled by the ELCB. Thus, this LED serves for checking if the RCP pulse signals are available and if they are handled as expected (e. g. if RCP handling is enabled for the specific signal). It is blinking e. g. during Gradient experiments (Lock Hold) or RCP shimming (INT_A).

The specific RS485 connector for the Keyboard has been moved from the former CPU to the ELCB. It is wired according to the figure below:

10.6 Service Software

For service purpose, there is a Web access available (setup, calibration and diagnostic). Some of these Web functions are open for all users (e. g. clients), other functions are reserved for service engineers - it is necessary to log in and enter the required password before these functions can be accessed (description in the BSMS/2 Service Web chap-ter).

1: XGND2: /LOCK_HOLD3: XGND4: /INT_A5: XGND6: /INT_B

Figure 10.6 RJ45 connector for real time control

Figure 10.7 DSUB-25 connector for keyboard

13: TX Data P12: RX Data P11: X10V10: X10V 9: X10VGND 8: X10VGND 7: TPD P 6: TOGGLE P 5: STROBE P 4: CLK P 3: DLED P

1: GND

25: TX Data N24: RX Data N

23: X10V22: X10V

21: X10VGND20: X10VGND

19: TPD N18: TOGGLE N17: STROBE N

16: CLK N15: DLED N

GND

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10.6.1 Lock Service Web

The Submenu „Main“ -> „Lock“ provides access to all service functions in connection with the ELCB and the related RF boards (L-RX, L-TX).

Most of the functions under the menu point „Lock Parameters & Commands“ are nor-mally handled by the TopSpin application over the CORBA interface. It is however possi-ble to invoke all of these functions by the Service Web. Also the solvent specific parameters that are normally passed by the TopSpin application (e. g. Lock Power, Lock Phase, Lock Gain, Loop Gain, Loop Time, Loop Filter, ..) can be checked and / or defined there.

The point „Lock Configuration“ provides setup of the Lock relevant parameters at instal-lation.

„Statistics“ displays information about Lock failures (in case that the Lock got lost), and „Diagnostics“ provides the sub-menu displaying of the 2H spectrum captured during the last Auto Lock trial, a sub-menu for configuration and trouble shooting of the RF boards (L-TX and L-RX) and a sub-menu containing the history of the Lock Regulator / Drift Compensator.

Figure 10.8 Main window for NMR lock functions

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10.6.2 Lock Parameters and Commands

The following dialog provides - alternatively to the TopSpin application - the setup of nucleus specific parameters and invoking of Lock / Auto Lock functions.

1. All Lock Field relevant parameters can be defined here. The specified Drift value (Field Units per 24 hours) is applied / compensated while manual Drift Compensa-tion is active. It is possible to define the behavior for Locking out („Lock Out Con-vention“). When the default option is selected („Keep Field after Auto Lock“) then the Field value of the „locked“ state remains after „lock off“ only if the „locked“ state has been reached by the Auto Lock command (e. g. TopSpin Command „Lock“ and definition of solvent). Alternatively it is possible to force resetting the Field to the value it had before it was „locked“, or the Field value of the „locked“ state can be kept always after „lock off“.

2. This section provides the setup of the solvent specific RF board settings

Figure 10.9 Basic lock operations by Service Web

1

2

3

4

5

6

7

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3. It is possible to shift the Lock Line within the Lock Display window from top (+100%) to bottom (-100%).

4. The regulator can be configured / optimized by these three parameters. These parameters are in the EDLOCK table (solvent specific) and are evaluated alterna-tively by a TopSpin macro (e. g. LOCK.7).

5. There are two internal parameters for optimization of the Auto Lock procedure, which should not be changed.

6. All Lock commands provided by the Keyboard and / or the TopSpin application (bsms display started by command „BSMSDISP“) can be invoked in this section.

7. The only calibration that is needed in context with the Lock can be started here. There must be a sample in the magnet containing a solvent of the selected nucleus, and locking in must be basically possible.

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10.6.3 Lock Configuration

1. There are several options for the Lock Display (e. g. Absorption, which is the stan-dard Lock level, Absorption Low Pass filtered, Dispersion, Regulator Output, ...). The display mode can be changed e. g. for trouble shooting.

2. The drift can be compensated automatically - it is compensated according to the continuously estimated remaining drift rate. Alternatively, it is possible to compen-sate the drift at a fixed rate that can be evaluated / entered manually. As a third option, the drift compensation can be switched off.

3. When locking in Auto Lock mode, either the Field (default) or the Shift (optional) can be adjusted for achieving the resonance condition.

4. If there is a 19F option installed at both RF boards (L-TX and L-RX), then the nucleus for Locking can be selected by the TopSpin command „LOCNUC“ and the

1

2

3

4

5

6

7

8

9

10

11

12

13

14

Figure 10.10 Configuration of NMR lock

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desired nucleus „2H“ or „19F“. This option reflects that selection - switching between the two nuclei simply by setting this parameter would not work. It is neces-sary that the TopSpin application selects also the appropriate preamplifier setup.

5. Option for L-TX and L-RX blanking (enables RCP inputs on L-TX).

6. The H0 coil type defined in the BOSS file is displayed here. It can not be modified manually.

7. Polarity of the H0 current can be reversed here.

8. If there is an external B0 compensation connected (e. g. for micro imaging), then the H0 current can be routed accordingly - it is however necessary to have a specific ELCB supporting that feature. Alternatively, there are specific Shim adapters avail-able, providing access for the B0 compensation (see also in the SCB20 chapter later on).

9. Setup of the pulse polarities.

10. The Lock In Power Step can be modified here - it is normally 10 dB. When locked in, the Lock Power is reduced by this value.

11. This factor is evaluated by the automatic H0 calibration. It can be set manually, e. g. for resetting the calibration (default = 1.0).

12. Base Frequency for Shift = 0 ppm, related to the currently selected nucleus (2H or 19F).

13. Base Frequency for Shift = 0 ppm, related to Proton.

14. Resulting DDS frequency (for testing / debugging).

10.6.4 Diagnostic and Trouble Shooting

If there is a problem related to the Lock, the logging can be configured in the Service Menu for issuing detailed information about the Lock System. It has to be made sure, that the 2H path is correctly initialized by typing „ii“ in the TopSpin. Additionally, all RF board tests can be run on the Lock „RF Board Diagnostic“ menu.

Since the Lock needs almost the complete spectrometer for correct operation, it is sometimes difficult to find a Lock related error. If it can not lock in or if there are no „Lock wiggles“ available on the Lock display, there are many possible reasons - the Field could be completely out of range, the Shims could be erroneously set, there could be a prob-lem on the 2H path / probe, some Cryo Shims or even the magnet could have quenched.

For checking the magnet (if the 2H FFA spectrum after a failed Auto Lock trial is com-pletely flat), it is recommended to run a simple 1H experiment on a water sample with a very large bandwidth - if there is a peak at all, it will show up.

The diagram below shows the RF board Diagnostic page, indicating the types and ver-sion codes of the connected RF boards. In our example, there is a 19F option installed on both boards.

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Figure 10.11 Lock RF boards - information and diagnostics

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11 SCB20

11.1 Introduction0 The SCB20 (Shim Control Board) is the enhanced and unified successor of the former SCB7 / 13 Shim Boards.

The new design is higher integrated so that one SCB20 can replace the combination of a SCB13 with a SCB7 (BOSS1 configuration), and two SCB20 can replace three SCB13 (for all other Shim Systems).

There is exactly one standard version of SCB20, which provides now the necessary per-formance and precision for all possible variants of connected Shim Systems.

Low level hardware functions are implemented directly on the SCB20, whereas higher level functions such as BOSS file handling, Auto Shim and RCB Shim are provided by the Software running on the ELCB.

It is now possible to store a complete BOSS file on the nonvolatile memory of the ELCB. For BOSS1 Shim Systems there is a predefined BOSS matrix, which does not need to be downloaded.

The formerly used BOSS files and the former Shim values are fully compatible. However the current sources of the new SCB20 have been unified - each current source provides a current ranging from -1 Ampere (-130‘000 current units) to +1 Ampere (+130‘000 cur-rent units). Since exchanging of Shim settings with the TopSpin application (command „rsh“ and „wsh“) is based on currents, it is not possible to transfer the former SCB7 / 13 Shim settings directly to the new SCB20 boards. It is however possible to enter manually all shims values (Z1, Z2, ...) that are also stored in the TopSpin shim files.

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11.2 Technical Data

1. The SCB20 boards are calibrated in the factory in order to achieve this accuracy. The uncalibrated gain error is significantly higher.

2. The sum of all Shim currents (absolute values) of one SCB20 board must not exceed this value. Additionally, the constraints of the power supplies have to be taken into account (including the dissipation loss of the SCB20). Therefore, the maximum available current sum may be further reduced, according to the following limits:

SCB20 in BSMS/2 Slot 10/11: up to 2A for each, + and -

SCB20 in BSMS/2 Slot 4 .. 9: up to 4 A for each, + and -

3. Measured with a Z-Shim (Boss-2) and an additional Resistor of 2.7 Ohms (consider-ation of wiring and connectors). See the diagrams below:

Parameter Min Typ Max Unit Notes

Output Current (continuous) -1.0 +1.0 Amp

Current Value, Resolution andStep Size

202

BituA

Maximum Offset +/- 20 uA

Gain Error 0.5 % 1)

Maximum Offset Drift +/- 1 uA / oC

Gain Drift < 11 ppm / oC

Tolerated range of connected Shim Coil resistance

0 15 Ohm

Required power supply voltage |VCC| and |VEE|

20 26 Volt

Sum of all shim currents(sum of absolute values)

6 Amp 2)

Small Step Response time(Transition from -100 to 100 mA)

20 ms 3)

Large Step Response time(Transition from -1 to 1 A)

160 ms 3)

Power Amplifier Temperaturefor Shut Down

165 oC

Current Limit (Power Amplifier) 3.5 Amp

Current Limit (shunt)for Shut Down

1.2 Amp

Table 11.1 Electrical Characteristics

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11.3 Configurations

There are basically two standard configurations - one SCB20 providing the necessary number of currents for BOSS1 and BSN-18, and two SCB20 covering all other types of Shim Systems. It may be necessary to use an adapter for connecting „non plug“ Shim Systems. The interconnection is described in detail in the following sub-chapters.

Configuration for a specific Shim System is done by loading a specific BOSS matrix. The corresponding files are delivered with the TopSpin installation, the latest versions can be downloaded from the Swiss ftp server.

BOSS1 Systems do not need a BOSS file - the predefined matrix is already available in the ELCB software. It were theoretically possible to override this matrix by a specific file, however there hasn‘t been any corresponding file defined so far.

All other Shim Systems (BOSS2, BOSS3, Wide Bore) require the according BOSS data to be loaded once. This is normally handled by the TopSpin application (version 2.0 or higher) - or it has to be performed manually during the installation. The complete BOSS data remain then in the nonvolatile memory of the ELCB.

11.3.1 BOSS1 Configuration

One SCB20 is sufficient for any type of a BOSS1 Shim System. It is recommended to plug the SCB20 into slot 9 / 10 (position „SCB1“), since there is a stronger power supply behind. If there is a GAB or a GAB/2 in the same BSMS/2 rack, then this position is man-datory (due to a specific common ground connection) - an error message is issued if this condition is not fulfilled.

There is a set of different adapters providing connectivity with all types of Shim Systems delivered by Bruker.

Figure 11.1 Step Response with step size of 200mA (left) and 2.0A (right)

18.4ms

Diff Amp: Gain=2

158.4ms

Diff Amp: Gain=1

100mA

-100mA

1000mA

-1000mA

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11.3.2 Configuration for BOSS2, 3 and WB

New „plug“ Shim Systems can be directly connected to the SCB20, using the according Shim cables. There are two types of former Shim Systems with fixed cables, the BSMS/2 types and the BSMS types. Both have the same type of connectors, however with a different space in between.

BSMS/2 type Shim Systems need a single adapter (Z105413). The fit for the older BSMS type Shim Systems is provided by an additional adapter (Z002795), which has to be stacked onto the BSMS/2 adapter (Z105413).

Opt

iona

l:A

dapt

er =

Z1

0656

8

Optional Adapters:

SCB20 Output

Op

tion

al:

Ada

pte

r =

Z10

5415

J1

For connectingBSN-18 type Shim Systems

For connecting fixedBOSS1 Shim System

Shi

m C

able

A (

Plu

g)

Pla

nned

Ada

pter

J2

Shi

m C

able

A (

Plu

g)

Connector / Jumpers forB0 Compensation Option

For B0 Compensation,also for non-BOSS1

Figure 11.2 Adapters for BOSS1 and BSN-18 type Shim Systems

Figure 11.3 Adapter for BSMS/2 and Adapter stack for former BSMS

Optional: Adapter = Z105413 Optional: Adapter = Z002795

SCB20

Use this adapter for connectingBSMS/2 type Shim Systems

Stack this adapter in addition forconnecting BSMS type Shim Systems

Top ViewSCB20 SCB20

Front view

Single adapter

Two adaptersstacked

Connector / Jumpers forB0 Compensation Option

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11.3.3 Overview of all Shim Adapters

The following table gives an overview over the currently available Shim adapters. For each combination of electronics (Shim Boards SCB7, SCB13 or SCB20) and Shim Sys-tem there is the required adapter (or set of adapters) indicated.

Note: The Shim Boards SCB7 and SCB13 are not used in BSMS/2 with ELCB and are listed for completeness only.

1) Use the additional adapter Z108181 for connection of an external B0 compensation, see

2) The adapter is ready for B0 compensation

Shim System

BSN-18 BOSS1 BOSS1 „Plug“

BOSS2 „BSMS“

BOSS2 „BSMS/2“

BOSS2 & WB „Plug“

BOSS3

BSMS „SCB13“

Z002734 - Z0039332)

- Z002796 Z1061942)

Z1061942)

BSMS/2 „SCB13“

Z002734 - Z0039332)

Z002795 - Z0028442)

Z0028442)

BSMS/2 „SCB20“

Z106568 Z1054152)

-1)

Z105413 +Z0027952)

Z1054132)

-1)

-1)

Table 11.2 Overview over all Shim adapters

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r forle

sion)r


The SCB20 is a SSRB slave and controlled by the ELCB, which is the BSMS/2 control-ler/coordinator. In addition to the SSRB and power supply, there are the synchronisation signals for RCP Shimming (INT_A, INT_B) that are provided by the IPSO (TCU in former consoles) and that are routed across the ELCB. Also the H0 current for Locking is pro-vided by the ELCB - it is routed by the Shim cable to the Shim System, which contains also the H0 coil for the Lock.

In normal configuration the SCB20 uses a common 10MHz clock that is distributed by the ELCB (this clock is typically generated by the AQS reference board). It is possible to select alternatively a local oscillator.

When the SCB20 is starting up, then the CPLD loads at first the current FPGA design from the flash. It is therefore possible to upgrade SCB20 boards in the field (e. g. for new features). The FPGA provides coordination / control of the hardware functions (e. g. con-trolling the current source regulator loops, protection and realtime functions). As soon as the FPGA is ready, the corresponding embedded software of the ELCB initializes the parameter settings (e. g. values of the Shim currents) and starts operation.

The yellow „Busy“ light flashes whenever there is interaction with the ELCB - there is a task running on the ELCB that periodically checks the connected SCB20 boards, which results in a regular flashing of the „Busy“ LED‘s.

Figure 11.4 Block Diagram of the SCB20 shim current board

Power Supply

SSRB

Clock BootCPLD

Flash

Error

Ready

Power

Busy

ControlFPGA

Bac

kpla

ne C

onne

ctor

ConnectoShim Cab(plug veror Adapte

H0 Current (Lock)

Programmableclock select

aimed

DA

measured

DA

shut down

1s

Poweramplifier

High precisionshunt resistor

20 times on aSCB20

HW Code resistor (identification)I2C BusPT100 Shim System temperature sensing

ControlFPGA

RCP signals (INT_A, INT_B)

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11.4.1 Shim Coil Identification

Each connected Shim System has a set of resistors built in that provide identification by measurement of the resistance values (hardware codes).

There are two ports for identification of the connected Shim System on each SCB20. BOSS1 style Shim Systems (one SCB20) may use therefore up to 2 resistor based hard-ware codes, non BOSS1 systems use actually 3 hardware codes - theoretically, up to 4 codes were possible.

The ports are implemented in two variants, so that the totally 4 wires (including Ground and power supply) can alternatively be used for I2C communication. New Shim systems may additionally contain a nonvolatile memory providing I2C access. This device will store in a first implementation the BIS, it is however an option for the future to store also the corresponding BOSS data in the Shim System.

11.4.2 Protection

The power amplifiers are protected against short circuits (limiting the output current) and over temperature. Additionally, the current sources are shut down if one of the measured currents exceeds the operating values or if the consistency check fails (e. g. if it is not possible to reach the aimed current value).

These two measures protect the SCB20 against short circuits and / or mismatched con-nections.


In the following section, there is a list of possible diagnostic functions that can be invoked by SSRB commands. According to the results of the measurements the soft-ware running on the ELCB may notify the user about abnormal events.

Status / Errors

The SCB20 can perform the following checks:

- Power voltages ok- Short circuits / disconnected lines at the current source output

Figure 11.5 Interface for HW codes and I2C identification device

SCB20 Shim Coil

R1 R2

Voltagemeasurement

A: Variant with VCC for I2C device

GND

VCC

SCB20 Shim Coil

R1 R2

Voltagemeasurement

B: Variant with GND for I2C device

GND

VCC

N1

N2P1

P2

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- Current source status (operational or shut down)- Heat sink over temperature

Output Measurements

Both, the current and the voltage of each current source output can be retrieved over the SSRB. Additionally, the voltage after the integrator stage (U Int) can be measured for each channel. This feature provides additional information about the connected load and could potentially be used for identification.

Temperature Measurement

There is a PT100 resistor built in the shim tube providing temperature measurement. It is therefore possible to read the shim tube temperature over the SSRB bus for diagnostic purpose. If the shim tube temperature exceeds a given limit then the current sources are shut down.

11.4.4 Calibration

The precision of the actual current depends directly on the quality of the current mea-surement. In order to achieve the desired excellent performance, it is necessary to cali-brate both, gain and offset. The initial calibration during production is however sufficient for the life cycle of the SCB20 board.

Gain Calibration

The gain deviation depends mainly from the shunt resistor value, the influences of the other components are relatively small.

Offset Calibration

Even if the offset is very small, there is also a factory calibration of the offset. Both, the Gain and Offset correction parameters are stored in the nonvolatile memory of the SCB20.

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11.4.5 Front Panel - Connectors and LED‘s

Error LED

This LED is active after Power ON. It turns off as soon as the SCB20 is initialized (e. g. FPGA design loaded from Flash) and the communication with the ELCB is established.

Later on, an active Error LED indicates that an error occurred (e. g. short circuit, over temperature, ...) and that in consequence the current sources have been shut down.

Ready LED

This LED is active as soon as the FPGA design is loaded and valid Shim values are acti-vated (initially no current). It is turned off while the Shim settings are changed (flickering during Shimming).

Figure 11.6 The picture below shows a SCB20 shim current board

Error: redReady: green

Power: green

Busy: yellow

Connector for Shim Cable

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Power LED

Indication that the SCB20 is correctly powered.

Busy LED

While the SCB20 is accessed by the ELCB (e. g. for setup, writing of new shim current values, ..) this LED is active. Since all connected SCB20 are checked by the ELCB soft-ware in regular intervals, this LED indicates in addition the „heart beat“ of the Shim Sys-tem.

Connector Pinout

The SCB20 provides a 50 pin connector at the front panel for connecting the Shim sys-tem. There are the 20 current sources (I1 .. I20), the Lock current (H0), two identification connections (Ident1/2), a connection for the temperature measurement (PT100) and the spare signals (Ctrl), which could be used in the future for I2C communication.

Figure 11.7 Pinout of the 50 pin Shim connector

I13-I13+I14-I14+I15-I15+I16-I16+I17-I17+PT100-I18-I18+I19-I19+I20-I20+

H0-

Ctrl-

I09-

I10-

I11-

I12-

Ident2-

Ident1-

H0+

Ctrl+

I09+

I10+

I11+

I12+

Ident2+

Ident1+

I01-

I02-

I03-

I04-

I05-

I06-

I07-

I08-

I01+

I02+

I03+

I04+

I05+

I06+

I07+

I08+

PT100+

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11.5 Bus Interface

As mentioned already earlier in this document, the SCB20 is not actually connected with the VME bus (apart from the power and ground lines). The communication with the ELCB runs exclusively over the User Bus.


Note: The VDD_BPL, AGND and VEE_BPL could be connected by placing the accord-ing 0 Ohms resistors - in the actual design, these lines are not connected.

11.6 Service Software

All connected SCB20 boards in a BSMS system are controlled by the ELCB software - both, the specific low level drivers and the overall control logic is implemented there. The ELCB software provides the operational functions for the NMR application by a CORBA interface. In addition there is a Web access available for service purpose (setup, calibra-tion and diagnostic). Some of these Web functions are open for all users (e. g. clients), other functions are reserved for service engineers - it is necessary to log in and enter the required password before these functions can be accessed (description in the BSMS/2

A B C

1 / 2 (Note) VDD_BPL VDD_BPL VDD_BPL

3 / 4 (Note) AGND AGND AGND

5 / 6 (Note) VEE_BPL VEE_BPL VEE_BPL

7 .. 10 - - -

11 - Slot ID 0 -

12 - Slot ID 1 /RNext

13 /SysReset Slot ID 2 RCLK

14 SSRB:SCLK Slot ID 3 SSRB:STXD

15 SSRB:SRXD - SSRB:/SINTR

16 H0+ H0+ H0+

17 H0- H0- H0-

18 / 19 - - -

20 VCC_BPL VCC_BPL VCC_BPL

21 DGND DGND DGND

22 .. 25 - - -

26 / 27 P_VPWR P_VPWR P_VPWR

28 .. 30 VPWRGND VPWRGND VPWRGND

31 / 31 N_VPWR N_VPWR N_VPWR


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Service Web chapter).

11.6.1 Shim Service Web

The Submenu „Main“ -> „Shim“ provides access to all service functions in connection with the SCB20 boards

Under the menu point „Shim BOSS“ it is possible to check the available Shims for the currently loaded BOSS file and to modify the Shims, alternatively to the Keyboard or TopSpin Application („bsmsdisp“). This page is helpful for double checks with the Appli-cation.

Downloading of new BOSS files and setting up of specific parameters for the Shim func-tions (e. g. pulse polarity for RCB) can be done under „Shim Configuration“.

The example shows a BSMS/2 with two SCB20, therefore there are two according menu points for low level service functions, one for each board, providing diagnostic informa-tion in case of problems.

A further option for debugging the Shim functions is the „Shim Current Tool“, which pro-vides access to all currents - it is possible to define the strength of the currents individu-ally, and to read the resulting current measurements on the display.

There is additionally a „Shim Power Supply Information“, which displays information about the current consumption due to the currently defined Shim settings.

Figure 11.8 Main Menu for the Shim Subsystem

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11.6.2 Setup the Shim Functions

1. The currently loaded BOSS file name is displayed here. If the connected Shim Sys-tem is a BOSS1 then the name of the predefined data set „BOSS1“ is displayed. If there is no valid BOSS data available for the connected Shim System, then this is indicated by „No BOSS Matrix loaded!“. The file names for non-BOSS1 Shim Sys-tems start with the Shim System ID (see point 3), with two characters appended - the first character specifies the frequency range for BOSS3 and BOSS-WB systems - character ‚a‘ means no specific range. The second character indicates the version of the BOSS file (ascending for higher versions).

2. Some BOSS files provide more than one mode, which can be selected here. How-ever, it is no longer necessary to differentiate between US and non-US systems, install mode and user mode. Typically, one mode is sufficient.

3. Here is the identification of the connected Shim System, which is based on 2 (BOSS1) or 3 hardware codes.

4. The maximum power dissipated in the Shim System - this value is defined in the BOSS file.

5. For specific situations it is possible to adapt / extend the „Shim Power Limit“. Setting this flag to „yes“ allows to override the value of the BOSS file by a user specific limit (service account necessary) -> the value can then be entered under point 4.

1

2

3

4

5

7

6

Figure 11.9 Setup and Configuration of the Shim Subsystem

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6. Time in seconds for softly starting up / shutting down the Shim Subsystem.

7. Normally the TopSpin application (version 2.0 or higher) makes sure that there is an appropriate BOSS file loaded - it can be however necessary to do this manually. This menu point provides selecting a specific BOSS file and loading it to the BSMS/2. The BOSS file is handled by the ELCB firmware - if the file is not valid (e. g. syn-tax errors, missing definitions), the Logging can be checked for details (kind of error, line number of the BOSS file where the error has been detected).

11.6.3 View and Modify the Shims

The example in the diagram above shows a Shim Subsystem configured for 28 available / accessible Shims. By the small panel at the bottom, the selected Shim („Z“ in our example) can be viewed or modified manually.

Depressing the link „Save Shims“ shows the complete Shim settings. It is possible to store these settings into a file. However, it is recommended to use the TopShim com-mand „wsh“ for saving the Shim settings for later use by the TopSpin application in order to guarantee compatibility.

Figure 11.10 View and manual modification of the Shims

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The following diagram shows the specific service Web page for the Shim function. There is a separate Web page for each SCB20 board, indicating the hardware status and the configuration. Several operations are reserved for service engineers and need the login procedure with a correct password.

For the case that there is a problem regarding the Shim function (e. g. if there is an error message issued when the user wants to set or modify the value of a Shim), it is possible to run the built in self test on each SCB20 board in order to verify that the SCB20 boards are in a correct state.

The power dissipation in the Shim Coil and the power consumption is displayed as addi-tional information. In case of a failed attempt to set or modify a shim value, it is recom-mended to check if the power limit of the Shim Coil is reached or if the power supply is at its limit. It may be necessary to reset manually all currents to zero, which can be easily done by the „Shim Current Tool“.

Additional information about the consumed power and remaining margin can be retrieved under „Main“ -> „Shim“ -> „Shim Power Supply Information“.

Figure 11.11 SCB20 diagnostic Web page

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11.6.5 No BOSS File for Currently Installed Shim System?

The procedure given here may be useful in case of an error message „Error: Shim: Can-not initialize Shim System .. with BOSS file ...“ or if you can not find an appropriate BOSS matrix file for the Shim System type that is indicated by the BSMS Service Web.It may be necessary to apply the procedure iteratively.

1. Verify that the Shim System Hardware Codes are Consistent

The „compact“ Shim System code provided by ELCB based systems has to be extended by multiplying each part by 8 in order to get the actual hardware codes, according to the following examples:

• „302928“ -> 240, 232, 224 (BOSS2-SB NON US)

• „302923“ -> 240, 232, 184 (BOSS2-SB PLUG)

Use Service Web:„main“->“shim“->“shim configuration“

Get shim system hardware codesThe Service Web provides a „compact“ code (HW codes / 8), multiply each partial code by 8Example: 302923 (= 240 232 184)

1: Verify that the shim system hardware codes are consistentAll codes (except 255)- must be in descending order: 240 232 184 (correct, BOSS2 SB plug), 232 184 240 (wrong)- must be different from each other: 248 255 255 (correct, BOSS1), 240 240 184 (wrong)

Is uncoded BOSS1 withless than 20 Shims?

Is consistent?

2: Confirm number of connected loadsDepress the Confirm button on the BSMS ServiceWeb „main“->“shim“->“shim configuration

Yes

No

3: Check ftp.bruker.ch for new filesIt may be necessary to download the requiredBOSS file from the ftp server. Check for latestversions onftp://ftp.bruker.ch/NMR/download/servtools/bsmstool/boss/ (including subdirectories)

Yes

Is Plug shim system?

4: Swap cables- Swap the shim cables at one side in order to check if they are plugged in correct order- Swap the shim cables at both sides: If a wrong code moves to a different position then the shim cable is probably defectif

5: If the problem persists: Perform a detailed hardware checkThe detailed hardware check is described later in this document

No

Yes

No

No BOSS file found

Figure 11.12 Trouble shooting problems with Shim System and BOSS file

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• ...

Note1: In case of a connected BOSS1 Shim System, the ELCB Service Web indicates explicitly „BOSS1“ as connected Shim System type and does not provide the corre-sponding hardware codes. In this case, there is no need to download a BOSS file - the predefined BOSS1 definitions are used.

For non-BOSS1 systems, verify the following points:

• Are codes 255 only followed by further codes 255?

• Are all codes except 255 different from each other?

• Apart from values of 255, are the values of the codes decreasing from left to right?

2. Uncoded BOSS1 Shim Systems with less than 20 Shims

The ELCB firmware checks if the number of connected loads corresponds with the num-ber of Shim coils defined in the BOSS file. For BOSS1 systems, the ELCB assumes 20 loads. However, there are older, uncoded Shim Systems with less than 20 loads (e. g. only 17 Shim coils). After power up, the user is informed about that by an error message. On the BSMS Service Web there is a button for confirmation of the actual number of loads of the currently connected Shim System. Afterwards, the load check is executed accordingly.

3. Check ftp.bruker.ch for New BOSS files

New BOSS files are published on the following ftp location:

ftp://ftp.bruker.ch/NMR/download/servtools/bsmstool/boss/

Check this directory (and the sub-directories) for new BOSS files and installation guides / service information. It might be necessary to update your locally installed BOSS files.

4. Swap Cables if You Have a „Plug“ >Type Shim System

The two Shim cables 'A' and 'B' could be connected in wrong order. Swapping the con-nectors at one side would eliminate the error. Make sure that the BSMS is switched off before swapping the cables!

In case of a defective Shim cable, swapping of the cables at both ends would move a wrong code to another position, e. g. from {<correct> <correct> <not correct>} to {<not correct> <correct> <correct>}.

5 Perform a Detailed Hardware Check

Verify that the Shim cables are correctly connected, check for any mechanical damage (cables, bent connector pins) and red error LED's on the SCB20.

Analyze the BSMS logging (provided by the service Web) particularly the sequence dur-ing the start up period. TopSpin 2.0 or later provides periodical transfer of the logging information to the workstation (in TopSpin type "bsmsdisp", select tab "service", enable the periodical transfer). The resulting long term logging can be displayed in the same menu page.

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Measure the resistance values that define the hardware codes using an Ohm meter (the values are in the range of 20-200 kOhm).

Pins for „non-plug“ Shim Systems (DIN connectors):

• V1: row 2, column B and D on SCB-R

• V2: row 2, column B and D on SCB-M

• V3: row 2, column B and D on SCB-L (may be missing)

Pins for „plug“ Shim Systems (DSUB50 connectors):

• V1: Pins 18 and 19 on connector A

• V2: Pins 20 and 21 on connector A

• V3: Pins 18 and 19 on connector B (may be missing)

For detachable cables do the measurement including and excluding the cables (connec-tions are 1:1). If there is a significant measurable difference, the cable is defect.

Compare the measured resistance values to the values corresponding to your Shim System part number as found in the table below. (Remark: this table only contains Shim Systems needing a BOSS matrix). If one of the values is outside the range given in the table then the Shim System is damaged and needs to be replaced.

If all resistance values are in the range given in the table then compare the version codes in square brackets [xxx] to the ones returned by the BSMS.

If there is a difference in V1 or V2 then retry with a replaced right hand SCB20. If there is a difference in V3 then retry with a replaced left hand SCB20.

The following table lists all Shim Systems needing a BOSS matrix file. Acceptable ranges for resistance values are in kOhm, and the corresponding hardware codes are in square brackets.

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Shim Coil Part Number

V1 Res[code]

V2 Res[code]

V3 Res[code]

BOSS2 STD S1 BSMS BOSS2 STD S1 BSMS/2BOSS2 STD S2 BSMS BOSS2 STD S2 BSMS/2BOSS2 STD S3 BSMS BOSS2 STD S3 BSMS/2BOSS2 STD S4 BSMS BOSS2 STD S4 BSMS/2BOSS2 STD S5 BSMS BOSS2 STD S5 BSMS/2BOSS2 STD S6 BSMS BOSS2 STD S6 BSMS/2

Z4114Z6555Z4115Z6556Z4116Z6557Z7888Z6558Z4800Z6559Z4676Z6560

147 .. 153kOhm

[240]

94 .. 99kOhm

[232]

68..72kOhm

[224]

BOSS2 USA S1 BSMS BOSS2 USA S1 BSMS/2BOSS2 USA S2 BSMS BOSS2 USA S2 BSMS/2BOSS2 USA S3 BSMS BOSS2 USA S3 BSMS/2BOSS2 USA S4 BSMS BOSS2 USA S4 BSMS/2BOSS2 USA S5 BSMS BOSS2 USA S5 BSMS/2BOSS2 USA S6 BSMS BOSS2 USA S6 BSMS/2

Z7874 Z44811Z7875 Z44812Z7876 Z44813Z7889 Z44814Z4810 Z44815Z4678 Z44816

147…153 kOhm

[240]

94…99 kOhm

[232]

53…56 kOhm

[216]

BOSS/W1 S2/BOSS2BOSS/W2 S4/BOSS2BOSS/W3 S5/BOSS2BOSS/W4 S6/BOSS2BOSS/W4 S7/BOSS2BOSS/W6 S6/BOSS2

Z46428.AZ46428.BZ46428.CZ46428.DZ46428.EZ46428.F

147…153 kOhm

[240]

147…153 kOhm

[240]

42…45 kOhm

[208]

BOSS/W1 S2/BOSS2 USBOSS/W2 S4/BOSS2 USBOSS/W3 S5/BOSS2 USBOSS/W4 S6/BOSS2 USBOSS/W4 S7/BOSS2 US

Z48379.AZ48379.BZ48379.CZ48379.DZ48379.E

147…153 kOhm

[240]

94…99 kOhm

[232]

34…37 kOhm

[200]

BOSS2 STD S1 PLUGBOSS2 STD S2 PLUGBOSS2 STD S3 PLUGBOSS2 STD S4 PLUGBOSS2 STD S5 PLUGBOSS2 STD S6 PLUGBOSS2 STD S7 PLUGBOSS2 STD S8 PLUGBOSS2 STD S9 PLUGBOSS2 STD SA PLUG

Z49732.1Z49732.2Z49732.3Z49732.4Z49732.5Z49732.6Z49732.7Z49732.8Z49732.9Z49732.A

147…153 kOhm

[240]

94…99 kOhm

[232]

25…27 kOhm

[184]

Table 11.4 List of Shim Systems needing a BOSS matrix file.

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BOSS3 STD S4 PLUGBOSS3 STD S5 PLUGBOSS3 STD S6 PLUGBOSS3 STD S7 PLUGBOSS3 STD S8 PLUGBOSS3 STD S9 PLUGBOSS3 STD SA PLUGBOSS3 STD SC PLUG

Z73436.4Z73436.5Z73436.6Z73436.7Z73436.8Z73436.9Z73436.AZ73436.C

94…99 kOhm

[232]

53…56 kOhm

[216]

21…23 kOhm

[176]

BOSS2/W1 ECL00BOSS2/W2 ECL00BOSS2/W3 ECL00BOSS2/W4 ECL00BOSS2/W5 ECL00BOSS2/W6 ECL00

Z46435.AZ46435.BZ46435.CZ46435.DZ46435.EZ46435.F

53…56 kOhm

[216]

42…45 kOhm

[208]

29…31 kOhm

[192]

BOSS2/W1 ECL01BOSS2/W2 ECL01BOSS2/W3 ECL01BOSS2/W4 ECL01BOSS2/W5 ECL01BOSS2/W6 ECL01

Z46435.AZ46435.BZ46435.CZ46435.DZ46435.EZ46435.F

53…56 kOhm

[216]

42…45 kOhm

[208]

25…27 kOhm

[184]

Shim Coil Part Number

V1 Res[code]

V2 Res[code]

V3 Res[code]

Table 11.4 List of Shim Systems needing a BOSS matrix file.

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12 GAB/2

12.1 Introduction0 The GAB/2 is the successor of the GAB gradient amplifier. It supports all its NMR gradi-ent functions and is compatible with both, the former AVII and the new IPSO based AVANCE spectrometers.

For compensation of eddy current effects on the Z1 field in connection with Gradient pulses, there has been a preemphasis built into the new GAB/2. The preemphasis cur-rent is based on three different exponential functions, each with a separate amplitude and time constant. These six parameters can be configured by the CORBA interface of the ELCB.

When it is used in a former AVII, real time gradient data are sent by the GCU/3 over a 28 bit LVDS link. In spectrometers of the new generation, the IPSO uses the 48 bit LVDS link for real time gradient control. According to the connected gradient controller, the GAB/2 selects automatically the appropriate LVDS input. Shaped gradient pulses can be transmitted with a time resolution of up to one sample per microsecond.

For future applications it is possible to connect the GAB/2 with any other device issuing the required real time gradient data. It is however necessary that the connected device fulfills the LVDS interface specifications, which are given in detail later in this document.

Both, the former GAB and the new GAB/2 can be used in a ELCB based BSMS/2. The new GAB/2 provides improved diagnostic functions and automatic offset calibration, which are both implemented in the specific GAB/2 driver. This driver is part of the BSMS software running on the ELCB.

In order to reduce distortions to a minimum, there is an improved, shielded connector for the Gradient cable to the probe head.

12.2 Technical Data


Peak Current -10.0 +10.0 Amp 1)

Peak Voltage -33 33 Volts

Fall Time (90 - 10%) 10 us 2)

Fall Time (residual current smaller than 10 uA)

80 us 2)

Amplitude Resolution for full range -10A to +10A

16 20 3) bit

Table 12.1 Electrical Characteristics (typical values)

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Notes concerning the Electrical Characteristics:

1. The peak current is provided during maximum 50 ms in a time frame of 1 sec.

2. Fall Time measurements with a load of 30uH / 1Ohm.

3. Typical resolution of 20 bit with preemphasis

12.3 Configurations

Residual current when there is no Gradient active

-10.0 +10.0 uA

Preemphasis time constants 0.02 20 ms


Table 12.1 Electrical Characteristics (typical values)

Optional

Error

Ready

Power

Oscilloscope for Displayof the Gradient Shapes

Pulse

1

23

GRAD OUT

MONITOR

Gradient Cable Z-Gradient-CoilProbe Head

LVD

S48

LVD

S28

LV

DS

28

LVDS Cable AQSGCU/3

GCON

GCU/3

B0 OUT

Article No HZ10296

Article No W1213791

Figure 12.1 GAB/2 in an AVII spectrometer

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12.3.1 Preemphasis

The GAB/2 provides three preemphasis terms (exponential functions), each with select-able gain and time constant. Typing „setpre“ in TopSpin (command line) opens a window for definition of the preemphasis parameters.

Note: The time constants by „setpre“ are defined in milliseconds, whereas the BSMS service web provides time constant setting in seconds.

Optional

Error

Ready

Power

Oscilloscope for Displayof the Gradient Shapes

Pulse

1

23

GRAD OUT

MONITOR

Gradient Cable Z-Gradient-CoilProbe Head

LVD

S48

LVD

S28

LV

DS

28

LVDS Cable IPSOGradient Controller

GCON

GCU/3

B0 OUT

Article No 87925

Article No W1213791

Figure 12.2 GAB/2 in an AVANCE spectrometer with IPSO

Figure 12.3 TopSpin window for preemphasis settings

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After power up, the design file stored in the Flash is downloaded to the FPGA. During this period, all four LED‘s are on.

Then the GAB/2 is ready to be configured by the ELCB. The corresponding GAB driver in the ELCB software is responsible for setting up the hardware for correct operation. The ELCB communicates over the SSRB (Synchronous Serial Rack Bus on the back plane) with the GAB/2. In addition, the error handling and service access (e. g. diagnos-tic functions) is part of the ELCB software.

The characteristics of the desired Gradient pulses for a specific NMR application is con-trolled just in time by real time commands transmitted over a LVDS link. Either the Gradi-ent Controller of the IPSO or the AQS GCU/3 generates the necessary data, according to the pulse program that is running in the TopSpin application.

In compliance with the incoming LVDS data, there are the desired analog current pulses generated. The current amplifier provides the aimed current regardless of the connected load - e. g. varying resistance of the cable, or changing characteristics of the coil with temperature have no effect on the resulting current.

Figure 12.4 Block Diagram of the GAB/2 Gradient Amplifier board

Aux1D

A

Aux2D

A

OffsetD

A

MainD

A

1

23

Monitor Output

GradientCurrent

Protection

Power SupplyAnalog

Power SupplyDigital

SSRB

LVDS28

LVDS28

LVDS48

Clock

BootCPLD

Flash

70 C

Error

Ready

Power

Pulse

CurrentAmplifier

ControlFPGA

LVD

S48

LVD

S28

LV

DS

28Bac

kpla

ne

Con

nect

or

G-Cntrl

GCU/3

Aux Out

Aimedgradient

value

Aux Out

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12.4.1 Protection

Both, the high power Gradient Connector and the Monitor Output are protected against short circuits and erroneously connected cables. The output current is limited (high side current measurement) and the temperature of the electronics is supervised. In case of overtemperature or overcurrent, the GAB/2 is switched off, and an error message is sent to the TopSpin application and the BSMS Keyboard.

12.4.2 Status LED‘s on the Front Panel

POWER LED

This LED indicates the state of all internal power supplies. It is active when all power supply voltages are within the specified range.

READY LED

This LED is switched on while the GAB/2 is on / ready for issuing Gradient pulses.

ERROR LED

After power up, this LED stays active until the GAB/2 has been completely initialized by the ELCB software. If the GAB/2 could not be accessed over the SSRB then this LED remains on.

In case of a error on the GAB/2, this LED is switched on until the error is handled by the ELCB software - an error message is sent then to the TopSpin application and the BSMS Keyboard. Therefore, the ERROR LED only flashes for a short time in case of an error.

PULSE LED

When the GAB/2 is in operation mode, the pulse LED is active as long as there is actu-ally a Gradient current available at the Gradient connector. In any other state, this LED indicates that new data are arriving at the LVDS input.

At power up, the PULSE LED indicates an uninitialized FPGA. This LED remains active if it was not possible to load a valid FPGA file from the Flash.


Monitor Output

The monitor output reflects the Gradient current provided by the Gradient current con-nector. This output is intended for diagnostic purpose. It can be useful for debugging the hardware or software (pulse programs). The relation is 1 Volt (monitor voltage) per 1 Ampères (Gradient current).

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Logging of LVDS link

For diagnostic purpose, the GAB/2 hardware provides recording of the LVDS link data - incoming requests for specific Gradient currents are logged (aimed value and time stamp in a raster of 10 ns). So it can be checked if the real time Gradient commands cor-respond exactly with the Gradient defined by the pulse program in TopSpin. This feature is accessible over the Service Web - the logging buffer can be reset before running an experiment, and the resulting information is displayed afterwards.

12.4.4 GAB/2 Control State Machine

After Power Up of the BSMS/2, the GAB/2 Control State Machine steps through the nec-essary steps for getting operational. First, the FPGA design is reloaded from the Flash, and after correct setup of the hardware - if no error occurs - the final state „Operation“ is reached. In this state the GAB/2 is ready for handling the incoming requests over LVDS.

It is possible to switch off the GAB/2 or to start some specific operations (e. g. Firmware Download or Automatic Offset Calibration) when the GAB/2 is in any state. After comple-tion of a specific operation, the GAB/2 is re-initialized. In the end - on successful Initial-ization - the GAB/2 is ready / operational again.

There is a set of non severe errors (e. g. parity bit errors on 48 bit LVDS link, temporary interruption of the selected LVDS link). If such an error occurs then the GAB/2 steps into a „Protection“ state - any existing Gradient current is reset (the relay is switched off). After a time-out the GAB/2 tries to re-initialize and reach the „Operate“ state again.

In case of a severe error (e. g. break down of the supply voltage) the GAB/2 steps into the Error state. It remains in this state until the client (e. g. TopSpin application) re-initial-izes the GAB/2. Both, the severe and non-severe errors, are reported to the client (Top-Spin application / BSMS Keyboard).

Figure 12.5 The GAB/2 Control State Machine

Protection:Relay = off

FirmwareDownload

Auto OffsetCalibration

Operation/ Ready

Off:Relay = off

GAB/2 State = Off

GAB/2 State = Pending

GAB/2 State = On

Other internalOperations

TransientStates

Initialize:FPGA reload

Error:Relay = off

GAB/2 State = Error

On

complete

complete

Any State

Off

FirmwareDownload

Auto OffsetCalibration

Other internalOperations

TransientErrors

PersistentErrors

After 10 trials

On

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12.4.5 Front Panel - Connectors

The Gradient current connector is shown in detail in the block diagram (figure 5.3). Cur-rent flowing in the indicated direction induces a positive Z-Gradient. The Monitor Output is a simple coaxial connector, e. g. for directly connecting a scope.

1

2

3 LVRX0_P

4 LVRX1_P

5 LVRX2_P

6 LVRX_CLK_P

7

8

9 LVRX3_P

10 LVRX4_P

11 LVRX5_P

12 LVRX6_P

13 LVRX7_P

14

LVRX0_N 15

LVRX1_N 16

LVRX2_N 17

LVRX_CLK_N 18

19

DGND 20

LVRX3_N 21

LVRX4_N 22

LVRX5_N 23

LVRX6_N 24

LVRX7_N 25

DGND 26

Figure 12.6 LVDS 48 interface used in AVANCE spectrometers with IPSO

1

2 LVRX3_P

3 LVRX_CLK_P

4 LVRX2_P

5 LVRX1_P

6 LVRX0_P

7 DGND

8

9

10

11

LVRX3_N 12

LVRX_CLK_N 13

LVRX2_N 14

LVRX1_N 15

LVRX0_N 16

DGND 17

18

19

20

Figure 12.7 LVDS 28 interface used in AVII spectrometers

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12.5 Bus Interface

As mentioned already earlier in this document, the GAB/2 is not actually connected with the VME bus (apart from the power and ground lines). The communication with the ELCB runs exclusively over the User Bus.


A B C

1 .. 10 - - -

11 - Slot ID 0 -

12 - Slot ID 1 -




16 .. 19 - - -


21 DGND DGND DGND

22 .. 25 - - -

26 / 27 P_VPWR P_VPWR P_VPWR

28 .. 30 VPWRGND VPWRGND VPWRGND

31 / 31 N_VPWR N_VPWR N_VPWR


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12.6 LVDS Interface Specification

Both LVDS interconnections provide data multiplexing - one LVDS signal pair represents 6 or 7 physical signals at the client side. This can be realized by a LVDS transmission rate 7 times higher than the data rate at the client side.

The actual protocol for transmission of Gradient commands is based on the physical sig-nals at the client side that are listed in the table below

Note: The LVDS-28 link provides only 16 bit Gradient data, whereas the LVDS-48 link transmits 20 bit Gradient data.

LVDS-28 LVDS-48

4 data pairs @ 140 MHz /28 bit @ 20 MHz

8 data pairs @ 560 MHz /48 bit @ 80 MHz

1 Next Go (NG)

2 Valid

3 Last

1..16

Data [0]..Data [15]

+100% = 0x7FFF- 100% = 0x8000

4..17

Not used

17..20

Not used 18..37

Data [0]..Data [19]

+100% = 0x7FFFF- 100% = 0x80000

21..26

Address [0]..Address [5]

38..43


27 Valid (BSTR) 44..47


28 Next Go (NXGO) 48 Parity bit (PAR)

Table 12.3 LVDS signals (client side)

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Between two subsequent commands, there must be a time span (Ts) of at least one microsecond.

Valid Gradient data can be sent in any order between two activation commands (Next Go = NG). If there is a Z component marked with the Valid flag, then it is loaded into the GAB/2. With the next activation command, the data are transferred into the DAC and become active one microsecond (TDelay) after the activation command.

The 28 bit LVDS link is based on 20 MHz - in contrast with the 80 MHz based 48 bit LVDS link. The protocol however is the same - between two subsequent commands, there must be a time span (Ts) of at least one microsecond.

Due to the slower clock rate, the duration of a Gradient command is 50 ns (Tclk20). There are the same rules for transmission of Gradient data as for the 48 bit LVDS, and the delay between the activation command and the corresponding DAC output is also 1 microsecond (TDelay).

Figure 12.8 Timing for the communication over the 48 bit LVDS link

LVDS_CLK80

LVDS_Data

LVDS_NG (N)

LVDS_VALID (V)

Xn

N

Yn Zn B0n

V V V V

Ts

N

V V V V

Xn+1 Yn+1 Zn+1 B0n+1

Tclk80

Xn+2 Yn+2

N

V V

DAC_Output Zn-2 Zn-1 Zn

TDelay

Figure 12.9 Timing for the communication over the 28 bit LVDS link

LVDS_CLK20

LVDS_Data

LVDS_NXGO~ (N)

LVDS_BSTR~ (V)

Xn

N

Yn Zn B0n

V V V V

Ts

N

V V V V

Xn+1 Yn+1 Zn+1 B0n+1

Tclk20

Xn+2 Yn+2

N

V V

DAC_Output Zn-2 Zn-1 Zn

TDelay

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12.7 Web Interface0 Both, the specific low level drivers and the overall control logic for the GAB/2 are imple-mented in the ELCB software. It provides setup and configuration for the operational functions for the NMR application by a CORBA interface. In addition there is a Web access available for service purpose (setup, calibration and diagnostic). Some of these Web functions are open for all users (e. g. clients), other functions are reserved for ser-vice engineers - it is necessary to log in and enter the required password before these functions can be accessed (description in the BSMS/2 Service Web chapter).

12.7.1 GAB/2 Service Web

The Submenu „Main“ -> „GAB“ provides access to all service functions for a connected GAB or GAB/2 board. Depending on the connected board (GAB or GAB/2) there is a dif-ferent set of commands available - the GAB provides a subset of all these commands.

On top of the GAB/2 menu there is the link to the Gradient Amplifier Control sub page. This page provides an overview over

• the connected board (GAB or GAB/2)

• its type (e. g. Z-Gradient Amplifier present)

• operating state (e. g. „operate“). If the GAB/2 is in state „off“, „protection“ or „error“ then the current source is disconnected by a relay.

The GAB/2 service functions provide detailed information for diagnostics and a push but-ton offset calibration (see also "Offset Re-Calibration in the Field" on page 126).

There are further links for BIS reading, preemphasis parameter setting and logging of the real time gradient signals on the LVDS interface.

Figure 12.10 Main Menu for the GAB/2 Subsystem

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12.7.2 Offset Re-Calibration in the Field

During production, the GAB/2 is calibrated for minimum residual offset. This calibration is normally sufficient for a long time period and a wide temperature range. However, it may happen in rare circumstances that the dynamic offset compensator reaches its limi-tations. This is reported by an error message sent to the TopSpin application and the BSMS Keyboard.

It is then necessary to go to the page „main“ -> „GAB“ -> „GAB/2 Service Functions“ and invoke the offset calibration again by depressing the button „Calibrate“ in the row „Offset Calibration“.

The other parameters on the GAB/2 Service Page are intended for diagnostic purpose. Service engineer access rights are necessary for modification - it is however not recom-mended to change these parameters under normal circumstances.

12.7.3 Preemphasis Setting by Service Web

Normally, the preemphasis parameters are defined by the „setpre“ feature provided by TopSpin (see also "Preemphasis" on page 117). Alternatively, the gains and time con-stants can be set also by the Service Web.

Note: The time constants (Tau1 .. Tau3) are defined in seconds.

Figure 12.11 Preemphasis settings

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12.7.4 Trouble Shooting

The following flow chart describes the suggested trouble shooting procedure in case of gradient problems.

Figure 12.12 Trouble shooting procedure for GAB/2

There is a problem with the gradient in a system with GAB/2

1: Run a gradient experimentwith NMR lock and check thelock line (lock display)

Visible dips?

2: Check Error LED on GAB/2

Error LED on?

3: Check Power LED on GAB/2

Power LED on?

4: Check Ready LED on GAB/2

Ready LED on?

5: Pulse LED beating whilegradient experiment is going on?

10: Go to the BSMS service web„gab“->“gradient amplifier control“

11: Depress button „GAB off“and then „GAB on“,depress „Refresh“ after 10 sec.

State?

DPP connected?no

12: Remove DPP sincethe GAB/2 has its ownpreemphasis generator

13: Check LVDS cables (type),Try using cable of SGU/2 channel(swap cables)

14: Check IPSO, the light besidethe GAB LVDS must be yellow.Run the IPSO self test

Still problems?

Still problems?

19: Gradientsand GAB/2 ok

Pulse LED?always off

always on

6: Stop experiment, detachgradient cable and watch locklevel (lock display)

beating

Lock jump?

18: The GAB/2 is likely to be defective.Fill in the result of each test as described atbottom of page 1 and send in the board for repair

17: Checkpulse program

16: Check the resistance of gradientcoil and cable individually, verify thatthere is no connection to ground

7: Measure gradient cablebetween pin 2 and pin 3

1.4 to 2.0 Ohm?

As expected?

9: Short cut gradientconnector pin 2 and 3,measure at monitor out

Gradients?

15: Check BSMS power suppliesat rear side, see BSMS loggedmessages for details

8: Measure at monitor outputusing a scope, expected voltage= 1 V per 10 % gradient strength

no yes

yes no

no yes

yes no

„operate“other

yes

noyes

yes no

no yes

yes no

yesno

noyes

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Some of the necessary checks are described in detail below. It depends on the preced-ing test results, which check actually has to be performed next. Typically, not all checks have to be executed.

1. Run a gradient experiment

In the ATP you may run a profile experiment (gzp) and check if the resulting profile has the expected shape.

You can execute a Bruker standard experiment (e. g. gradient COSY) on a nucleus other than your lock nucleus (typically 2H for lock) with activated NMR lock. You should be able to see the deep dips in the lock level (check the lock display) while the gradient is active.

6. Check for unintended / faulty ground connection

In case of a faulty connection between one of the gradient wires and the ground poten-tial there is typically a current flowing. This current has an influence on the Z1-Shim and disappears as soon as the gradient connector is unplugged. A perfect shim with the influence of that current would get significantly worse without, and the lock level would drop accordingly.

7. Measure gradient cable between pin 2 and 3

Unplug the gradient cable and measure at GAB/2 side. Since the resistance of the gradi-ent (cable and coil) is very low, the measurement has to be made very carefully (at best differential measurement).

8. Connect an oscilloscope to the monitor output

The monitor output on the GAB/2 provides a voltage that represents the current actually provided by the GAB/2 current source. 1 Volt represents 1 Ampère current, which is a gradient strength of 10%. If the voltage at the monitor is only a few millivolts and very noisy, there is probably no gradient load connected. In this case, the gradient cable and the coil resistor have to be measured by a Ohm meter (see point 16).

9. Suspicion of open gradient load

Detach the gradient cable and connect pin 2 and 3 of the gradient connector e. g. by a bent paper clip. Restart your gradient experiment afterwards and check the monitor out-put.

10. Use the BSMS Service Web to get the GAB/2 state

In TopSpin (version 2.0 or later) type "ha" to get access to the Service Web. In former TopSpin versions (1.3) or XWinNMR, use a standard Web browser and select the address 149.236.99.20.

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11. Restart the GAB/2 on the corresponding service web page.

Perform the indicated command sequence. Wait about 10 seconds before depressing the "refresh" button. If you have no success, you may try several times.

12. If there is a DPP

The GAB/2 can operate without DPP and has its own preemphasis generator. The DPP is therefore not necessary and should be removed. Some versions of the DPP did not provide a parity bit, which would cause communication errors.

13. Check the LVDS cables

Verify that only the certified LVDS cables are used, if you are not sure about the required type, contact your Service support. You might try with a cable from a SGU/2 channel.

15. If the GAB/2 is in error state

Normally, the cause for a GAB/2 error is reported to TopSpin by an error message. One possible cause could be a missing power supply voltage. It is helpful to check also the logging provided by the BSMS Service Web (page "service"->"display logged mes-sages"). There might be a hint why the GAB/2 is in error state.

Long term BSMS logging can be enabled on the "bsmsdisp" provided by TopSpin. The enable check box is on the service page (password required), and the logging can be viewed on the same page.

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13 L-TRX / L-19F

13000000

13.1 Introduction0 The BSMS/2 LOCK TRANSCEIVER (L-TRX) and the optional BSMS/2 LOCK TRANS-CEIVER 19F (L-19F) are new designed and incorporate the following units:

• former BSMS LOCK TRANSMITTER (L-TX)

• former BSMS LOCK RECEICER (L-RX)

• actively gated 5W pulsed power amplifier for 2H gradient shimming purposes

• former BSMS L-TX OPTION 19F

• former BSMS L-RX OPTION 19F

In addition, the L-TRX / L-19F have several new features:

• enhanced digital transmitter and receiver

• power amplifier with active quiescent current control

• field-upgradable by firmware

• fast SSRB interface to ELCB

• real-time pulses also accessible via backplane connector

• on board over temperature protection

• extended internal diagnostics

• BIS hardware identification system

• milled housing with narrow form factor and optimized cooling fins

• dedicated up- and down converter unit for fluorine lock (L-19F)

As with the former lock system there is one L-TRX unit per system frequency. The L-19F unit is one single 19F unit for 300 MHz to 1000 MHz system frequency.

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13.2 System Architecture / Overview0

Figure 13.1 L-TRX Block Diagram

RX- Section:Gating, Down Converter, Decimation & Filtering

Control Section:Interface, Error Handling, internal Diagnostics

TP-F0

BLNKTR_2H~

SEL-2H/AMP~

ELCB

ADC 2H-REC IN

2H-TR OUT

2H IN

FPGA

Power Supply Powerincl. Supervision

REF IN

BP

BPDACTX- Section:DDS, Pulse Former, Power & Phase Calibration

Gating

Firmware &BIS Memory

Reference ClockDistribution

DiagnosticHardware

PA

Back

plan

e

Supply

Rx-Data

Tx-Data

Ampl.

SSRB

CONTROL BUS

Figure 13.2 L-19F Block Diagram

Switchable Filter Banks

REF INReference ClockDistribution

REF OUT

LOCK IN

2H-TR OUT

19F-TR OUT

2H-REC OUT

2H-TR IN

Ampl.

Ampl.

ELCB SSRBControl Section:Interface, Error Handling, internal Diagnostics

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2H &

19F

Pre

ampl

ifier

Figure 13.3 Block Diagram L-TRX unit


TP-F0

BLNKTR_2H~

SEL-2H/AMP~

ELCB

ADC2H-REC IN

2H-TR OUT

2H IN

FPGA

Power Supply Powerincl. Supervision REF IN

BP


Gating



DiagnosticHardware

PA

Back

plan

e

Supply

Rx-Data

Tx-Data

Ampl.

SSRB

CONTROL BUS


Figure 13.4 Block Diagram with optional L-19F unit



TP-F0

BLNKTR_2H~

SEL-2H/AMP~

ELCB

ADC2H-REC IN

2H-TR OUT

2H IN

FPGA

Power Supply Powerincl. Supervision REF IN

BP


Gating



DiagnosticHardware

PA

Back

plan

e

Supply

Rx-Data

Tx-Data

Ampl.

SSRB

CONTROL BUS

REF INReference ClockDistribution

REF OUT

LOCK IN

2H-TR OUT

19F-TR OUT

2H-REC OUT

2H-TR IN

Ampl.

Ampl.

ELCB SSRBControl Section:Interface, Error Handling, internal Diagnostics



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13.2.1 Function Description

The architecture of the L-TRX / L-19F units is significantly different to the design of the former L-TX and L-RX units. The individual signal processing and amplifier control stages are as much as possible shifted into the digital domain.

Signal processing

The transmitter consist of a direct digital synthesizer. The output power range is fully implemented with D/A-converters, which eliminates the need of real-time controlled ana-log attenuators.

The receiver consists of a mostly direct digital system. The receiver gain is mainly imple-mented in the digital section.

Deuterium Power Amplifier with Active Quiescent Current Control

The operating point of the on-board 5W power amplifier for 2H gradient shimming is matched to the different operating modes in order to reduce power dissipation. The indi-vidual quiescent current values are stored in the calibration data memory of each unit. In ‚2H Lock‘ mode the quiescent current is actively regulated.

Gradient Shimming

Together with the L-19F unit, the on-board 5W power amplifier should not be used for gradient shimming on 2H. In spectrometer configurations with the L-19F unit a high power 2H amplifier is anyway mandatory for 2H observe experiments. In this configura-tion the same high power 2H amplifier is used for gradient shimming.

The L-TRX / L-19F units do not support gradient shimming on 19F.

Reference Clock

The L-TRX / L-19F units use the same reference frequency mixture produced by the AQS REFERENCE board as the AQS SGU. The former 10 MHz system clock is not required anymore.

SSRB Communication Interface with ELCB

The L-TRX / L-19F units use a dedicated SSRB (Synchronous Serial Rack Bus) inter-face for control and data transfer to the ELCB.

Real-Time Pulses via Backplane

The L-TRX is able to receive and transmit real-time control pulses via backplane to reduce external wiring. This feature is currently only used in the NanoBay console (BLNKTR_2H~). Other pulses and/or consoles may follow in the future.

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2H-TR Power Amplifier Output Connector

The output connector is a N-type instead of SMA to avoid the risk of unintentional wrong wiring. E.g. low power rf-boards could be permanently damaged if wrongfully connected to the 5W power output of the L-TRX.

Product Firmware

The L-TRX / L-19F firmware packages are field-upgradable via ELCB. The factory con-figuration is stored on-board in a write protected memory section. The user can always reload the factory firmware.

Fluorine Lock

The former fluorine lock option piggy modules have been integrated into a dedicated deuterium to fluorine up and down converter unit (L-19F). While locking on a deuterated solvent, the L-19F unit is bypassed. Whereas the L-19F unit translates the deuterium lock signal into the fluorine lock signal, while locking on samples containing fluorine as lock solvent.

13.2.2 Protection

Power Supply and Reference Clock Supervision

All power supply voltages and the necessary reference clocks are internally monitored. In case of a failure the ‚PWR/CLK‘ LED (L-TRX) or the ‚PWR‘ LED (L-19F) are deacti-vated and an appropriate error message is generated (if still possible).

Over-Temperature Protection (L-TRX only)

The power amplifier and board temperature are monitored on-board. The ELCB can access the relevant sensors and act accordingly.

If the temperature reaches the limit of safe operation, the power amplifier is switched off immediately without intervention of the ELCB. The L-TRX enters the ERROR state. An error message is sent to TopSpin and displayed on the BSMS keyboard. See "Over Tem-perature Error" on page 160

After regaining normal temperature conditions, the L-TRX reverts to the operating mode prior to the error.

Over-Current Protection (L-TRX only)

If the power amplifier drain current exceeds the limit of safe operation, it is switched off and the L-TRX enters the ERROR state. An error message is sent to TopSpin and dis-played on the BSMS keyboard. See "Over Current Error" on page 161

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13.2.3 Internal Diagnostics

The L-TRX has extensive internal diagnostic functions which can be accessed via the service web. See "Diagnostic Functions" on page 157.

Many of the diagnostics are performed automatically during power-up and assessed by the ELCB. If a failure occurs, an appropriate error message is generated.

Due to the low complexity of the L-19F unit, the unit does not have any dedicated diag-nostic functions.

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13.2.4 Technical Data BSMS/2 Lock Transceiver

Transmitter (TX):

Output power for gradient shimming @ +4 dBm input power min. 5 W

Conditions: pulsed power only, max. pulse length = 1s, max. duty-cycle = 10 %, all independent of actual output power

Output power for Lock operation: FFA Mode (250us pulse) typ. 28 dBm

Lock Mode (Lock pulse) -60...+20 dBm

Output power resolution typ. 0.1 dB

Frequency resolution 14 mHz

Phase resolution 0.1 °(deg)

Phase range 0..360 endless °(deg)

Frequency range f2H ± 1 MHz

Load mismatch: no damage infinite VSWR for on board diagnostics 3.6 VSWR

Confamp (except for Z109887 and Z109888 with ECL< 2) Supported

Receiver (RX):

Gain range 80 dB

Gain resolution 0.1 dB

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13.2.5 Technical Data BSMS/2 19F Lock Transceiver 300-1000

Transmitter (TX, 19F Lock Operation):

Output power for Lock operation: FFA Mode (250us pulse) typ. +10 dBm

Lock Mode (Lock pulse) -60...+10 dBm

Output power resolution See 13.2.4

Frequency resolution See 13.2.4

Phase resolution See 13.2.4

Phase range See 13.2.4

Frequency range f19F ± 1 MHz

Load mismatch See 13.2.4Confamp N/A

Receiver (RX, 19F Lock Operation):

Gain range 60 dB

Gain resolution See 13.2.4

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13.2.6 2H Lock with L-TRX Internal Power Amplifier

Minimal system for 2H lock using internal power amplifier for gradient shimming only (no 2H Observe or Decoupling capability). Set ‚2H-TX Control‘ Router Address according to your configuration. (see "2H-TX Control (Router Address)" on page 153)

Interrupt of ‚Lock 2H‘ Operation with SEL_2H/AMP~ Signal in Real-Time

Figure 13.5 2H Lock system with L-TRX internal power amplifier for gradient shimming

BLKTR-2H

AQS SGU / (ROUTER)

2H-OUT

TP_F0 LOCK_PP

AQS PSD or DRU

2H-TR

2H IN

BLKTR-2H~

TP-F0

2H-RECREF

BSMS L-TRX

SEL_2H/AMP~

REF

AQS REF

ELCB

SEL_2H/DEC

AQS IPSO

LOCKHOLD

via AQS PSD or

LOCK-OUT

Control

2H-TRANSM PROBE

HPPR/2 or AQS PREAMP

NanoBay backplane

Lock 2H 2H Gradient Shimming Lock 2H

PROBE

TP-F0

BLKTR-2H~

2H-IN

SEL_2H/AMP~

+20 dBm +37 dBm

Figure 13.6 Timing diagram of ‚Lock 2H‘ operation with interrupts for gradient shimming

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13.2.7 2H Lock with Additional, External 2H Power Amplifier

A more powerful external amplifier can be used for 2H gradient shimming, 2H Observe and 2H Decoupling. Set ‚2H-TX Control‘ Router Address to ‚255‘. (see "2H-TX Control (Router Address)" on page 153).

In order to mute the lock stimulus in real-time during 2H-Observer and 2H-Decoupling experiments, the signal ‚SEL_2H/DEC‘ must be connected to the AQS 2H-TX and the L-TRX unit. For further details on the wiring see .

Interrupt of ‚Lock 2H‘ Operation with SEL_2H/AMP~ Signal in Real-Time.

Figure 13.7 2H Lock system with additional, external 2H power amplifier

FO_IN

FX_IN

SEL_2H_AMP~

2H-OUT

AQS 2H-TX

BLKTR-2H~

TP_F0 LOCK_PP

AQS PSD or DRU

2H-TR

2H-IN

BLKTR-2H~

TP-F0

2H-RECREF

BSMS L-TRX

SEL_2H/AMP~

REF

AQS REF

BSMS ELCB

SEL_2H/DEC

AQS IPSO

LOCKHOLD BLKTR-2H

AQS SGU / (ROUTER)

2H-OUT

LOCK-OUT

Control

2H-TRANSM PROBE

HPPR/2 or AQS PREAMP

(via Backplane)

Figure 13.8 Timing diagram of ‚Lock 2H‘ operation with interrupts for 2H Decoupling or 2H Observe

PROBE

2H-TR

TP-F0

SEL_2H/AMP~

BLKTR-2H~

2H IN

Lock 2H 2H Decoupling Lock 2Hor 2H Observe

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r

13.3 AVANCE III MicroBay/OneBay/TwoBay Configurations0 The BSMS/2 CHASSIS (Z002774, ECL ³ 02) is compatible to both generations of lock systems. Only a power supply board must be replaced.

13.3.1 Installation

• Install the L-TRX unit in the L-TX slot

• Install the L-19F unit in the L-RX slot

• If L-19F is not installed, cover the L-19F slot with a blind plate (Z14118, 8TE)

• If L-19F is installed, cover the remaining openings with two blind plates (Z123939, 1TE, in parts list of L-19F included)

Figure 13.9 L-TRX and L-19F slots in BSMS/2 chassis (Front View)

CP

U (

ob

sole

te)

SLC

B/2

Ob

sole

te

Opt

iona

l: G

AB

/2 =

Z10

484

4

SC

B2

0 =

Z1

029

30

ELC

B =

Z1

0081

8

L-T

RX

2H

TX

: Ob

sole

te

BSMS/2 1

0


No

n B

OS

S1

:se

cond

SC

B2

0 =

Z1

0293

0

L-19

F (

Opt

ion

al)

Figure 13.10 PSB5 slot in BSMS/2 chassis (Rear View)

• Remove the cover plateover the power supplyboards

• Replace PSB2 with PSB5(Z111143)

• Replace the cover plate

230V SHOCK HAZARD

Disconnect powe


PS

B 5

PS

B 7

EC

L 2

or

new

er

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13.3.2 Settings

2H-TX Control (Router Address):

Enable or disable the internal power amplifier for gradient shimming. See "2H-TX Con-trol (Router Address)" on page 153.

If no AQS 2H-TX is present, enable the internal power amplifier for gradient shimming:

• Set router address according to the BLNKTR~ pulse used: Nanobay 3 Channel = ‚7‘MicroBay 2 Channel = ‚7‘ MicroBay 3 Channel = ‚7‘OneBay/TwoBay ext. BLA = ‚7‘

If an AQS 2H-TX is present, disable the internal power amplifier:

• Set router address to ‚255‘.

With this setting the internal power amplifier is only used for ‚2H Lock‘ operation.

13.3.3 Wiring

The following figures describe the wiring of the L-TRX with the CABLE SET L-TRX UPGRADE (H14042, blue).

Wiring AVANCE III MicroBay, One & TwoBay with HPPR/2

Figure 13.11 Wiring AVANCE III MicroBay with AQS Preamplifier (H14034 and H14013)

DR

U

RE

F

SG

U1

1H2H

PS

D

L-T

RX

POS

1

2

3

4

5

6

7

8

9

10

2H-REC IN / J1 SMA

REF IN / J3 SMA

TP-F0 OUT/ J4 SMA

BLNKTR_2H~ IN / J5 SMA

SEL-2H/AMP~ IN / J6 SMA

SMA / TRANSM 2H

2H IN / J8 SMA

2H-TR OUT / J9 N

SMB / LOCK OUT

SMB / TGPF0

Coaxipack / PSD A2

SMA J9 / REF.4

CoaxipackT-Cont. U1

SMA J7 / AUX OUT

Z100055

HZ03806

HZ14169

HZ15443

HZ13679

HZ03806

HZ03806

AQS/3 BSMS/2

Additional requirements:

IPS

O

142 Z108028_00_06

Z1080

L-TRX / L-19F

Figure 13.12 Preamplifier and no external 2H Amplifier (H14010 and H14013)

IPS

O

RE

F

SG

U1

PS

D

L-T

RX

CO

VE

R

1H

2H

POS

1

2

3

4

5

6

7

8

9

10

LOCK OUT / BNC

REF IN / J3 SMA

TP-F0 OUT/ J4 SMA



N J9 / 2H-TR OUT

2H IN / J8 SMA

TRANSM 2H / N

SMA J1 / 2H-REC IN

SMB / TGPF0

Coaxipack / PSD A2

SMA J9 / REF.4

CoaxipackT-Cont. U1

SMA J7 / AUX OUT

Z12256

HZ03806

HZ13635

HZ15443

HZ13679

HZ03806

HZ16777

AQS/3 BSMS/2 HPPR/2

Additional requirements:

Figure 13.13 Wiring AVANCE III One & TwoBay with AQS 2H-TX (H14010, H14020 and H14014)

IPS

O

RE

F

SG

U1

2H

-TX

PS

D

L-T

RX

CO

VE

R

1H

2HPOS

1

2

3

4

5

6

7

8

9

10

LOCK OUT / BNC

REF IN / J3 SMA

TP-F0 OUT/ J4 SMA



2H-TR OUT / J9 N

2H IN / J8 SMA

TRANSM 2H / N

FX IN / SMA

SMA J1 / 2H-REC IN

SMB / TGPF0

SMA J9 / REF.4

CoaxipackT-Cont. U1

SMA J7 / AUX OUT

SMA / FO IN

SMA / 2H OUT

Z12256

HZ04329

HZ13635

HZ13679

HZ03806

HZ16512

Z12257

AQS/3 BSMS/2 HPPR/2

not used (BLNKTR_2H~ IN must be open!)Additional requirements: SMA-T adapter (67072)

SEL-2H/AMP~ / SMA

HZ04329

143 28_00_06

L-TRX / L-19F

LNK

IN

IN

T

H AMP

LNK

IN

IN

T

H AMP

Figure 13.14 Wiring AVANCE III One & TwoBay with BLAXH2H (H14008, H14010 and one of H14014 or H14015 or H14016)

RE

F

SG

U1

PS

D

L-T

RX

CO

VE

R

1H

2H

POS

1

2

3

4

5

6

7

8

9

10

LOCK OUT / BNC

REF IN / J3 SMA

TP-F0 OUT/ J4 SMA

N J9 / 2H-TR OUT

2H IN / J8 SMA

SMA J1 / 2H-REC IN

SMB / TGPF0

SMA J9 / REF.4

Z12256

HZ04329

HZ13635

HZ16512

AQS/3 BSMS/2 HPPR/2

not used (BLNKTR_2H~ IN must be open!)Additional requirements: REF/2: Splitter (Z102000)or 6dB attenuator (45999)

IPS

O

IPSO

BL

AX

H2

H

SMA J7 / AUX OUT

SMA J6 / SEL-2H/AMP~ IN

N / TRANSM 2H

LTX BSMA

HZ04329

HZ04329 2H FXSMA

2H FOSMA2H OUN

Z2739


CoaxipackT2 / A1

HZ13629 or HZ13679 or HZ14770 (QNP) SEL 2BNC

Figure 13.15 Wiring AVANCE III One & TwoBay with L-19F and BLAXH2H (H14008, H14010, Z125188 and one of H14014 or H14015 or H14016)

RE

F

SG

U1

PS

D

L-T

RX

CO

VE

R

1H

2H

POS

1

2

3

4

5

6

7

8

9

10

LOCK OUT / BNC

REF IN / J3 SMA

2H-TR OUT J9 / N

2H IN J8 / SMA

2H-REC IN J1 / SMA

TGPF0 / SMB

REF.4 J9 / SMA

Z12256

HZ04329

HZ13635

HZ16512

AQS/3 BSMS/2 HPPR/2

not used (BLNKTR_2H~ IN must be open!)Additional requirements: REF/2: Splitter (Z102000)or 6dB attenuator (45999)

IPS

O

IPSO

BL

AX

H2

H

AUX OUT J7 / SMA

SEL-2H/AMP~ IN J6 / SMA

TRANSM 2H / N

LTX BSMAHZ04329

HZ04329

2H FXSMA

2H FOSMA2H OUN

Z2739

BLNKTR_2H~ IN J5 / SMAHZ13629 or HZ13679 or HZ14770 (QNP)

SEL 2BNC

L-1

9F

19F

CoaxipackT2 / A1

TRANSM 19F / N19F-TR OUT J7 / SMA

2H-TR IN J8 SMA

2H REC OUT J2 / SMA

REFIN J3 / SMA

REF OUT J4 / SMA

2H-TR OUT J9 / N

144 Z108028_00_06

Z1080

L-TRX / L-19F

BLNKTRMicroBay2 Channel

MicroBay3 Channel

One & TwoBay

BLNKTR(1)~ AQS BLA2BB X(via AQS backplane)

AQS BLA2BB X(via AQS backplane)

External BLA 1-6(Cable HZ10148)

BLNKTR(2)~ AQS BLA2BB H(via AQS backplane)

AQS BLA2BB H(via AQS backplane)

BLNKTR(3)~ AQS BLAX300(via AQS backplane)

BLNKTR(4)~

BLNKTR(5)~

BLNKTR(6)~

BLNKTR(7)~ L-TRX(Cable HZ15443)

L-TRX(Cable HZ15443)

L-TRX(Cable HZ15443)

BLNKTR(8)~

Table 13.1 Wiring BLNKTR_2H~ (AQS PSD to 2H Amplifier) a

a. AQS 2H-TX: blanking pulse via AQS backplane

145 28_00_06

L-TRX / L-19F

13.4 Front Panel - Connectors and LED‘s

13.4.1 BSMS/2 Lock Transceiver

0

LED ‚ERROR‘ (red):

All errors detected by the L-TRX are displayed with the ‚ERROR‘ LED. In addition inter-rupt requests activate the LED for at least 250 ms. If the ELCB does not process the interrupt immediately, the LED stays active. In diagnostic mode the LED beats with approx. 2 Hz. During the Error state only a minimal set of diagnostic functions is avail-able.

Figure 13.16 View BSMS/2 LOCK TRANSCEIVER 300

ERROR READY PWR/CLK INACTIVE

2H-REC IN (J1)

REF IN (J3)

TP-F0 OUT (J4)

BLNKTR-2H~ IN (J5)

SEL-2H/AMP~ IN (J6)

2H IN (J8)

2H-TR OUT (J9)

146 Z108028_00_06

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L-TRX / L-19F

r-

e -

LED ‚READY‘ (green):

The ‚READY‘ LED is active if the L-TRX is successfully initialized and ready for ELCB commands. If the LED stays dark, the L-TRX FPGA initialization has failed. If an error is detected, the LED is deactivated. In addition any communication deactivates the LED for at least 250 ms.

LED ‚PWR/CLK‘ (green):

In case of a power supply failure or missing reference clock the ‚PWR/CLK‘ LED is deac-tivated. The L-TRX enters the ERROR state.

LED ‚INACTIVE‘ (yellow):

During normal operation the ‚INACTIVE‘ LED displays the L-TRX Lock signal generation status. The LED is continuously on when no Lock mode is active or beats with approx. 2 Hz if the signal generation is suppressed with the SEL_2H/AMP~ input.

In diagnostic mode the LED displays the transmitter (power amplifier) status. If the trans-mitter is switched off, the LED is active. During pulsed operation the LED beats with approx. 2 Hz. In CW signal generation mode the LED is deactivated.

LED Status Operating Mode LED Status Operating Mode

Power OFF:The L-TRX is switched off.

‚Lock 2H‘:Normal operating mode. Pulsed Lock signal geneated.

,Idle‘:No 2H stimulus signal, no RF-signal generated.

‚Lock 2H‘ and ‚Mute 2H‘:L-TRX in normal Lock mode with temporarysignal suppression due toactive external SEL_2H/AMP~ signal. The LED beats with approx. 2 Hz.

‚Error‘:Error in L-TRX detected but neither power supply failure nor missing reference clock.(e.g. over temperature in power amplifier)

‚Diagnostic‘:Power amplifier not activrespectively no output signal generated. The ‚ERROR‘ LED beatswith approx. 2 Hz.

Table 13.2 L-TRX Status LED‘s in different operating modes

ERROR

READY

PWR / CLK

INACTIVE

ERROR

READY

PWR / CLK

INACTIVE

ERROR

READY

PWR / CLK

INACTIVE

ERROR

READY

PWR / CLK

INACTIVE

ERROR

READY

PWR / CLK

INACTIVE

ERROR

READY

PWR / CLK

INACTIVE

147 28_00_06

L-TRX / L-19F

er- h

2H-REC IN (J1, SMA):

2H receiver input from 2H preamplifier (HPPR/2, AQS 1H2H, LOCK-OUT)

• Maximum input power with no damage: +0 dBm

REF IN (J3, SMA):

Reference clock input from AQS REFERENCE board or L-19F REF OUT (J3)

• Nominal input power @ 160 MHz: -0.5 ±0.5 dBm


TP-F0 OUT (J4, SMA):

Transmitter pulse output to HPPR preamplifier (via AQS DRU or PSD board)

• 5V TTL output, no damage with 50 load(pulse polarity see "Lock Configuration" on page 154)

BLNKTR-2H~ IN (J5, SMA):

Power amplifier blanking pulse from AQS SGU (via NanoBay backplane or AQS PSD board)

• 5V TTL input (high (+5V) = power amplifier blanked, low (0V) = power amplifier gated)

SEL-2H/AMP~(J6, SMA):

Power amplifier control signal from IPSO unit (SEL_2H/DEC, AQS or 19“ unit)

‚Error‘:Error in L-TRX power sup-ply or missing reference clock.

‚Diagnostic‘:Pulsed output signal genated. Both ‚ERROR‘ and‚INACTIVE‘ LED beat witapprox. 2 Hz.

‚Diagnostic‘:CW output signal gener-ated. The ‚ERROR‘ LED beats with approx. 2 Hz.

LED Status Operating Mode LED Status Operating Mode

Table 13.2 L-TRX Status LED‘s in different operating modes

ERROR

READY

PWR / CLK

INACTIVE

ERROR

READY

PWR / CLK

INACTIVE

ERROR

READY

PWR / CLK

INACTIVE

148 Z108028_00_06

Z1080

L-TRX / L-19F

• 5V TTL input (high (+5V) = 2H Lock, low (0V) = 2H amplifier selected for gradient shimming, 2H Lock muted)

2H IN (J8, SMA):

Power amplifier input RF-signal from AQS SGU (direct or via AQS ROUTER)


2H-TR OUT (J9, N):

2H RF-output to HPPR preamplifier (2H TRANSM), AQS 2H-TX (FX-IN) or L-19F unit (2H-TR IN) depending on configuration

• Transmitter output specification see "Transmitter (TX):" on page 137

149 28_00_06

L-TRX / L-19F

13.4.1 BSMS/2 19F Lock Transceiver 300-1000

0

LED ‚ERROR‘ (red):

All errors detected by the L-19F unit are displayed with the ‚ERROR‘ LED.

LED ‚PWR‘ (green):

In case of a power supply failure the ‚PWR‘ LED is deactivated. The L-19F unit enters the ERROR state.

LED ‚2H‘ (green):

If the L-TRX & L-19F units are configured to lock on a deuterated solvent, the ‚2H‘ LED is activated. The deuterium signal is bypassed by the L-19F unit.

Figure 13.17 View BSMS/2 19F LOCK TRANSCEIVER 300-1000

ERROR PWR 2H 19F

LOCK IN (J1)

2H REC OUT (J2)

REF IN (J3)

REF OUT (J4)

19F-TR OUT (J7)

2H-TR IN (J8)

2H-TR OUT (J9)

150 Z108028_00_06

Z1080

L-TRX / L-19F

LED ‚19F‘ (green):

If the L-TRX & L-19F units are configured to lock on a solvent with fluorine, the ‚19F‘ LED is activated. The L-19F unit translates the L-TRX deuterium lock signal to fluorine lock signal.

LOCK IN (J1, SMA):

Receiver input from HPPR/2 or AQS 1H2H preamplifier (LOCK-OUT)


2H REC OUT (J2, SMA):

Receiver output to L-TRX 2H-REC IN J1

REF IN (J3, SMA):

Reference clock input from AQS REFERENCE board

LED Status Operating Mode

Power OFF:The L-19F unit is switched off.

,2H‘:L-TRX and L-19F are configured for deuterium lock.

‚19F‘:L-TRX and L-19F are configured for fluorine lock.

‚Error‘:Error in L-19F power supply. At least one power supply voltage is out of range.

Table 13.3 L-19F Status LED‘s in different operating modes

ERROR

PWR

2H

19F

ERROR

PWR

2H

19F

ERROR

PWR

2H

19F

ERROR

PWR

2H

19F

151 28_00_06

L-TRX / L-19F



REF OUT (J4, SMA):

Reference clock output to L-TRX REF IN J3

19F-TR OUT (J7, SMA):

19F RF-output to HPPR/2 19F preamplifier (19F TRANSM)

• 19F Transmitter output specification see "Transmitter (TX, 19F Lock Operation):" on page 138

2H-TR-IN (J8, SMA):

Deuterium lock signal from L-TRX 2H-TR OUT J9

• Maximum input power with no damage: +37 dBm (2H operation)

• Maximum input power with no damage: +10 dBm (19F operation)

2H-TR OUT (J9, N):

2H RF-output to any high power amplifier (FX-IN)

• Transmitter output specification see "Transmitter (TX, 19F Lock Operation):" on page 138

152 Z108028_00_06

Z1080

L-TRX / L-19F

13.5 Web Interface0 The configuration, service and diagnostic functions of the L-TRX can be accessed via the ELCB service web.

For more information on the Lock configuration setup please refer to "Service Software" on page 88.

13.5.1 Service Web

2H-TX Control (Router Address)

Enable or disable the L-TRX internal power amplifier for gradient shimming.

If no external 2H power amplifier is present, enable the internal power amplifier for gradi-ent shimming.

If an external 2H power amplifier (e.g. AQS 2H-TX, BLAXH2H) is present, disablethe internal power amplifier:

• All configurations: set router address to ‚255‘.

With this setting the internal power amplifier is only used for ‚2H Lock‘ operation.

Figure 13.18 2H-TX Control

1

AV III Configuration Router Address

NanoBay 3

MicroBay 2 Channel 7

MicroBay 3 Channel 7

OneBay / TwoBay ext. BLA 7

Table 13.4 2H-TX Control: Router Address

153 28_00_06

L-TRX / L-19F

Lock Configuration

Configuration settings for external pulses. For other settings please refer to "Lock Con-figuration" on page 92.

1. TP_F0 pulse polarity: select ‚High active‘ (standard) or ‚Low active‘

‚High active‘ = all configurations

‚Low active‘ = currently not used

2. SEL-2H/AMP~ pulse source: select ‚Front Panel‘ (standard) or ‚Backplane‘

‚Front Panel‘ = all configurations

‚Backplane‘ = currently not available

3. BLNKTR-2H~ pulse source: select ‚Front Panel‘ (standard) or ‚Backplane‘

‚Front Panel‘ = MicroBay / OneBay configuration with internal power amplifier used for gradient shimming

‚Backplane‘ = NanoBay-E console ECL 02

Service Functions

Most information on this page are for service use only.

Figure 13.19 Lock Configuration

1

2

3

154 Z108028_00_06

Z1080

L-TRX / L-19F

1. FPGA revision and build date (yymmdd)

2. Hardware code = used by ELCB to identify Lock system

3. Firmware status and file name (download and factory default)

4. Reboot buttons: use ‚Factory Default FW‘ to revert to factory firmware

5. Mode register status

6. L-TRX status information

Firmware Upgrade/Download

A new firmware release can be downloaded from the Bruker ftp-server. The factory firm-ware is retained in a write protected memory section. To revert to the factory firmware see "Service Functions" on page 154.

Figure 13.20 Service Functions

0x0100

080923

LTRXAA12.bin

LTRXAA12.bin

1

2

3

4

5

6

2

1

3

4

5

155 28_00_06

L-TRX / L-19F

1. Path and filename for firmware download (file-type = .bin)

2. Current firmware filename

A firmware download will take up to 5 minutes.

i Before upgrading the L-TRX software read the corresponding release note carefully. Dif-ferent system frequencies and hardware revisions might require different software ver-sions.

BIS Information

The BIS memory is write protected. The information can only be altered at the factory.

1

2

1

2

Figure 13.21 Firmware Download

156 Z108028_00_06

Z1080

L-TRX / L-19F

Diagnostic Functions

The numbers and types of the diagnostic functions, measurements and selftests may vary, depending on hardware level (ECL) and/or firmware release.

Figure 13.22 View BIS

157 28_00_06

L-TRX / L-19F

es-lies

1. Select selftest to be executed

2. Selftest result summary, use ‚Details‘ to read the complete selftest result log.

3. Diagnostic ADC measurements

4. Reference clock status

5. Refresh (update) measurements

Figure 13.23 L-TRX Diagnostic Functions

Selftest result logV1;U_P3V6_Selftest; 3.507; passed;U_P15V0_Selftest; 14.859; passed;U_N15V0_Selftest; -15.399; passed;U_P28V_Selftest; 27.904; passed;TempBg_Selftest; 29.2; passed;TempPa_Selftest; 38.4; passed;ErrorCount_AdcLvdsIf_Selftest; 0; passed;DCOffset_ADC_Selftest_10dBm_LSB24; 3857.50; passed;PeakPower_ADC_Selftest_10dBm; -7.24; passed;2ndHarm_ADC_Selftest_10dBm; -48.44; passed;Spours_ADC_Selftest_10dBm; -89.27; passed;Spours_0bin_ADC_Selftest_10dBm; -70.68; passed;DCOffset_ADC_Selftest_DDSoff; 4045.50; passed;InBandNoisePower_ADC_Selftest_DDSOff; -66.30; passed;OutBandNoisePower_ADC_Selftest_DDSOff; -74.29; passed;Spours_ADC_Selftest_DDSoff; -91.71; passed;Level_CW_DEC_Selftest_10dBm; -1.6135; passed;Phase_CW_DEC_Selftest_10dBm; -0.429; passed;NoisePower_CW_DEC_Selftest_10dBm; -74.9196; passed;NoiseP_CW_DEC_Selft_10dBm_LPF_BW; -74.9353; passed;Spours_64bin_CW_DEC_Selftest_10dBm; -102.85; passed;Spours_0bin_CW_DEC_Selftest_10dBm; -82.03; passed;Spours_8bin_CW_DEC_Selftest_10dBm; -92.98; passed;Level_Lock20dBm_Selftest; -2.5370; passed;Phase_Lock20dBm_Selftest; 0.4312; passed;RP1Position_Lock20dBm_Selftest; 3; passed;NoisePower_Lock20dBm_Selftest; -79.4044; passed;Level_Lock28dBm_Selftest; -2.3397; passed;Phase_Lock28dBm_Selftest; 0.3903; passed;RP1Position_Lock28dBm_Selftest; 1; passed;NoisePower_Lock28dBm_Selftest; -72.6619; passed;

1

2

3

4

5

Name Description Precondition

Sel

ftest

ADC interface Tests LVDS interface between receiver ADC and the signal processing unit. This test does not verify the electrical performance of the ADC.

Reference clock prent and power suppwithin specification

Power supply Voltage measurement with diagnostic ADC none

Table 13.5 Summary of Diagnostic Selftests and ADC Functions

158 Z108028_00_06

Z1080

L-TRX / L-19F

ort ad J9 hin ec-

lse s, H-

ate put

EC ver

nal cy ig-

Sel

ftest

Reference frequency RF-signal detector, minimal power level only none

Temperature Temperature measurement with sensors and diagnostic ADC

none

CW-ADC diagnostic Verification of transmitter and receiver signal path (internal loop). Measurement bandwidth is 80 MHz, CW stimulus internally generated with +10 dBm and -Inf dBm power level.

L-TRX does not repany error and the lomismatch at output 2H-TR OUT is witspecification (see stion 13.2.4)

CW-ADC diagnostic DDS off

Pulse diagnostic Verification of transmitter pulse shape with own receiver (internal loop).

CW-decimated diagnostic Verification of transmitter and receiver signal path (internal loop). Measurement bandwidth is 3.3 kHz (lowpass filter), CW measurement sig-nal with +10 dBm power level.

Lock mode diagnostic Verification of transmitter and receiver signal path (internal loop). Measurement bandwidth is 330 Hz (bandpass filter), pulsed stimulus sig-nal with +20 dBm and +28 dBm power.

Lock mode diagnostic, FFA power

ext. pulse power diagnostic Measures output power in 2H amplifier opera-tion. Actual output power level at J9 2H-TR OUT depends on input level at J8 2H-IN.

Apply RF pulse (pulength 1ms to 100 mup to 4 dBm) to J8 2IN, with appropriblanking signal at inJ5 BLNKTR-2H~

ext. RX input power CW diag-nostic

Measures receiver input power level in CW operation (lowpass filter, BW=3.3 kHz). Power level is scaled to dBFS.

Terminate J1 2H-RIN to measure receinoise.

Connect any sigsource with frequenof f2H to measure snal strength.

ext. RX input power gated diag-nostic

Measures receiver input power level in pulsed operation with phase alternating gating (band-pass filter, BW=330 Hz). Power level is scaled to dBFS.

Dia

gnos

tic A

DC Power supply input voltages Voltage measurement with diagnostic

ADCnone

Board and power amplifier temperature

Temperature measurement with sensors and diagnostic ADC

none

Name Description Precondition

Table 13.5 Summary of Diagnostic Selftests and ADC Functions

159 28_00_06

L-TRX / L-19F

13.5.2 Trouble Shooting

No ,2H Lock‘ during Firmware Download

During a firmware download all other functions are temporarily suspended.

• Do not attempt to initiate ,2H Lock‘ mode, select amplifier for gradient shimming or any diagnostic mode during download.

Firmware Download Takes too Long

If the firmware download takes much longer than 5 minutes, the service web message log configuration may be amiss.

• Check service web ‚Service‘ ‚Log Configuration‘ that the setting for ‚Log Specific Info: SSRB communication to slave units‘ is set to ‚Off (default)‘

Without this setting all communication to the L-TRX is logged in detail, which extends the download time indefinitely.

Missing Reference Clock

The reference clock is vital to most operations of the L-TRX. The clock is generated by the AQS REFERENCE board. SSRB communication with the ELCB is possible without reference clock.

In case of a missing reference clock the ‚PWR/CLK‘ LED is deactivated.

• Check the clock wiring and the AQS REFERENCE board for correct operation.

Over Temperature Error

In case of power amplifier or board over temperature all operations are temporarily sus-pended and the L-TRX enters the ERROR state. An error message is sent to TopSpin and displayed on the BSMS keyboard. When the over temperature condition is past, the L-TRX reverts to the operating mode prior to the error.

Error message examples:

• L-TRX interrupt: ‚L-TRX Amplifier overtemperature error occurred‘

• ELCB periodic monitoring: ‚L-TRX Temperature 'TempPA' out of range. Value: 76°C Limits: 0 / 75‘

In case of an error do as follows:

• Check that no 2H Observe or Decouple experiment is running with the internal power amplifier. The internal power amplifier can only be used for gradient shim-ming.

• Check that the maximum duty cycle and pulse length specifications are not violated. See "Technical Data BSMS/2 Lock Transceiver" on page 137.

160 Z108028_00_06

Z1080

L-TRX / L-19F

Over Current Error

If the power amplifier drain current exceeds the limit of safe operation, it is switched off and the L-TRX enters the ERROR state. An error message is sent to TopSpin and dis-played on the BSMS keyboard.

6. Reboot L-TRX to clear error state

7. The 2H-TR output (J9) of the L-TRX must be connected to a load (max. mismatch see "Technical Data BSMS/2 Lock Transceiver" on page 137). Check wiring and load (i.e. 2H Amplifier). To avoid this error, try to improve the matching of the 2H coil of your probe.

8. Repeat your experiment

9. If the error remains it is a hardware failure. Replace the L-TRX and/or contact a Bruker service representative.

Duty Cycle Error and Pulse Length Error

If the power amplifier is operated over its specification1 in terms of maximal duty cycle or the maximal pulse length, the L-TRX board issues an error and deactivates the power amplifier stage. The power amplifier is reactivated after the blanking signal has been deasserted and the measured duty cycle is within specification.

The BSMS system will report an error with the following message : ‚L-TRX 2H Amplifier: RF Pulse Length or Duty Cycle violation! Please check your Pulse Program.‘

Power Supply Error P3V6

Early versions of the power supply Z111143 (BSMS/2 POWER SUPPLY BOARD 5) were not capable of providing both units L-TRX and L-19F with enough current. If this error occurs please check if a new version (ECL ³ 2) has been installed.

1. see "Technical Data BSMS/2 Lock Transceiver" on page 137 or BIS of L-TRX board in figure "View BIS" on page 157

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13.5.3 L-TRX Specific Error Messages

Error Description / Measures

L-TRX Power Supply error occurred External or internal power supply failure. check power supply board status check power supply diagnostic check the version of PSB5 is at least ECL 2If the power supply input voltages are within their limits, a hardware failure has occurred. Replace the L-TRX and/or contact a Bruker service representative.

L-TRX 160MHz clock missing orL-TRX 320MHz clock missing

see "Missing Reference Clock" on page 160

L-TRX Amplifier: overcurrent error occurred

see "Over Current Error" on page 161

L-TRX Amplifier: bias current regulator underflow error occurred

A hardware failure has occurred. Replace the L-TRX and/or contact a Bruker service representative.

L-TRX Error: Signal 'BLKTR-2H' was acti-vated without selecting 'SEL_2H/DEC'

check wiring (if external power amplifier is used, the BLNKTR-2H~ input must be left open) check experiment setup (pulse program)

L-TRX FPGA DCM (PLL) lock error occurred

Reference clock synchronization failure restart BSMS (power off/on) check reference clock (REF_IN J2) from AQS REFERENCE boardIf the error remains a hardware failure has occurred. Replace the L-TRX and/or contact a Bruker service representative.

Table 13.6 L-TRX Error Messages

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13.6 System Requirements0 The L-TRX / L-19F can replace the former L-TX/L-RX system in all configurations with ELCB. Constraints and minimal requirements are listed below.

13.6.1 Power Supply

The L-TRX requires in both BSMS/2 and NanoBay configurations a designated power supply board.

13.6.2 Lock Control Board

BSMS/2 ELCB (Z100818)

• Hardware requirement: ECL06 or newer

• Firmware requirement: Releases spring 2011 and onwards support both genera-tions of lock systems. Software components and interfaces are set up accordingly.

BSMS LCB (Z002720)

i The L-TRX and the L-19F units are not compatible to the LCB board. Please contact your sales representative for an upgrade of your console.

13.6.3 TopSpin Software

Minimal requirement: TS2.1pl5, TS3 and onwards

13.6.4 Related Units and Accessories

AQS REFERENCE Board

The L-TRX / L-19F units are compatible to all versions. If four or five TX channels (AQS

Chassis L-TRX / L-19F L-TX / L-RX

BSMS/2 BSMS/2 PSB 5 (Z111143, ECL 2 or newer)

BSMS/2 PSB 2 (Z002776)

NanoBay INES PSB 6 (Z111144) INES PSB 3 (Z103142)

Table 13.7 Power supply boards for different Lock systems

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SGU) are present in the console a REF/2 board (Z104236) with an AQS BB SPLITTER 2-WAY (Z102000) or 6 dB attenuator (45999) at connector J8/REF.3 or J9/REF.4 must be used.

AQS 2H-TX Amplifier board (Z103550, Z103551)

The L-TRX is compatible to all versions. Only the frequency range has to be matched.

BSMS/2 2H-TX Amplifier board (Z002793, Z002794)

This configuration is not officially supported. When detected, the BSMS subsystem will report an error message.

i The BSMS 2H-TX is no longer supported because it has only 20W and there are two other more powerful 2H amplifiers available.

The new L-TRX has an integrated 2H amplifier to enable 2H gradient shimming without an additional, external 2H-TX. When requiring more power for very short 2H pulses and high power 2H decoupling experiments it is recommended to use the existing high power 2H amplifiers (e.g. AQS 2H-TX, BLAHX2H) with 80W and more.

2H Preamplifiers

The L-TRX is compatible to all HPPR/2 style 2H preamplifier modules (AQS 1H2H, HPPR/2 1H2H, HPPR/2 2H). Only the 2H frequency has to be matched.

19F Preamplifiers

The L-19F is compatible to all HPPR/2 19F modules.

RT and Cryo Probes

The L-TRX / L-19F units are compatible to all probes with the appropriate 2H or 19F fre-quency.

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13.7 Ordering Information0

Part No. Unit

Z109886 BSMS/2 LOCK TRANSCEIVER 200













Table 13.8 L-TRX Unit Numbers

Part No. Unit

Z120014 BSMS/2 19F LOCK TRANSCEIVER 300-1000

Table 13.9 L-19F Unit Numbers

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14 SLCB/2 & SLCB/3

14.1 Introduction0 The SLCB (Sample & Level Control Board) was introduced 1992 and has been enhanced for the BSMS/2 system with ELCB.

This chapter describes the SLCB/2 and SLCB/3 boards as a subsystem of the BSMS/2 with ELCB (Bruker Smart Magnet control System) which handles the sample control, helium (He) level measurement, and (optional) analog nitrogen (N2) level measurement systems. All functions of the sample and level subsystem of the BSMS/2 are accessible via the BSMS panel within Topspin, the BSMS/2 Service Web or the BSMS keyboard.

There are two versions available, the SLCB/2 and the SLCB/3.

i In this chapter the abbreviation SLCB stands for the boards SLCB/2 and SLCB/3. The former version Z002707 BSMS SLCB SAMPLE+LEVEL CONTROL BOARD, used for earlier BSMS systems, is not described here.

The SLCB is a smart controller board which is inserted into slot 3 of the BSMS/2 chassis (front side) as described in chapter "Configurations" on page 53. It has the following functions:

1. Sample lift control.

2. Sample rotation control (spin).

3. Helium (He) level measurement.

4. Nitrogen (N2) level measurement (SLCB/3 only).

All functions are controlled by a microprocessor. The application software runs on a real time operating system and can be downloaded via the BSMS/2 Service Web.

For sample lift and sample rotation, the SLCB must be combined with a pneumatic mod-ule. The pneumatic module is plugged into the rear side of the BSMS/2.

The shim upper section model type BST is automatically recognized by the BSMS/2.

14.2 Configurations

Basically there are two configurations available - one for standard systems and another one for systems with an additional input for the "Nitrogen Level Sensor" (analog mode only).

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14.3 Technical Data

The boards differ in the number of interfaces and additional software regulated gas flows:

Bruker Part Num-

ber

Name Purpose

Z100322 BSMS/2 SLCB/2 SAMPLE+LEVEL CTRL BD - standard

Z108145 BSMS/2 SLCB/3 SAMPLE+LEVEL CTRL BD - analog N2 level sensor interface( e.g. required for BSNL option)

Table 14.1 SLCB variants

SLCB/2 SLCB/3

Helium level sensor (HELIUM LEVEL) included included

BST sensor interface (SAMPLE CONTROL) included included

BACS interface (SAMPLE CHANGER) included included

Analog liquid nitrogen level sensor interface (NITROGEN LEVEL)

n/a included

Table 14.2 SLCB/2 vs. SLCB/3

Parameter Min Typ Max Unit

Helium measurement system rangea 0 100 %

resolutionb 1 %

accuracyc -4 +4 %

Helium measurement source voltage range 29.0 31.0 V

Helium measurement current range 40 150 mA

resolution 1 mA

accuracy -5 +5 %

default 110 mA

de-ice current 200 mA

auto switch-off time 30 s

Table 14.3 He level measurement

a. valid for calibrated system only

b. valid for calibrated system only

c. for a He-level in the range of 20%...100%

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N2 measurement system range 0 100 %

resolution -1 +1 %

accuracy -3 +3 %

N2 voltage measurement maximum input rangea -8.0 0 VDC

resolution 10 mV

accuracy -5 +5 %FS

Sensor supply output voltage positive 9.75 10 10.25 V

output voltage negative - 9.75 - 10.0 - 10.25 V

supply current 50 mA

Table 14.4 N2 level measurement (SLCB/3 only)

a. analog sensor has to be calibrated for 0V .. -5V (=> 100% .. 0%), new digital sensors are factory calibrated


Sample Rotation signal analoga range 0 5 V

SAMPLE_UPS signal digital high level input voltage 2.6 5 V

low level input voltage 0 2.4 V

Light barrier supply output voltage 4.75 5.25 V

sink resistanceb 95 105 Ohm

Table 14.5 BST signal interface

a. when using signal for sample down detection, calibration is necessary

b. allows to connect LED directly without additional series resistor


Power source (S_5VP, input) input voltage 4.5 5 5.5 V


SIGSH, SIGSH~ source 4 mA

(output current) sink -4 mA

Table 14.6 Sample changer interface

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Operating temperature (ambient)a 15 25 35 °C

Relative humidity non-condensing 10 95 %

Storage condition non-condensing 5 50 °C

Table 14.7 Environment

a. where specifications are met

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SLCB/2 & SLCB/3


The SLCB is a VME slave and controlled by the ELCB, which is the BSMS/2 controller / coordinator.

Figure 14.1 Block diagram of the SLCB/2

Bac

kpla

ne C

onn

ecto

r

Power Supply

Microprocessor

Flash

VME

ERRORREADYPNEU24VHE30V

HELIUM LEVEL

A/D

DA

XO

SAMPLE & LEVEL CONTROL BOARD SLCB/2

SAMPLE

SAMPLECONTROL

CHANGERIO

RAM

Timers

Logic/

PNK PWM

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Figure 14.2 Block diagram of the SLCB/3

Bac

kpla

ne

Con

nect

or

Power Supply

Microprocessor

Flash

VME

ERRORREADYPNEU24VHE30V

HELIUM LEVEL

A/D

DA

XO

SAMPLE & LEVEL CONTROL BOARD SLCB/2

SAMPLE

SAMPLECONTROL

CHANGERIO

NITROGENLEVEL

RAM

Timers

Logic/

PNK PWM

DC/DCSupply

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SLCB/2 & SLCB/3


Error

Ready

Pneumatic

Helium supply 30V

Helium level

Sample Changer

Sample Control(BST)

Supply

Figure 14.3 The picture below shows a SLCB/2

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Error LED

This LED is active after Power ON. It turns off as soon as the SLCB is initialized and the communication with the ELCB is established.

Later on, an active Error LED indicates that an error occurred (e. g. short circuit,...).

Ready LED

This LED is active as soon as the firmware is loaded and the board is running.

Nitrogen level

Sample Changer

Sample Control(BST)

Error

Ready

Pneumatic

Helium supply 30V

Supply

Helium level

Figure 14.4 The picture below shows a SLCB/3

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SLCB/2 & SLCB/3

PNEU24V LED

Indication that the galvanically isolated power supply for the pneumatics is available.

HE30V LED

Indication that the galvanically isolated power supply for the helium level measurement is available.

Connectors

Not all connectors are protected against short-circuiting. Ensure correct wiring.

Label Description Note

HELIUM LEVEL Connector for helium level sensor

NITROGEN LEVEL Connector for N-level sensor SLCB/3 only

SAMPLE CHANGER External sample lift control, cur-rently used by the BACS sample changer.

SAMPLE CONTROL Signals from BST (upper light barrier, sample down sensor and tube version)

Table 14.8 Connectors

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14.5 Function Description

14.5.1 Liquid Helium Level Measurement

For monitoring the He-level, a He-level sensor is inserted into the top of the helium dewar. The he-level sensor is a wire that is superconducting in liquid helium. Together with the starter resistor the total resistance at 100% fill level is about 150 Ohms.The resistance is measured using a current source and instrumentation amplifiers. The volt-age resulting from the saturation resistance gives an indication of the actual He-level in the dewar.

The He-level sensor is galvanically isolated from the BSMS electronics. The frequency modulated control and measuring signals are transmitted by optocouplers.

The He-level sensor current is produced by a controllable current source. The applied current is measured via a shunt resistor and the differential amplifier A1 as a function test. The voltage across the sensor is measured by the differential amplifier A2.

To avoid damaging the magnet or evaporating too much helium through warming, the length of time the current is applied is limited. The supply of power is restricted to a max-imum period of 30 seconds by the switch S1. As a further safety measure, the S2 switch short-circuits the He-level sensor in between measurements to provide a current bypass.

Sta

rter

Resi

stor

Superc

onduct

ing W

ire

He-leve

l senso

r

+30V

+36V +30V +15V

DC

DC–4.3V

Switching Regulator

5 min.HE_RESET

Sensor current

HE_SHORT

Sensor bypass Off(current through sensor)

galvanically isolated

HE_LEVEL

He-level or

sensor current

HE_VC_SEL

Select He-level

HE_CURR_FREQ

sensorV

F

V

F

A2

–

+

S2

Sensor current On

S1

Rm 5

Voltage Controlled Current Source

electrically isolated

electrically isolated

or sensor current

He-level

Sensor bypass On

A1

–

+Sensor current

Multifuse

Linear

15 Ohm

current

RegulatorVoltage

Linear

RegulatorVoltage

On

Figure 14.5 Block diagram Helium level measurement

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SLCB/2 & SLCB/3

Timing Diagram

Figure 14.6 He-Level Measurement Timing Diagram

Time Description

tt Duration of He-measurement system test. This precedes every He-level measurement.

tthaw Duration of sensor thaw. The thawing current (Ithaw) places the He-level sensor in a resistive state. As soon as the measuring cur-rent has established a stable value, thawing is halted. It can be assumed that the part of the sensor that is not immersed in the liq-uid helium has become resistive.

tm Duration of He-level measurement. To avoid unnecessary turbu-lence, a small sensor current (Imeas) is used to conduct the mea-surement itself.

Imeas Current during measurement (default: 110 mA)

Ithaw Current during sensor thaw. This has a value of Imeas x MeasT-hawfactor. MeasThawfactor has a default value of 1.05, and can be changed from the BSMS/2 Service Web with service access privi-lege.

Table 14.9 Definitions

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14.5.2 Liquid Nitrogen Level Measurement (SLCB/3 only)

Nitrogen level measurements are performed by a sensor that is encircled by a cylindrical conductor. The sensor and surrounding conductor form a capacitor. The presence of liq-uid nitrogen between the sensor and conductor changes the capacitance, and this is measured. The capacitance is then converted by the sensor electronics into a propor-tional voltage which is interpreted by the SLCB to provide the reading.

The measurement circuit on the SLCB board is separated galvanically from the other electronics.

The interface of the SLCB/3 is fully compatible with all models of Bruker "Nitrogen Level Sensor".

DC

DC

N-level sensor

Voltage

+10V

–10V

Input Buffer

V

F

Isolated

galvanically isolated

N_LEVEL

+5V +10V+15V

Switching Regulator

LinearVoltageRegulator

Input

Measurementdevice

normalized voltage:-5V = 0%0V = 100%

Figure 14.7 Analog nitrogen level measurement block diagram

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SLCB/2 & SLCB/3

14.5.3 Sample Down and Sample Up Detection

The SLCB provides the electrical interface for standard Bruker Shim Upper part (BST)

i The circuits in the BST are not short-circuit proof. Damaged and used up cables may damage the infrared diodes inside the shim upper part (BST). Check connectors and cables when exchange the BST or the SLCB.

14.5.4 Version of the Shim Upper Part

The shim upper part version can be read by the SLCB.

BST_+5V

12345678

100

SAMPLE DOWNREFERENCE

+5V +5V

12

765 3

8

4 SAMPLE_UP

270BSMS/2 SLCB

RJ45

BST

+5V

GND

SA

MP

LE

_UP

SPIN

LED_RETURN

+5.00V

SIGNAL

A

D

(SPIN)VOLTAGE

Figure 14.8 BST Signals

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SLCB/2 & SLCB/3

14.5.5 Sample Changer Interface

The sample changer has its own pneumatic controller. The shim upper part (BST) is equipped with a light switch to detect whether there is a sample present for pickup. This information is then passed to the sample changer via the sample changer interface of the BSMS.

reserved / do not connect

Remarks:

• all signals from SLCB are galvanically isolated

• SampleUp / SampleUp represent the state of the upper light barrier directly

• outputs are complementary, broken lines can be detected

The measurement circuit on the SLCB board is galvanically isolated from the other elec-tronics.

14.5.6 Calibration

The ELCB has full control over the SLCB hardware and provides methods for setting up the sample lift, helium level measurements and nitrogen level measurement (SLCB/3 only).

SLCB calibration is stored in the non-volatile memory of the ELCB.

Spin Calibration

Spinning rate calibration is necessary in conjunction with the pneumatic module.

Setup of Sample Lift Parameters

Depending on cryostat bore size and height and NMR spinner type a different amount of gas is necessary for lifting the sample. Setup of the lift parameters is described on the according service web page in detail.

Pin Signal (Connector)

Function Specification

1 SampleUp positive active (CMOS-high)when sample is up

CMOS, IOut max. +/-4mA

2 SampleUp negative active (CMOS-low), when sample is up CMOS, IOut max. +/-4mA

3

4

5

6

7 S_5VP +5V from sample changer +/- 5%, IL max. 30mA

8 S_GND ground potential from sample changer

Table 14.10 Pin assignment Sample Changer RJ45

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SLCB/2 & SLCB/3

Helium Level Sensor Calibration

Sensor characteristic depends on cryostat size and sensor model. Setup up of the sen-sor is described on the according service web page in detail.

Nitrogen Level Sensor Calibration

The digital "Nitrogen Level Sensor" is factory calibrated. There are no settings stored on the SLCB. Former analog sensors have to be calibrated itself. For detailed information consult the Magnet System Service Manual SB/WB/SWB ZTKS0177 / Z31977.

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SLCB/2 & SLCB/3

14.6 Bus Interface

The SLCB is connected to the VME bus where the communication with the ELCB is run-ning.

Pin A B C

1 VDD_BPL VDD_BPL VDD_BPL


3 AGND AGND AGND

4 AGND AGND AGND

5 VEE_BPL VEE_BPL VEE_BPL


7 24V_POWER 24V_POWER 24V_POWER


9 GND_POWER GND_POWER GND_POWER


11 - -

12 -

13 RCLK

16 SPIN_RATE0 SPIN_RATE1

17 FLAP LIFT

18 RES0 RES1

19 VER_PNEU_MODULE


21 DGND DGND DGND

22

23 X_5V X_5V X_5V

24 X_GND X_GND X_GND

25

26 HE_+30V HE_+30V HE_+30V

27 HE_+30V HE_+30V HE_+30V

28 HE_GND HE_GND HE_GND



31 GND_PNEU GND_PNEU GND_PNEU

32 24V_PNEU 24V_PNEU 24V_PNEU

Table 14.11 User Bus Back Plane Connector (DIN41612)

Pin A B C

1 DV(0)

2 DV(1)

3 DV(2)

4 DV(3) BG0IN~

5 DV(4) BG0OUT~

6 DV(5) BG1IN~

7 DV(6) BG1OUT~

Table 14.12 VME Bus Back Plane Connector (DIN41612)

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SLCB/2 & SLCB/3

8 DV(7) BG2IN~

9 DGND BG2OUT~ DGND

10 SYSCLK BG3IN~ SYSFAIL~

11 DGND BG3OUT~ BERR~

12 DS1~ SYSRES~

13 DS0~ LWORD~

14 WRITE~ AM(5)

15 DGND AV(23)

16 DTACK~ AM(0) AV(22)

17 DGND AM(1) AV(21)

18 AS~ AM(2) AV(20)

19 DGND AM(3) AV(19)

20 IACK~ DGND AV(18)

21 IACK_IN~ AV(17)

22 IACK_OUT~ AV(16)

23 AM(4) DGND

24 AV(7)

25 AV(6)

26 AV(5)

27 AV(4) AV(11)

28 AV(3) AV(10)

29 AV(2) AV(9)

30 AV(1) AV(8)

31 VSS12 +12V

32 VCC VCC VCC

Pin A B C

Table 14.12 VME Bus Back Plane Connector (DIN41612)

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14.7 Service

A connected SLCB in a BSMS/2 system is controlled by the ELCB. The ELCB software provides the operational functions for the NMR application by a CORBA interface. In addition there is a Web access available for service purpose (setup, calibration and diagnostic). Some of these Web functions are open to all users, other functions are reserved for service engineers - it is necessary to log in and enter the required password before these functions can be accessed (description in the BSMS/2 Service Web chap-ter).

14.8 System Requirements

All SLCB/2 and SLCB/3 boards are compatible with BSMS/2 systems with ELCB. Typi-cally, BSMS/2 with ELCB have been delivered with ECL02 of Z002774 BSMS/2 CHAS-SIS WIRED

14.9 Ordering Information

See "SLCB variants" on page 168

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15 PNK Modules

15.1 Introduction0 Delivered BSMS/2 systems until 2010 have integrated all pneumatic sub-systems and associated driver electronics integrated in one module, called PNK.

This module is located on the rear side in the right most slot (as seen from rear) and comes in three variants:

Bruker Part Number

Name Purpose

Z003139 BSMS/2 PNK3 PNEUMATIC SB This is the standard module with one spin valve and two lift valves

Z003828 BSMS/2 PNK3S PNEUMATIC SB This is a standard version with an additional emergency lift feature, intended for the Cryo Probe Sample Safety option

Z003140 BSMS/2 PNK5 PNEUMATIC WB This is the “wide bore” module with two spin valves and three lift valves, accounting for the increased air consumption

Table 15.1 PNK variants

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15.2 Technical Data

The boards differ in the number of interfaces and additional software regulated gas flows

:


Input pressure range 4 6 bar

stability, @0..150l/min -0.5 0.5 bar

Air flow PNK3, PNK3S (standard bore)

100 l/min

PNK5 (wide bore) 150 l/min

Table 15.2 Sample lift



stability -0.5 0.5 bar

Max. air flow @ 5bar supply PNK3, PNK3S (standard bore)

15 50 l/min

PNK5 (wide bore) 25 100 l/min

Rotation rate range set point 7 50 Hz

range measurement 0 100 Hz

setting resolution 1 Hz

Table 15.3 Sample Rotation


Operating temperature (ambient)a


15 25 35 °C




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PNK Modules


Figure 15.1 Block diagram of the PNK3 module

Bac

kpla

ne C

onn

ecto

r

Power Supply

DRIVER

LIFT

PNK3 BOARD

LIFT IN

SPIN IN

SPIN OUT

BUFFER

OPTO

NEEDLE VALVE

Version

Figure 15.2 Block diagram of the PNK3S module

Bac

kpla

ne C

onn

ecto

r

Power Supply

DRIVER

LIFT

PNK3S BOARD

LIFT IN

SPIN IN

SPIN OUT

BUFFER

OPTO

NEEDLE VALVE

EMERGENCYLIFT IN

Version

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The PNK is controlled by the BSMS/2 SLCB by two PWM (Pulse Width Modulation) sig-nals. These signals are galvanically isolated and then fed to two groups of switching drivers. There is one driver per valve solenoid.

All valves in one group (1,2 or 3 valves, depending on group and PNK type) are con-nected in parallel.

A screwdriver operated needle valve at the spin output greatly improves the PWM linear-ity by presenting a flow dependant exhaust pressure to the PWM valve. Furthermore, the needle valve adapts the PWM range to the spin airflow range when calibrated prop-erly.

15.4 General Installation Hints0 In BSMS/2 systems with ELCB and Service Web, calibration and parameter set-up for spin and lift is straightforward and described in detail on the corresponding BSMS/2 Ser-vice Web page.

Figure 15.3 Block diagram of the PNK5 module

Bac

kpla

ne C

onne

ctor

Power Supply

DRIVER

LIFT

PNK5 BOARD

LIFT IN

SPIN IN

SPIN OUT

BUFFER

OPTO

NEEDLE VALVE

Version

NOTICE

Never supply the console with non-filtered gas. Gas supply filter 88437 must be installed!

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PNK Modules

15.5 Module Drawings0

0 Note the valve block carrying three valves only.

Figure 15.4 PNK3 Drawing

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PNK Modules

Note the valve block carrying five valves.

Figure 15.5 PNK5 Drawing

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PNK Modules

Note the manual valve (marked “EMERGENCY LIFT“) and the emergency lift inlet (marked “EMERGENCY“).

Figure 15.6 PNK3S Drawing

191 28_00_06

PNK Modules

net

15.6 PNK3S Description

15.6.1 Emergency Lift Functional Description

During normal operation, the lift air from the lift valves is passed through to the lift air out-let and the buffer. The pneumatic switch over valve is held in this position by a spring. In case of an emergency sample eject, the CRP delivers lift air to the inlet marked “EMER-GENCY“. This air is throttled by the EMERGENCY LIFT valve, allowing the valve operat-ing pressure to build up and finally switch over the valve.

Now the emergency lift air is passed through to the lift air outlet and the buffer. The nor-mal lift air is held off and the sample protected from jumping out of the magnet because of double lift air.

That same throttle valve is used to adjust the emergency lift airflow to a value that com-fortably suspends the sample in its up position without catapulting it out of the magnet.

The buffer smooths the instantaneous switch over and eventual switchback and sample landing.

In contrast, the normal lift is slowly ramped up and down and a missing buffer would only be remarked in case of a power failure during a “lift up” period.

Figure 15.7 Block Diagram Emergency Lift

to mag

Lift air

Buffer

Lift Valves

EMERGENCY

PNK3S

LIFT IN

BUFFER

LIFT OUT

Emergencyair fromCRP

Supplyair

EMERGENCYLIFT

NOTICE

The standard buffer must be present and working. A missing or plugged buffer can result in sample and/or probehead damage due to the instan-taneous switching of the emergency lift.

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PNK Modules

15.6.2 PNK3S Additional Installation Hints

When exchanging an existing PNK3 with a new PNK3S, the spin and lift must be re-cali-brated (as with any PNK exchange) and the emergency lift airflow must be adjusted.

1. replace the old PNK3 with the new PNK3S

2. check the buffer connection

3. start BSMS/2 Service Web, go to Sampling Handling -> Sample Rotation

4. follow the instructions

5. close the EMERGENCY LIFT valve (turn clockwise)

6. access the Cryo Controller (CRCO) with UniTool and switch on emergency lift

7. adjust the valve until the sample floats in the upper position

8. check adjustment by switching on and off with UniTool

The sample must not land too hard or jump too far out of the magnet. If you cannot find a satisfactory valve position, check the following:

• Is the buffer connected and not plugged?

• Are shim system and probehead mounted ok (air leakage)?

• Is the sample temperature stub unconnected and exhausting lift air?

• Is the Cryo Platform air supply pressure below specification?

• Is the emergency lift hose running from CRP to console bent or squeezed?

• Does the Cryo Platform deliver lift air? Use a short piece of hose to open the self closing hose plug at the Cryo Platform.

• Disconnect the LIFT OUT and connect an air supply to EMERGENCY lift in. The air supply must switch over the pneumatic valve and exhaust at LIFT OUT.Try to change the airflow with the manual valve.

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15.6.3 Front Panel - Connectors

SPIN NEEDLE VALVE

BUFFER

LIFT OUT

SPIN IN

LIFT OUT

SPIN OUT

Figure 15.8 The picture below shows a PNK3

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PNK Modules

SPIN NEEDLE VALVE

BUFFER

LIFT OUT

SPIN IN

LIFT OUT

SPIN OUT

EMERGENCY LIFT INPUT

EMERGENCY LIFT NEEDLE VALVE

Figure 15.9 The picture below shows a PNK3S

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PNK Modules

SPIN NEEDLE VALVE

BUFFER

LIFT OUT

SPIN IN

LIFT OUT

SPIN OUT

Figure 15.10 The picture below shows a PNK5

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PNK Modules

15.7 Bus Interface

The PNK boards are directly coupled to the SLCB/2 or SLCB/3.

Pin A B C

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17 SPIN_RATE0 SPIN_RATE1

16 FLAP LIFT1

15 RES0 RES1

14 VER_PNK


12 DGND DGND DGND

11

10

9

8

7

6

5

4

3



Table 15.5 User Bus Back Plane Connector (DIN41612 R)

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PNK Modules

15.8 Service

A connected PNK in a BSMS/2 system is controlled by the SLCB and ELCB software - the specific low level drivers and the overall control logic are implemented there. The ELCB software provides the operational functions for the NMR application by a CORBA interface. In addition there is a Web access available for service purpose (setup, calibra-tion). Some of these Web functions are open to all users, other functions are reserved for service engineers - it is necessary to log in and enter the required password before these functions can be accessed (description in the BSMS/2 Service Web chapter).

15.8.1 Sample Handling Service Web

Via the Sample Handling Service Page lift and spin can be calibrated or parameterized. Please read the instructions on these pages carefully.


Sample rotation (SPIN) not running

• Check air hoses and console gas pressure

• Check needle valve

• Lift the sample and insert again

Gas flow variations

• Check supply pressure

Figure 15.11 Sample Handling Service Page

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PNK Modules

• Check the gas pressure after console pressure regulator, pressure must be higher than 4 bar and stable.

As long as the console pressure is within the specified range of 4-6 bar the console pres-sure regulator is within a useful operating point. Gas supply pressure must be at mini-mum 1 bar higher than set with the pressure regulator of the console (head room for proper pressure regulation).



See "PNK variants" on page 185.

NOTICE


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16 BSVT Introduction & Configurations

16.1 Introduction

Since mid 2010 a new and higher integrated VT system is provided for all NMR applica-tions. The so called BSVT (Bruker Smart Variable Temperature System) replaces all for-mer standalone BVT3000 (Standard, MAS, BEST) and BSMS integrated BVT3200 variants. By using a modular BSMS/2 integrated concept all BVT variants and also for-mer pneumatic units like PNK3, PNK3S and PNK5 as well as the SLCB/2 and SLCB/3 boards are replaced by the new Sensor & Pneumatics Board (SPB) and the Variable Power Supply Board (VPSB). The adaptation of the various probes and temperature control accessory interfaces is realized with smartVT interfaces (also named VTAdapt-ers). This digital interface has also been introduced for other new digital sensors (e.g. digital liquid nitrogen level sensor).

Sensor & Pneumatics Board (SPB) Variable Power Supply Board (VPSB)

smartVT interface

Figure 16.1 typical BSVT components

20128_00_06

BSVT Introduction & Configurations

16.2 BSVT Hardware

The new VT system consists of the following hardware:

• Sensor & Pneumatics Board (SPB or SPB-E)always required

• Variable Power Supply Boards (VPSB)only required for VT option

• VT Interfaces (several styles)only required for VT option 1

For existing probes and existing VT accessories the corresponding VT interfaces have to be ordered separately. When ordering new probes and VT accessories the VT inter-faces are included.

These new units are controlled by the BSMS/2 ELCB and are therefore fully integrated into the well known EthernetTM based communication concept including the web-based service access.

1. Mainly for interfacing existing VT accessories and NMR probes (important to check with console exchanges to have appropriate VT adapter!)

smartVT interfaces

Figure 16.2 BSVT – Open / Digital VT architecture

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16.3 BSVT Software and Features

The new BSVT is fully supported with TopSpin 3.0 or later by using an attractive and modern VT panel for easy user control, monitoring, configuration and other VT specific operation.

• Full Client/Server architecture via ELCB (EthernetTM)

• Modern Topspin Control with JAVA operated GUI

• VT accessories (e.g. LN2 Exchanger, Booster, BCU-05) are fully supported

• Optimum performance is provided with basic configuration (no BTO-2000 required)

• Built-in gas flow control and supervision

• Expandable in future due to modular concept (e.g. easy upgrade for FlowNMR probe)

• Up to 4 heater channels and total 9 temperature sensors channels supported

• Plug & play operation

• Integrated flush gas and shim cooling connections

• No console interaction anymore during normal use (e.g. sensor style change)

The TopSpin compliant software architecture enables a seamless integration and pro-vides a convenient user interface with common GUI elements. The new plug & play fea-ture makes the system to behave very smart.

Figure 16.3 Example of the VT panel within Topspin3.0

203 28_00_06


16.4 BSVT Specifications

General

• Multi channel intelligent EthernetTM based VT architecture (PnP)

• Up to 2 heater channels (additional 2 channels possible)

• Up to 2 sensor / cooling channels (additional 3 channels possible)

• Software controlled shim cooling and flush gas operation (SPB-E version)

VT control electronics

• Temperature setting resolution of 0.1°C (Topspin)

• BTO-2000 equivalent temperature stability

• Applicable temperature range (without cooling option, dew point <4°C):

- Min. regulated temperature approx. +30°C with 25°C input gas temperature

- Max. temperature depending on probe (>400°C with optional BVTB-3500)

Full electronic VT gas control

• VT gas flow up to 2000 l/h (min. 4 bar of dry air or N2 gas) with SPB

3000 l/h with SPB-E

• Fine VT gas flow steps

• Extended monitoring and logging capabilities

• VT flow meter with approx. +/-5% precision

• VT gas pressure meter with approx. +/-5% precision

Other

• Minimum Topspin 3.0 required

• Additional VT interfaces might be required for software control of existing probes and accessories

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Not supported probe interfaces

Part number Description

W1100255 THERMOCOUPLE HR 500WB

W1100407 THERMOCOUPLE HR 600MHZ

W1100401 THERMOCOUPLE HR 200-500MHZ

W1100884 THERMOCOUPLE HR 750MHZ

W1100024 HEATER SC FOR HP CXP/MSL

W1100316 HEATER SC ALL HR HEAD

W1100399 HEATER SC ALL HR HEAD

Table 16.1 Not supported external probe interfaces (discontinued products)

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16.5 Basic BSMS/2 BSVT Configuration

i Note: The basic BSMS/2 BSVT configuration includes sample transport and rotation and cryostat helium level measurement but does not include a VT system

Part name Part Number ECL

BSMS/2 CHASSIS WIRED Z002774 >= 02.00

BSMS/2 ELCB EXTENDED LOCK CTRL BOARD Z100818 >= 05.00

PNM AIR FILTER SYSTEM AVANCE CABINET 88437 -

Table 16.2 Minimal requirements for all configurations

Power Supply Sensors & Pneumatics

Magnet System Bore

PSB1Z002775

PSB7Z117631

SPBZ115191

SPB-EZ115192

SB

WB

Table 16.3 Required boards depending on magnet system

1 2

BS

MS

/2 S

PB

(-E

)

BSMS/2 (rear view)

1 2

MAINS - SELECTORPSB5 PSB2 PSB1 / PSB7

BSMS/2

SPB(-E)

Figure 16.4 Minimal BSMS/2 configuration (without VT system)

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16.6 Basic BSMS/2 BSVT Configuration with VT System Option

i The basic VT system option includes a smart VT interface for 2 thermocouple type T sensors (Z119237 BSMS/2 VTA TC-2T) (see also 16.9)

Note: When upgrading an already installed system from BVT3000, BVT3200 or BVT3200A to BSVT, then a different rear panel is necessary (Z117207).

16.7 Support for Nitrogen Level Sensor

In former BSMS/2 systems the only unit that supported nitrogen level sensors was the SLCB/3. With introduction of the BSVT, interfaces changed and the new peripheral bus BFB (Bruker Field Bus) was introduced for connecting external digital sensors (see "Sys-tem Architecture / Overview" on page 59).

Power Supply Pneumatics & Sensors

Variable Power Supply

Magnet Bore

PSB1Z002775

PSB7Z117631

SPBZ115191

SPB-EZ115192

VPSBZ115193

SB

WB

Table 16.4 Required boards for basic BSVT configuration with VT system option

1 2 3

AQ

S S

GU

40

0

BS

MS

/2 S

PB

BSMS/2 (rear view)

1 3 2 19

BS

MS

/2 V

PS

B


BSMS/2BSMS/2

VPSB SPB

Figure 16.5 Typical BSMS/2 configuration with VT system

207 28_00_06


i For detailed information on nitrogen level sensor and required cables see "Nitrogen Level Sensor" on page 291.

VPSBZ115193

SPBZ115191

SPB-EZ115192

Digital sensor

Analog sensor

Table 16.5 Support for Nitrogen Level Sensor

3 2

AQ

S S

GU

400

BS

MS

/2 S

PB

-E

BSMS/2 (rear view)

3 2

BS

MS

/2 V

PS

B


BSMS/2BSMS/2

VPSB SPB

Figure 16.6 BSMS/2 units that support nitrogen level sensors

208 Z108028_00_06

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16.8 Required Cable Sets for VT Pptions

i These cable sets can be used for BSMS/2 and NanoBay configurations

Cable Set

Z11

985

1 C

AB

LE

SE

T B

SV

T B

AS

IC

Z11

985

2 C

AB

LE

SE

T B

SV

T 9

M H

EA

TE

R

Z11

985

3 C

AB

LE

SE

T B

SV

T 4

.5M

HE

AT

ER

Z11

985

4 C

AB

LE

SE

T B

SV

T A

UX

ILIA

RY

HE

AT

ER

(sta

nd

ard

len

gth

9m

)

Z11

751

2 C

AB

LE

RD

8P

9.0

M B

SM

S/2

AU

X V

TA

1 probe heater and 1 cooling option X X Xa

a. only required for BVTB3500 booster operation

2nd heater channel Xb

b. required for LN2 evaporator or LN2 heat exchanger operation or other additional heater channels

Table 16.6 Required cable set

209 28_00_06


-2T

Figure 16.7 Basic BSMS/2 configuration with VT system option

VTA

2

BSMS/2V

PS

B C

TR

L

Z115193 BSMS/2 VPSB BSMS/2 PSB7

VTA

1

AU

X2

AU

X1

FILTER

RE

GU

LA

TO

R/

MA

NO

ME

TE

R

typ. 5bar

LIF

TB

UF

FE

R

SP

IN S

B

GA

S I

N 1

VP

SB

CT

RL

1

VT

VP

SB

CT

RL

2

SP

IN W

B

GA

S IN

2

FLU

SH

SH

IM C

OO

LIN

G

AU

X

EM

ER

GE

NC

Y

Z115192 BSMS/2 SPB(-E)

Z13928 *85997 * Z116299 *94209 * 49569/Z123989 *

* included in Z119851 CABLE SET BSVT BASIC

88437

console rear panel

Z116304 (9m) ** orZ116301 (4.5m) ***

Z117512 (9m) **orZ117511(4.5m) ***

**included in Z119852 CABLE SET BSVT 9M HEATER

***included in Z119853 CABLE SET BSVT 4.5M HEATER

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

TC-2T

Z119237BSMS/2 VTA TC

210 Z108028_00_06

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16.9 BSVT Probe Adaptation

The whole variety of probe temperature sensor interfaces and VT accessories can be adapted with smart VT interfaces (BSMS/2 VTA).

For the different probe or VT accessory interfaces dedicated smart VT interfaces are available, for details see the following pages.

By default, delivered systems with VT option includes one smart VT interface for up to 2 thermocouple type T sensors.

16.9.1 HR RT Probes (Thermocouple Type T)

i RT probes are typically operated with a VTA TC-2T. One of the sensor cables is not con-nected. It does not matter which sensor cable is connected as the connected sensor is recognized automatically. 1HR RT probes (BTO2000)

Figure 16.8 Standard HR RT probe with thermocouple T

VTA

2

VP

SB

CT

RL

BSMS/2 VPSB Power Supply

VTA

1

AU

X2

AU

X1

LIF

TB

UF

FE

R

SP

IN

GA

S IN

1

VP

SB

CT

RL 1VT

GA

S IN

2

FL

US

HS

HIM

CO

OLI

NG

EM

ER

GE

NC

Y

BSMS/2 SPB(-E)

console rear panel

COOLINGOPTION

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

TC-2T

Z119237BSMS/2 VTA TC-2T

1. RT probes can also be operated with single Z116922 VTA TC-T. This variant is obsolete.

211 28_00_06


O

Figure 16.9 HR RT probes (BTO2000)

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

BTO

Z116924BSMS/2 VTA BT

VTA

2

VP

SB

CT

RL


VTA

1

AU

X2

AU

X1

LIF

TB

UF

FE

R

SP

IN

GA

S IN

1

VP

SB

CT

RL

1

VT

GA

S I

N 2

FLU

SH

SH

IM C

OO

LIN

G

EM

ER

GE

NC

Y

BSMS/2 SPB(-E)

console rear panel

COOLINGOPTION

212 Z108028_00_06

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P

)

16.9.2 CryoProbes

i The BVT connector at the Cryo Controller has 24V on the male pins. Do not plug in the VTA connector while the Cryo Controller is on; there is risk of short-circuiting.

When operating a RT probe, the Z116923 BSMS/2 VTA CRP must not be disconnected from the Cryo Platform.

With BSVT the VT adapter box Z13874 is obsolete and must not be connected to the system.

Figure 16.10 CryoProbe

VTA

2

VP

SB

CT

RL


VTA

1

AU

X2

AU

X1

LIF

TB

UF

FE

R

SP

IN

GA

S IN

1

VP

SB

CT

RL

1

VT

GA

S IN

2

FLU

SH

SH

IM C

OO

LIN

G

EM

ER

GE

NC

Y

BSMS/2 SPB(-E)

console rear panel

COOLINGOPTION

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

CRP

Z116923BSMS/2 VTA CR

COOLINGUNIT

CRYO

(Cryo Controller)

If no CRP SAMPLE PROTECTION SYSTEM is availableZ122973 CRP BSVT SAFETY GAS KIT must be installed

CryoProbeTM

(incl. ET variants

NEEDLE VALVE *)47657

*) part of Z109739 CRP SAMPLE PROTECTION SYSTEM 2 NEW

EMERGENCY LIFT OUT

213 28_00_06


-2T

16.9.3 Solids Probes (2 Thermocouple Type T)

Solids probes DVT (thermocouple type T)

Figure 16.11 Solids probehead DVT with 2 thermocouple T

VTA

2

VP

SB

CT

RL


VTA

1

AU

X2

AU

X1

LIF

TB

UF

FE

R

SP

IN

GA

S IN

1

VP

SB

CT

RL

1

VT

GA

S I

N 2

FLU

SH

SH

IM C

OO

LIN

G

EM

ER

GE

NC

Y

BSMS/2 SPB(-E)

console rear panel

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

TC-2T


COOLINGOPTION

214 Z108028_00_06

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-2T

Solids probes VTN/WVT (thermocouple type T)

Figure 16.12 Solids probehead VTN/WVT with 2 thermocouple T

VTA

2

VP

SB

CT

RL


VTA

1

AU

X2

AU

X1

LIF

TB

UF

FE

R

SP

IN

GA

S IN

1

VP

SB

CT

RL

1

VT

GA

S IN

2

FL

US

HS

HIM

CO

OLI

NG

EM

ER

GE

NC

Y

BSMS/2 SPB(-E)

console rear panel

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

TC-2T


COOLINGOPTION

MAS IIUNIT

bearing sense

SPB(-E) must be configured for „external VT gas“(BSMS Service Web)

215 28_00_06


-2T

16.10 BSVT and Heater Accessory (Power Booster)

BVTB3500 Booster

i The power booster will also work with other probehead adaptation like VTA TC-T or VTA BTO etc.

Figure 16.13 Power booster and solids probehead

VTA

2

VP

SB

CT

RL


VTA

1

AU

X2

AU

X1

LIF

TB

UF

FE

R

SP

IN

GA

S IN

1

VP

SB

CT

RL

1

VT

GA

S IN

2

FLU

SH

SH

IM C

OO

LIN

G

EM

ER

GE

NC

Y

BSMS/2 SPB(-E)

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

TC-2T


COOLINGOPTION

BVTB3500

BOOSTER500W

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

BVTB

W1100117

Z119720BSMS/2 VTA BVTB

console rear panel

Z117512 (9m)

216 Z108028_00_06

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-2E

16.11 BSVT and HT Accessory (High Temperature)

BVTE3900

The BVTE3900 (P/N W1208962) is a cooling system for high temperature NMR.

Figure 16.14 BVTE3900 and BSVT

VTA

2

VP

SB

CT

RL


VTA

1

AU

X2

AU

X1

LIF

TB

UF

FE

R

SP

IN

GA

S IN

1

VP

SB

CT

RL

1

VT

GA

S IN

2

FLU

SH

SH

IM C

OO

LIN

G

EM

ER

GE

NC

Y

BSMS/2 SPB(-E)

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

TC-2E


COOLINGOPTION

BVTE3900

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

BVTB

W1100117

Z119720BSMS/2 VTA BVTB

console rear panel

Z117512 (9m)

GAS

WATER

COOLING &

POWER BOOSTER

217 28_00_06


16.12 BSVT and VT Gas Cooling Accessory Adaptation

16.12.1 BSCU05 / BSCUX COOLING UNIT

Connection of BSCU05 and BSCUX is identical and straightforward.

Figure 16.15 BSCU05 or BSCUX COOLING UNIT

VTA

2

VP

SB

CT

RL


VTA

1

AU

X2

AU

X1

LIF

TB

UF

FE

R

SP

IN

GA

S IN

1

VP

SB

CT

RL

1

VT

GA

S IN

2

FL

US

HS

HIM

CO

OLI

NG

EM

ER

GE

NC

Y

BSMS/2 SPB(-E)

console rear panel

BSMS/2 VTA

BSCU05BSCUX

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

218 Z108028_00_06

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16.12.2 BCU05 / BCU-X COOLING UNIT

Connection of BCU05 and BCU-X is identical using a Z116925 BSMS/2 VTA BCU.

i Do not feed the heater power cable from the VTA thru the BSC-X. Connect the heater cable directly to the probe.

Figure 16.16 BCU05 or BCU-X COOLING UNIT

VTA

2

VP

SB

CT

RL


VTA

1

AU

X2

AU

X1

LIF

TB

UF

FE

R

SP

IN

GA

S IN

1

VP

SB

CT

RL

1

VT

GA

S I

N 2

FLU

SH

SH

IM C

OO

LIN

G

EM

ER

GE

NC

Y

BSMS/2 SPB(-E)

console rear panel

BCU05BCU-X

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

BCU

Z116925BSMS/2 VTA BCU

BSMS/2 VTA

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

219 28_00_06


16.12.3 BVTL3200 N2 EXCHANGER

BVTL3200 N2 EXCHANGER is adapted to the BSMS/2 BSVT system using a Z119238 BSMS/2 VTA LN2.

Figure 16.17 BVTL3200 N2 EXCHANGER

VTA

2

VP

SB

CT

RL


VTA

1

AU

X2

AU

X1

LIF

TB

UF

FE

R

SP

IN

GA

S IN

1

VP

SB

CT

RL

1

VT

GA

S I

N 2

FLU

SH

SH

IM C

OO

LIN

G

EM

ER

GE

NC

Y

BSMS/2 SPB(-E)

console rear panel

BSMS/2 VTA

Z116304*

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

LN2

Z119238BSMS/2 VTA LN2

BVTL3200 N2

EXCHANGER

Z116299 *49569 *

* part of Z119854 CABLE SET BSVT AUXILIARY HEATER

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

220 Z108028_00_06

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16.12.4 BVTL3200 N2 EVAPORATOR

BVTL3200 N2 EVAPORATOR is adapted to the BSMS/2 BSVT system using a Z119238 BSMS/2 VTA LN2.

Figure 16.18 BVTL3200 N2 EVAPORATOR

VTA

2

VP

SB

CT

RL


VTA

1

AU

X2

AU

X1

LIF

TB

UF

FE

R

SP

IN

GA

S IN

1

VP

SB

CT

RL

1

VT

GA

S I

N 2

FLU

SH

SH

IM C

OO

LIN

G

EM

ER

GE

NC

Y

BSMS/2 SPB(-E)

console rear panel

BSMS/2 VTA

Z116304*

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

LN2

Z119238BSMS/2 VTA LN2

BVTL3200 N2

EVAPORATOR

Z116299 *49569 *


VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

221 28_00_06


C-2T

16.13 BSVT and FlowProbe Adaptation (FLOW-NMR)

For Flow-NMR there exist several variants. The following configurations shows typical applications.

FlowProbe with HT Heated Probe Capillary

i FlowProbes with BTO2000 require a Z116924 BSMS/2 VTA BTO

Figure 16.19 FlowProbe with HT Heated Probe Capillary

VTA

2

VP

SB

CT

RL


VTA

1

AU

X2

AU

X1

console rear panel

Z116299 *49569 *


HT

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

FLOW-NMR

Z120851BSMS/2 VTA FLOW-NMR

Z116304*

Heated ProbeCapillary

LIF

TB

UF

FE

R

SP

IN

GA

S IN

1

VP

SB

CT

RL

1

VT

GA

S I

N 2

FLU

SH

SH

IM C

OO

LIN

G

EM

ER

GE

NC

Y

BSMS/2 SPB(-E)

COOLINGOPTION

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

TC-2T

Z119237BSMS/2 VTA T

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C-2T

FlowProbe with TCTC Temperature Controlled Transfer Capillary

i FlowProbes with BTO2000 require a Z116924 BSMS/2 VTA BTO

Figure 16.20 FlowProbe with TCTC Temperature Controlled Transfer Capillary

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

TC-2T

Z119237BSMS/2 VTA T

COOLINGOPTION

VTA

2

VP

SB

CT

RL


VTA

1

AU

X2

AU

X1

LIF

TB

UF

FE

R

SP

IN

GA

S IN

1

VP

SB

CT

RL

1

VT

GA

S IN

2

FL

US

HS

HIM

CO

OLI

NG

EM

ER

GE

NC

Y

Z115192 BSMS/2 SPB -E

console rear panel

Z116304*

Controlled

Z116299 *49569 *


TCTC Temperature

Transfer Capillary

HT

VTA

2

VP

SB

CT

RL

Z115193 BSMS/2 VPSB

VTA

1

AU

X2

AU

X1

VP

SB

CT

RL

1

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4


VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

FLOW-NMR


Z116304*

Z116299 *49569 *

FLOW-NMR

Heated ProbeCapillary

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RP

CryoProbe with CryoFit Preheater

Figure 16.21 CryoProbe with CryoFit Preheater

VTA

1

VP

SB

CT

RL


VTA

2

AU

X1

AU

X2

LIF

TB

UF

FE

R

SP

IN

GA

S IN

1

VP

SB

CT

RL

1

VT

GA

S I

N 2

FLU

SH

SH

IM C

OO

LIN

G

EM

ER

GE

NC

Y

BSMS/2 SPB(-E)

console rear panel

COOLINGOPTION

VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

CRP

Z116923BSMS/2 VTA C

COOLINGUNIT

CRYO

(Cryo Controller)


VT

PO

WE

R

CH

1

CH

2

CH

3

CH

4

FLOW-NMR

Z116299 *49569 *


Z116304*

Preheater CF CryoFit

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17 BSVT Concept

17.1 Plug and Play Concept

The BSVT variable temperature control system is designed for usage with all existing and new types of BRUKER probes, chillers, pre-heaters (e. g. for flow NMR) and other accessories. Different types and numbers of temperature sensors can be connected to the appropriate VT adapters, which provide the matching cables and connectors. All VT adapters can be connected to the BSVT units in the console, either via a standard accessory cable (communication and VT adapter power supply) or via a standard heater cable (providing in addition the variable power).

After power up of the BSVT system, the VT adapters connected to the cable coming from the console are powered up and identified. The collectivity of the connected adapt-ers (with corresponding probe, chiller, or accessory device) and the VT gas supplies (VT gas, flush gas, Shim cooling / drying) are considered as an entity, which is called BSVT configuration. The various options for BSVT configurations are described in chapter "BSVT Introduction & Configurations" on page 201. It is possible to add or remove VT adapters, a probe or a chiller at any time even during operation.

i The system can detect a new adapter only when it is connected or disconnected to or from a cable coming from the console. Connecting or disconnecting accessories to or from the adapter (e.g. N2 evaporator) will not lead to a configuration change.

After a BSVT configuration change, the new devices are recognized automatically and integrated into the system with minimal user interaction.

i To enable and display a changed BSVT configuration, the temperature control has to be turned off and on again within the Topspin vtudisp/edte.

When a device involved in temperature regulation is removed then the temperature con-trol is switched off. Adding further devices has no effect on a running temperature control process.

17.2 Control Logic of the BSVT

There is a common control logic for the complete BSVT configuration. Rather than set-ting the gas flow or switching on or off a specific heater, the BSVT is switched on or off as a whole.

In addition to the base states (on / off) there are additional states for system calibration / tuning (self tune), system identification (self test), exceptional situations (anti freeze pro-tection, sample protection), errors (gas flow error, sensor error), and a check configura-tion state (when a device has been added or removed).

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17.2.1 State Off / Standby

This state is active when the BSVT is switched off. In general, the thermal energy of the system is kept as steady as possible (sub state „off“):

• Heater(s) = off

• Chiller = off

• Gas flow = standby gas flow (between 0 and maximum)

Nevertheless, it is possible that the system looses energy (e. g. chilling by active Cryo-Probe), and the temperature drops below the minimum allowed temperature. In this case, a minimum heating is activated, and the control logic goes into the sub state „anti freeze protection“:

• Heater(s) = on, regulating for temperature next to room temperature

• Chiller = off

• Gas flow = operating gas flow (between minimum and maximum)

If the measured temperature stays below the minimum temperature even if the anti-freeze heating is active then the sample is lifted for protection (sub state „sample protec-tion“). As soon as the temperatures are in range again, the sample is transported to its original location.

Anti-FreezeProtection

On Self Tune

Off / Standby

Complete (success)

Sample Protection

Complete (failed)

Too coldOff

On / Operating

SelfTune

SelfTune- Off- Temperature limits exceeded- Unsufficient gas flow

On

Check Configuration

Self Test

Sensorreconnected

Gas Flow Error

Too cold Temperaturerecovered

Sensor Error

Gas supply erroror blocked VT gas(from any state)

Sensor missingor defective

(from any state)

Power up

complete

Start selftest(from any state)

complete

Deviceremoved

Configurationchanged

Gas flowrecovered

Figure 17.1 BSVT states

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17.2.2 State On / Operating

This state is active when the BSVT is switched on. All devices of the BSVT configuration are active:

• Heater(s) = regulating for required target temperature(s)

• Chiller = according to user settings

• Gas flow = operating gas flow (between minimum and maximum)

The PID controller parameters can be optimized by a „self tune“ operation. If the global self tune procedure is activated then all active channels are tuned in parallel. As soon as the self tune of a channel is complete, the according channel is starting operational tem-perature regulation.

Self tuning can be started from both states - off / standby and on / operating. If it fails in the end then the BSVT is switched off unless the self tuning has been started from on / operation and the measured temperatures have been close to the aimed values.

It is possible to add further devices to the BSVT configuration while the temperature con-trol is on / operating. The added devices stay inoperable (no active temperature regula-tion) and provide only temperature measurement. As soon as the BSVT is switched off, the pending changes are handled, and the BSVT configuration is updated.

However, if devices that are involved in temperature regulation are removed during oper-ation then the BSVT stops its activity.

17.2.3 State Sensor Error

If the connection to a sensor involved in temperature regulation gets lost then the BSVT goes into the sensor error state. However, if only one sensor of a double sensor adapter (e. g. TC-2T) is used, then the according channel runs in single sensor mode, and the unconnected sensor is not considered.

17.2.4 State Gas Flow Error

There are two possible types of gas flow errors - either the VT gas flow is blocked some-where between the SPB and probe (VT gas tube, chiller, etc) or in the probe itself or the gas supply is too weak or out of order. In both cases, the BSVT goes into the gas flow error state. The gas flow status indicates the exact error type (blocked or missing). As soon as the VT gas flow has recovered (e. g. interrupted gas supply has been re-estab-lished and the required standby gas flow has been reached), the BSVT control goes back to the off state. There is a maximum gas pressure that can be adjusted in the ser-vice web - the VT gas flow regulation guarantees that this maximum pressure is never exceeded even if the VT gas is blocked somewhere.

17.2.5 State Self Test

If there is a problem - e. g. the BSVT refuses to go into operation or some connected devices do not behave as expected - it is recommended to run a self test. The self test can be started on the service web and may last some seconds (it may be useful to check

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as

the state until the self test is complete). In the end, there is a short self test report avail-able, providing information about all connected devices and their status (e. g. missing sensor connections, missing gas flow, and so on).

17.3 Specific Configurations

In the following subsections there are a few specific configurations described.

17.3.1 BSVT with CryoProbes

CryoProbes in cold state cool down the sample if there is no active VT operation. In this configuration, the auxiliary gas of the BSVT (which is designed for flushing of the RF section of room temperature probes), is used as a safety gas flow in order to prevent from sample freezing, in case the BSMS/2 BSVT system was powered down.

Figure 17.2 VT emergency gas flow

SPB-Evariant only

BSVT

Emergency VT gas0.3 bar

BCU or

BSCU

VT gas

Bypass (BCU variants)

BSVT emergency VT gas

Flush GasActive when

BSVT has no power

Active whenBCU is off

Active while VT is inoperation

Active when CRP is coldand if VT pressure < 0.3 bar

CRP bypassinput

CRP VT g

Gas Supply

Cryo Platform emergency VT gas

Cryo Platform /Sample Protection Unit

Variable flushgas for RT probes

for configuration/ part details see "CryoProbes" on page 213

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If a CRP Sample Safety Option is installed then the Cryo Platform initiates a sample ejection in case of insufficient temperature. This operation is detected by the BSVT, and in case of safety lift initiated by the Cryo Platform, the BSVT disables its own lift function.

17.3.2 MAS Probes with Tempered Bearing Gas (VTN / WVT)

Some MAS probes have no specific VT gas channel - instead they use the MAS bearing gas for temperature regulation. In these cases, the BSVT can be configured for „external VT gas supply“, where the probe heating is enabled as long as there is enough pressure on the bearing gas detected. The VT gas valve in the BSVT unit is closed in this opera-tion mode.

Figure 17.3 Gas flow diagram for emergency lift

BSVT

BSTBufferGas Supply

Throttle valve

Emergency lift

Lift

BSVT lift is disabledwhile emergency lift is active

Temperature sensing

Cryo Platform /Sample Protection Unit

for configuration/ part details see "CryoProbes" on page 213

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17.3.3 BSVT with Booster

For very high temperature applications it may be necessary to use a booster (BVTB3500 500W booster). This booster is normally installed inside the NMR cabinet and connected via the appropriate VT adapter (VTA BVTB) to an accessory VT channel. If the installed booster is not used then the probe is connected to the VT power channel as indicated in the BSVT configuration chapter.

By connecting the booster cables accordingly, the user can activate booster operation. The BSVT is configured automatically without any further user intervention.

Figure 17.4 External VT gas supply (e. g. MAS bearing gas)

BSVT

VT gas

Gas Supply

Flow measurementnot used

Valve closed

Heater Power

Enable power whenpressure is detected

Bearing gas

MAS Unit

MAS probe (VTN, WVT)

VT powerCombined VT /bearing gas

BSVT configured forexternal VT gas mode

Bearing gaspressure measurement

Figure 17.5 Booster installed, but normal probe operation

BSVT

Booster

VT adapter Probe

VT adaptertype BVTB

Power channel

Accessorychannel

VT power

VT regulation

Booster feedback

Booster power

NMR cabinet

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BSVT Concept

17.4 Frequently Asked Questions

• What is the difference between a power channel and an accessory channel?A power channel provides - in contrast to an accessory channel - a variable power, which can be controlled (VT power). The basic BSVT configuration provides 2 power channels and 2 accessory channels. BSVT configurations can be extended up to 4 power channels and 5 accessory channels.Both channel types have the 15 pin D-Sub connecter at the user side, but the accessory channel is connected to the back panel of the NMR cabinet by a smaller RJ45 connecter. The width of the power channel cable is quite higher than that of an accessory channel.

• What happens if a probe is connected to an accessory channel?A probe can be connected via the appropriate VT adapter to any channel. However, if the channel does not provide VT power then the VT temperature of the probe can-not be controlled and stabilized. Nevertheless, the temperature measurements are transferred in regular intervals to the BSVT unit and displayed within the Topspin GUI.

• What could be the reason for inoperable devices?It can happen that a power device connected to a power channel can not be oper-ated and is marked as inoperable in the Topspin GUI. Either a heater or sensor cable between VT adapter and heating device (e. g. probe) is not connected. Or the device (VT adapter) has been added while the BSVT was in operation. In that case, the BSVT stays in operation mode (as long as there is no device removed that was involved in temperature regulation) - the new devices are integrated into the BSVT temperature control as soon as the temperature regulation is switched off next time.

• When the target strength (= cooling power) of the cooling unit is set, nothing hap-pens, and the actual strength remains unchanged - why could this happen?BSVT operation is required for activation of a connected cooling unit. As soon as the BSVT is „on“, the actual cooling strength changes to the required value defined by the target strength parameter. In addition, the rotary knob of the new BSCU cool-ing units must be set to „remote“ position. Otherwise, the settings of the Topspin

Figure 17.6 Booster in operation

BSVT

Booster

VT adapter Probe

VT adaptertype BVTB

Power channel

Accessorychannel

VT power

VT regulation

Booster feedback

Booster power

NMR cabinet

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software are ignored and the locally set strength (by rotary knob position) is consid-ered for operation.Note: The BCU-X requires a minimum VT gas pressure and gas flow before it becomes active. If there is no gas flow (or no gas supply) then a connected BCU-X cannot be detected by the VT adapter.

• Which channel is the probe channel?Probe channel identification is set to „auto“ by default (This setting can be defined on the BSMS service Web under the menu „VT configuration“).Normally, there is a single heater device in the BSVT configuration, and the map-ping is therefore evident. Configurations for flow NMR applications can be handled automatically as well - additional heaters are connected via specific VT adapters, and the remaining active channel can therefore be considered as the probe chan-nel. In applications with several VT adapters of the same type (e. g. specific MAS configurations with separate heaters for VT, bearing and rotation) it may be neces-sary to give an explicit definition of the probe channel.

• How is the VT power represented in the new BSVT?Inside the BSVT the VT power is represented in Watt (absolute power). However, the user can select alternatively a relative representation for the GUI (percent). In that case the reference power is the highest possible power that can be achieved with the connected probe and the maximum voltage (48 Volt) of the VT power sup-ply. Example:- Cryo Probe heater with 48 Ohms: Imax = 1 A, Pmax = 48 Watt (= 100%)

• Has the maximum VT power setting an influence on the Self Tune?The Self Tune is no longer affected by the maximum VT power (as long as it is high enough), since the required power for Self Tune is evaluated in the beginning of the tuning automatically. If the power limit is set too low then the Self Tune aborts with a corresponding error message (similar case if the chilling is not sufficient to reach the target temperature). The temperature control process is not stopped in case of too restrictive power limitation (or insufficient chilling) - it is simply indicated in the regu-lator status that the heater power limitation is too strict or that the chilling is not suffi-cient.

• Do I still need the cable Z13874 with VT power attenuator (with heat spreader) for CryoProbes?For operation of the former Variable Temperature control systems (e. g. BVT3000, BVT3200) with CryoProbes, it was necessary to insert a power attenuator between the BVT and the heater of the probe. The user could select between „low“ = 10%, „high“ = 50% and „ET“ = 100% resulting VT power at the probe. With the new BSVT, this attenuator is no longer used, since the VT power is provided by the BSVT in high resolution down to smallest values and therefore also appropriate for direct operation with CryoProbes. Problems with overheated attenuators or full power val-ues varying with the selected power range at the attenuator are eliminated with the BSVT.

• When I power on the BSMS/2 chassis, all LEDs on the VPSB board are off. Is the board defect?The VPSB has no connection to the BSMS/2 backplane. It is powered from the mains and controlled completely via the cable from the SPB board (port is labeled VPSB CTRL). The power stages on the VPSB itself and the front panel LEDs are switched on, as soon as the ELCB has enabled the signals on this control port. This may take some time. If the LEDs were still remain OFF check the cable connection, correct working SPB (ERROR LED off on SPB) and verify that the latest ELCB firm-ware is loaded.

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18 SPB

18.1 Introduction0 The SPB (Sensor & Pneumatic Board) is the enhanced and higher integrated replace-ment of the former SLCB1 (Sample & Level Control Board) and the PNK board family (PNK3, PNK3S, PNK5).

There are two versions of the SPB available: The basic version is used for Standard Bore systems whereas the extended version supports wide bore NMR magnets and additional features like the liquid nitrogen level sensor interface or control outputs for more than one VPSB.

Low level hardware functions (e.g. sample sensor interfaces, safety circuits) are imple-mented directly on the SPB, whereas higher level functions such as helium level calibra-tion and measurement, sample transport control (lift), sample rotation regulation (spin) or pneumatic valve control for VT gases are provided by the software running on the ELCB.

The SPB pneumatics now include the gas flows for the variable temperature system (VT). Integrated mass flow and pressure sensors provide accurate gas flow setting.

The new electronics are fully compatible to the well known sensors for helium or nitrogen measurements or the sample detection electronics.

The SPB has additional interfaces for connecting up to 2 Variable Power Supply Boards (used by the VT system to control the probe temperature) and novel digital accessory sensors.

18.2 Configurations

Basically there are two variants - one for standard bore systems and another one for wide bore systems or systems with optional accessory (temperature or nitrogen level sensors).

1. SLCB/2 or SLCB/3 with interface for liquid nitrogen level sensor (analog mode only)

23328_00_06

SPB

g

rs on

i Digital Nitrogen Level Sensors introduced in 2011 do not require a SPB-E anymore. The digital sensors are connected typically to AUX ports on the VPSB. However, the SPB-E support both analog and digital nitrogen level sensors. For details see "Nitrogen Level Sensor" on page 291.

Bruker Part Number

Name Purpose

Z115191 BSMS/2 SPB SENSOR & PNEUMATIC BD - Standard bore systems- CryoProbe systems- fixed gas flow for probe flushing- fixed gas flow for shim cooling

Z115192 BSMS/2 SPB-E SENSOR & PNEUMATIC BD - Wide bore systems- regulated gas flow for probe flushin- regulated gas flow for shim cooling- support for all nitrogen level senso(e.g.for systems with BSNL optiinstalled before 2011)

Table 18.1 SPB variants

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SPB

18.3 Technical Data

The boards differ in the number of interfaces and additional software regulated gas flows:

SPB SPB-E Unit

Gas Flow VT 0..2000 0..3000 l/h

Gas Flow Probe Flush 300 (fixed) 0..600 l/h

Gas Flow Shim Cooling 1800 (fixed) 0..3000 l/h

Gas Flow Spin SB 0..720 0..720 l/h

Gas Flow Spin WB n/a 0..1440 l/h

Gas Flow Sample Lift 0..6000 0..9000 l/h

Helium level sensor(HELIUM LEVEL)

included

BST sensor interface (SAMPLE CONTROL)

includeda

a. Old style shim upper parts (SOT72) using Z12084 CABLE ADAPT BSMS/SOT72 can be connected to a SPB(-E) ECL02.03 and newer. Because these shim upper parts do not include a sample up light barrier, re-duced functionality (sample lift speed, display) will result.

BACS interface (SAMPLE CHANGER)

included included

Analog and digital liquid nitrogen level sensor interface (NITROGEN LEVEL)

n/a included

Maximum active temperature control channels (VPSB CTRL) b

b. Variant SPB has 1 VPSB CTRL interface to control 1 Z115193 VPSB (dual heater power supply), variant SPB-E has 2 VPSB CTRL interface to control 2 Z115193 VPSB for total 4 heater channels

2 4

Auxiliary digital sensor interface (AUX)

n/a 1

Table 18.2 Overview SPB vs. SPB-E


Helium measurement system rangea 0 100 %

resolutionb 1 %

accuracyc -4 +4 %

Helium measurement source voltage

range 29.0 31.0 V


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Helium measurement current range 40 150 mA

resolution 1 mA

accuracy -2 +2 %

default 110 mA

de-ice current 200 mA

auto switch-off time

30 s

Helium measurement input voltage

differential input voltage

0 +30 VDC

measurement accuracy

-2 +2 %FS

a. valid for calibrated system only

b. valid for calibrated system only

c. for a He-level in the range of 20%...100%


N2 measurement system range 0 100 %

resolution -1 +1 %

accuracy -3 +3 %

N2 voltage measurement maximum input rangea

a. sensor has to be calibrated for 0V .. -5V (=> 100% .. 0%)

0 -8.0 VDC

resolution 10 mV

accuracy -2 +2 %FS

Sensor supply output voltagepositive

9.75 10 10.25 V

output voltage negative

- 9.75 - 10.0 - 10.25 V


Table 18.4 Analog N2 level measurement interface (SPB-E version only)


Sample Rotation signal analoga

range 0 5 V




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SPB

SAMPLE_UPS signal digi-tal

high level input volt-age

2.6 5 V

low level input volt-age

0 2.4 V

Light barrier supply output voltage 4.75 5.25 V

sink resistanceb 95 105 Ohm

a. when using signal for sample down detection, calibration is necessary

b. allows to connect LED directly without additional series resistor



stability, @0..150l/min

-0.5 0.5 bar

Gas flow standard bore 100 l/min

wide bore 150 l/min

Table 18.6 Sample lift



stability -0.5 0.5 bar

Max. air flow @ 5bar sup-ply

standard bore 15 l/min

wide bore 25 l/min

Rotation rate range set point 7 50 Hz

range measurement 0 100 Hz

setting resolution 1 Hz

Table 18.7 Sample Rotation


Power source (S_5VP, input) input voltage 4.5 5 5.5 V


SIGSH, SIGSH~ source 4 mA

(output current) sink -4 mA

Table 18.8 Sample changer interface



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SPB

Parameter (@ input pres-sure 5bar)

ECL Min Typ Max Unit

Flush gas flow range a

a. factory setting

0201

270 300 330 l/h

03 500 600 700 l/h

accuracy -10 10 %FS

gas outlet 6 mm

Shim gas flow rangeb

b. factory setting

1600 1800 2000 l/h

accuracy -10 10 %

gas outlet 8 mm

Gas supply N2 or dry air 4 6 bar

Gas inlet 8 mm

Table 18.9 Auxiliary gas specifications (SPB version)

Parameter (@ input pres-sure 5bar)

ECL Min Typ Max Unit

Flush gas flow range a

a. adjustable by software

0 300 600 l/h

accuracy -10 10 %FS

gas outlet 6 mm

Shim cooling gas flow rangeb

b. adjustable by software

0 1800 3600 l/h

accuracy -10 10 %FS

gas outlet 6 mm


Gas inlet 8 mm

Table 18.10 Auxiliary gas specifications (SPB-E version)

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SPB

Parameter Details Min Typ Max Unit

Probe gas flow range set point SPB 0 33 l/min

range set point SPB-E 0 50 l/min

resolution set point

1 l/min

accuracy -5 5 %FS

temperature stability

a

a. flow is regulated, specification valid for constant gas supply pressure

0.5 1 %/°C


Gas inlet 8 mm

Table 18.11 VT gas specifications

Parameter Details Min Typ Max Unit

Operating temperature (ambient)a


15 25 35 °C




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Y

ING


Figure 18.1 Block diagram of the SPB

Ba

ckpl

ane

Con

nect

or

Power Supply

Control FPGA

Flash

SSRB

VP

SB

LVDS

CT

RL

1

ERRORREADYPOWERHE30V

HELIUM LEVEL

A/D

DAVCXO

LIFT

EMERGENCLIFT

to A

/Dto

A/D

SENSOR & PNEUMATIC BOARD

SHIM COOL

GAS 2 IN

GAS 1 IN

FLUSH GAS

VT GAS

SPIN SB

SAMPLE

SAMPLECONTROL

CHANGERIO

A/D

flow

met

er a

nd

dia

gnos

tics

BUFFERD

A

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SPB

Y

ING

Figure 18.2 Block diagram of the SPB-E

Bac

kpla

ne C

onn

ecto

r

Power Supply

Control FPGA

Flash

SSRB

VP

SB

LVDS

CT

RL

1

ERRORREADYPOWERHE30V

HELIUM LEVEL

NITROGENLEVEL

SAMPLE

SAMPLECONTROL

AUX

CHANGER

VP

SB

C

TR

L 2

IO

A/D

VCXO

LIFT

EMERGENCLIFT

A/D

to A

/Dto

A/D

SENSOR & PNEUMATIC BOARD EXTENDED

SHIM COOL

GAS 2 IN

GAS 1 IN

FLUSH GAS

VT GAS

SPIN SB

SPIN WB

flow

met

er a

nd

diag

nost

ics

BUFFERD

A

DA

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SPB

The SPB(-E) is controlled by the ELCB, which is the BSMS/2 controller / coordinator. The ELCB and the SPB(-E) are connected via the BSMS/2 backplane SSRB (Synchro-nous Serial Rack Bus).

In normal configuration the SPB(-E) uses a common 10MHz clock that is distributed by the ELCB (this clock is typically generated by the AQS reference board) for oscillator synchronisation. If not available the system is running with the on-board crystal fre-quency.

When the SPB(-E) is starting up, the FPGA first tries to load the design (field bit stream) from the flash memory. If not available it loads a fully functional backup bit stream called factory bit stream whose primary purpose is to get the system up to a point where a valid bit stream can be loaded to the flash memory.

During startup the ELCB checks the SPB(-E) bit stream version.

18.4.1 Protection

All external interfaces are protected against short circuits (limiting the output current or with current measurement and power switches).

18.4.2 Measurements Provided for Diagnostics

The on-board diagnostics supervises essential board functions like power supply and clock synchronisation. A watchdog mechanism checks for valid connection to the ELCB. In case of a failure the board will reset and put electronics and valves into a safe state.

The software running on the ELCB may notify the user about abnormal events.

Status / Errors

The SPB(-E) can perform the following checks:

• Power supply voltages

• Short circuits / disconnected lines at sensor interface connectors and connection to VPSB (variable power supply board)

• Helium level measurement current source status (operational, correct current, bro-ken sensor)

• Valve block temperature

• Emergency lift air status (used in CryoProbe systems)

Gas Flow and Pressure Measurements

The gas flow channels for VT and probe flush gas are equipped with flow sensors. These are used for gas flow regulation and for diagnostic purposes. A pressure sensor checks VT gas pressure.

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Temperature Measurement

There is a PT1000 resistor built into the valve block providing temperature measure-ment.

Sample Down Detection Circuit

The sample down signal is continuously measured using a fast sampling A/D converter. This feature provides superior adoption of the reflection sensor to different NMR spin-ners.

18.4.3 Calibration

There are no calibration settings to store on the SPB. The ELCB has full control over the SPB hardware and provides methods for setting up the sample lift, helium level mea-surements and nitrogen level measurement (SPB-E only). Spin calibration known from former systems is no longer necessary.

Sample Lift Calibration

Depending on the cryostat bore size and height and the NMR spinner type a different amount of gas is necessary for lifting the sample. The setup of the lift parameters is described on the according service web page in detail.

Helium Level Sensor Calibration

Sensor characteristic depends on cryostat size and sensor model. Setup up of the sen-sor is described on the according service web page in detail.

Nitrogen Level Sensor Calibration

The digital "Nitrogen Level Sensor" is factory calibrated. Former analog sensors had to be calibrated itself by adjusting trimmers. For detailed information consult the Magnet System Service Manual SB/WB/SWB ZTKS0177 / Z31977.

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Figure 18.3 Front view of a SPB

Error

Ready

Power

Helium supply 30VLIFT

BUFFER


GAS 2 IN

SHIM COOLING GAS

GAS 1 IN

SPIN STANDARD BORE

VT GAS

PROBE FLUSH GAS

Helium level

Sample Changer

Sample Control(BST)

VPSB control 1

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SPB

Error LED

This LED is active after Power ON. It turns off as soon as the SPB is initialized (e. g. FPGA design loaded from Flash Memory) and the communication with the ELCB is established.

Later on, an active Error LED indicates that an error occurred (e. g. short circuit, watch-dog event,...) and that in consequence all valves and connected sensors are switched off.

Figure 18.4 Front view of a SPB-E

Error: red

Ready: green

Power: green

Helium supply 30V: greenLIFT

BUFFER


GAS 2 IN

SHIM COOLING GAS

GAS 1 IN

SPIN STANDARD BORE

SPIN WIDE BORE

VT GAS

PROBE FLUSH GAS

Helium level

Nitrogen level

Sample Changer

Sample Control(BST)

Auxiliary Interface

VPSB control 2

VPSB control 1

VPSB connected

VPSB connected

(analog mode)

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Ready LED

This LED is active as soon as the FPGA design is loaded and valve and sensor inter-faces are active.

Power LED

Indication that the SPB is correctly powered.

HE30V LED

Indication that the galvanically isolated power supply for the helium level measurement is available.

VPSB connected LED

Whenever a VPSB is connected and initialized correctly, the LED above the connectors labeled VPSB CTRL will be switched on. This can used for diagnostic purpose.

Connectors

Connectors are protected against short-circuiting. Nevertheless, ensure correct wiring.


HELIUM LEVEL Connector for helium level sensor

NITROGEN LEVEL Connector for analog nitrogen level sen-sor

SPB-E only

SAMPLE CHANGER

External sample lift control, currently used by the BACS sample changer.

SAMPLE CONTROL Signals from BST (upper light barrier, sample down sensor and tube version)

AUX Auxiliary bus connector for BSMS/2 VT adapters, digital nitrogen level sensor or future use of other accessories

SPB-E only

VPSB CTRL 2 Control signals for BSMS/2 Variable Power Supply Board (VPSB)Digital signalling is with LVDS at 10MBit/s

SPB-E only

VPSB CTRL 1 Control signals for BSMS/2 Variable Power Supply Board (VPSB)Digital signalling is with LVDS at 10MBit/s

Table 18.13 Connectors

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SPB

18.5 Function Description

18.5.1 Liquid Helium Level Measurement

For monitoring the He-level, a He-level sensor is inserted into the top of the helium dewar. This He-level sensor is a superconducting sensor through which electrical cur-rent is caused to flow. When warm, the sensor has a resistance of about 100 Ohms. The voltage resulting from the saturation resistance gives an indication of the actual He-level in the dewar.

The He-level sensor is galvanically isolated from the BSMS/2 electronics. Measured sig-nals are amplified and sampled. All control and data lines are galvanically isolated. The He-level sensor current is produced by a digital controlled current source. The applied current is measured via a shunt resistor and the differential amplifier A1 as a function test. The voltage across the sensor is measured by the differential amplifier.

To avoid damaging the magnet or evaporating too much helium through warming, the length of time the current is applied is limited. The supply of power is restricted to a max-imum period of 30 seconds by the switch S1. As a further safety measure, the S2 switch short-circuits the He-level sensor in between measurements to provide a current bypass.

Sta

rter

Res

isto

rS

upe

rco

nd

uctin

g W

ireHe

-le

vel s

enso

r

+30V

A

D

A2

–

+

S2

Sensor current OnS1

Rm 5

Digital Controlled Current Source

He-level

Sensor bypass OnA1

–

+Sensor current

Multifuse

15

Ohm

A

D

A

D

A

D

galv

an

ic is

ola

tion

D

A

digital Data

digital Data

digital Data

HE_RESET

HE_SHORT

Tim

er

Figure 18.5 Helium level measurement principle

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18.5.2 Analog Liquid Nitrogen Level Measurement (SPB-E only)

Nitrogen level measurements are performed by a sensor that is encircled by a cylindrical conductor. The sensor and surrounding conductor form a capacitor. The presence of liq-uid nitrogen between the sensor and conductor changes the capacitance, and this is measured and converted by the sensor electronics into a proportional voltage which is interpreted by the SPB-E to provide the reading.

The measurement circuit on the SPB-E board is separated galvanically from the other electronics.

The interface of the SPB-E is fully compatible with all models of Bruker "Nitrogen Level Sensor".

It is recommended to use the digital nitrogen level sensor and connect it to the AUX port of the SPB-E or the BSMS/2 VPSB. For details see "Nitrogen Level Sensor" on page 291.

18.5.3 Sample Down and Sample Up Detection

The interface for standard Bruker Shim Upper part (BST) is backward compatible to the former SLCB circuit. An improved signal processing for the sample down detection allows reliable detection of the various spinners. Sensor supplies are short circuit proof and wiring detection allows improved system diagnostic.

+10V

-10V

AD

galv

anic

isol

atio

n

DC

DC

+10V

-10V

+24V

Buffer

Nitrogen level sensor

Data

normalized voltage:-5V = 0%0V = 100%

Cap.meter

Figure 18.6 Analog nitrogen level measurement block diagram

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SPB

18.5.4 Version of the Shim Upper Part

The shim upper part version can be read by the SPB.

i Old style shim upper parts (SOT72) using Z12084 CABLE ADAPT BSMS/SOT72 can be connected to a SPB(-E) ECL02.03 and newer. Because these shim upper parts do not include a sample up light barrier, reduced functionality (sample lift speed, display) will result.

BST_+5V

12345678

100

SAMPLE DOWNREFERENCE

+5V +5V

12

765 3

8

4 SAMPLE_UP

270BSMS/2 SPB

RJ45

BST

+5V

GND

SA

MP

LE_

UP

SPIN

LED_RETURN

+5.00V

SIGNAL

A

D

(SPIN)VOLTAGE

Figure 18.7 BST Signals

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SPB

18.5.5 Sample Changer Interface

The sample changer has its own pneumatic controller. The shim upper part (BST) is equipped with a light switch to detect whether there is a sample present for pickup. This information is then passed to the sample changer via the sample changer interface of the BSMS.

reserved / do not connect

Remarks:

• all signals from SPB are galvanically isolated

• SampleUp / SampleUp represent the state of the upper light barrier directly

• outputs are complementary, broken lines can be detected

The measurement circuit on the SPB board is galvanically isolated from the other elec-tronics.

Pin Signal (Connector)

Function Specification

1 SampleUp positive active (CMOS-high)when sample is up

CMOS, IOut max. +/-4mA

2 SampleUp negative active (CMOS-low), when sample is up CMOS, IOut max. +/-4mA

3

4

5

6

7 S_5VP +5V from sample changer +/- 5%, IL max. 30mA

8 S_GND ground potential from sample changer

Table 18.14 Pin assignment Sample Changer RJ45

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SPB

18.5.6 Control Output for BSMS/2 Variable Power Supply Board

The SPB provides 1 (SPB) or 2 (SPB-E) interfaces for connecting BSMS/2 VARIABLE POWER SUPPLY BOARDS (VPSB). These boards do not have any connections to the BSMS/2 backplane and all control signals are carried over this interface.

On the interface connector some supply and detection signals and a high speed LVDS-based digital interface are wired. The LVDS-based interface carries the Synchronous Serial Rack Bus signals from the ELCB and BSMS/2 backplane over the cable connec-tion to the control FPGA on the VPSB. The interface is hot-plug capable, has automatic connect/disconnect detection and power supply signals are short-circuit proof.

Figure 18.8 Overview of point-to-point full duplex VPSB CTRL interface

M-LVDS LVTTL

GND_24V

FPGA

up to 20m shielded twisted-pair

DC/DC

SCLK

STXD

SRXCLK

Limit

optionalgalvanicisolation

SCLK

SRXD

STXD

FPGA

5 V

Limit24 V

GND

BISSRCLK

SINTR

SRXD

SINTR

AWG 28max. 0.44 Ohm/m (loop impedance)

SCLK_EN

STX_EN

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Pin Signal Pin Signal

1 GND_24V 11 +24V

2 GND_24V 11 +24V

3 GND_5V 13 FLOW_VT_GAS_ON_N

4 GND_5V 14 FLOW_VT_GAS_REQ_N

5 LVDS_SRX_P 15 LVDS_SRX_N

6 LVDS_STX_N 16 LVDS_STX_P

7 LVDS_SRXCLK_P 17 LVDS_SRXCLK_N

8 LVDS_SCLK_N 18 LVDS_SCLK_P

9 RES0 19 SINTR_N

10 GND_5V 20 +5V

Table 18.1. Pin assignment VPSB CTRL (master interface)

+24V

LVDS_STX_N

LVDS_SRX_PGND_5V

GND_24V

LVDS_STX_P

LVDS_SRX_NFLOW_VT_GAS_REQ_N

+24VFLOW_VT_GAS_ON_N GND_5V

GND_24V

SINTR_N RES0LVDS_SCLK_NLVDS_SCLK_P

LVDS_SRXCLK_N LVDS_SRXCLK_P

GND_5V+5V

MASTER

Figure 18.9 Pinning VPSB CTRL

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SPB

18.5.7 Auxiliary Bus Connector (VT Accessory, SPB-E)

With introduction of the Bruker Sample & Variable Temperature System (BSVT) a new generation of sensor interface adaptors are available. These adapters convert sensor signals into a digital data-stream. These sensors are typically connected to the BSMS/2 VARIABLE POWER SUPPLY BOARDS (VPSB).

The SPB-E variant is equipped with one supplementary auxiliary bus interface connec-tor.

The interface is hot-plug capable, has automatic connect/disconnect detection and power supply signals are short-circuit proof.

Gnd

FPGA

20m shielded twisted-pair

DC/DC

STXD

Limit


STXD

5 V

Limit24 V

Gnd

AWG 24 0.16 Ohm/m (loop resistance maximum)

BIS

STXD_EN

SRXDSRXD

SRXD_EN

FPGA, PLD

or Controller

Figure 18.10 Overview Auxiliary Bus Connector (SPB-E) only

Pin Signal

1 TX+

2 TX-

3 RX+

4 24V

5 GND_24V

6 RX-

7 5V

8 GND_5V

Table 18.15 Pin assignment of AUX connector RJ45

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18.5.8 Pneumatics

For detailed technical specifications please see "Technical Data" on page 235 .

The SPB contains all valves, valve drivers, and pneumatic connectors necessary to con-trol

• sample lift

• sample spinner (sample rotation)

• VT gas

• probe flush gas

• shim system cooling gas

• emergency lift detection

and replaces the former BSMS/2 PNK3, PNK3S and PNK5 boards.

The valve drivers are galvanically isolated and the module is controlled by the ELCB which also saves the calibration values.

To provide usage of different gases for sample transport/shim cooling and delicate probe head gases (VT, spin, flush gas), these two functional groups have separate gas inputs.

For reasons of sample safety it is necessary to connect a buffer to the lift system.

With the exception of the lift system and emergency lift gas for the CryoProbe sample safety option, there are no further calibration procedures necessary. In particular spin calibration is not necessary.

Controlled gas flow

The VT gas flow on the SPB(-E) is controlled using the integrated mass flow meter a solenoid control valve. Flow variations (within physical limits, some minimal quality of gas supply must be guaranteed) of the gas supply are eliminated and as a result stable conditions for the temperature regulation are provided.

The gas flow meter is factory-calibrated and the compensation values stored on the on-board non-volatile flash memory.

NOTICE


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SPB

CryoPlatform Emergency Lift Detection

For the CryoProbe Systems there is a Sample Safety Option available. This option runs independently from the NMR console and guarantees sample tempering (in case of a power failure) and emergency sample lift (in case of vacuum breakdown).

This additional emergency lift air must NOT be fed directly into the emergency lift input as with the legacy PNK3S. Instead the emergency lift air must be carried through an external throttle valve.

As before the amount of emergency lift air flow must be adjusted with this external throt-tle valve. Please see CryoProbe installation manual for details and some notes in "BSVT with CryoProbes" on page 228.

Regulated Gas Flow Channel SPB SPB-E

VT yes yes

Probe flush gas no (fixed flow) yes

Shim Cooling gas no (fixed flow) yes

Table 18.16 Controlled gas flows

NOTICE

The mass flow controller can not compensate for poor gas supply or insufficient input gas pressure. The new gas flow regulation ensure sta-ble gas flow as long as site planning specifications for pressurized gas are met.

to magnet

Lift air

EMERGENCY

SPB

GAS 2 INBUFFER

LIFT OUT

Emergencyair fromCryoPlatform

Supplyair

Buf

fer

Lift Valve

LIFT Flow detection

controlthrottle valve

Figure 18.11 Block diagram emergency lift detection

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SPB

18.6 Bus Interface

As mentioned earlier in this document, the SPB is not connected to the VME bus. The communication with the ELCB runs exclusively over the User Bus.

Pin A B C



30 AGND AGND AGND

29 AGND AGND AGND







22 - Slot ID 0 -

21 - Slot ID 1 /RNext




14


12 DGND DGND DGND

11

10

9

8

7 HE_+30V HE_+30V HE_+30V

6 HE_+30V HE_+30V HE_+30V






Table 18.17 User Bus Back Plane Connector (DIN41612 R)

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SPB

18.7 Service

A connected SPB in a BSMS system is controlled by the ELCB software - both, the spe-cific low level drivers and the overall control logic is implemented there. The ELCB soft-ware provides the operational functions for the NMR application by a CORBA interface. In addition there is a Web access available for service purpose (setup, calibration and diagnostic). Some of these Web functions are open to all users, other functions are reserved for service engineers - it is necessary to log in and enter the required password before these functions can be accessed (description in the BSMS/2 Service Web chap-ter).

18.7.1 SPB Service Web

The SPB Service Page contains information about the board itself. Functions controlled by the ELCB are described in the corresponding chapters.

Figure 18.12 SPB Service Page

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SPB


During normal operation all important signals and supplies are supervised. In case of a fatal hardware failure the board will go to a safe state (e.g. closes all valves). This is real-ized with a board watchdog mechanism. Board level trouble shooting must be done in the factory.

In case of failures, always check the LEDs on the SPB front panel and the LEDs on the BSMS/2 Power Supply Boards:

• red LED ERROR must be off

• green LED‘s READY, POWER and HE30V must be on

• if a VPSB is connected, the green LED above the VPSB CTRL connector must be on

Sample Rotation (SPIN) not Running

• Check air hoses and console gas pressure

• Lift the sample and insert again

• Check the sample down sensor signal threshold levels

•

Thresholdsforrotationmeasurement

must be enabled

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SPB

Gas Flow Variations

• Check supply pressure

• Check the gas pressure after console the pressure regulator, pressure must be higher than 4 bar and stable.

As long as the console pressure is within the specified range of 4-6 bar the flow can be stabilized. The gas supply pressure must be at minimum 1 bar higher than set with the pressure regulator of the console (margin for proper pressure regulation).


See "Minimal requirements for all configurations" on page 206.


See "Basic BSMS/2 BSVT Configuration" on page 206.

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260 Z108028_00_06

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19 VPSB

19.1 Introduction

The VPSB (Variable Power Supply Board) is a new development for the Temperature Control System.

Today‘s and future applications need flexible, scalable, highly integrated, precision power sources as heater power supplies. The VPSB integrates two independent vari-able power sources in one 12TE 19“ unit.

Precise temperature regulation for NMR samples over a wide range of VT gas flows and temperatures demands a very stable power source that can regulate heater power down to true zero watts and which is controllable with fine resolution. On the other hand new high temperature NMR experiments demand increased heater power.

Thanks to a novel architecture and modern integrated analogue and digital technology it is possible to integrate these characteristics into one compact unit.

Low level hardware functions (e.g. safety circuits, A/D and D/A converter control) are implemented directly on the VPSB, whereas higher level functions such as output power control and read-out of the power monitoring are done by software running on the ELCB.

A two-stage watchdog system and a smart probe heater impedance meter circuit ensure safe operation in case of serious malfunction.

The VPSB has interfaces for connecting new digital accessory sensors (temperature, digital level sensors).

19.2 Configurations

There is only one board variant available.

One VPSB has two power outputs that allow to set-up two controlled temperature chan-nels. If more than 2 regulated temperature channels are required, then a second VPSB board can easily be added to the BSMS/2. There is only a mains cord and a control cable to connect. A requirement for operation with two VPSB is the presence of a SPB-E (Z115192).

26128_00_06

VPSB

19.3 Technical Data

19.3.1 Technical Data, Environment and Norms

19.3.2 Electrical Specification

Both power outputs have the same specification:


Input voltage range 85 264 VAC

frequency 47 63 Hz

Ambient operating temperature 15 45 °C

Safety EN 61010-1

Protection degree IP20

Approval CB (EN60950)a

a. including national deviations for Canada and the USA

Table 19.1 VPSB, technical data


Output power 0 210 W

Output voltage range 0 48 VDC

Output current 0 7 A

Settling time 10..100% load 10 ms

Ripple & Noise 30MHz BW 50 mVpp

Hold-up time >10 ms

Short circuit protection constant current

Table 19.2 Variable Supplies Specification

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VPSB


Figure 19.1 Block diagram of the VPSB

Power Supply

Control FPGA

Flash

VP

SB

LVDS

CT

RL

ERRORREADYPOWER

VCXO

VARIABLE POWER SUPPLY BOARD

IO

A

A

D/A

DA

D/A

DA

A/D

DA

A/D

V

V

24V

+5V +15

V

FP

GA

SU

PP

LY

MAINS

VT PWR 1VT PWR 2VTA 1VTA 2AUX 1AUX 2

VTA 1

VTA 2

AUX 1

AUX 2

control and sync

inhibit

from

SP

B

TRIPLEPOWERSUPPLY

+5V+24V

heat

er im

peda

nce

mea

s. c

ircui

tD

A

Watchdog

serial bus

reset

trigger

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VPSB

19.4.1 Control FPGA

The control FPGA receives commands (e.g. desired heater power) from the ELCB via the SPB LVDS (Low Voltage Differential Signaling) link. The link is an extended Synchro-nous Serial Rack Bus (SSRB). The FPGA drives the Digital-to-Analog and Analog-to-Digital converters that control the power stages of the variable power supplies.

19.4.2 Triple Power Supply and Output Power Control

The heart of the VPSB is a 450W triple power supply with wide-range input. It can con-trol the two main outputs down to true Zero with full resolution. The third supply delivers fixed +24V for external devices and on-board circuits.

The output of a VPSB channel is enabled whenever a temperature regulator is operat-ing.

Before the output power is enabled the load resistance is measured by dedicated elec-tronics with high precision. Afterwards, during actual VT operation, output current and voltage are measured and monitored. For a specific heater power, the voltage is evalu-ated based on the inital load resistance. If the load resistance changes significantly dur-ing operation (e. g. broken lines, contact problems, material faults) then the BSVT switches off and issues an error message.

The two power stages can be enabled independently.

The registers for output power commands are self-clearing. A control instance must therefore update the output parameters at regular intervals, otherwise the outputs are reset by a watchdog circuitry for safety reasons.

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VPSB

19.4.3 Output Power Connector

:

915 1011121314

17 234568

Figure 19.2 D-Sub15 female, pin assignment (VTA 1, VTA 2)

DSub Pin Signal

1 Heater Power +

2 Heater Power +

3 Heater Power -

4 BFB_TX-

5 BFB_24V

6 BFB_RX-

7 BFB_5V

8 BFB_GND_5V

9 Heater Power +

10 Heater Power -

11 Heater Power -

12 BFB_TX+

13 BFB_RX+

14 BFB_GND_24V

15 reserve

Table 19.3 D-Sub15 female, pin assignment

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19.4.4 Auxiliary Bus Connector (VT Accessory)

Together with the Bruker Sample & Variable Temperature System (BSVT) a new genera-tion of sensor interface adaptors (VTA) are introduced. These adapters convert the sen-sor signals into a digital data stream and usually are connected to the BSMS/2 VARIABLE POWER SUPPLY BOARDS (VPSB).

The interface is hot-pluggable, has an automatic connect/disconnect detection and the power supplies are short-circuit-proof.

19.4.5 Protection

All external interfaces are protected against short circuits (limiting the output current or with current measurement and power switches).

Figure 19.3 Overview Auxiliary Bus Connector

Gnd

FPGA

20m shielded twisted-pair

DC/DC

STXD

Limit


STXD

5 V

Limit24 V

Gnd

AWG 24 0.16 Ohm/m (loop resistance maximum)

BIS

STXD_EN

SRXDSRXD

SRXD_EN

FPGA, PLD

or Controller

Pin Signal

1 TX+

2 TX-

3 RX+

4 24V

5 GND_24V

6 RX-

7 5V

8 GND_5V

Table 19.4 Auxiliary Connector RJ45, pin assignment

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VPSB

The power stages are protected against over-heating.


The on-board diagnostics supervise essential board functions like power supply and clock synchronisation. A two-stage watchdog mechanism checks for valid connection to the ELCB and for valid power commands. In case of a failure the board will reset and switch off the power stages.


Status / Errors

The VPSB can perform the following checks:

• Power voltages ok

• Short circuits / disconnected lines at heater or sensor interface connectors

All connectors are equipped with current-shunt monitors. These measurements

allow detection of connected adapters and over-current conditions.

19.4.7 Calibration

There are no calibration settings to store on the VPSB.

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VPSB

19.4.8 Bus Interface

Though inserted in one of the BSMS/2 rack slots, the VPSB has no connection to the backplane. The communication with the ELCB exclusively runs over the VPSB CTRL cable from the SPB board.

Pin Signal Pin Signal

20 GND_24V 10 +24V

19 GND_24V 9 +24V

18 GND_5V 8 FLOW_VT_GAS_ON_N

17 GND_5V 7 FLOW_VT_GAS_REQ_N

16 LVDS_SRX_P 6 LVDS_SRX_N

15 LVDS_STX_N 5 LVDS_STX_P

14 LVDS_SRXCLK_P 4 LVDS_SRXCLK_N

13 LVDS_SCLK_N 3 LVDS_SCLK_P

12 RES0 2 SINTR_N

11 GND_5V 1 +5V

Table 19.1. Pin assignment VPSB CTRL (slave interface)

+24V

LVDS_STX_N

LVDS_SRX_PGND_5V

GND_24V

LVDS_STX_P

LVDS_SRX_NFLOW_VT_GAS_REQ_N

+24VFLOW_VT_GAS_ON_NGND_5V

GND_24V

SINTR_NRES0LVDS_SCLK_N LVDS_SCLK_P

LVDS_SRXCLK_NLVDS_SRXCLK_P

GND_5V +5V

SLAVE

Figure 19.4 Slave pinning VPSB CTRL

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VPSB


Error LED

This LED is lit after power ON. It turns off as soon as the VPSB is initialized (i.e. the FPGA has loaded its configuration from the flash memory and the communication with the ELCB is established).

Later on, the Error LED indicates is lit when an error has occurred (e. g. short circuit, watchdog event,...) and that in consequence the connected VTAs and the power outputs are switched off.

Figure 19.5 Front view of a VPSB

Error

Ready

Power

VPSB control

Mains

connectors

connectorsfor auxiliary VT adapters (typically accessory

for VT adapterson power channels(e.g. probe heater,N2 evaporator)

like BCU, N2 exchanger)

VT PWR 1

VT PWR 2

VTA 1

VTA 2

AUX 1

AUX 2

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VPSB

Ready LED

This LED is lit as soon as the FPGA design is loaded and the sensor interfaces are active

Power LED

Indication that the VPSB is correctly powered

VT PWR 1

This LED is lit whenever the output power on the connector VTA1 is enabled

VT PWR 2

This LED is lit whenever the output power on the connector VTA2 is enabled

VTA 1 LED

Whenever a VTA is connected to the connector labeled VTA 1 and initialized correctly, the LED will be switched on

VTA 2 LED

Whenever a VTA or BSCU is connected to the connector labeled VTA 2 and initialized correctly, the LED will be switched on

AUX 1 LED

Whenever a VTA is connected to the connector labeled AUX 1 and initialized correctly, the LED will be switched on

AUX 2 LED

Whenever a VTA or BSCU is connected to the connector labeled AUX 2 and initialized correctly, the LED will be switched on

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VPSB

Connectors


VTA 1 for VTA adapters that are used for power channels (e.g. probe heater, LN2 accessory)

VTA 1 will be mapped to regulator channel 1 in Topspina

a. if a 2nd VPSB is in use then its VTA 1 will be mapped to regulator channel 3 and VTA 2 to regulator channel 4 respectively

VTA 2 VTA 2 will be mapped to regulator channel 2 in Topspin

AUX 1 for VTA adapters that do not require heater power (e.g. BCU control)

AUX 1 will be mapped to auxiliary channel 1 in Topspinb

b. if a 2nd VPSB is in use then the device at AUX 1 will be mapped to auxiliary channel 3 and AUX 2 to auxiliary channel 4 respectively

AUX 2 AUX 2 will be mapped to auxiliary channel 2 in Topspin

MAINS Mains power

Table 19.5 VPSB front panel connectors

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19.5 Service

A connected VPSB in a BSMS system is controlled by the ELCB software - both, the specific low level drivers and the overall control logic is implemented there. The ELCB software provides the operational functions for the NMR application by a CORBA inter-face. In addition there is a Web access available for service purpose (setup, calibration and diagnostic). Some of these Web functions are open to all users (e. g. clients), other functions are reserved for service engineers - it is necessary to log in and enter the required password before these functions can be accessed (description in the BSMS/2 Service Web chapter).

19.5.1 VPSB Service Web

The VPSB Service Page contains information about the board itself. Functions con-trolled by the ELCB are described in the corresponding chapters.

monitoring

voltage andcurrent

Figure 19.6 VPSB Service Page

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VPSB


During normal operation all important signals and supplies are supervised. In case of a fatal hardware failure the board will go to a safe state (e.g. shut down f the power con-version stages). This is implemented with a board watchdog system. Board level trouble shooting must be done in the factory.

In case of failures, always check the LEDs on the VPSB front panel and the connection to the SPB

• red ERROR LED must be off

• green READY LED and POWER LED must be on

• if a VTA is connected, the corresponding green LED must be on

• if the output on a channel is on (e.g. during temperature regulation) the correspond-ing yellow LED (VT PWR 1 or VT PWR 2) must be on. If not, check cables, connec-tors and firmware on connected devices.

i There are no fuses that could be replaced at customer site.





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20 VTA

20.1 Introduction0 VTA is the abbreviation for Variable Temperature System Adapter.

For application specific needs a wide variety of temperature sensors and heater inter-faces must be supported. Some NMR probes need standard thermocouple sensors type-T, others need PT100 thermistors, some need two sensors etc.

In order to obtain precise and accurate temperature measurement the analog sensor signal cannot be carried over long distances or have many connector contacts between sensor and electronics.

Many NMR users want to work with different NMR probes and therefore must change the sensor adaptation conveniently.

For every temperature sensor and heater adaptation variant or other accessory device a tailored VTA is available but only one type of cable connection is needed for probe to console adaptation. This cable carries wires for digital signals, low-voltage power supply and the heater power.

The VT Adapters for probe head temperature control

• adapt the specific sensor, convert the sensor signal to a digital temperature reading and transmit this value to the BSMS/2 ELCB.

• measure the environmental temperature, use this value to compensate the room temperature dependencies of the specific sensor and transmit the room tempera-ture value to the BSMS for further elimination of room temperature artefacts.

Heater power and heater safety sensor signals are fed through the VTA for three rea-sons:

• the heater power and the corresponding regulation sensor are bundled, thus pre-venting erroneous usage of a spare sensor for regulation

• the heater over-temperature sensor can be evaluated

• the heater current can be filtered close to the probe, suppressing RF noise picked up by the long cable running from the console to the magnet

To connect other temperature accessories like chillers, heat exchangers, nitrogen level measurement, pressure measurement etc. there are dedicated VTAs available. These accessory adapters are connected through a thinner cable that carries digital signals and low-voltage power supply only.

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r

20.2 Configurations

The various applications and related VTA variants are presented in the following chap-ters:

• "BSVT Probe Adaptation" on page 211

• "BSVT and Heater Accessory (Power Booster)" on page 216

• "BSVT and VT Gas Cooling Accessory Adaptation" on page 218

• "BSVT and FlowProbe Adaptation (FLOW-NMR)" on page 222

Bruker Part

Number

Name Marking Typical usage [Power or

Auxiliary ]a

Typical usage Connected devices

Z119237 BSMS/2 VTA TC-2T TC-2T POWER RT, Solids and Flow-probes

VTN/WVT/DVT

Z116924 BSMS/2 VTA BTO BTO POWER RT probeswith BTO2000

Z116923 BSMS/2 VTA CRP CRP POWER CryoProbe

Z120851 BSMS/2 VTA FLOW-NMR FLOW-NMR POWER Flow NMR Capillary Heater

Z120728 BSMS/2 VTA TC-2E TC-2E POWER probes for solids,high temperature

Z119238 BSMS/2 VTA LN2 LN2 POWER N2 EvaporatorN2 heat exchanger

Z116925 BSMS/2 VTA BCU BCU AUX BCU-05, BCU-X

Z119720 BSMS/2 VTA BVTB BVTB AUX BVTB3500 Power Booster

Z119239 BSMS/2 VTA AUX-2P AUX-2P AUX -

Z116922 BSMS/2 VTA TC-T TC-T POWER RT probes

Table 20.1 List of available VTAs

a. POWER means that this application needs heater power and therefore must be connected through a cable that contains heatepower wires to an output of the VARIABLE POWER SUPPLY BOARD (VPSB)

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20.3 Technical Data

VTA TC-T

VTA BTO


Temperature measurement Range -270 400 °C

Thermocouple type T Accuracy +/- 0.5 °C

Number of channels 1

Connector typea A

Heater Connector type H

Maximum voltage 50 V

Maximum current 7 A

Safety temperature measurement Range -200 +850 °C

Thermocouple type K Resolution 0.1

Measurement update rate 1 s-1

Table 20.2 VTA TC-T

a. connector types: see "VTA cable connectors" on page 282



Thermocouple type T Accuracy +/- 0.5 °C


Connector typea C

BTO2000 Supply Voltage 24 V

Current 500 mA

Connector type D



Maximum current 7 A




Table 20.3 VTA BTO


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VTA CRP

VTA TC-2T


Temperature measurement Range -200 +850 °C

PT100 Accuracy, without sensor +/- 0.25 °C


Connector typea M/N

Heater Connector type M/N


Maximum current 2.5 A


PT100 Resolution 0.1


Table 20.4 VTA CRP




Thermocouple type T Accuracy, without sen-sor

+/- 0.5 °C


Connector typea A



Maximum current 7 A




Table 20.5 VTA TC-2T


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VTA

VTA FLOW-NMR

VTA TC-2E



Thermocouple type T Accuracy (without sen-sor)

+/- 0.5 °C

Type 1


Connector typea A

Heater Connector type J


Maximum current 7 A


PT100 Resolution 0.1


Table 20.6 VTA FLOW-NMR



Temperature measurement Range -200 +1000 °C

Thermocouple type E Accuracy (without sen-sor)

+/- 1 °C


Connector typea B



Maximum current 7 A




Table 20.7 VTA TC-2E


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VTA

VTA LN2

VTA BCU


Level measurement Range 0 500 Ohm

Resistive PT100 type Resolution 0.1 Ohm

Accuracy +/- 1 Ohm

Stability °C/°C

Connector typea J

Heater Connector type J


Maximum current 7 A


Resistive PT100 type Resolution 0.1 °C


Table 20.8 VTA LN2



Control signal output Max. voltage 5 V

Max. current 50 mA

Connector typea K

Table 20.9 VTA BCU


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VTA

VTA BVTB

VTA AUX-2P

VTA MAG-RS


BVTB control signal Connector typea L

Control voltageb 0 +10 V


(amplified voltage from BVTB3500) Resolution 0.1 °C


Table 20.10 VTA BVTB


b. 0..+10V (refers to 0..500W), accuracy is defined from driving VPSB




Connector typea C


Table 20.11 VTA AUX-2P





Connector typea O

Heater Connector type P


Maximum current 7 A


Table 20.12 VTA MAG-RS


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Figure 20.1 VTA cable connectors

BVTB3500

A +5V (VCC)C NCE GND_BTO (isol.)G +15 v_BTO (isol.)J NCL DGNDM sdaN sclO power controlP PNEU_GND,HEAT_GNDR PNEU_GND,HEAT_GNDS thermocoupleT b_relayU b_connected

PT100orBTO2000

Thermocouple T

N2HEATER

1 heater -

2 heater -

3 safety thermocouple -

4 safety thermocouple +

5 heater +

6 heater +

7 GND (Shield)

1 current +

2 PT100 / BTO T+

3 PT100 / BTO T-

4 current -

3 (Cu) GND (Shield)

1 (Cu) Thermocouple +

2 (CuNi) Thermocouple -

1 N2 heater +, power output

2 level sensor +,

3 evaporator detection,

4 AGND

5 N2 heater - ,

6 exchanger detection, exchanger

BCU05

1 heater on (output) turns on

2 DGND

3 nc not connected

the BCU05 when high (> 2,4 V)

evaporator detected if grounded

level detection input (0 - 2,5 V)

detected if grounded

1

2

Thermocouple E

3 (Cu) GND (Shield)

1 (NiCr) Thermocouple +

2 (CuNi) Thermocouple -

1

2 3

2

1

BTO2000

1 BTO XGND

2 BTO +24V

3 BTO GND

Power Supply

Front View on Cable Connectors (Mating Side)

1

2

3 4

5

6

7

A B C D

H J K L

1

2

34

5

6

CRP LEMO 6

1 heater +

2 safety sensor PT100 T+

3 safety sensor PT100 T-

4 sample sensor PT100 T+

5 sample sensor PT100 T-

6 heater -

12345

6789

1 sample sensor PT100 T+

2 Relay contact 1 (GPI 1)

3 -

4 XGND

5 -

6 sample sensor PT100 T-

7 Relay contact 2 (GND/GPI1)

8 -

9 X24V (+24..31V) from

CryoPlatform (CRCO)

M N

3 BTO GND

O

5

12

3

4

1 safety sensor PT100 T+

2 safety sensor PT100 T-

3 heater -

4 heater +

5 -

Magnet RS (Heater)

(incl. excitation)

(incl. excitation)

CryoController

1 2

34

1 ssensor excitation +

2 sensor signal +

3 sensor signal -

4 sensor excitation -

5 -

Magnet RS (Sensor)

P

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VTA


The primary function of the VTA is to adapt the various sensors and signals of probe-head and chiller devices to the common interface of the BSMS/2 integrated VT system.

Inside the VTA a common basic infrastructure for configuration, communication and board identification (BIS) is available. Depending on the specific function these are com-plemented by the appropriate number of ADC channels, galvanic isolation or sensor excitation signals. Some VTA (e.g. for connecting a BCU) are equipped with solid-state switches.

Thermocouple Adaptation (VTA TC-T, TC-2T, TC-2E)

The thermocouple signal from the probehead is fed into the VTA where the cold-junction compensation and signal conversion is done. Simultaneous measurements of sensor temperature and cold-junction temperature leads to precise results. The heater current is fed through the VTA for RF filtering before entering the probehead. A dedicated ADC channel is used for measuring the safety temperature sensor that is mounted on the heater to prevent overheating. Broken, ground-shorted or disconnected sensor lines are detected for safety and diagnostic reasons.

Mainly for Solids NMR and high temperature applications there are VTA variants with two thermocouple connectors.

VTAs with two sensor inputs are fully operable with only one sensor connected. The open sensor line will be ignored and the VTA behaves like a single sensor type.

BTO2000 Adaptation (VTA BTO)

The cold-junction compensated signal from the BTO2000 is fed into the VTA where the signal conversion is done. The VTA BTO provides the power supply for the thermal oven and electronics of the BTO2000. Apart from that the device provides the same function-ality as the TC-2T variant.

Figure 20.2 Block diagram of the VT Adapter

Flash/BIS

PWRCH1CH2

VT ADAPTER

CH3CH4

VTA Controller

A/D

DA

A/D

DA

RF-Filterprobeheater

general purpose digital I/O

appl

icat

ion

spec

ific

sens

or a

dapt

atio

n

Se

rial

Inte

rfac

e

Power SupplyCon

nect

or

probe,

sensors

(applicationspecificcables)

OSCsafety or

heater power

accessory

LED

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CryoProbe Adaptation (VTA CRP)

In contrast to the room temperature probes the CryoProbes use PT100 sensors for both regulator and safety temperature measurement. Their heater impedance is higher than that of a room temperature probe.

Furthermore, the analog signal from the safety sensor has to be wired to the CryoPlat-form which also delivers the bias current. This ‘lending-out’ of the safety sensor estab-lishes a redundant system for sample temperature monitoring. To prevent ground coupling, the signals between the BSMS/2 and the CryoPlatform are galvanically iso-lated. If the CryoPlatform is switched off, the VTA is unable to measure the safety sensor and thus inhibits sample heating.

Care must be taken when connecting the CryoPlatform: The male connector on the CryoPlatform side exposes a voltage of about 29V on a pin. It is almost impossible to plug the VTA cable without shorting this pin to frame ground which can damage the CRCO and the VTA. Always switch off the CryoPlatform when connecting the VTA CRP to its rear panel! The VTA can be left connected to CryoPlatform and must not be disconnected when operating a RT probe.

BCU-05 and BCU-X Adaptation (VTA BCU)

To integrate the legacy “BCU” gas chillers into the new temperature system an adaptor VTA is needed. It detects the presence of such a chiller and enables remote operation.

The VTA BCU can be used for BCU05 or BCU-X (BCU-Extreme) type of cooling units and can be connected to an auxiliary control port.

New BSCU-05 and BSCU-X do not need a VTA BCU adapter. They come with an embedded VTA-style interface and should be connected to an auxiliary control port.

Adaptation of Low Temperature Options (VTA LN2)

For sample temperature control far below room temperature two devices are available: the LN2 Heat Exchanger and the LN2 Evaporator.

The VTA LN2 adapts both of these and detects the type of the connected device. It mon-itors the level and safety sensors and continuously sends these values to the BSMS/2 ELCB where they are evaluated.

For LN2 Heat Exchanger and LN2 Evaporator operation heater power is required. The heater power is fed through the VTA and the heater safety sensor is monitored for safe operation. For that an additional heater cable is necessary (Z116301 CABLE RD 15P 4.5M 1:1 BSMS/2 VPSB-VTA or Z116304 CABLE RD 15P 9M 1:1 BSMS/2 VPSB-VTA).

BVTB3500 Power Booster Adaptation

The BVTB3500 Power Booster is controlled by an external 0-10V signal that corre-sponds to an output power of 0-500W and an on/off control signal. The BVTB3500 itself provides a signal when the unit is powered on and makes the heater safety thermocou-ple signal available. The VTA BVTB is connected between the output of the standard probe heater and the BVTB3500 control connector. By monitoring the heater control sig-nal and safety thermocouple sensor the VTA is able to supervise the booster operation and provide safe operation.

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20.4.1 Protection

All external interfaces are protected against short circuits. The monitoring takes place on the VPSB board (measurement electronics) and on the ELCB board (monitoring of low-level-measurements from the VPSB board).

Monitored are:

- Heater and controller temperature

- Heater -voltage and -current

- Impedance of connected devices (e.g. heater)

- Communication between VTA and VPSB

Supervision is done via status information.

If one of the measurements is outside the tolerance, the BSVT and all connected devices will switch off.


The VTA detects shorted or disconnected lines at sensor interface connectors.

TC-2TVTA TC-T

PH

BVTB3500

Heater Cable

Lemo

Heater

Binder7-M

2.5m

2.5m

10m10m

VTA BVTB

TC-ADC

0-10V

Ready

3.5m

24V W1100117

0-10V

TC-EBTO...

BSMS

BSMS DSUB15

DSUB15

BoosterPower

Sensor Cable

Figure 20.3 Wiring diagram BSVT and BVTB3500

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l

The VTA sends periodically measurement data and status information to the BSVT con-trol software running on the ELCB board. In case of failure (e.g. missing status informa-tion) the VTA will be re-booted (power cycle on the VTA‘s 5V).

The software running on the ELCB may notify the user about abnormal events (failures, status information). This information is send via ethernet from the ELCB board to the workstation.

20.4.3 Calibration

There are no calibration settings to store on the VTA.

20.4.4 Connectors and LED‘s

Figure 20.4 The picture below shows two typical VT adapter

VT power

BusConnector

status and channe

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VTA

LED‘s CH1/2/3/4 and VT POWER

The LEDs on the VT adapters indicate the status of the adapters (connected, initialized). The indicated channel number (CH1, CH2, CH3, CH4) corresponds to the number which is displayed in the BSMS Service Web or on the vtudisp in Topspin.

VT adapters can be connected or disconnected at any time. The temperature control will go to OFF state if disconnected

In general, the

• green LED indicates the channel number and state

• amber LED indicates the heater status (power on, standby, on state)

Figure 20.5 LED Code on VT adapters

Ch1 Ch2 Ch3 Ch4

off, not powereddark

all blinking ready, but not initialized (2Hz, 250ms)

‚heartbeat‘

‚heartbeat‘

‚heartbeat‘

‚heartbeat‘

Sensor Channel 1

Sensor Channel 2

Sensor Channel 3

Sensor Channel 4

VT Power

POWER blinking Heater standby / off (2Hz, 250ms)

POWER darkPOWER steady

no heater availableheater on / regulator on

‚heartbeat‘

‚heartbeat‘

‚heartbeat‘

‚heartbeat‘

active Heater/Sensor Channel 1




blinking Internal failure (no signal)

VT POWER LED

CHANNEL LED‘s

blinking Internal failure (no BIS)

Heartbeat frequency: Power channel: long ON time, short OFF timeAuxiliary channel: short ON time, long OFF time

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Bus Interface

VT Adapters are connected to the VPSB or SPB-E. These boards provide the necessary power supply and data interface signals.

20.5 Service

20.5.1 VTA Service Web

There is no particular web site for each connected VTA, but there is a common page list-ing all VTA or other devices connected to one of the peripheral bus (BFB, Bruker Field Bus) connectors:

9 1510 11 12 13 14

1 72 3 4 5 6 8

Figure 20.6 D-Sub 15 male, pin assignment

DSub Pin Signal

1 Heater Power +

2 Heater Power +

3 Heater Power -

4 BFB_TX-

5 BFB_24V

6 BFB_RX-

7 BFB_5V

8 BFB_GND_5V

9 Heater Power +

10 Heater Power -

11 Heater Power -

12 BFB_TX+

13 BFB_RX+

14 BFB_GND_24V

15 reserved for production testing

Table 20.13 D-Sub 15 male, pin assignment

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VTA


The device state is displayed using the 5 LED. See "" on page 287 for detailed descrip-tion.

In addition, on-board diagnosis data or failure events are sent to the ELCB immediately and displayed within Topspin GUI or Logfile.





BFB Channel 1 corresponds to VTA 1 connector

Accessory CH1 corresponds toAUX 1 connectoron the VPSB board

on the VPSB board

currently connected VTA modeletc.

Figure 20.7 Overview of VTAs connected to the BFB peripheral bus

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21 Nitrogen Level Sensor

21.1 Introduction0 For the ASCEND family of NMR magnet systems a new digital liquid nitrogen sensor has been developed and introduced in 2010.

The new sensor is compatible with all AVANCE spectrometers with BSMS/2 BSVT elec-tronics (VPSB, SPB-E). For former BSMS/2 systems without BSVT, a Z108145 SLCB/3 board is necessary.

Due to its digital concept this sensor avoids effects of analogue technology and provides a user friendly plug and play operation as well as a direct on-board LED N2 level indica-tion. It allows measuring the level of the liquid nitrogen within the corresponding cryostat of the magnet system at any time and as many times as wanted. Together with MICS software the Nitrogen level measurement allows monitoring the Nitrogen level over lon-ger time periods and gives an estimate for the next refill date.

For easy use the sensor electronics has a built-in connector detection and automatically provides

• a digital reading of the absolute fill level in percent or

• an analog voltage between 0 and -5V (100% to 0% fill level)

on the same connector and is therefore fully compatible with all Bruker fill level measure-ment units.

21.2 Configurations and Installation

For every size of cryostat an individual nitrogen level sensor length is necessary. The electronics itself does not change.

On system level there are two configurations depending on AVANCE spectrometer gen-eration (digital or analog mode).

21.2.1 Installation

i For detailed information on sensor installation consult the Magnet System Service Man-ual SB/WB/SWB ZTKS0177 / Z31977 and the wiring on page 292.

29128_00_06

Nitrogen Level Sensor

21.2.2 Digital Configuration (BSMS/2 with BSVT)

Figure 21.1 Digital configuration

VPSBBSMS/2

AVANCE CONSOLE

AUX2

NITROGEN LEVEL

1

1 23

2

3 HZ14769 CABLE RD 8P 9000 DSUB 9P-RJ45

94209 ST BU 8-8 RJ45 MOD JACK COUPLER CAT 5E

88670 CABLE RD 4X2P2000 RJ45 CAT 5E VIOLET

orHZ16931 CABLE 9.0 MT BSMS/BSVT-MAGNETHZ16932 CABLE 5.0 MT BSMS/BSVT-MAGNET

HZ16931 and HZ16932 are combined cable sets between console and magnet

AU

X 2 Cooling

Unit

Cryo

for systemswith BSNLoption only

4 Z106877 CABLE 6M CU N2 LEVELZ109207 CABLE 8M CU N2 LEVELZ109208 CABLE 12M CU N2 LEVEL

H14037 CABLE SET NITROGEN SENSOR

4

292 Z108028_00_06

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ing

R

21.2.3 Analog Configuration (BSMS/2 with SLCB/3)

i Z115192 BSMS/2 SPB-E does also support the analog mode. When a SPB-E is avail-able it is recommended to use the digital mode and use the AUX connector (improved precision and diagnostic).

21.2.4 Protection

All external interfaces are protected against short circuits (either by limiting the output current or by current monitoring and shut down).

Figure 21.2 Analog configuration

SLCB/3BSMS/2

AVANCE CONSOLE

NITROGEN

NITROGEN LEVEL

1

1 23

2



88670 CABLE RD 4X2P2000 RJ45 CAT 5E VIOLET

LEVEL

NITROGEN

LEVEL

HZ16931 and HZ16932 are combined cable sets between console and magnet

CoolUnit

Cryo

for systemswith BSNLoption only

4

HZ16931 CABLE 9.0 MT BSMS/BSVT-MAGNETHZ16932 CABLE 5.0 MT BSMS/BSVT-MAGNET

or

4 Z106877 CABLE 6M CU N2 LEVELZ109207 CABLE 8M CU N2 LEVELZ109208 CABLE 12M CU N2 LEVEL

H14037 CABLE SET NITROGEN SENSO

293 28_00_06



The on-board diagnostics supervise essential board functions like power supply and ADC state. In case of a failure the board will reset and reboot.


Status / Errors

The LN2 sensor can perform the following checks:

• communication and functionality of the ADCs

• power voltages

• shorted or disconnected lines at sensor interface connectors

21.2.6 Calibration

Factory calibration is stored on the board (no field calibration necessary).

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LED‘s

Like the VT adapters the LN2 sensor can be connected or disconnected at any time.

In general, the

• green LED‘s indicates the current nitrogen level

• red LED indicate an error or low nitrogen level

Figure 21.3 The picture below shows a nitrogen level sensor

level indicators

D-SUB15 toCryoPlatform

D-SUB9 toBSMS/2 (standard)

(BSNL option)

295 28_00_06


Interface

The N2 level sensor is connected to the BSMS/2 BSVT electronics (back panel RJ45 connector labeled NITROGEN LEVEL) and to the CryoPlatform if a BSNL option is installed (Bruker Smart Nitrogen Liquefier). These units provide the necessary power supply and data interface signals.

Figure 21.4 LED Code on N2 level sensor

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9 10 11 12

1 2 3 4 5


DSub Pin Digital Systems (BSVT)

Analog systems (SLCB/3)

1 BFB TX+ +10V

2 BFB RX- -10V

3 BFB RX + NC

4 reserved NC

5 NC NC

6 BFB RX- analog output (-5V..0V)

7 BFB 5V GND

8 GND GND

9 reserved NC


9 1510 11 12 13 14

1 72 3 4 5 6 8


DSub Pin Signal DSub Pin Signal

1 sensor excitation + (input) 9 NC

2 sensor excitation - (input) 10 NC

3 sensor signal - (sense output) 11 NC

4 sensor signal + (sense output) 12 NC

5 NC 13 NC

6 NC 14 detection -

7 NC 15 NC

8 detection +


297 28_00_06


21.3 Service

This new digital nitrogen level sensor does not need any calibration in the field, the prod-uct is factory calibrated.

21.3.1 Service Web

There is an ELCB service web page available for the nitrogen level measurement.


The device state is displayed using the 5 LED. See "LED‘s" on page 295 for detailed description.

In addition, on-board diagnosis data or failure events are sent to the ELCB immediately and displayed within Topspin GUI or logfile.


See "Configurations and Installation" on page 291 and "Support for Nitrogen Level Sen-sor" on page 207


Part numbers of the sensor depend on magnet size and height. Please consult the mag-net documentation for an appropriate model and contact the sales department

[email protected]

Part numbers of cables in case of an upgrade can be found in "" on page 292 and "" on page 293 respectively.

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22 Radiation Shield Temperature Control (MAG-RS)

22.1 Introduction

For RS (refridgerated radiation shield) type of magnet systems the temperature of the refrigerated radiation shield inside the cryostat must be monitored during operation.

For that two PT 100 temperature sensors are mounted inside the cryostat. The tempera-ture measurement is realized using a digital adapter that can be connected to the BSMS/2 like other accessory (e.g. Nitrogen Level Sensor or BSMS/2 VTA).

In case of a failure the operator will receive an alarm by MICS.

22.2 Configurations and Installation

Necessary cable set: Z119854 CABLE SET BSVT AUXILIARY HEATER

22.2.1 Installation

i For detailed information on sensor installation consult the Magnet System Service Man-ual ZTKS0156 / Z31820 / Rev.: 03 and the wiring on page 300.

Bruker Part Number

Name Marking Typical usage

[Power or Auxiliary ]a

a. POWER means that this application needs heater power and therefore must be connected through a cable that contains heater power wires to an output of the VARIABLE POWER SUPPLY BOARD (VPSB)

Z122502 BSMS/2 VTA MAG-RS MAG-RS POWER

Table 22.1 Available unit

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R

TER

22.2.2 Connection to the Console (BSMS/2 with BSVT)

Figure 22.1 Connection to BSMS/2 (Monitoring and Service)

VPSBBSMS/2

AVANCE CONSOLE

VTA 2

1

1 23

2

3 Z116304 CABLE RD 15P 9.0M 1:1 BSMS/2 VPSB-VTA

Z123989 ST BU SFT 15 D-SUB SET

Z116299

VTA

2

Z119854 CABLE SET BSVT AUXILIARY HEATE

VTA 2

CABLE RD 15P 1.4M 1:1 BSMS/2 VPSB-VTA

VT POWER

CH 1

CH 2

CH 3

CH 4MA

G-R

S

Z122502BSMS/2 VTA MAG-RS

Default Wiring

Figure 22.2 Connection to BSMS/2 (Monitoring only)

VPSBBSMS/2

AVANCE CONSOLE

AUX21 2

AU

X 2

1

2



88670 CABLE RD 4X2P2000 RJ45 CAT 5E VIOLETZ119855 CABLE SET BSVT AUXILIARY NOHEA

3

AUX2

VT POWER

CH 1

CH 2

CH 3

CH 4MA

G-R

S

Monitoring only mode and usage of the cable Z117512 CABLE RD 8P 9.0M BSMS/2 AUX VTAis applied when the „power cable“ Z116304 is used for VT accessory (e.g. LN exchangeror LN evaporator).

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22.2.3 Protection

All external interfaces are protected against short circuits (either by limiting the output current or by current monitoring and shut down).

22.2.4 Measurements Provided for Diagnostics

The on-board diagnostics supervise essential board functions like power supply and ADC state. In case of a failure the board will reset and reboot.


Status / Errors

The MAG-RS unit can perform the following checks:

• communication and functionality of the ADCs

• power voltages

• shorted or disconnected lines at sensor interface connectors

22.2.5 Calibration

Factory calibration is stored on the board (no field calibration necessary).


Connectors and LED‘s

see "Connectors and LED‘s" on page 286

22.3 Service

This unit does not need any calibration in the field, the product is factory calibrated.

22.3.1 Service Web

For a pulse tube replacement or service, a heater must be activated.

There is an ELCB service web page available for service, please follow the instructions on:

BSMS/2 Service WEB -> Magnet Monitoring -> Magnet Control Service

301 28_00_06


22.3.2 Diagnostics and Trouble Shooting

The device state is displayed using the 5 LED. See "LED‘s CH1/2/3/4 and VT POWER" on page 287 for detailed description.

In addition, on-board diagnosis data or failure events are sent to the ELCB immediately and displayed within Topspin GUI or logfile.


See "Introduction" on page 299 and "Configurations and Installation" on page 299


For more information please contact the sales department

[email protected]

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23 Maintenance

23.1 Safety and Function Protection

Electrical System

Function Protection

Handling under ESD safety conditions is absolutely necessary.

WARNING

Before a unit can be unplugged for exchange, the BSMS/2 must be com-pletely switched off and the cables to the unit must be disconnected.

Avant qu'une unité puisse être débranchée pour l'échange, le BSMS/2 doit être complètement hors tension et le câble de réseau doit être débranché.

NOTICE

Use the ESD discharge bracelets while servicing the BSMS/2. Don’t touch uncovered metal surfaces on the PCBs, electronic devices or connectors before beeing grounded by the ESD bracelet.

Mettez le bracelet ESD avant de toucher les surfaces métallique sur le PCBs, les appareils électroniques ou les connecteurs.

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Maintenance

23.2 Replacing boards

If the ELCB is being replaced then the Shim values have to be stored by typing the Top-Spin command „wsh“.

Then the Shims can be ramped down softly by depressing the button „Soft Shutdown Shims“ on the page „Main“ -> „Service“ (see also figure 2.11 and 2.12). When the ramp down of the Shims is complete, the message „Shims shut down. Switch BSMS Power Off“ appears, and the BSMS/2 can be switched off for the replacement of the boards.

When the BSMS/2 has booted with the new hardware, the page „Main“ -> „Setup“ has to be opened, and it has to be checked if the firmware versions of all connected subsys-tems are correct. It may be necessary to download the required version from the Swiss ftp server and to install the firmware on the according board.

If the ELCB is one of the new boards then the complete calibration procedure has to be performed after the firmware check (as described before).

NOTICE

Before removing an SLCB, PNK or SPB board, it is recommended to make sure that there is no sample remaining in the magnet!

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Maintenance

23.3 Fans0 On top of the BSMS/2, there is the fan tray, which can be lifted up when the according screws are removed. It contains also the mains connector, the fuses and the power switch.

Figure 23.1 Fan Tray

with fuse

Power switch

Mains connector

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s

23.3.1 Fan Repair Procedure

0

WARNING

Before you remove a fan (e. g. a defect one), make sure that the mains cable is disconnected.

Figure 23.2 Fan Tray removal, step by step

1) Remove screws of the fan tray 2) Solder out the two wiresconnecting the fan to be removed

3) Cut the fan rubber fittingand remove the fan

Figure 23.3 Fan Tray Reassembly, step by step

1) Get a fan repair set 2) fix the rubber fittings 3) place the fan wire sidetowards the solder pads

4) solder the wires red => +black or blue => -

5) plug the fan with the rubberfittings and pull from the otherside until they snap in

6) shorten the rubber fittingsif necessary

air direction see fan side

Art. No 42308 (1x)Art. No 73487 (4x)

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24 Troubleshooting

The following chapter describes the possible causes of faults, and the work required to rectify them.

In the event of repeated faults, shorten the maintenance intervals in accordance with the actual load.

If a failure occurs during operation, the system interrupts the current procedure.

On the Topspin screen an error message, i. e. a code number with a corresponding text, is displayed. Take down the code number and complete error message. Furthermore have ready the following information:

• Part number and ECL (Engineering change level) of the units

• Spectrometer type and order number.

• Magnet Type

With this information contact the customer service. See "Contact" on page 15 for contact details.

Contact the manufacturer in the event of faults which cannot be rectified in accordance with the instructions below.

24.1 Diagnostic and Trouble Shooting

In case of a problem regarding the BSMS/2, check the following points:

• Are all power voltages ok? Check the LED‘s on each subsystem indicating if it is correctly powered. At the rear side of the BSMS/2 rack, there are two additional rows of LED‘s belonging to the power supplies, which have to be checked as well.

• Are all firmware components up to date? It may be necessary to load the current BsmsCheckDownload.txt file from the Swiss ftp server and do the checks as described before.

For further investigations, the BSMS/2 provides a detailed logging service. The latest information can be retrieved under the menu point „Main“ -> „Service“ -> „display logged messages“. On the same Web Page, there is a button for resetting the buffer before run-ning a specific command sequence.

Additionally, it is possible to activate periodical transfer of that logging information to the hard disk of the workstation. This feature is available in TopSpin (version 2.0 or higher) by typing the command „bsmsdisp“ and selecting the Service Tab. There is a check box for enabling this transfer and a button for viewing the stored long term information.

It may be necessary to configure the logging (how detailed some events are logged), which is provided under the menu point „Main“ -> „Service“ -> „Log Configuration“.

There is a watchdog task running on the ELCB. If the application is blocked for a long time then the BSMS/2 is rebooted. The watchdog function, which is normally active, can be disabled on the service main page (service access is necessary).

After a restart, the logging of the session before - the post mortem log - is still available

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Troubleshooting

(depress „PostMortem“ button on the page „display logged messages“), providing addi-tional information.

i In this manual you can find separate chapters on troubleshooting in the description of the individual units e.g. ELCB, SPB, etc.

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25 Dismantling and Disposal

Following the end of its useful life, the device must be dismantled and disposed of in accordance with the environmental regulations.

i Installation, initial commissioning, retrofitting, repairs, adjustments or dismantling of the device must only be carried out by employees of the manufacturer or persons authorised by the manufacturer.

25.1 Safety

Electrical System

Improper Dismantling

WARNING

Electrical hazard from electrical shock! A life threatening shock may result when the housing is open during operation.

Disconnect the device from the electrical power supply before opening the device. Use a voltmeter to verify that the device is not under power!

Be sure that the power supply cannot be reconnected without notice.

WARNING

Danger of injury due to improper dismantling!

Stored residual energy, angular components, points and edges on and in the device or on the tools needed can cause injuries.

Ensure sufficient space before starting work.

Handle exposed, sharp-edged components with care.

Dismantle the components properly.

Secure components so that they cannot fall down or topple over.

Consult the manufacturer if in doubt.

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Dismantling and Disposal

25.2 Dismantling

Before starting dismantling:

• Shut down the device and secure to prevent restarting.

• Physically disconnect the power supply from the device; discharge stored residual energy.

• Remove consumables, auxiliary materials and other processing materials and dis-pose of in accordance with the environmental regulations.

• Dismantle the device by following the installation instructions in reverse.

Clean assemblies and parts properly and dismantle in compliance with applicable local occupational safety and environmental protection regulations.

25.3 Disposal Intructions

If no return or disposal agreement has been made, send the dismantled components for recycling.

• Scrap metals.

• Send plastic elements for recycling.

• Sort and dispose of other components in accordance with their material composi-tion.

NOTICE

Danger to the environment from incorrect handling of pollutants!

Incorrect handling of pollutants, particularly incorrect waste disposal, may cause seri-ous damage to the environment.

Always observe the instructions below regarding handling and disposal of pollut-ants.

Take the appropriate actions immediately if pollutants escape accidentally into the environment. If in doubt, inform the responsible municipal authorities about the damage and ask about the appropriate actions to be taken.

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Appendix

A Appendix

A.1 Warning Signs

CAUTION

general workplace dangers ........................................................................... 30

this combination of symbol and signal word indicates a possibly hazardous sit-uation which could result in minor or slight injury unless avoided ................. 18

DANGER

230V shock hazard, disconnect power before servicing ............................. 141

damages, wear or abnormal behavior ........................................................... 25

do not replace BSMS/2 units with mains switch turned on ........................... 26

do not try to service the equipment by yourself ............................................. 26

high voltage ................................................................................................... 25

this combination of symbol and signal word indicates an immediately hazardous situation which could result in death or serious injury unless avoided .......... 17

NOTICE

danger to the environment from incorrect handling of pollutants ................ 310

environmental protection ............................................................................... 33

gas filter must be installed ........................................................................... 199

genuine samples ........................................................................................... 31

maintenance, ESD safety precaution .......................................................... 303

make sure that there is no sample remaining in the magnet during board re-placement .................................................................................................... 304

software Errors .............................................................................................. 31

this combination of symbol and signal word indicates a possibly hazardous sit-uation which could result in damage to property or the environment unless avoided .......................................................................................................... 18

WARNING

all electrical connectors must be used as supplied by BRUKER .................. 27

do not use the BSMS/2 system for a purpose other than the described “Intended

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Usage” ........................................................................................................... 21

field exchangeable units ................................................................................ 28

gases under pressure ................................................................................... 31

heavy equipment ........................................................................................... 25

risk to life for unauthorized personnel ........................................................... 24

safety considerations for dismanteling and disposal ................................... 309

safety during maintenance .......................................................................... 303

strong magnetic fields ................................................................................... 32

technically qualified personnel only ............................................................... 29

this combination of symbol and signal word indicates a potentially hazardous situation which could result in death or serious injury unless avoided .......... 18

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Appendix

A.2 Figures

Figure 6.1 Principle of firmware upgrading ........................................................... 42

Figure 6.2 Setup of the BSMS/2 firmware............................................................. 43

Figure 6.3 Calibration and System Configuration ................................................. 44

Figure 6.4 Log in as service engineer ................................................................... 45

Figure 6.5 Service Page after successful service engineer registration ............... 46

Figure 8.1 BOSS1 configuration with LTX / LRX (front)........................................ 53

Figure 8.2 Power supplies for any non-L-TRX configuration (rear side) ............... 54

Figure 8.3 Configuration for BOSS2, BOSS3 and BOSS-WB .............................. 55

Figure 8.4 AVANCE II - configurations with GAB.................................................. 55

Figure 8.5 Configuration with L-TRX (example with GAB/2)................................. 56

Figure 8.6 Power supplies for L-TRX (rear side)................................................... 56

Figure 8.7 Configuration with L-TRX and optional L-19F unit (example with GAB/2)57

Figure 8.8 SPB(-E), VPSB(´s) and power supply (rear side) ................................ 58

Figure 8.9 System Architecture / Overview........................................................... 59

Figure 8.10 The BSMS/2 rack with the specific slots .............................................. 61

Figure 8.11 Front View of BSMS/2 Rack ................................................................ 62

Figure 8.12 Rear View of BSMS/2 Rack ................................................................. 62

Figure 8.13 BSMS/2 Main Service Page................................................................. 64

Figure 8.14 AC / DC wiring and power supplies ..................................................... 66

Figure 8.15 Power distribution by BSMS/2 backplane ............................................ 67

Figure 8.16 Backplane - Slot 1 to 4......................................................................... 68

Figure 8.17 Backplane - Slot 5 to 8......................................................................... 69

Figure 8.18 Backplane - Slot 9 and 10.................................................................... 70

Figure 8.19 Backplane - Slot 11 to 14..................................................................... 71

Figure 8.20 Backplane - Slot 15, 16 and 17............................................................ 72

Figure 8.21 Backplane - Slot 18 and 19.................................................................. 73

Figure 9.1 View of a PSB2 module ....................................................................... 77

Figure 10.1 ELCB front panel with LED‘s and connectors ...................................... 81

Figure 10.2 Functional system architecture ............................................................ 82

Figure 10.3 Abstract control domain and real time domain..................................... 83

Figure 10.4 Lock state machine .............................................................................. 84

Figure 10.5 LED‘s indicating different states during start up................................... 86

Figure 10.6 RJ45 connector for real time control .................................................... 88

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Figure 10.7 DSUB-25 connector for keyboard ........................................................ 88

Figure 10.8 Main window for NMR lock functions ................................................... 89

Figure 10.9 Basic lock operations by Service Web ................................................. 90

Figure 10.10 Configuration of NMR lock ................................................................... 92

Figure 10.11 Lock RF boards - information and diagnostics..................................... 94

Figure 11.1 Step Response with step size of 200mA (left) and 2.0A (right)............ 97

Figure 11.2 Adapters for BOSS1 and BSN-18 type Shim Systems ........................ 98

Figure 11.3 Adapter for BSMS/2 and Adapter stack for former BSMS ................... 98

Figure 11.4 Block Diagram of the SCB20 shim current board .............................. 100

Figure 11.5 Interface for HW codes and I2C identification device ........................ 101

Figure 11.6 The picture below shows a SCB20 shim current board ..................... 103

Figure 11.7 Pinout of the 50 pin Shim connector .................................................. 104

Figure 11.8 Main Menu for the Shim Subsystem .................................................. 106

Figure 11.9 Setup and Configuration of the Shim Subsystem .............................. 107

Figure 11.10 View and manual modification of the Shims ...................................... 108

Figure 11.11 SCB20 diagnostic Web page ............................................................. 109

Figure 11.12 Trouble shooting problems with Shim System and BOSS file ........... 110

Figure 12.1 GAB/2 in an AVII spectrometer .......................................................... 116

Figure 12.2 GAB/2 in an AVANCE spectrometer with IPSO................................. 117

Figure 12.3 TopSpin window for preemphasis settings......................................... 117

Figure 12.4 Block Diagram of the GAB/2 Gradient Amplifier board ...................... 118

Figure 12.5 The GAB/2 Control State Machine..................................................... 120

Figure 12.6 LVDS 48 interface used in AVANCE spectrometers with IPSO......... 121

Figure 12.7 LVDS 28 interface used in AVII spectrometers.................................. 121

Figure 12.8 Timing for the communication over the 48 bit LVDS link ................... 124

Figure 12.9 Timing for the communication over the 28 bit LVDS link ................... 124

Figure 12.10 Main Menu for the GAB/2 Subsystem................................................ 125

Figure 12.11 Preemphasis settings......................................................................... 126

Figure 12.12 Trouble shooting procedure for GAB/2 .............................................. 127

Figure 13.1 L-TRX Block Diagram ........................................................................ 132

Figure 13.2 L-19F Block Diagram ......................................................................... 132

Figure 13.3 Block Diagram L-TRX unit.................................................................. 133

Figure 13.4 Block Diagram with optional L-19F unit.............................................. 133

Figure 13.5 2H Lock system with L-TRX internal power amplifier for gradient shim-ming ................................................................................................... 139

Figure 13.6 Timing diagram of ‚Lock 2H‘ operation with interrupts for gradient shim-

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Appendix

ming ................................................................................................... 139

Figure 13.7 2H Lock system with additional, external 2H power amplifier ............ 140

Figure 13.8 Timing diagram of ‚Lock 2H‘ operation with interrupts for 2H Decoupling or 2H Observe.................................................................................... 140

Figure 13.9 L-TRX and L-19F slots in BSMS/2 chassis (Front View) ................... 141

Figure 13.10 PSB5 slot in BSMS/2 chassis (Rear View) ........................................ 141

Figure 13.11 Wiring AVANCE III MicroBay with AQS Preamplifier (H14034 and H14013) ............................................................................................. 142

Figure 13.12 Preamplifier and no external 2H Amplifier (H14010 and H14013)..... 143

Figure 13.13 Wiring AVANCE III One & TwoBay with AQS 2H-TX (H14010, H14020 and H14014) ...................................................................................... 143

Figure 13.14 Wiring AVANCE III One & TwoBay with BLAXH2H (H14008, H14010 and one of H14014 or H14015 or H14016)............................................... 144

Figure 13.15 Wiring AVANCE III One & TwoBay with L-19F and BLAXH2H (H14008, H14010, Z125188 and one of H14014 or H14015 or H14016).......... 144

Figure 13.16 View BSMS/2 LOCK TRANSCEIVER 300......................................... 146

Figure 13.17 View BSMS/2 19F LOCK TRANSCEIVER 300-1000 ........................ 150

Figure 13.18 2H-TX Control .................................................................................... 153

Figure 13.19 Lock Configuration ............................................................................. 154

Figure 13.20 Service Functions .............................................................................. 155

Figure 13.21 Firmware Download ........................................................................... 156

Figure 13.22 View BIS ............................................................................................ 157

Figure 13.23 L-TRX Diagnostic Functions .............................................................. 158

Figure 14.1 Block diagram of the SLCB/2............................................................. 171

Figure 14.2 Block diagram of the SLCB/3............................................................. 172

Figure 14.3 The picture below shows a SLCB/2 ................................................... 173

Figure 14.4 The picture below shows a SLCB/3 ................................................... 174

Figure 14.5 Block diagram Helium level measurement......................................... 176

Figure 14.6 He-Level Measurement Timing Diagram ........................................... 177

Figure 14.7 Analog nitrogen level measurement block diagram ........................... 178

Figure 14.8 BST Signals ....................................................................................... 179

Figure 15.1 Block diagram of the PNK3 module ................................................... 187

Figure 15.2 Block diagram of the PNK3S module................................................. 187

Figure 15.3 Block diagram of the PNK5 module ................................................... 188

Figure 15.4 PNK3 Drawing ................................................................................... 189

Figure 15.5 PNK5 Drawing ................................................................................... 190

Figure 15.6 PNK3S Drawing ................................................................................. 191

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Appendix

Figure 15.7 Block Diagram Emergency Lift........................................................... 192

Figure 15.8 The picture below shows a PNK3 ...................................................... 194

Figure 15.9 The picture below shows a PNK3S.................................................... 195

Figure 15.10 The picture below shows a PNK5 ...................................................... 196

Figure 15.11 Sample Handling Service Page ......................................................... 198

Figure 16.1 typical BSVT components .................................................................. 201

Figure 16.2 BSVT – Open / Digital VT architecture............................................... 202

Figure 16.3 Example of the VT panel within Topspin3.0....................................... 203

Figure 16.4 Minimal BSMS/2 configuration (without VT system) .......................... 206

Figure 16.5 Typical BSMS/2 configuration with VT system................................... 207

Figure 16.6 BSMS/2 units that support nitrogen level sensors ............................. 208

Figure 16.7 Basic BSMS/2 configuration with VT system option .......................... 210

Figure 16.8 Standard HR RT probe with thermocouple T ..................................... 211

Figure 16.9 HR RT probes (BTO2000) ................................................................. 212

Figure 16.10 CryoProbe .......................................................................................... 213

Figure 16.11 Solids probehead DVT with 2 thermocouple T................................... 214

Figure 16.12 Solids probehead VTN/WVT with 2 thermocouple T.......................... 215

Figure 16.13 Power booster and solids probehead................................................. 216

Figure 16.14 BVTE3900 and BSVT ........................................................................ 217

Figure 16.15 BSCU05 or BSCUX COOLING UNIT................................................. 218

Figure 16.16 BCU05 or BCU-X COOLING UNIT .................................................... 219

Figure 16.17 BVTL3200 N2 EXCHANGER............................................................. 220

Figure 16.18 BVTL3200 N2 EVAPORATOR........................................................... 221

Figure 16.19 FlowProbe with HT Heated Probe Capillary....................................... 222

Figure 16.20 FlowProbe with TCTC Temperature Controlled Transfer Capillary.... 223

Figure 16.21 CryoProbe with CryoFit Preheater ..................................................... 224

Figure 17.1 BSVT states ....................................................................................... 226

Figure 17.2 VT emergency gas flow...................................................................... 228

Figure 17.3 Gas flow diagram for emergency lift................................................... 229

Figure 17.4 External VT gas supply (e. g. MAS bearing gas) ............................... 230

Figure 17.5 Booster installed, but normal probe operation ................................... 230

Figure 17.6 Booster in operation ........................................................................... 231

Figure 18.1 Block diagram of the SPB .................................................................. 240

Figure 18.2 Block diagram of the SPB-E............................................................... 241

Figure 18.3 Front view of a SPB ........................................................................... 244

Figure 18.4 Front view of a SPB-E........................................................................ 245

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Appendix

Figure 18.5 Helium level measurement principle .................................................. 247

Figure 18.6 Analog nitrogen level measurement block diagram ........................... 248

Figure 18.7 BST Signals ....................................................................................... 249

Figure 18.8 Overview of point-to-point full duplex VPSB CTRL interface ............. 251

Figure 18.9 Pinning VPSB CTRL .......................................................................... 252

Figure 18.10 Overview Auxiliary Bus Connector (SPB-E) only............................... 253

Figure 18.11 Block diagram emergency lift detection ............................................. 255

Figure 18.12 SPB Service Page ............................................................................. 257

Figure 19.1 Block diagram of the VPSB................................................................ 263

Figure 19.2 D-Sub15 female, pin assignment (VTA 1, VTA 2) ............................. 265

Figure 19.3 Overview Auxiliary Bus Connector..................................................... 266

Figure 19.4 Slave pinning VPSB CTRL ................................................................ 268

Figure 19.5 Front view of a VPSB......................................................................... 269

Figure 19.6 VPSB Service Page ........................................................................... 272

Figure 20.1 VTA cable connectors........................................................................ 282

Figure 20.2 Block diagram of the VT Adapter ....................................................... 283

Figure 20.3 Wiring diagram BSVT and BVTB3500 ............................................... 285

Figure 20.4 The picture below shows two typical VT adapter............................... 286

Figure 20.5 LED Code on VT adapters................................................................. 287

Figure 20.6 D-Sub 15 male, pin assignment......................................................... 288

Figure 20.7 Overview of VTAs connected to the BFB peripheral bus................... 289

Figure 21.1 Digital configuration ........................................................................... 292

Figure 21.2 Analog configuration .......................................................................... 293

Figure 21.3 The picture below shows a nitrogen level sensor .............................. 295

Figure 21.4 LED Code on N2 level sensor............................................................ 296

Figure 21.5 D-Sub 9 male, pin assignment........................................................... 297

Figure 21.6 D-Sub 15 male, pin assignment......................................................... 297

Figure 22.1 Connection to BSMS/2 (Monitoring and Service) .............................. 300

Figure 22.2 Connection to BSMS/2 (Monitoring only)........................................... 300

Figure 23.1 Fan Tray............................................................................................. 305

Figure 23.2 Fan Tray removal, step by step ......................................................... 306

Figure 23.3 Fan Tray Reassembly, step by step .................................................. 306

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Appendix

A.3 Tables

Table 2.1 Overview Installation and Operation Requirements for Personnel ..... 20

Table 4.1 Technical Data of BSMS/2 Chassis .................................................... 35

Table 4.2 Technical Data of BSMS/2 Chassis .................................................... 35

Table 4.3 Operating Environment ....................................................................... 36

Table 9.1 PSB1 Electrical Characteristics (SLCB / PNK configurations)............ 75

Table 9.2 PSB2 Electrical Characteristics (LTX / LRX configurations) ............... 75

Table 9.3 PSB5 Electrical Characteristics (L-TRX configurations) ..................... 76

Table 9.4 PSB 7 Electrical Characteristics (BSVT configurations) ..................... 76

Table 10.1 Parameter and Technical Data............................................................ 79

Table 10.2 User Bus Back Plane Connector ........................................................ 87

Table 11.1 Electrical Characteristics..................................................................... 96

Table 11.2 Overview over all Shim adapters ........................................................ 99

Table 11.3 User Bus Back Plane Connector ...................................................... 105

Table 11.4 List of Shim Systems needing a BOSS matrix file. ............................113

Table 12.1 Electrical Characteristics (typical values)...........................................115

Table 12.2 User Bus Back Plane Connector ...................................................... 122

Table 12.3 LVDS signals (client side) ................................................................. 123

Table 13.1 Wiring BLNKTR_2H~ (AQS PSD to 2H Amplifier) ........................... 145

Table 13.2 L-TRX Status LED‘s in different operating modes............................. 147

Table 13.3 L-19F Status LED‘s in different operating modes.............................. 151

Table 13.4 2H-TX Control: Router Address ........................................................ 153

Table 13.5 Summary of Diagnostic Selftests and ADC Functions ...................... 158

Table 13.6 L-TRX Error Messages ..................................................................... 162

Table 13.7 Power supply boards for different Lock systems............................... 163

Table 13.8 L-TRX Unit Numbers......................................................................... 165

Table 13.9 L-19F Unit Numbers.......................................................................... 165

Table 14.1 SLCB variants ................................................................................... 168

Table 14.2 SLCB/2 vs. SLCB/3........................................................................... 168

Table 14.3 He level measurement .................................................................... 168

Table 14.4 N2 level measurement (SLCB/3 only) ........................................... 169

Table 14.5 BST signal interface ....................................................................... 169

Table 14.6 Sample changer interface .............................................................. 169

Table 14.7 Environment .................................................................................... 170

Table 14.8 Connectors........................................................................................ 175

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Table 14.9 Definitions ......................................................................................... 177

Table 14.10 Pin assignment Sample Changer RJ45 ............................................ 180

Table 14.11 User Bus Back Plane Connector (DIN41612) ................................... 182

Table 14.12 VME Bus Back Plane Connector (DIN41612)................................... 182

Table 15.1 PNK variants ..................................................................................... 185

Table 15.2 Sample lift ........................................................................................ 186

Table 15.3 Sample Rotation.............................................................................. 186


Table 15.5 User Bus Back Plane Connector (DIN41612 R) ............................... 197

Table 16.1 Not supported external probe interfaces (discontinued products)..... 205

Table 16.2 Minimal requirements for all configurations....................................... 206

Table 16.3 Required boards depending on magnet system ............................... 206

Table 16.4 Required boards for basic BSVT configuration with VT system option...207

Table 16.5 Support for Nitrogen Level Sensor.................................................... 208

Table 16.6 Required cable set ............................................................................ 209

Table 18.1 SPB variants ..................................................................................... 234

Table 18.2 Overview SPB vs. SPB-E.................................................................. 235

Table 18.3 He level measurement .................................................................... 235

Table 18.4 Analog N2 level measurement interface (SPB-E version only) .. 236

Table 18.5 BST signal interface........................................................................ 236

Table 18.6 Sample lift ........................................................................................ 237

Table 18.7 Sample Rotation.............................................................................. 237

Table 18.8 Sample changer interface .............................................................. 237

Table 18.9 Auxiliary gas specifications (SPB version) .................................. 238

Table 18.10 Auxiliary gas specifications (SPB-E version)............................... 238

Table 18.11 VT gas specifications ..................................................................... 239


Table 18.13 Connectors........................................................................................ 246

Table 18.14 Pin assignment Sample Changer RJ45 ............................................ 250

Table 18.15 Pin assignment of AUX connector RJ45 ........................................... 253

Table 18.16 Controlled gas flows.......................................................................... 255

Table 18.17 User Bus Back Plane Connector (DIN41612 R) ............................... 256

Table 19.1 VPSB, technical data ........................................................................ 262

Table 19.2 Variable Supplies Specification ......................................................... 262

Table 19.3 D-Sub15 female, pin assignment ...................................................... 265

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Table 19.4 Auxiliary Connector RJ45, pin assignment ....................................... 266

Table 19.5 VPSB front panel connectors............................................................ 271

Table 20.1 List of available VTAs........................................................................ 276

Table 20.2 VTA TC-T .......................................................................................... 277

Table 20.3 VTA BTO........................................................................................... 277

Table 20.4 VTA CRP........................................................................................... 278

Table 20.5 VTA TC-2T ........................................................................................ 278

Table 20.6 VTA FLOW-NMR............................................................................... 279

Table 20.7 VTA TC-2E........................................................................................ 279

Table 20.8 VTA LN2............................................................................................ 280

Table 20.9 VTA BCU........................................................................................... 280

Table 20.10 VTA BVTB......................................................................................... 281

Table 20.11 VTA AUX-2P ..................................................................................... 281

Table 20.12 VTA MAG-RS.................................................................................... 281

Table 20.13 D-Sub 15 male, pin assignment........................................................ 288

Table 21.1 D-Sub 9 male, pin assignment.......................................................... 297

Table 21.2 D-Sub 15 male, pin assignment........................................................ 297

Table 22.1 Available unit..................................................................................... 299

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Appendix

A.4 Index

BBSCU05 / BSCUX cooling units, BSVT support ............................................ 218BSMS Service Web ........................... 63BSVT concept ................................. 230BSVT introduction ........................... 201BTO2000, adpater ........................... 211BVTB3500 booster support, BSVT con-cept .................................................. 230BVTB3500 Booster, configuration ... 216BVTE3900, configuration ................ 217BVTL3200 N2 evaporator, configuration 221BVTL3200 N2 heat exchanger, configu-ration ............................................... 220

CCable sets for VT options ................ 209Calibration, general information ........ 43Check / Download firmware .............. 42Configurations, BSMS/2 .................... 53Configurations, BSVT ...................... 201

EELCB, technical data ......................... 53Emergency VT ................................. 228

FFans ................................................ 305Firmware download ........................... 42FlowProbe, VT adapter ................... 222

GGAB/2, hardware description .......... 115

IIntroduction, BSMS/2 system with ELCB 51IP address of the BSMS/2 ................. 63

LL-19F ............................................... 131Lift and Spin Calibration .................... 46LN2 Level Sensor ............................ 291Lock Transceiver ............................. 131L-TRX .............................................. 131

MMagnet System Service Manual ..... 291, 299MAG-RS .......................................... 299Mains selection and fuses ................. 41

NN2 Level Sensor .............................. 291Nitrogen Level Sensor ..................... 291

PPNK modules .................................. 185

RRadiation Shield Temperature Control ..299

SSCB20, hardware description ............ 95Service Web ...................................... 63SLCB ............................................... 167SLCB/2 ............................................ 167SLCB/3 ............................................ 167SPB, hardware description .............. 233

TThermocouple type T, VT adapter ... 211

VVPSB, hardware description ........... 261VT emergency gas flow ................... 228VTA, hardware description .............. 275VTN / WVT probes, support with BSVT 229

323 28_00_06

Appendix

324 Z108028_00_06

325 Z108028_00_06

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