Brenna Flaugher Oct. 31 th CDF Meeting1 RunIIb Silicon Project Successful Lehman Review Sept. 24-26 Workshop at LBL 10/23-10/25: Wednesday-Thursday hybrids

Brenna Flaugher Oct. 31th CDF Meeting

1

CDF RunIIb Silicon Project

• Successful Lehman Review Sept. 24-26

Workshop at LBL 10/23-10/25:• Wednesday-Thursday

hybrids testing and burnin plans status of construction and testing

of modules and staves contributions and plans for

various groups on Run IIb• Friday (joint with D0)

Chip status and scheduleGrounding issues


2

CDF Lehman Review Results

No “Findings”Committee was impressed with advance state of

prototyping Told us to reduce the $ contingency and increase

schedule contingency.Additional “guidance” from Lab has been included

– we think we have a final schedule

• Total silicon project cost Now Oct 02:14.3M$ + 5M$ contingency = 19.3M$ (FY02$) was 13.6M$ + 6.6M$ = 20.2M$ at Lehman Review

• We are approved as much as possible – Run IIb still contingent on accelerator review – still have to get through a few external reviews of

project management issues.


3

CDF Stave: conceptual view

Mounting holes

Chips

Hybrid Pitch Adapter

Cooling tubes

Wing Cable

Mini PC

Mounts

Sensors

• 2 sensors + hybrid = 1 module• 3 modules per side• 1 MPC per stave• 1 readout unit per stave• Stave is 66 cm long

We now have all components in hand and have made thefirst electrical stave!


4

CDF Silicon Sensors

All detectors are single sided and based on the high voltage operation layout (CMS,ATLAS,L00)

Prototype stereo sensors delivered to Tsukuba last week.

High yield on axial sensors and high quality (0% bad channels grade “A” and 0.07% grade “B”)

characterization of stereo sensors in progress

Testing of irradiated axial sensors is in progress

Production signoff scheduled for Nov. 25th


5

CDF Prototype Stave Assembly


6

CDF 1st Electrical Stave


7

CDF SVX4 chip

• 1st full prototype submission in April ‘02

• Chip back in June ‘02Tested at LBL and FNALNo major problems foundCorrections for bow and

channel to channel variation are in progress

Yield looks very good, ~85% (but low stats)

Next Submission Mid. Jan.


8

CDF Chip Schedule

Summer submission (preproduction?) has only 10 days of slack

ID Task Name Start Finish Duration Total Slack

19 SVX4 chips: 2nd prototype Wed 10/23/02 Fri 6/13/03 160 days 0 days

20 2nd Chip: layout Wed 10/23/02 Thu 1/23/03 60 days 0 days

21 2nd Chip: submission (eng. Run) Thu 1/23/03 Thu 1/23/03 0 days 0 days

24 2nd Chip: manufacturing Fri 1/24/03 Thu 4/3/03 50 days 0 days

25 2nd Chip: postprocessing Fri 4/4/03 Thu 4/17/03 10 days 0 days

26 2nd Chip: engineering evaluation at FNAL Fri 4/18/03 Thu 5/15/03 20 days 95 days

27 2nd Chip: engineering evaluation at LBL Fri 4/18/03 Fri 6/6/03 35 days 0 days

28 2nd Chip: evaluation and radiation test Fri 4/18/03 Fri 6/13/03 40 days 10 days

29 2nd Chip ready for hybrids Thu 5/15/03 Thu 5/15/03 0 days 0 days

30 SVX4 chip: production Fri 5/16/03 Tue 4/6/04 223 days 30 days

31 Setup for production chip testing Fri 5/16/03 Fri 6/13/03 20 days 95 days

32 Production Chip: layout Mon 6/16/03 Mon 7/14/03 20 days 10 days

33 Production chip Submission Mon 7/14/03 Mon 7/14/03 0 days 10 days

36 Production Chip: manufacturing Tue 7/15/03 Tue 9/23/03 50 days 10 days

37 Production Chip: post processing Wed 9/24/03 Tue 10/7/03 10 days 10 days

38 Production Chip: engineering evaluation at LBL Wed 10/8/03 Tue 11/11/03 25 days 15 days

39 CDF chips: Test Wed 10/15/03 Tue 4/6/04 118 days 10 days

40 Production Chips ready for hybrids Wed 11/12/03 Wed 11/12/03 0 days 10 days

41 Chip testing Complete Tue 4/6/04 Tue 4/6/04 0 days 232 days

Qtr 1Qtr 2Qtr 3Qtr 4Qtr 1Qtr 2Qtr 3Qtr 42003 2004

on critical path


9

CDF Module

• Ten modules fully assembled

• Hybrids work with No problems!

• Module tests at LBL in progress, Soon will test at FNAL (FCC) with full DAQ


10

CDF Pre-prototype stave tests at LBL

• One module glued to bus cable on carbon fiber (top of stave)

• First results with deadtimeless operation on a stave!

• looks pretty good - many things still to optimize, all peaks go away with DPS (RTPS) on

• Second module sent to LBL and new results will come soon


11

CDF Workshop: Friday

• Discussion with chip designers, CDF and D0 about chip schedule

• Two problems are being addressed with next submissionBow and channel-channel variations

• everyone seems to agree on the plan (we meet weekly)Simulations at LBL have reproduced the channel to channel variationsLayout changes are in progress at LBL and FNAL: Submit mid Jan. 03For next submission two new versions will be submitted: Min and Max

changes. Also the current version of the chip will be included for quality control

• Grounding DiscussionWe are starting to work out plans for grounding staves

– Connect CF in staves to ground at the mini portcard

– Connect stave ground to bulkheads and screens

– Connection to L0 ground


12

CDF Critical Path Milestones

ID Task Name Start

% Complete: 0% Thu 1/23/03

21 2nd Chip: submission (eng. Run) Thu 1/23/03

29 2nd Chip ready for hybrids Thu 5/15/03

85 Hybrid #2 available Mon 6/2/03

441 modules # 2 available Mon 6/16/03

481 #2 Stave available Tue 7/15/03

92 Preproduction Hybrid: Submission Tue 9/9/03

311 Go ahead for Preproduction Tue 9/9/03

94 Preproduction Hybrid ready for chips Tue 11/25/03

97 Preproduction Hybrid Available Thu 12/18/03

448 Preproduction modules available Wed 1/7/04

316 Ready to test Preproduction DAQ chain Thu 1/22/04

492 Preproduction Stave: electricals available Thu 1/22/04

104 Production Hybrid Submission Thu 3/18/04

318 DAQ Production Go-Ahead Thu 3/18/04

108 Production Hybrids Available Mon 6/14/04

456 1st production module available Tue 7/6/04

510 Stave Production Complete Thu 3/24/05

690 Stave installation complete Thu 3/24/05

698 Outer Detector Complete Thu 5/5/05

724 SVX2b Ready for Installation into ISL Mon 7/18/05

Qtr 1Qtr 2Qtr 3Qtr 4Qtr 1Qtr 2Qtr 3Qtr 4Qtr 1Qtr 2Qtr 3Qtr 4Qtr 12003 2004 2005 2006

Project complete 7/18/05!

2nd prototype round2/03 – 9/03

preproduction9/03 – 3/04

Production3/04 -3/05

1st prototypes: now-2/03


13

CDF Conclusion (1)

• We have an aggressive schedule, but already most of the prototype parts work well.

• 1st electrical stave is ready for testing!

• Preprototype stave tests at LBL look good so far but just started.

• Commitments to Run IIb LBL is doing tests with prototype chips, hybrids, modules and pseudostaves and is

committed to providing oversite of Hybrid production Davis is preparing for Hybrid burnin and testing Helsinki is going to send 3 people to LBL for ~9mths this spring and will continue

to provide support for hybrid assembly, testing and burnin Will need to send more people to LBL/Davis for full production efforts Uof I is developing a PC based test stand Uof I and Rutgers are collaborating on Stave Burnin Sensor testing at Purdue, UNM, Tsukuba

• Discussions in progress of other groups – We need to get MOUs with all the groups


14

CDF Conclusion (2)

• Completion date is July 18th 2005 – our schedule• Official completion date with Lab contingency is May 31, 2006 • Could gain time on July 18th date by eliminating the 2nd prototype

round of DAQ components.• L0 is not on the critical path. We want to keep it that way.

need to have acceptable cables to make progress on design• We are already scheduling signoff meetings for going into

productionsensors – Nov. 25thbeampipe flanges – done (beampipe is already being fabricated)

• Lab and Sidet are preparing to provide large labor force for Run IIb• This is a great time to join Run IIb – Plenty of hardware projects for

students and postdocs. Come talk to us!

Documents

Brenna Flaugher Oct. 31 th CDF Meeting1 RunIIb Silicon Project Successful Lehman Review Sept. 24-26 Workshop at LBL 10/23-10/25: Wednesday-Thursday hybrids