Book 1. Conductive adhesives for Electronics Packaging edited by Johan Liu, Electrochemical

Publications Ltd , UK, ISBN No 0 901 150 37 1, June 1999. 2. Reliability of Microtechnology–Interconnects,Devices and Systems,Johan Liu, Olli

Salmela, Jussi Särkkä, James E. Morris, Per-Erik Tegehall and Cristina Andersson, Springer Verlag, ISBN 978-1-4419-5759-7. March 2011

Conference proceedings edited 1. International Seminar in Conductive Adhesive Joining in Electronics Packaging,

Eindhoven, Philips, The Netherlands, September 5, 1995, ISBN No 91-630-3729-7, edited by Johan Liu and Rolf Jansson.

2. The First IEEE International Symposium on Polymeric Electronics Packaging (PEP´97) October 26-30, 1997, Norrköping, Sweden, edited by Johan Liu and Rolf Jansson, IEEE Catalogue number 97TH8268.

3. The Second IEEE International Symposium on Polymeric Electronics Packaging (PEP´99) October 27-30, 1999, Sheraton Hotel, Göteborg, Sweden, edited by Johan Liu, Dag Andersson and Rolf Jansson.

4. The third IEEE International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´00), SIMTECH, Shanghai, China, December 14-16, 2000, edited by Xiaomin Xie and Johan Liu.

5. The Fourth IEEE International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´02), SIMTECH, Shanghai, China, June 30- July 3, 2002, edited by Xiaomin Xie and Johan Liu, ISBN No: 0-7803-9823-8.

6. The Fifth IEEE International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´02), SIMTECH, Shanghai, China, June 30- July 3, 2002, edited by Xiaomin Xie and Johan Liu, ISBN No: 0-7803-9823-8.

7. The sixth IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´04), Baolong Hotel, Shanghai, China, June 30- July 3, 2004, edited by Johan Liu and Jialin Cao, IEEE Catalog Number: 04EX905.

Journal publications 1. Fundamental experimental parameters in the direct wire-casting process, J. Liu, L.

Arnberg, N. Bäckström and S. Savage, Materials Science and Engineering, 98 (1988) 21-24.

2. Fluid flow behaviour and solidification studies during ultrasonic gas atomization, J. Liu, L. Arnberg, N. Bäckström, H. Klang and S. Savage, Materials Science and Engineering, 98 (1988) 43-46.

3. Mass and heat transfer during ultrasonic gas atomization, J. Liu, L. Arnberg, N. Bäckström, H. Klang and S. Savage, Powder Metallurgy International, 20:2 (1988) 17-22.

4. Hot extrusion and mechanical properties of rapidly solidified Al and Cu alloy powders, J. Liu, U. Backmark, L. Arnberg, N. Bäckström, O. Grinder and S. Savage, Materials Science and Engineering, 98 (1988) 419-423.

5. On the mechanisms of formation of directly cast rapidly solidified wires, J. Liu, L. Arnberg and S. Savage, Journal of Materials Science Letters, 8 (1989) 121-124.

6. Theoretical analysis of residual stress effect on the magnetostrictive properties of amorphous wires, J. Liu, R. Malmhäll, L. Arnberg and S. J. Savage, Journal of Applied Physics, 67:9 (1990) pp4238-4240.

7. Production and properties of rapidly solidified Fe-Si micro-wires, J. Liu, E. Strinning, L. Arnberg, S. J. Savage and A. Inoue, Scandinavian Journal of Metallurgy, 19(1990)14-18.

8. Improved corrosion resistance in silicon-alloyed stainless steel wires by rapid solidification, J. Liu, H. Tomioka, L. Arnberg and S. J. Savage, Materials Letters, 8:9 (1989) 381-384.

9. Development of a cost effective and flexible bumping method for flip-chip interconnection, J. Liu, Hybrid circuits No 29, September, 1992, pp. 25-31.

10. Joining of displays using thermo-setting anisotropically conductive adhesives, Johan Liu and Roger Rörgren, Journal of Electronics Manufacturing, 3(1993) pp205-214.

11. Reliability of surface-mounted anisotropically conductive adhesive joints, J. Liu, Circuit World, Vol.19, No. 4, 1993, pp. 4-11.

12. Process yield and reliability of 0.65 mm pitch component technology in surface mounting, Johan Liu, Soldering & Surface Mount Technology, No 16, pp5-10, February 1994.

13. Reliability assessment of isotropically conductive adhesive joints in surface mount application, Roger Rörgren and Johan Liu, IEEE transactions of Components, Packaging and Manufacturing Technology-Part B, Vol. 18, No. 2, May 1995 pp. 305-311.

14. High volume electronics manufacturing using conductive adhesives for surface mounting, Johan Liu, Roger Rörgren and Lars Ljungkrona, Journal of Surface Mount Technology, April 1995, Vol. 8. issue 2, pp30-41.

15. Development of Flip-chip Joining technology on flexible circuitry using anisotropically conductive adhesives and eutectic solder, Johan Liu, Katarina Boustedt and Zonghe Lai, Circuit World, Vol.22, No 2, 1996.

16. An overview of advances of conductive adhesive joining technology in electronics applications, Johan Liu, Materials Technology, Vol. 10, Numbers 11/12, 1995, pp. 247-252.

17. Reliability of thermo-setting anisotropically conductive adhesives in Chip on Glass application, Johan Liu and Lars Ljungkrona, Microsystem Technologies, Spring-Verlag, 2(1995)17, pp32-37.

18. On the failure mechanism of anisotropically conductive adhesive joints on copper metallisation, Johan Liu, International Journal of Adhesion and Adhesives, Vol 16, No 4, 1996, pp285-287.

19. Development of conductive adhesive joining for surface-mounting electronics manufacturing, Johan Liu, Lars Ljungkrona and Zonghe Lai, IEEE transactions of Components, Packaging and Manufacturing Technology-Part B, Vol., 18 No. 2, May 1995, pp313-319.

20. Flip-chip joining for solderless multi-chip modules assembly using anisotropic and non-conductive adhesives, Johan Liu and Zonghe Lai, Journal of Surface Mount Technology, 1996, vol. pp37-42.

21. Moisture sorption in some popular conductive adhesives: What really happens?, Cynthia Khoo and Johan Liu, Circuit World, Vol.22 No.4, 1996, pp. 9-15.

22. Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates, Zonghe Lai and Johan Liu, IEEE Transactions of CPMT, Part B: Advanced Packaging, Vol. 19, No. 3, August 1996, pp. 644-660.

23. Surface characteristics, reliability and failure mechanisms of tin, copper and gold metallizations, Johan Liu, Katrin Gustafsson, Zonghe Lai and Changhai Li, IEEE Transactions of CPMT, Part A, Vol.20, No1, pp21-30, March 1997.

24. Use of conductive adhesives in electronics applications-world wide achievements and future challenges, invited paper, presented at the First Conference of Materials Science and Technology for Domestic and Overseas Chinese Young Scientists, October 4-8, 1995, Xián, China, Chinese Journal of Materials Research, Vol 9, Suppl., December 1995, pp521-531.

25. Measurements of solder bump lifetime as a function of underfill material properties, Jon Nysether, Pontus Lundström and Johan Liu, IEEE CPMT Transactions Part A, June 1998, Vol. No 2, pp281-287.

26. Quantitative estimation of the characteristics of conductive particles in ACA by using Nano indentor, Xitao WANG, Yanli WANG, Guoliang CHEN, Johan LIU, Zonghe LAI, IEEE CPMT Transactions Part A, Vol 21, No, 2, pp. 248-251, June 1998.

27. Overview of conductive adhesive interconnection technologies for LCDs, Helge Kristiansen and Johan Liu, IEEE CPMT Transactions Part A, June 1998, Vol. 21, No 2, pp. 208-214.

28. Conductive Adhesives for High-Frequency Applications, Rolf Sihlbom, Markus Dernevik, Zonghe Lai, Piotr Starski and Johan Liu, IEEE CPMT Transactions Part A, Vol. 21, NO. 3, September, 1998, pp469-478.

29. High frequency measurements and simulations on wire-bonded modules on the sequential build up substrates (SBU), Rolf Sihlbom, Markus Dernevik, Mats Lindgren, Piotr Starski, Zonghe Lai and Johan Liu, IEEE CPMT Transactions Part A, Vol. 21, No 3, September 1998, pp478-492.

30. Temperature cycling effects in some glob top materials, Cynthia Khoo and Johan Liu, Circuit World, Vol. 24, Number 4, 1998, pp11-24.

31. Overview of using conductive adhesives for direct flip-chip attach applications, Johan Liu, Microsystem Technologies, 26 (1998), Springer-Verlag, Germany, Nov. 1998, pp72-80.

32. Effect of bump height on the reliability of ACA flip-chip joining with FR4 rigid and polyimide flexible substrate, Zonghe Lai, Ruoyin Lai, Katrin Persson and Johan Liu, Journal of Electronics Manufacturing, Vol. 8, Nos 3 and 4 (September and December) 1998, pp217-224.

33. A reliable and environmentally friendly packaging technology - Flip Chip joining using anisotropically conductive adhesives, Johan Liu, Arne Tolvgård, Jens Malmodin and Zonghe Lai, IEEE Transactions on Components and Packaging Technology, Vol 22, No 2, June 1999, pp 186-190.

34. Conduction modelling of conductive adhesive with bimodal distribution of conducting element, Ying Fu, Johan Liu and Magnus Willander, International Journal of Adhesion and Adhesives, dec. 1998, pp281-286.

35. Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives, L.L. Ye, Z. H. Lai, J. Liu and A. Thölen, IEEE Component, Packaging and Manufacturing Technology Transactions, Part C: Manufacturing, October 1999, Volume 22, Number 04, pp299-302.

36. Electromagnetic wave transmission through lossless electrically conductive adhesive, Y. Fu, J. Liu and M. Willander, Journal of Electronics Manufacturing, Vol.9, No 4 (1999) 275-281.

37. Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesives, Ying Fu, Yanli Wang, Xitao Wang, Johan Liu, Zonghe Lai, Guoliang Chen and Magnus Willander, IEEE CPMT transactions, Part B: Advanced Packaging, Vol.23, No 1, February, 2000. pp. 15-21

38. Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip application, Kuntjoro Pinardi, Zonghe Lai, Dietmar Vogel, Yi Lan Kang, Johan Liu, Sheng Liu, Ralf Haug and Magnus Willander, IEEE CPMT Transactions, Part A, September 2000, Volume 23, Number 03, pp447-451.

39. Thermal cycling life Flip-Chip On Board circuits with solder and isotropically conductive adhesive joints, Jon B Nysæther, Zonghe Lai and Johan Liu, IEEE CPMT Transactions, Part B: Advanced Packaging,Vol 23, No 4, November 2000, pp743-749.

40. The effect of bump height on the reliability of ACF in flip-chip, C.M.L. Wu, Johan Liu and

N. H. Yeung, Soldering & Surface Mount Technology, 13/1, 2001, pp25-30. 41. Spatial distribution of metal fillers in isotropically conductive adhesive, Journal of

Electronics Materials, Ying Fu, Magnus Willander and Johan Liu, Vol 30. No 7, 2001, pp 866-871.

42. Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B Lead Free Solders, L.L. Ye, Z. Lai, J. Liu and A. Thölén, Soldering and Surface Mounting Technology, Volume 13 Number 3 2001, pp16-20

43. ACA bonding technology for low-cost electronics packaging applications – current status and remaining challenges, Johan Liu, Soldering and Surface Mount Technology, Volume 13 Number 3 2001, pp39-57.

44. Statistics on conduction in ACA materials, Ying Fu, Magnus Willander, and Johan Liu, IEEE Transactions on Components and Packaging Technology, vol.24, p.250-5, 2001

45. A review of microwave curing of polymer materials, Tiebing Wang and Johan Liu, Journal of Electronics Manufacturing, Vol 10, No 3, 2001, pp 181-189.

46. Life Cycle Analysis of a telephone exchange station, Anders Andrae, Ulf Östermark and Johan Liu, Journal of Electronics Manufacturing, Vol 10, No 3, 2001, pp147-160.

47. Reliability of ACA flip-chip joints on FR-4 substrate, Johan Liu and Zonghe Lai, Journal of Electronics packaging, September 2002, Vol.124, pp 240-245.

48. Electrical Characterization of Isotropic Conductive Adhesive under Mechanical Deformation, Zhimin Mo, Xitao Wang, Tiebing Wang, Shiming Li, Zonghe Lai and Johan Liu, Journal of Electronics Materials, Vol. 31(9), 916-920, Sept. 2002.

49. Characterization of Liquid Crystal Polymer for High Frequency System-in-a-Package Applications, Gang Zou, Hans Grönqvist, J. Piotr Starski and Johan Liu, IEEE CPMT Transactions, Part B, Vol 25, No 4, November 2002, pp503-508.

50. Process development and adhesion behaviour of Electroless Copper on Liquid Crystal Polymer (LCP) for Electronic Packaging Application, Liu Chen, Midhat Crinic, Zonghe Lai and Johan Liu, IEEE Transactions on Electronics Packaging Manufacturing, Vol 25, No 4, October 2002, pp247-278.

51. Microwave-transmission, heat and temperature properties of electrically conductive adhesives, Ying Fu, Tiebing Wang and Johan Liu, IEEE CPMT Transactions, Part A, Vol 26, No 1, March, 2003, pp. 193-198.

52. System-on-Packaging: A Broad Perspective from System Design to Technology Development, Li- Rong Zheng and Johan Liu, Microelectronics Reliability, 43 (8): 1339-1348, August 2003.

53. Electrical conduction characteristics of anisotropic conductive adhesive particles, Guangbin Dou, Y C Chan and Johan Liu, G. B. Dou, Y. C. Chan and Johan Liu, Journal of Electronic Packaging -- December 2003, Volume 125, Issue 4, pp. 609-616.

54. An environmental assessment of Gallium Arsenide Monolithic Microwave Integrated Circuit System in Package (SIP) switch product, Anders Andrae, Gang Zou and Johan Liu, International Journal of Life Cycle Analysis 9 (1), 2004, pp 45-52.

55. Theoretical Analysis of RF Performance of Anisotropic Conductive Adhesive Flip-Chip Joints, Gang Zou, Hans Grönqvist and Johan Liu, IEEE CPMT Part A: Vol.27, No 3, September 2004, pp546-550.

56. Study on thermomechanical reliability of a tunable light modulator, Zhimin Mo, Helge Kristiansen, Morten Eliassen, Shiming Li and Johan Liu, Microelectronics Reliability, 44(2004), pp779-785.

57. Characterization of Substrate Materials for System-in-a-Package Applications, Liu Chen, Anders Andrae, Gang Zou and Johan Liu, Journal of Electronics Packaging 126 (2), 2004, pp. 195-201.

58. Thermal Fatigue Cracking of Surface Mount Conductive Adhesive Joints Z. Mo, Z. Lai, S.

Li and J. Liu, Soldering & Surface Mount Technology, 16 (1), 48-52 (2004). 59. Thermodynamic assessment of Sn-Co lead-free solder system, Libin Liu, Cristina

Anderson, and Johan Liu, Journal of Electronic Materials, Vol. 33, No.9, 2004, pp.935-939.

60. Uncertainty estimation by Monte-Carlo Simulation applied to life cycle inventory of cordless phones and microscale metallization processes, Anders Andrae, Patrik Möller, Johan Anderson and Johan Liu, IEEE Transactions on Electronics Packaging Manufacturing, Vol 27, No. 4, October 2004, pp.233-245.

61. Cristina Andersson, Zonghe Lai, Johan Liu, Hairong Jiang, and Yongning Yu, “Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders”, Materials Science and Engineering A, 394 (2005), pp20-27.

62. Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate, Liqiang Cao, Zonghe Lai and Johan Liu, Journal of Electronics packaging, March 2005, Vol.127, pp43-46.

63. Significance of intermediate production processes in life cycle assessment of electronic products assessed using a generic compact model, Andræ Anders S. G., Andersson Dag R. and Liu Johan, The Journal of Cleaner Production, 2005, page 1269-1279.

64. Formulation and Characterization of Anisotropic Conductive Adhesive Paste for Microelectronics Packaging Applications, Liqiang Cao, Shiming Li, Zonghe Lai, and Johan Liu November 2005 (volume 34, number 11), Journal of Electronic Materials, pp.1420-1427.

65. Low Cycle Fatigue testing and simulation of Sn-8Zn-3Bi and Sn-37Pb Solder joints, Peng Sun, Cristina Andersson, Xicheng Wei, Liqiang Cao, Zhaonian Cheng and Johan Liu Soldering and Surface Mounting Technology, Vol.17. No.4.,2005, pp38-45.

66. A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic Conductive Adhesive Joining Technology, Johan Liu, Liqiang Cao, Min Xie, Thong-Ngee Goh and Yong Tang, IEEE Component Packaging and Manufacturing Technology, Vol.28, No.4, October 2005, pp. 322-327.

67. Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint, Peng Sun, Cristina Andersson, Xicheng Wei, Zhaonian Cheng, Dongkai Shangguan and Johan Liu , Soldering and Surface Mount Technology, Vol.18. Number 2. 2006, pp 4-11.

68. Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection, Liu Chen, Zonghe Lai, Zhaonian Cheng, Johan Liu, Journal of Electronic Packaging, 2006, Vol.128, issue 3, pp. 177-183.

69. Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering, Peng Sun, Cristina Andersson, Xicheng Wei, Zhaonian Cheng, Dongkai Shangguan and Johan Liu, Materials Science and Engineering B, Vol.135, No.2, 2006, pp.134-140.

70. High temperature aging study of intermetallic compound formation of Sn-3,5Ag and Sn-4.0Ag-0,5Cu solders on electroless Ni(P) metallization, Peng Sun, Cristina Andersson, Xicheng Wei, Zhaonian Cheng, Dongkai Shangguan and Johan Liu, Journal of Alloys and Compounds, Vol.425, Nos.1-2, 2006, pp.191-199.

71. A method for determining elastic properties of micron-sized polymer particles by using flat punchtest, Z.L. Zhang, H. Kristiansen and J. Liu Computational Materials Science, Volume 39, Issue2, April 2007, Pages 305-314

72. Integrated inductors on liquid crystal polymer substrate for RF applications, Gang Zou, Hans Grönqvist and Johan Liu, Circuit World, Vol.32, No.1, 2006, pp41-44.

73. Reliability aspects of electronics packaging technology using anisotropic conductive adhesives, Johan Liu, Xiu-Zhen Lu and Liqiang Cao, Journal of Shanghai University (English Edition), ISSN 1007-6417, Vol.11 No. 1. Feb 2007, pp1-16.

74. Process and pad design optimization for 01005 passive component surface mount assembly, Yu Wang, Michael Olorunyomi, Martin Dahlberg, Zoran Djurovic, Johan Anderson and Johan Liu, Soldering and Surface Mount Technology, Volume 19, Number 1, 2007, pp.34-44.

75. Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate, Peng Sun, Cristina Andersson, Xicheng Wei, Zhaonian Cheng, Dongkai Shangguan and Johan Liu, Journal of Alloys and Compounds, 437 (2007), pp. 169–179.

76. Interface Modelling of Microsystem Interconnections Using Micropolar Theory and Discontinuous Approximation Computers and Structures, Ragnar Larsson, Yan Zhang, Jing-Yu Fan and Johan Liu, Computers and Structures, 2007, Vol 85, pp.1500-1513.

77. Low Temperature Transfer and Formation of Carbon Nanotube Arrays by Imprinted Conductive Adhesive, T. Wang, B. Carlberg, M. Jönsson, G.-H. Jeong, E. E.B. Campbell and J. Liu, APPLIED PHYSICS LETTERS, 91, 093123, 2007.

78. "Tensile Properties and Microstructural Characterization of Sn-0.7Cu-0.4Co Bulk Solder Alloy for Electronics Applications," C. Andersson, P. Sun, and J. Liu, Journal of Alloys and Compounds,457 2008 (1/2) pp. 97-105.

79. Effect of different temperature cycle profiles on the crack initiation and propagation of Sn3,5Ag wave soldered joints, Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall, and Johan Liu, Microelectronics Reliability, 2007, vol. 47. pp.266-272.

80. Thermal Cycling aging effect on the shear strength, microstructure, IMC and initiation and propagation of surface mounted Sn-3,8Ag-0,7Cu and wave soldered Sn-3,5Ag ceramic chip components, Cristina Andersson, Per-Erik Tegehall, Dag Andersson, Göran Wetter and Johan Liu, IEEE Transactions on Components Packaging Technology, 31 2008 (2) pp. 331-344. .

81. Effect of Corrosion on the Low Cycle Fatigue Behaviour of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints, C. Andersson and J. Liu, International Journal of Fatigue, 30 (2008) pp.917-930.

82. The Comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu)/Cu joints during isothermal aging and their tensile strengths, Ju Guo-Kui, Xicheng Wei, Peng Sun and Johan Liu, Soldering and Surface Mount Technology, Vol.20 No. 3, 2008, pp4-10.

83. Understanding BGA interconnect interface behaviour using Micropolar theory, Yan Zhang, Johan Liu, Ragnar Larsson, Journal of Electronics Packaging,JUNE 2008, Vol. 130, page: 021010-1 to 021010-7-7.

84. Experiment investigation and micropolar modelling of the anisotropic conductive adhesive flip-chip interconnection, Yan Zhang, Johan Liu, Ragnar Larsson and Itsuo Watanabe, Journal of Adhesion Science & Technology, 22 (2008) 1717–1731.

85. Millimeter-wave ultra-wideband bandpass filter based on LCP substrates for automotive radar systems, Xia Zhang, Johan Liu, Peng Cai, Camilla kärnfeldt, Xu Wang, James Morris and Herbert Zirat, Journal of Microwave and Optical Technology Letters, Vol 50, No 9, September 2008, pp. 2276-2280.

86. Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression, Xiangdong Zou, Yulai Gao, Qijie Zhai, Cristina Andersson and Johan Liu, Journal of Electronics Materials, Vol. 38, No. 2, 2009, pp351-355.

87. Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures, Yi Fan, Xiaolong Zhong, Johan Liu, Teng Wang, Yan Zhang and Zhaonian Cheng, Microsystem Technologies, 2009 Vol. 15 pp.375-381.

88. MeltingtemperaturedepressionofSn-0.4Co-0.7Cu lead-free solder nanoparticles, C.D. Zou, Y.L. Gao, B. Yang and Q.J. Zhai, C. Andersson and J. Liu, Soldering & Surface Mount Technology, 21/2 (2009) pp. 9–13.

89. Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages, C.Andersson, B Vandevelde, C Noritake, P. Sun, P.E. Tegehall, D.Andersson, G.Wetter and J.Liu, Soldering and Surface Mount Technology, 21/2 (2009) pp28-38.

90. Coffin-Mansson equation of Sn-4.0Ag-0.5Cu solder joint, Soldering and Surface Mount Technology, S Chen, P. Sun, X. C Wei, Z.N. Cheng and J. Liu, 21/2 (2009), pp 48-54.

91. Polymer-metal nano-composite films for thermal management, Bjo¨rn Carlberg and Teng Wang, Johan Liu and Dongkai Shangguan, Microelectronics International, 26/2 (2009), pp. 28–36.

92. A compact ultra-wideband bandpass filter with ultra-fine conductor trace based on Liquid Crystalline Polymer Substrates, Xia Zhang, Johan Liu, Camilla kärnfeldt, Shiwei Ma, Xu Wang, Liqing Meng and Herbert Zirat, Circuitl World, Volume 35, Number 1, 2009, pp16-21.

93. Design of 50-70 GHz Planar Wideband Bandpass Filter on Liquid Crystalline Polymer Substrate, Xia Zhang, Dan Kuylenstierna, Johan Liu, Peng Cai, Cristina Andersson, James Morris and Herbert Zirat, Journal of Infrared Millimeter Terahertz Waves, Vol 30, 2009, pp183-189.

94. Electrospun polyurethane scaffolds for proliferation and neuronal differentiation of human embryonic stem cells, Björn Carlberg, Mathilda Zetterström Axell, Ulf Nannmark, Johan Liuand H Georg Kuhn, Biomed. Mater. Vol. 4 (2009) 045004 (7pp).

95. Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy,Yulai Gao, Changdong Zou, Bin Yang, Qijie Zhai, Johan Liu,Evgeny Zhuravlev, Christoph Schick, Journal of Alloys and Compounds 484 (2009) pp.777–781.

96. Through silicon vias filled with planarized carbon nanotube bundles, Teng Wang, Kjell Jeppson, Niklas Olofsson, Eleanor E B Campbell and Johan Liu, Nanotechnology 20 (2009) 485203.

97. Directphtolithographic patterning of electrospun films for defined nanfibrillar microarchitectures, Björn Carlberg, Teng Wang and Johan Liu,Langmuir, (2010), DOI:10.1021/1a9045447 A-E.

98. Application of through silicon via technology for in situ temperature monitoring on thermal interfaces, Yifeng Fu, TengWang, Ove Jonssonand Johan Liu, JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 20 (2010) 025027 (5pp) doi:10.1088/0960-1317/20/2/025027.

99. Design of Printed Monopole Antennas on Liquid Crystal Polymer Substrates, Xia Zhang, X. R. Yan, Johan Liu, Jian Yang and J. Morris, Journal of Infrared Millimeter and Terahertz Waves, 31 (4 ) s. 469-480, 2010.

100. Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach,Yue, C. ; Zhang, Y. ; Hu, Z. L. and Liu, J.(2010). Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems. 16 (4) s. 633-639.

101. Dry densification of carbon nanotube bundles, Teng Wang, Kjell Jeppson and Johan Liu, Carbon, Doi:10.1016/j.carbon.2010.06.042

102. A Reliability Study of Nanoparticles Reinforced Composite Lead- Free Solder, Si Chen, Lili Zhang, Johan Liu, Yulai Gao and Qijie Zhai, Materials Transactions, Vol. 51, No. 10 (2010) pp. 1720-1726.

103. Ultrafast Transfer of Metal Enhanced Carbon Nanotubes at Low Temperature for Large Scale Electronics Assembly, Yifeng Fu, Yiheng Qin, Teng Wang, Si Chen and

Johan Liu, Advanced Materials, DOI: 10.1002/adma.201002415 104. A reliability study of nanoparticles reinforced composite lead-free solder, Si

Chen, Lili Zhang, Johan Liu, Zhaonian Cheng, Yulai Gao and Qijie Zhai, Materials Transactions, Vol. 51, No. 10 (2010) pp. 1720- 1726, The Japan Institute of Metals.

Journal paper accepted:

• Flip Chip Assembly Using Carbon Nanotube Bumps and Anisotropic Conductive Adhesive Film, XiaZhang, Teng Wang, Pär Berggren, Si Chen, JohanLiu, to be appeared in Electrochemical Society Transactions - CSTIC 2010" Volume 27, "Packaging and Assembly", March 2010.

• Molecular Gun Composed of Carbon Nanotube, in the Journal of Computational and Theoretical Nanoscience (CTN), Zhili Hu, Xingming Guo, September 2010.

Journal paper submitted:

• Istropic conductive adhesive interconnect technology in electronics packaging applications, James E Morris, Jeahuck Lee and Johan Liu, Changqings book chapter

Conference papers 1. Solidification studies of iron-base alloys, J. Liu and H. Fredriksson. Proceedings of the

Third International Conference: Solidification Processing, 1987, The Institute of Metals, 1988.

2. Production and properties of rapidly solidified atomized powders. L. Arnberg and J. Liu, invited paper presented at the MRS meeting on Advanced Materials, May 30-June 3, 1988, Tokyo, Japan.

3. Influence of processing conditions on structure and mechanical properties of a rapidly solidified Al-alloy, L. Arnberg, U. Backmark, J. Liu, N. Bäckström, A. Sjöberg and P. Liu, presented at the MRS meeting on Advanced Materials, May 30-June 3, 1988, Tokyo, Japan.

4. Nickel-iron-aluminium shape memory alloys with improved properties by rapid solidification, P. Johansson, J. Liu and S. Savage, presented at the European Conference "The Martensitic Transformation in Science and Technology", March 9-10, 1989, Bochum, West Germany.

5. A cost effective and flexible bumping method for flip-chip interconnections, J. Liu, Proceedings of ISHM-Nordic, Hotel Marienlyst, Helsingör, Denmark, September 22-25, 1991, pp223-232.

6. Joining of surface mounted devices using anisotropically conductive adhesives and non-conductive adhesives, J. Liu, Proceedings of ISHM-Nordic, Oslo/Lillenström, Norway, September 20-23, 1992, pp. 165-186.

7. Reliability of surface mounted devices using anisotropically conductive adhesives, J. Liu, invited paper, Proceedings Supplement of International Conference on Electronic Components and Materials, November 11-14, 1992, Hangzhou, China.

8. Process yield and reliability of fine pitch components in surface mounting technology, J. Liu, Proceedings of ISHM-Nordic 93, September 26-29, 1993, Göteborg, Sweden, pp. 30-46.

9. Development of 0.5 and 0.65 mm pitch QFP technology in surface mounting, Johan Liu and Anne Tillström, Proceedings of the 1993 IEEE/IEMT International Electronics Manufacturing and Technology (IEMT) Symposium, October 4-6, Santa Clara, California, USA, pp52-62.

10. Reliability assessment of anisotropically conductive adhesives as interconnection media in LCD applications, Roger Rörgren and Johan Liu, Proceedings of the International Seminar on Recent Achievements on Conductive Adhesives Joining Technology In Electronics Manufacture, IVF, Gothenburg, Sweden, September 23-24, 1993.

11. Chip On Glass using anisotropically conductive adhesives, Lars Ljungkrona and Johan Liu, Proceedings of the International Seminar on Recent Achievements on Conductive Adhesives Joining Technology In Electronics Manufacture, IVF, Gothenburg, Sweden, September 23-24, 1993.

12. Development of Chip on Glass technology using thermo-setting anisotropically conductive adhesives, Johan Liu and Lars Ljungkrona, Proceedings of the 4th International Conference and Exhibition on Micro System Technologies ´94"Micro, Electro, Opto, Mechanical Systems and Components", October 19-21, ICC, Berlin, Germany, VDE-Verlag gmbh, pp599-610.

13. Polymeric electronic packaging - World-wide achievements and future challenges, Johan Liu, Proceedings of the 1st International Conference on Adhesive Joining Technology in Electronics Manufacturing, Berlin, Germany, VDE/VDI-Verlag gmbh, November 2-4, 1994.

14. Process development for conductive adhesive joining technology for surface mounting electronics manufacturing, Lars Ljungkrona and Johan Liu, Proceedings of the 1st International Conference on Adhesive Joining Technology in Electronics Manufacturing, Berlin, Germany, VDE/VDI-Verlag gmbh, November 2-4, 1994.

15. Avoiding environmental regulation by using conductive adhesives, Johan Liu, invited paper, Proceedings of the European Surface Mount Conference organized by the SMART group November 16-17 1994, Old Ship Hotel, Brighton, UK, invited.

16. Reliability and failure mechanism of isotropically conductive adhesives, Li Li, James Morris, Johan Liu, Zonghe Lai, Lars Ljungkrona and Changhai Li, Proceedings of the 45th Electronic Components Technology Conference, Las Vegas, USA, May 21-24, 1995, pp114-120.

17. Comparison of non-conductive and conductive adhesive for surface mount application, Helge Kristiansen, Johan Liu and Are Björneklett, Proceedings of the 10th European Microelectronics Conference, May 13-17, 1995, Copenhagen, Denmark, pp35-43.

18. Flip-chip joining technology using conductive adhesives for solderless multi-chip modules assembly, Johan Liu and Zonghe Lai, Proceedings of International Conference on Electronic Components and Materials, Sensors and Actuators, ICECM´95, Xian, China, October 5-8, 1995, International Academical publishers, 1st edition, 1995, ISBN 7-80003-352-X, pp81-86.

19. A comparative study of ball grid array and ultra fine pitch QFP technologies using solder paste stencil printing, Roger Rörgren, Per Carlsson and Johan Liu, Proceedings of the Surface Mount International, San Jose, USA, August 27-31, 1995, pp286-294.

20. High frequency performance of flip-chip Joints using conductive adhesives, Peter Schwemm, University of Bremen, Johan Liu and Bill Brox, proceedings of the International Seminar in Conductive Adhesive Joining in Electronics Packaging, Eindhoven, Philips, The Netherlands, September 5, 1995, ISBN No 91-630-3729-7, pp183-196.

21. High frequency signal simulation of electrically conductive adhesives, Rolf Sihlbom and Johan Liu, proceedings of the International Seminar in Conductive Adhesive Joining in Electronics Packaging, Eindhoven, Philips, The Netherlands, September 5, 1995, ISBN No 91-630-3729-7, pp199-220.

22. When can we use conductive adhesives in volume production - An overview of advances of conductive adhesive joining technology in electronics applications, Johan Liu,

proceedings of the International Seminar in Conductive Adhesive Joining in Electronics Packaging, Eindhoven, Philips, The Netherlands, September 5, 1995, ISBN No 91-630-3729-7, pp225-234.

23. An overview of polymeric electronics packaging using conductive adhesives, Johan Liu, invited paper, Proceedings of the 2nd European Conference on Electronics Packaging, Essen, Germany, January 31 and February 2, 1996, DVS-Berichte Band 173, ISBN 3-87155-478-2, pp19-23. Also translated into Japanese by Nihon Handa, Japan in April 1996.

24. Flip-Chip bonding using isotropically conductive adhesives, Bela Rösner, Johan Liu and Zonghe Lai, Proceedings of the 46th Electronic Components and Technology Conference (ECTC), May 28-31, 1996, Florida, USA, pp578-581.

25. Surface characteristics, reliability and failure mechanisms of tin, copper and gold metallizations, Johan Liu, Katrin Gustafsson, Zonghe Lai and Changhai Li, Proceedings of the Second International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Stockholm, Sweden, June 2-6, 1996, pp141-153.

26. Large flip chip modules on FR-4 substrate using conductive adhesive joining technology, Bela Rösner, Kai Guttmann, Johan Liu, Zonghe Lai, Proceedings of the Second International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Stockholm, Sweden, June 2-6, 1996, pp301-305.

27. Influence of curing on the electrical and mechanical reliability of conductive adhesive joints, Cynthia Khoo, Johan Liu, Maria Ågren and Thomas Hjertberg, Proceedings of the 1996 International Electronics Packaging Society Conference, Austin, Texas, USA, September 29- October 1, 1996, pp483-501.

28. Modification of processes and design rules to achieve high reliable conductive adhesive joints for surface mount technology, Johan Liu and Bertil Weman, Proceedings of the Second International Symposium on Electronics Packaging Technology, December 9-12, 1996, printed by Shanghai Commercial Press, Fudan University, Shanghai, China, pp. 313-319.

29. The effect on temperature ramping rate on the flip-chip joint quality and reliability using anisotropically conductive adhesive film on FR-4 substrate, Katrin Gustafsson, Samjid Mannan, Johan Liu, Zonghe Lai, David Whalley and David Williams, ECTC´47, San Jose, California, USA, May 18-21, 1997, pp561-566.

30. High-frequency measurements and modelling of anisotropic, electrically conductive adhesive flip-chip joint, Markus Dernevik, Rolf Sihlbom, Zonghe Lai, Piotr Starski and Johan Liu, EEP-Vol. 19-1, Advances in Electronics Packaging - 1997 Volume 1 ASME 1997, pp. 177-184.

31. Piezoresistive measurement of mechanical stress in epoxy underfilled flip-chip-on-board (FCOB) devices, Jon Nysether, Pontus Lundström, and Johan Liu, presented at the Interpack´97,The Pacific Rim/ASME International, Intersociety Electronic & Photonic Packaging Conference, Sheraton Orchid Hotel, Hawaii, USA, June 15-19, 1997, published in EEP-Vol. 19-1, Advances in Electronics Packaging - 1997 Volume 1 ASME 1997, pp. 185-191.

32. Conductive adhesive joint reliability under full-cure conditions, Johan Liu, Pontus Lundström, Katrin Gustafsson and Zonghe Lai, presented at the Interpack´97,The Pacific Rim/ASME International, Intersociety Electronic & Photonic Packaging Conference, Sheraton Orchid Hotel, Hawaii, USA, June 15-19, 1997, published in EEP-Vol. 19-1, Advances in Electronics Packaging - 1997 Volume 1 ASME 1997, pp. 193-199.

33. Use of adhesives for electronics packaging and interconnecting applications, Johan Liu, presented in plenary session, Proceedings of the International Conference and Exhibition,

Micro Materials (Micro Mat´97), Berlin, Germany, edited by B Michel and T. Winkler, ISBN 3-932434-05-6, April 16-18, 1997, pp76-83.

34. Surface reactions on a tin/lead metallization used for conductive adhesive joining in electronics packaging, Katrin Persson, Anders Nylund, Johan Liu and Ingemar Olefjord, Proceedings of the 7th European Conference on Applications of Surface and Interface Analysis, Gothenburg, June 1997.

35. Recent Advances in Conductive Adhesives for Direct Chip Attach Applications, Johan Liu and Helge Kristiansen, Invited, presented at Semicon West´97, Packaging Materials Conference, July 16, 1997, San Jose Convention Center, USA, pp. I-1.

36. High-frequency properties of electrically conductive adhesive connections, Markus Dernevik, Rolf Sihlbom, Zonghe Lai, Piotr Starski and Johan Liu, Gigahertz´97, October 23-24, 1997, Kista, Sweden, pp48-49.

37. High-frequency measurements and simulations on the sequential build-up boards (SBU) - low-cost multilayer carriers, Rolf Sihlbom, Markus Dernevik, Mats Lindgren, Piotr Starski, Zonghe Lai and Johan Liu, Gigahertz´97, October 23-24, 1997, Kista, Sweden, pp54-55.

38. Flip-chip joining technology for solderless multi-chip modules assembly using anisotropic and non-conductive adhesives, Johan Liu and Zonghe Lai, Proceedings of the 7é Forum Microelectronique ASICs – MCM – Hybrids –CMS, Exposition & Conferences, 2-3 Avril, 1996, Sofitel,ST-Jacques, Paris, France, pp87-101.

39. Effect of the bump height on the reliability of ACA made joints for Flip-Chip electronic packaging, Anis Zribi, Katrin Persson, Zonghe Lai, Johan Liu, Yilan Change, Shouwen Yu and Magnus Willander, 2nd International Advanced Technology Workshop on Flip-Chip Technology, Chateau Elan Winery and Resort, Brazelton, Georgia, USA, March 14-16, 1998.

40. Electrically conductive adhesives at Microwave frequencies, Markus Dernevik, Rolf Sihlbom, Klas Axelsson, Zonghe Lai, Johan Liu and Piotr Starski, Proceedings of the 48th Electronic Components and Technology Conference (ECTC48), May 25-28, 1998, The Seattle Sheration, Seattle, Washington, USA.

41. High frequency interconnections using electrically conductive adhesives, Markus Dernevik, Johan and Liu Piotr Starski, presented at Mikon-98, the International Conference on Microwaves and Radar, Krakow, Poland, May 20-22, 1998.

42. The effect of microstructure of the Ni/Au metallization on the bondability of FR-4 substrate, Zonghe Lai and Johan Liu, Proceedings of The third International Symposium on Electronics Packaging Technology, ISEPT´98, August 17-20, 1998, Beijing, China, pp 168-172.

43. Application perspective of Nano Indentor in the Flip-Chip Bonding Technology of ACA, Yanli Wang, Guoliang Chen, Johan Liu and Zonghe Lai, Proceedings of The third International Symposium on Electronics Packaging Technology, ISEPT´98, August 17-20, 1998, Beijing, China, pp 483-486.

44. Isotropically conductive adhesives for Flip-Chip On Board circuits - measurements of life time under thermal cycling, Jon B Nysæther, Katrin Persson, Zonghe Lai and Johan Liu, Proceedings of the Third International Conference on Adhesive Joining Technology in Electronics Manufacturing ”Adhesives in Electronics”, Binghamton, USA, September 27-30, 1998, pp 125-131.

45. Overview of Conductive adhesive joining technology in electronics packaging applications, Johan Liu, Zonghe Lai, Helge Kristiansen and Cynthia Khoo, Proceedings of the Third International Conference on Adhesive Joining Technology in Electronics Manufacturing ”Adhesives in Electronics”, Binghamton, USA, September 27-30, 1998, pp 1-18.

46. Effect of bump height on flip-chip joint reliability using ACA, Katrin Persson, Anis Zribi, Zonghe Lai, Johan Liu and Magnus Willander, Proceedings of the Third International Conference on Adhesive Joining Technology in Electronics Manufacturing ”Adhesives in Electronics”, Binghamton, USA, September 27-30, 1998, pp 132-136.

47. Deformation study of the PCB during the flip-chip assembly process by using anisotropically conductive adhesive (ACA) as a bonding element, Kuntjoro Pinardi, Johan Liu, Ralf Haug, C Treutler and Magnus Willander, proceedings of the Third International Conference on Adhesive Joining Technology in Electronics Manufacturing ”Adhesives in Electronics”, Binghamton, USA, September 27-30, 1998, pp 34-37.

48. Thermal characterization of electrically conductive adhesive flip-chip joints, Anders Sihlbom and Johan Liu, Proceedings of the IEEE/CPMT Electronic Packaging Technology Conference, December 8-10, 1998, Singapore, pp251-257.

49. Silicon test structures for investigating the thermo-mechanical impact of polymeric packaging materials on microsystem reliability and performance, Jon Nysether, Johan Liu, Bent Liveröd, Andre Larsen and Per A Ohlckers, International, ASME/IEEE/IMAPS Workshop, MECHANICAL RELIABILITY OF POLYMERIC MATERIALS AND PLASTIC PACKAGES OF IC DEVICES, Paris, November 29 - December 3, 1998, pp 99-108.

50. Recent achievement in microstructure investigation of Sn0.5Cu3.5Ag lead-free alloy by adding boron and zirconium, L.L. Ye, Z. H. Lai, J. Liu and A. Thölen, Proceedings of the IMAPS/IEEE-CPMT 4th Symposium on Materials in Electronic Packaging, March 15-17th, 1999, Braselton, GA, USA, pp.262-267

51. The effects of bonding force on ACA flip-chip joint reliability”, Zonghe Lai and Johan Liu. 1999 IMAPS Proceedings of the Advanced Technology Workshop on Flip Chip Technology, Chateau Elan, Braselton, GA, USA March 12-14, 1999.

52. Exceeding the Tg of the underfill material in FCOB circuits - the impact on solder bump lifetime under thermal cycling, Jon B Nysæther and Johan Liu, proceedings of the 3rd 1999 International IEMT/IMC Symposium, April 21-23,1999 in Omiya, Japan, pp 276-280.

53. Reliability of ACA flip-chip joints on FR-4 substrate, Johan Liu and Zonghe Lai, InterPACK'99, International, InterSociety, Electronic Packaging Technical/Business Conference & Exhibition, June 13-17, 1999 / Maui, Hawaii, USA, pp. 1691-1697.

54. Overview of bumping technology for adhesive flip-chip joining technology, Helge Kristiansen and Johan Liu, InterPACK'99, International, InterSociety, Electronic Packaging Technical/Business Conference & Exhibition, June 13-17, 1999 / Maui, Hawaii, USA, Advanced Electronics Packaging, Vol.2, pp. 1681-1689

55. High frequency properties of lossless electrically conductive adhesive, Y. Fu, J. Liu and M. Willander, Proceedings of the 99´ International Symposium on High Density Packaging and Component Failure Analysis, Organized by SIM Daimler-Chrysler LAB, Shanghai Institute of Metallurgy, Chinese Academy of Sciences & The Swedish Institute of Production Engineering Research, June 28-30, 1999, Shanghai, China

56. The effect on the bump height on the strain pattern during the ACA flip-chip bonding, Kuntjoro Pinardi, Zonghe Lai, Dietmar Vogel, Johan Liu, Ralf Haug and Magnus Willander, Proceedings of The Second IEEE International Symposium on Polymeric Electronics Packaging, October 24-28, 1999, Göteborg, Sweden, pp. 159-162

57. World wide research and education status in electronics production and packaging, Lena Kvist and Johan Liu, Proceedings of The Second IEEE International Symposium on Polymeric Electronics Packaging, October 24-28, 1999, Göteborg, Sweden, pp.81-93

58. State of the art of conductive adhesive joining technology, Invited paper, Proceedings of the International Conference on Mechanics, Reliability and Processes on Polymeric

Materials in Electronics and Photonics Packaging, Poly´99, December 12-15, 1999, Paris, France, Johan Liu and James Morris, pp. 159-181.

59. Characterization of bulk mechanical properties of lead-free solders, Li Xiao, Johan Liu, Zonghe Lai, Lilei Ye and Anders Thölén, Proceedings of the International Conference on ”Advanced Packaging Materials Processes, Properties and Interfaces” March 6-8, 2000, Chateau Elan Braselton, Georgia, USA, pp145-151.

60. Effect of thermal ageing on the shear strength of lead-free solder joints, James Oliver, Johan Liu and Z. Lai, Proceedings of the International Conference on ”Advanced Packaging Materials Processes, Properties and Interfaces” March 6-8, 2000, Chateau Elan Braselton, Georgia, USA, pp152-157.

61. Microstructural coarsening of lead-free solders, Lilei Ye, Zonghe Lai, Johan Liu and Anders Thölén, ECTC50, Las Vegas, USA, May 20-23, 2000, pp134-137

62. An Internet Course on Conductive Adhesives for Electronics Packaging, Johan Liu and James E. Morris, ECTC 50th , May 20-23, 2000, Las Vegas, USA, pp1016-1020.

63. Bump Height Effect on the Reliability and on the Strains Variations of ACA Flip-chip Joints, K. Pinardi1, Zonghe Lai, Yi Lan Kang, Johan Liu, Sheng Liuand Ralf Haug,ECTC 50th, May 20-23, 2000 Las Vegas, USA, pp1118-1121.

64. Cluster effects on electrical conductance of isotropically conductive adhesive, Fu Ying, Magnus Willander and Johan Liu, Proceedings of the 4th Adhesive joining and Coating Technology in Electronics Manufacturing, 18-21 June 2000, Helsinki University of Technology, Espoo, Finland, pp188-193.

65. Reliability of ACF in Flip-Chip with Various Bump Height, C M L Wu, Johan Liu, N H Yeung,Proceedings of the 4th Adhesive joining and Coating Technology in Electronics Manufacturing, 18-21 June 2000, Helsinki University of Technology, Espoo, Finland, pp101-106.

66. ACA bonding technology for low-cost electronics packaging applications – current status and remaining challenges, Johan Liu, Key-note paper. Proceedings of the 4th Adhesive joining and Coating Technology in Electronics Manufacturing, 18-21 June 2000, Helsinki University of Technology, Espoo, Finland, pp1-15.

67. Heating and reliability characterization electrically conductive adhesives using variable frequency microwave cure, Tiebing Wang, Ying Fu, Matthias Becker and Johan Liu, 3rd EPTC'2000, Singapore, Dec 5-7, 2000 pp373-377.

68. Microwave transmission, heating of electrically conductive adhesives, Ying Fu, Tiebing Wang and Johan Liu, Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis, December 14-16, 2000, Shanghai, China, pp134-139

69. Heat Transfer Modeling of System in Package (SIP), Jiemin Zhou, Xitao Wang, Liu Chen, and Johan Liu, Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis, December 14-16, 2000, Shanghai, China, pp107-125.

70. Fatigue properties of lead-free solders, Xitao Wang, Cristina Andersson, Zonghe Lai, Johan Liu, Hairong Jiang, Yongning Yu, Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis, December 14-16, 2000, Shanghai, China, pp 163-169.

71. Modelling of Heat Transfer for System in Package (SIP), Jiemin Zhou, Xitao Wang, Liu Chen, and Johan Liu, EurosimE/2001, Paris, France, April 9-11,2001, pp89-94.

72. Development of an internet Course on Conductive Adhesives for Electronics Packaging, Johan Liu, Xitao Wang and James E. Morris, ECTC 51th , May 30-June 2, 2001, Florida, USA, pp1270-1275.

73. Microwave Cure of Metal-filled Electrically Conductive Adhesives, Tiebing Wang, Ying Fu, Matthias Becker and Johan Liu, ECTC 51th, May 30-June 2, 2001, Florida, USA, 593-597.

74. Low Cycle fatigue of lead-free solders, Cristina Andersson, Xitao Wang, Zonghe Lai and Johan Liu, The Fourth International Symposium on Electronic Packaging Technology, (ISEPT´01), August 8-11, 2001, Beijing, China, pp462-470.

75. Modelling of the anisotropic conductive adhesive assembly, David Whalley. Liu Chen and Johan Liu, Proceedings of Conference presentation at ISEPT´01, August 8-13, 2001, Beijing, China, pp319-324.

76. Comparison of Mechanical Fatigue Test and Thermal Cycling for Failure Analysis of Solder Joints, Xitao Wang, Liu Chen, Zonghe Lai, Johan Liu, Proceedings of The IMAPS Nordic 38th Annual Conference, Oslo, Norway, 23-26 September 2001, pp 70-77.

77. Low-Cycle fatigue life of SnAgBi and Sn-Ag lead-free solders, Cristina Andersson, Xitao Wang, Zonghe Lai and Johan Liu, Proceedings of the IMAPS Nordic, September 21-23, 2001, Olso, Norway, pp298-303.

78. Characterisation of Mechanical Properties of Metal-coated Polymer Spheres for Anisotropic Conductive Adhesive, H. Kristiansen, Y. Shen and J. Liu, submitted to 1st

International IEEE Conference on Polymers andAdhesives in Microelectronics and Photonics, POTSDAM, GERMANY, OCTOBER 21 - 24, 2001, pp344-348.

79. Life time prediction of anisotropic conductive adhesive joint for electronics packaging applications, Johan Liu, Proceedings of the 1st International IEEE Conference on Polymers andAdhesives in Microelectronics and Photonics, POTSDAM, GERMANY, OCTOBER 21 - 24, 2001, pp209-212.

80. D. C. Whalley, G. Glinsky, C.J. Bailey and J. Liu "Computational Modelling of the Anisotropic Conductive Adhesive Assembly Process" Proceedings of the 3rd International Symposium on Electronics Materials and Packaging, November 2001, Jeju, Korea, pp393-398, ISBN 0-7803-7157-7

81. D. C. Whalley and J. Liu "Thermal Performance of a System in Package Design Concept" Proceedings of APACK 2001 International Conference on Advances in Packaging, December 2001, Singapore, pp461-467, ISBN 981-04-4638-1.

82. High frequency characteristics of Liquid Crystal Polymer for System in a Package Application, Gang Zou, Hans Grönqvist, Piotr Starski and Johan Liu, 2002 8th International Advanced Packaging Materials Symposium, March 3-6, 2002, ISBN: 0-7803-7434-7, pp 337-341

83. Formulation and electrical and mechanical properties of anisotropic conductive adhesive pastes, Liqiang Cao, Shiming Li, Johan Liu, Proceedings of the 2002 Internatinal Conference on Electronics Packaging (2002 ICEP), Japan, pp272-277.

84. Panel-Size Component Integration (PCI) with Molded Liquid Crystal Polymer (LCP) Substrates, J. Kivilahti, J. Liu, J. E. Morris, T. Suga and C. P. Wong, ECTC´02, San Diego, USA, pp. 955-961.

85. Development of a generic model for life cycle inventory of up-stream processes in life cycle assessment of electronic products, Anders S. G. Andrae and Johan Liu, First International Conference on Design and Manufacture for Sustainable Development, June 27- 28 2002, University of Liverpool, UK, pp241-254.

86. Isotropically Conductive Adhesives for Large Power Electronics Applications,Kristian Olsson, Daniel Johansson, Shiming Li, Karsten Ovesen and Johan Liu, proceedings of the second International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronik´02, June 23-26, 2002, Hungary, pp 29-37.

87. Development and Characterization of Single Mode Microwave Cured Adhesives for Electronics Packaging Application, Shiming Li and Johan Liu, ECTC´02, San Diego, USA, pp 1147-1150.

88. Web Course on Electrically Conductive Adhesives, Johan Liu, James E. Morris*, Xitao Wang and Liqiang Cao, ECTC´02, San Diego, USA, pp.1502-1506.

89. Behaviour and Properties of Conductive Particles for Anisotropic Conductive Adhesive, Helge Kristiansen and Johan Liu, The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP´02), June 30 – July 3, 2002, Shanghai, China, pp111-114, ISBN No: 0-7803-9823-8.

90. Experimental and Theoretical Analysis for Material Behavior of Anisotropically Conductive Adhesive Film, Yilan Kang, Johan Liu, Zhonghe Lai, Zhifeng Zhang,Yu Qiu, The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP´02), June 30 – July 3, 2002, Shanghai, China, pp123-125, ISBN No: 0-7803-9823-8.

91. Microstructure Investigation of Sn-Ag-Based Lead-Free Solder Joints by Electron Microscopy, L. L. Ye, Z. H. Lai, J. Liu and A. Thölén, Proceedings of the IMAPS Nordic Conference, September 20-23, 2002, Stockholm, Sweden, pp180-187.

92. Development of a web-based course on lead-free solders, Johan Liu and Cristina Andersson, ECTC´03, May 27-30, 2003, New Orleans, USA, pp739-742.

93. Thermal Stress Analysis of a Novel Light Modulator, Zhimin Mo, Helge Kristiansen, Morten Eliassen, Shiming Li & Johan Liu, ECTC53, May 27-30, 2003, New Orleans, USA, pp1408-1412

94. Thermodynamic Assessment of Sn-Co-Cu Lead-free Solder Alloy, Libin Liu, Cristina Andersson, Johan Liu and Y C Chan, Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition July 6–11, 2003, Maui, HawaiiInterPack, 2003-35126.

95. Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate using the peel test with different moisture environment, Liqiang Cao, Polytronik´03, Montreu, Schweitzland, October,20-23, 2003, pp 309-313.

96. Z. Duo, L. Zheng, H. Tenhunen, L. Chen, G. Zou, and J. Liu, ‘Design and Development of Thin Film and LCP-Based System-on-Package Modules for RF/Wireless Applications’, Proceedings of The 4th Pori Electronics Production and Packaging Technology Conference, pp. 205-213, May, 2003

97. The deformation Characterization of Conductive Particles in Anisotropically Conductive Adhesive Using FEM, Liqiang Cao, Yanli Wang, Guoliang Chen and Johan Liu, Proceedings of the IMAPS Nordic Annual Conference, Helsingör, Denmark, September 21-23, 2004, pp.92-97.

98. Reliability Modeling and Simulation of Anisotropic Conductive Adhesive Flip-Chip Bonding Assembly using Global/Local FEM Approach, Zhimin Mo and Johan Liu, Proc. of 6th Internal Conference on Electronic Materials & Packaging (EMAP 2004), Penang, Malaysia, Dec 2004. pp 66-71.

99. Integrated Inductors on Liquid Crystal Polymer Substrate for RF Applications, Gang Zou, Hans Gronqvist and Johan Liu, Proc. of 6th Internal Conference on Electronic Materials & Packaging (EMAP 2004), Penang, Malaysia, Dec 2004. pp 484-487.

100. A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic conductive adhesive joining technology, Johan Liu, Liqiang Cao, Min Xie, Thong-Ngee Goh and Yong Tang, Proceedings of the Polytronik04, September 13-15, 2004, Portland, USA, Session paper: RT23.

101. High Frequency Flip Chip Interconnection on Liquid Crystal Polymer Substrate Using Anisotropic Conductive Adhesive,G. Zou, Hans Grönqvist, Zonghe Lai, Ulf Södervall J. Liu, CD Rom of the Proceedings of the Polytronik04, September 13-15, 2004, Portland, USA, Track no: AP35

102. Process Development and Reliability for System-in-a-Package Using Liquid Crystal Polymer Substrate, Liu Chen, Xingzhong Duo, Lirong Zheng, Zonghe Lai, Johan Liu,

ECTC04, Las Vegas, USA, pp 24-28. 103. Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip

Interconnection, Chen, Zonghe Lai, Zhaonian Cheng, Johan Liu, Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´04), Baolong Hotel, Shanghai, China, June 30- July 3, 2004, edited by Johan Liu and Jialin Cao

104. Integrating nano carbon tubes with microchannel cooler, Zhimin Mo, Johan Anderson and Johan Liu, Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´04), Baolong Hotel, Shanghai, China, June 30- July 3, 2004, edited by Johan Liu and Jialin Cao

105. Environmental Assessment of Embedded chip manufacturing Technology. A.S.G. Andrae, L. Chen, K. Schischke, M. Hagelueken, J. Liu (2004): In Proceedings of Electronics Goes Green 2004+, Sept.6-8, Berlin, Germany, 913-918.

106. Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of lead free solder joints of different electronic components, Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall, and Johan Liu, Proceedings of the 5th international conference on thermal, mechanical and thermo-mechanical simulation and experiments in micro-electronics and micro-systems (EuroSimE)”, Brussels, Belgium, May 10th to 12th, 2004, pp.455-464.

107. Characterization of electrical and mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive, Helge Kristiansen, T.O Grönlund and Johan Liu, Proceedings of IMAPS Nordic Annual Conference, Helsingör, Denmark, 26-28, September, 2004, pp86-91.

108. Microsystem Manufacturing, Assembly and Packaging Technology in Display-CardTM Applications,Junmei Duan, Johan Asplund and Johan Liu, Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4), pp290-293,Baolong Hotel, Shanghai, China, June 30- July 3, 2004, edited by Johan Liu and Jialin Cao, IEEE Catalog Number: 04EX905.

109. Characterization of Metal- coated Polymer Spheres and its Use in Anisotropic Conductive Adhesive, H.Kristiansen, T.O.Gronlund and J.Liu, Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4), pp259-264,Baolong Hotel, Shanghai, China, June 30- July 3, 2004, edited by Johan Liu and Jialin Cao, IEEE Catalog Number: 04EX905.

110. Effect of Curing Condition of Adhesion Strength and ACA Flip Chip Contact Resistance, Liqiang Cao, Zonghe Lai and Johan Liu, Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4), pp254-258, Baolong Hotel, Shanghai, China, June 30- July 3, 2004, edited by Johan Liu and Jialin Cao, IEEE Catalog Number: 04EX905.

111. Development of an ontology for the ACA technology in electronics applications, Johan Liu, Yu Wang and James Morris, 10th International Symposium and Exhibition on, Advanced Packaging Materials, March 16-18, 2005, Irvine, CA, USA, Paper 8.1.

112. Characterisation of Mechanical Properties of Metal-coated Polymer Spheres for Anisotropic Conductive Adhesive, H. Kristiansen, Z. Zhang, J. Liu, 10th International Symposium and Exhibition on, Advanced Packaging Materials, March 16-18, 2005, Irvine, CA, USA,. Paper 8.2

113. Integrated Nanotube Microcooler for Microelectronics Applications, Zhimin Mo, Raluca Morjan, Johan Anderson, Eleanor E.B. Campbell and Johan Liu, Proceedings of the IEEE CPMT Conference on Electronics Component Technology (ECTC55), , May 30 - June 3, 2005, Orlando, USA,. pp51-54.

114. Isothermal Low Cycle Fatigue Behavior of Single Shear Sn-9Zn and Sn-8Zn-3Bi Solder

Joint, Peng Sun, Cristina Andersson, Zhaonian Cheng, Zonghe Lai, and Johan Liu, Proceedings of the IEEE CPMT Conference on Electronics Component Technology (ECTC55), May 30 - June 3, 2005, Orlando, USA, pp696-700.

115. Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive, Liqiang Cao, Zhaonian Cheng, Zonghe Lai and Johan Liu, Proceedings of the 2005 International Conference on Electronics Packaging (ICEP), , Shinagawa Prince Hotel, Tokyo, Japan, April 13 -15, 2005, pp48-55.

116. Characterization of thermally conductive epoxy nano-composites", Lisa Ekstrand, Helge Kristiansen and Johan Liu, Proceedings of the 28th International Spring Seminar (ISSE), IEEE Catalog Number 05EX1142C, ISBN: 0-7803-9325-2, Wiener Neustadt, Austria, May 19-23, 2005, pp 19-23.

117. Integrated Capacitors and Resistors on Liquid Crystal Polymer Substrate, Gang Zou, Hans Gronqvist and Johan Liu, Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), June 27-30, 2005, Shanghai, China, pp305-308.

118. Residual Stress in Flip Chip Joining Using Anisotropic Conductive Adhesive, Zhaonian Cheng, Lisa Ekstrand, Johan Liu, Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), June 27-30, 2005, Shanghai, China, pp.139-144.

119. Microstructural evolution of Sn-Zn based lead-free solders after exposure to temperature and humidity, Peng Sun, Cristina Andersson, Zonghe Lai, Xicheng Wei, Zhaonian Cheng and Johan Liu, Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), June 27-30, 2005, Shanghai, China, pp197-202.

120. Determination of Mason-Coffin equation for Sn-Zn based lead-free solder joint, Peng Sun, Cristina Andersson, Zhaonian Cheng, Zonghe Lai, Dongkai Shangguan and Johan Liu, Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), June 27-30, 2005, Shanghai, China, pp342-347.

121. Adhesion study of copper layer deposited and liquid crystalline polymer for electronics packaging, Qi Zhang, Johan Liu and Lars Nyborg, Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), June 27-30, 2005, Shanghai, China, pp. 109-114.

122. Numerical Simulation Based on CFD for Impingement Heat Transfer in Electronics Cooling, Yan Zhang, Jingyu Fan and Johan Liu, Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), June 27-30, 2005, Shanghai, China, pp.360-364.

123. Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation, Yan Zhang, Ragnar Larsson, Jingyu Fan and Johan Liu, Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), June 27-30, 2005, Shanghai, China, pp. 115-119.

124. An Ontology of ICA for Microsystem applications, Jim Morris, Jeahuck Lee and Johan Liu,, Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), June 27-30, 2005, Shanghai, China, pp.120-127.

125. Ontology for the anisotropic conductive adhesive interconnect technology for electronics packaging applications, Johan Liu, Yu Wang, James Morrisand Helge Kristiansen, Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), June 27-30, 2005,

Shanghai, China,pp156-172. 126. Design for Manufacturability and Reliability of Embedded Display Smart Card, Yang Liu,

Rui Rodrigues and Johan Liu, Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), June 27-30, 2005, Shanghai, China, pp.476-478.

127. Microsystem Interconnections Modelling Using Micropolar Theory and Discontinuous Approximation, Yan Zhang, Ragnar Larsson, Jingyu Fan, Zhaonian Cheng, Johan Liu, Proceedings of 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2005), Wroclaw, Poland, 2005, pp.176-179.

128. THERMAL MODELING FOR SYSTEM-IN-A-PACKAGE BASED ON EMBEDDED CHIP STRUCTURE Liu Chen, Lisa Ekstrand and Johan Liu, Proceedings of the 5th IEEE International Conferences on Adhesives and Polymers (POLYTRONIK05), Wroclaw, Poland, 23-26 October 2005, pp.24-227.

129. Lisa Ekstrand, Zhimin Mo, Yan Zhang and Johan Liu, “Modelling of Carbon Nanotubes as Heat Sink Fins in Microchannels for Microelectronics Cooling” Proceedings of Polytronic 2005, Wroclav, Poland, October 23-26, 2005, pp.185-187.

130. Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of Sn-3.8Ag-0.7Cu solder joints, Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall, and Johan Liu, Proceedings of the IMAPS 2005, Brugge, Belgium, June 12-15, 2005, pp.523-528.

131. Process development and surface characterisation on liquid crystalline polymer substrate based system on package with chip embedded for electronic application, Qi Zhang, Zonghe Lai, Urban Jevelstam, Göran Fritz, Zhaonian Cheng, Lars Nyborg and Johan Liu, Proceedings of the International Conference on Electronic Packaging (ICEP 2006), Tokyo, Japan, April 19-21, 2006, pp 83-89.

132. Consequential toxicity assessment of the global shift to Pb free solder paste, Anders Andrae and Johan Liu, Proceedings of the International Conference on Electronic Packaging (ICEP 2006), Tokyo, Japan, April 19-21, 2006, pp298-303.

133. High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization, Peng Sun, Cristina Andersson, Xicheng Wei, Zhaonian Cheng, Zonghe Lai, Dongkai Shangguan and Johan Liu, Proceedings of the 56th IEEE CPMT International Conference on Electronic Components and Technology Conference (ECTC’06), San Diego, California, USA, May 30 –June 2, 2006, pp 1468-1475.

134. Low Cycle Fatigue of Sn-based Lead-free Solder joints and the analysis of fatigue life prediction uncertainty, Cristina Andersson, Peng Sun, and Johan Liu, Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Yan Chang Campus, Shanghai University, Shanghai, China, June 27- June 30, 2006, pp.19-26.

135. Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering, Peng Sun, Cristina Andersson, Xicheng Wei, Zhaonian Cheng, Dongkai Shangguan and Johan Liu, Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Yan Chang Campus, Shanghai University, Shanghai, China, June 27- June 30, 2006, pp.32-38.

136. RF Characterisation of Flip-Chip Aniostropic Conductive Adhesive Joints, Xu Wang, Zhaonian Cheng and Johan Liu, Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Yan Chang Campus, Shanghai University, Shanghai, China, June 27- June 30, 2006, pp123-127.

137. Design for embedded Chinese Display smart card, Hua Zhou, Yang Liu, Dimitar Antonov Kolev, Jingjing Chen, Zonghe Lai and Johan Liu, Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Yan Chang Campus, Shanghai University, Shanghai, China, June 27- June 30, 2006, pp134-138.

138. Homogenization Model Based on Micropolar Theory for the Interconnection Layer in Microsystem Packaging, Yan Zhang, Ragnar Larsson, Jing-yu Fan, Zhaonian Cheng1, Johan Liu, Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Yan Chang Campus, Shanghai University, Shanghai, China, June 27- June 30, 2006, pp.166-170.

139. On the heat transfer enhancement based on micro-scale air impingingment jets with microstructure heat sink in electronics cooling, JingYu Fan, Yan Zhang and Johan Liu, Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Yan Chang Campus, Shanghai University, Shanghai, China, June 27- June 30, 2006, pp.171-175.

140. Analysis of Mechanical Strength for Flip-chip Bonding of GaAs MMIC, Bo Zhang, Vignesh Murugesan，Niklas Billström，Patrik Stenquist and Johan Liu, Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Yan Chang Campus, Shanghai University, Shanghai, China, June 27- June 30, 2006, pp.325-328.

141. Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal ccling testing, Peng Sun, Cristina Andersson, Johan Liu, Dag R Andersson, Per-Erik Tegehall and Dongkai Shangguan, Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, Shanghai, China, August 26-29, 2006, pp.760-767.

142. Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate, Si Chen, Peng Sun, Johan Liu, Xiecheng Wei, Zhaonian Cheng and Dongkai Shangguan, Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, Shanghai, China, August 26-29, 2006, pp.368-373.

143. New Nano-Thermal Interface Material for Heat Removal in Electronics Packaging, Johan Liu, Michael Olugbenga Olorunyomi, Xiuzhen Lu, Wen Xuan Wang, Tomas Aronsson1 and Dongkai Shangguan, Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany, pp.1-6.

144. Characterization of Nanoparticles of Lead Free Solder Alloys, Wanbing Guan, Suresh Chand Verma,Yulai Gao, Cristina Andersson, Qijie Zhai1 and Johan Liu, Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany, pp.7-12.

145. Development of SOP Module Technology Based on LCP Substrate for High Frequency Electronics Applications, Xia Zhang, Qi Zhang, Gang Zou, Liu Chen, Zhaonian Chen and Johan Liu1, Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany, pp.118-125.

146. Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy, Andersson C Liu L. and Liu J. Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany, pp.152-160.

147. Flip-Chip Interconnection Using Anisotropic Conductive Adhesive with Lead Free Nano-Solder Particles, Suresh Chand Verma, Wanbing Guan, Cristina Andersson, Yulai Gao, Qijie Zhai and Johan Liu, Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden,

Germany, pp.282-286. 148. Assessment of Lead-Free Inert Gas Soldering Using a Novel Reflow Technology,

Oyebode Ayoade, Andersson Cristina, Hjertkvist Tobias and Liu Johan, Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany, pp.428-437.

149. Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free in Corrosive Environmental Conditions, Andersson C. and Liu J., Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany, pp.457-467.

150. Study on the Multi-Scale Properties of the Internal Structure in ACA Interconnection, Yan Zhang, Ragnar Larsson, Jing-yu Fan, Johan Liu, Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany, pp.757-761.

151. Flow Behaviour of Anisotropic Conductive Adhesive Film during COG Bonding Process in Flat Panel Display Assembly, Fabien Raugi, Mohammad Kamruzzaman Chowdhury, Helge Kristiansen2 and Johan Liu, Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany, pp.828-833.

152. Development and Characterization of Microcoolers using Carbon Nanotubes, Teng Wang, Martin Jönsson, Elisabeth Nyström, Zhimin Mo, Eleanor E.B. Campbell and Johan Liu, Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany, pp.881-885.

153. Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection, Teng Wang, Martin Jönsson, Eleanor E.B. Campbell and Johan Liu, Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany, pp.892-895.

154. Development of nanosolders and nanothermal interface materials and cooling devices based on nanocarbon tubes, Johan Liu, Teng Wang,Wanbing Guan, Michael Olugbenga Olorunyomi, Martin Jönsson, WenXuan Wang, Tomas Aronsson, Xiuzhen Lu, Yulai Gao, Qijie Zhai, Eleanor E.B. Campbell and Dongkai Shangguan, Proceedings of International Microelectronics and Packaging Conference (IMAPS) Nordic, September 17-19, 2006. ISBN number: 951-98002-9-8, pp212-219, Göteborg, Sweden.

155. Computational Fluid Dynamics Simulation for On-chip Cooling with Carbon Nanotube Micro-fin Architectures, Xiaolong Zhong, Yan Zhang, Teng Wang, Zhaonian Cheng, Johan Liu, 8th IEEE International Conference on Electronic Materials and Packaging (EMAP), December 11–14, 2006, Hong Kong, pp117-123.

156. Development of High Adhesion Nano-Thermal Interface Materials for Electronics Packaging Applications, Tomas Aronsson, WenXuan Wang, Michael Olugbenga Olorunyomi, Xiuzhen Lu, Dongkai Shangguan and Johan Liu, 8th IEEE International Conference on Electronic Materials and Packaging (EMAP), December 11–14, 2006, Hong Kong, pp196-199.

157. New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging Applications, WenXuan Wang, Xiuzhen Lu, Johan Liu,Michael Olugbenga Olorunyomi, Tomas Aronsson and Dongkai Shangguan, 8th IEEE International Conference on Electronic Materials and Packaging (EMAP), December 11–14, 2006, Hong Kong, pp631-635.

158. Manufacturing and Characterisation of Silver nano particles based Nano Thermal Interface material, Michael Olugbenga Olorunyomi, Xin Li, Johan Liu and Dongkai Shangguan, proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC), May 29-June 1, 2007, Reno, Nevada, USA, pp475-479.

159. Research on Lead-Free Solders at Chalmers University of Technology, Sweden, and Shanghai University, China, Johan Liu, Cristina Andersson and Qijie Zhai, TMS Spotlight paper on frontpage at: httpmaterialstechnology.tms.orgpbFreepbHome.asp Sept 5, 2007

160. Electrospun Nano-fibrous Polymer Films with Barium Titanate Nanoparticles for Embedded Capacitor Applications, Björn Carlberg, Jonas Norberg and Johan Liu, proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC), May 29-June 1, 2007, Reno, Nevada, USA, pp.1019-1026.

161. Development and Characterization of Carbon Nanotube-based Bumps for Ultra Fine Pitch Flip Chip Interconnection, T. Wang, M. Jönsson, B. Carlberg, E. E.B. Campbell and J. Liu. Proceedings of the 16th European Microelectronics and Packaging Conference & Exhibition:EMPC2007, Oulu, Finland, June 17 - 20, 2007, pp 723-727.

162. Realization of A Ultra Wideband BPF based on LCP Substrate for Wireless Application, Xia Zhang, Camilla Kärnfeldt, Johan Liu, Shiwei Ma and Herbert Zirat, Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07), Shanghai Everbright Convention & Exhibition Center, Shanghai, China, June 26-28, 2007, pp.470-474.

163. A Study of Effects of Different Coolants on On-chip Cooling with Carbon Nanotube Micro-fin Architectures by Using Computational Fluid Dynamics Simulation, Yi Fan, Xiaolong Zhong, Johan Liu, Teng Wang, Yan Zhang and Zhaonian Cheng, Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07), Shanghai Everbright Convention & Exhibition Center, Shanghai, China, June 26-28, 2007, pp.448-453.

164. A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array, Xiaolong Zhong, Yi Fan, Johan Liu, Yan Zhang, Teng Wang, and Zhaonian Cheng, Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07), Shanghai Everbright Convention & Exhibition Center, Shanghai, China, June 26-28, 2007, pp.442-447.

165. Investigation of the Effect of Processing Variables on the Structure and Morphology of Nano-TIM, Wen Xuan Wang, Xiuzhen Lu, Johan Liu, Xu Wang, Zhaonian Cheng and Dongkai Shangguan, Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07), Shanghai Everbright Convention & Exhibition Center, Shanghai, China, June 26-28, 2007, pp.431-435.

166. An aging study of intermetallic compounds formation in Sn-0.4Co-0.7Cu, Lili Zhang, Si Chen, Peng Sun, Johan Liu and Zhaonian Cheng, Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07), Shanghai Everbright Convention & Exhibition Center, Shanghai, China, June 26-28, 2007, pp.331-335.

167. Studies of solder joint reliability under mechanical bending test on FR-4 PCBs with Sn-4.0Ag-0.5Cu solder paste, Si Chen, Peng Sun, Xicheng Wei, Zhaonian Cheng and Johan Liu, Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07), Shanghai Everbright Convention & Exhibition Center, Shanghai, China, June 26-28, 2007, pp.325-330.

168. Encapsulation of OLED device by Using Anisotropic Conductive Adhesive, Yan Zhang, Måns Andreasson, Hua Zhou, Johan Liu, Thorvald Andersson, Jing-yu Fan, Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07), Shanghai Everbright Convention & Exhibition Center, Shanghai, China, June 26-28, 2007, pp.314-317.

169. Tensile fracture behaviour of Sn-3.0Ag-0.5Cu solder joints on copper, Ju Guo-kui, Wei Xi-cheng, Sun Peng, Johan Liu, Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07), Shanghai Everbright

Convention & Exhibition Center, Shanghai, China, June 26-28, 2007, pp.306-310. 170. Preparation Techniques and Characterization for Sn-3.0Ag-0.5Cu Nanopowders, Xinzhi

Xia, Changdong Zou, Yulai Gao, Johan Liu, Qijie Zhai Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07), Shanghai Everbright Convention & Exhibition Center, Shanghai, China, June 26-28, 2007, pp.302-305.

171. Advances in Europe - China Green Electronics Collaboration, to Andersen, Idun Husabø Anderssen, Johan Liu, David Whalley, Helge Kristiansen, Tom Ove Grønlund, Krystyna Bukat and Xiuzhen Lu, Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07), Shanghai Everbright Convention & Exhibition Center, Shanghai, China, June 26-28, 2007, pp.131-134.

172. Investigation of Dielectric Strength of Electrospun Nanofiber Based Thermal Interface Material, Xu Wang, Wenxuan Wang, Xin Li, Bjőrn Carlberg, Xiuzhen Lu, Zhaonian Cheng, Johan Liu and Dongkai Shangguan, Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07), Shanghai Everbright Convention & Exhibition Center, Shanghai, China, June 26-28, 2007, pp.436-441.

173. Nanostructured Polymer-metal Composite for Thermal Interface Material Applications, Björn Carlberg, Teng Wang, Yifeng Fu, Johan Liu and Dongkai Shangguan, proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC), May 27-May 30, 2008, Orlando, USA, pp 191-197.

174. Development of High Temperature Stable Isotropic Conductive Adhesives，Zhikun Zhang, Sijia Jiang, Johan Liu and Masahiro Inoue，Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, July 28/31, 2008, Shanghai，China, CD Version，paper E3-04．

175. Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging，Johan Liu, Yifeng Fu and Teng Wang，Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, July 28/31, 2008, Shanghai，China, CD Version，paper E3-0１．

176. Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles，Lili Zhang, Wenkai Tao, Johan Liu, Yan Zhang, Zhaonian Cheng, Cristina Andersson, Yulai Gao and Qijie Zhai，Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging , July 28/31, 2008, Shanghai, China, CD Version， paper E1-10．

177. Numerical Investigation on the Effect of Filler Distribution on Effective Thermal Conductivity of Thermal Interface Material，Cong Yue, Yan Zhang, Johan Liu, Zhaonian Cheng, Jing-yu Fan，Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, , July 28/31, 2008, Shanghai，China, CD Version, paper C1-10．

178. A Study of Fluid Coolant with Carbon Nanotube Suspension for Microchannel Coolers，Yi Fan, Yifeng Fu, Yan Zhang, Teng Wang, Xiaojing Wang, Zhaonian Chengand Johan Liu，Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, July 28/31, 2008, Shanghai，China, CD Version， paper D1-05．

179. Vibration and Bucling of a carbon nanotbue inserted with a carbon chain, Zhili Hu, Ximing Guo and Johan Liu, Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, July 28/31, 2008, Shanghai，China, CD Version, paper D1-09.

180. Heat transfer simulation of nanofluids in microfluidic channels, Hongjun Liu, Xiaojin Wang, Minliang Zhang, Wen Zhang and Johan Liu, Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, , July 28/31, 2008, Shanghai，China, CD Version paper A2-04.

181. Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation Application, Li Xu, Cong Yue, Johan Liu, Yan Zhang, Xiu Zhen Lu and Zhaonian Cheng, Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, July 28/31, 2008, Shanghai，China, CD Version， paper EP-05．

182. Preparation of polysulfoneamide electrospinning nanofibers, Liu Li, Ying Shi, Qinghua Jiao, Yanan Wu, Zhikun Zhang and Johan Liu, Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, July 28/31, 2008, Shanghai，China, CD Version， paper EP-12.

183. A Compact V-band Planar Wideband Bandpass Filter Based on Liquid Crystal Polymer Substrates, Xia Zhang, Dan Kuylenstierna, Johan Liu, Peng Cai, Cristina Andersson, James Morris, Herbert Zirath, Proceedings of the 2nd Electronics Systemintegration Technology Conference, Greenwich, UK, September 1-4 2008, IEEE Catalog number: 978-1-4244-2814-4/08, pp163-167.

184. Recent Progress of Thermal Interface Materials, Johan Liu,, Teng Wang, Björn Carlberg, Masahiro Inoue, Proceedings of the 2nd Electronics Systemintegration Technology Conference, Greenwich, UK, September 1-4 2008, IEEE Catalog number: 978-1-4244-2814-4/08, pp351-358.

185. RF Performance of Flip Chip ACA Joints for CPW Transmission Lines,Xu Wang, Xia Zhang, Johan Liu and Yan Zhang, Proceedings of the 2nd Electronics Systemintegration Technology Conference, Greenwich, UK, September 1-4 2008, IEEE Catalog number: 978-1-4244-2814-4/08, pp501-506.

186. Effect of Encapsulation on OLED Characteristics with Anisotropic Conductive Adhesive, Yan Zhang, Måns Andreasson, Johan Liu, Thorvald Andersson, Hsuan-Yi Liao, Itsuo Watanabe, Proceedings of the 2nd Electronics Systemintegration Technology Conference, Greenwich, UK, September 1-4 2008, IEEE Catalog number: 978-1-4244-2814-4/08, pp613-616.

187. Overview of Carbon Nanotubes as Off-Chip Interconnects, Xia Zhang, Teng Wang, Johan Liu and Cristina Andersson, Proceedings of the 2nd Electronics Systemintegration Technology Conference, Greenwich, UK, September 1-4 2008, IEEE Catalog number: 978-1-4244-2814-4/08, pp633-638.

188. Recent Advances in the Synthesis of Lead-free Solder Nanoparticle, Cristina Andersson, Changdong Zou, Bin Yang, Yulai Gao, Johan Liu and Qijie Zhai, Proceedings of the 2nd Electronics Systemintegration Technology Conference, Greenwich, UK, September 1-4 2008, IEEE Catalog number: 978-1-4244-2814-4/08, pp915-922.

189. Electrical and Thermal Properties of Electrically Conductive Adhesives Using A Heat-resistant Epoxy Binder, Masahiro Inoue and Johan Liu, Proceedings of the 2nd Electronics Systemintegration Technology Conference, Greenwich, UK, September 1-4 2008, IEEE Catalog number: 978-1-4244-2814-4/08, pp1147-1152.

190. The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn–0.7Cu –0.4Co eutectic solder and ENIG/Cu substrate finish, Lili Zhang, Cristina Andersson, Johan Liu and Zhaonian Cheng, Proceedings of the 2nd Electronics Systemintegration Technology Conference, Greenwich, UK, September 1-4 2008, IEEE Catalog number: 978-1-4244-2814-4/08, pp1295-1300.

191. Heat Removal of Microchannel Coolers with Carbon Nanotube Suspension as the Coolant, Yi Fan, Yifeng Fu, Teng Wang, Johan Liu, Yan Zhang, Xiaojing Wang, Zhaonian Cheng,

Proceedings of the 2nd Electronics Systemintegration Technology Conference, Greenwich, UK, September 1-4 2008, IEEE Catalog number: 978-1-4244-2814-4/08, pp.1391-1394.

192. Preparation of Polymer-metal Nanocomposite Films and Performance Evaluation as Thermal Interface Material, Björn Carlberg, Teng Wang, Yifeng Fu and Johan Liu, Proceedings of the 2nd Electronics Systemintegration Technology Conference, Greenwich, UK, September 1-4 2008, IEEE Catalog number: 978-1-4244-2814-4/08, pp.1395-1400.

193. Recent Progress of Thermal Interface Material Research – An Overview, Johan Liu, Bruno Michel, Marta Rencz, Christian Tantolin, Claude Sarno, Ralf Miessner, Klaus-Volker Schuett, Xinhe Tang, Sebastien Demoustier and Afshin Ziaei, Therminic 2008, 24-26 September 2008, Rome, Italy, EDA Publishing/THERMINIC 2008, ISBN: 978-2-35500-008-9, pp 156-162.

194. Recent Development of Nano-solder Paste for Electronics Interconnect Applications, Johan Liu, Cristina Andersson, Yulai Gao and Qijie Zhai, Proceedings of the IEEE 10th Electronics Packaging Technology Conference, Dec 9-12, 2008, Singapore, pp84-93.

195. Stem Cell Growth and Migration on Nanofibrous Polymer Scaffolds and Micro-Fluidic Channels on Silicon-Chip, Johan Liu, H. Georg Kuhn, Yujia Jing, Jan-Olof Dahlberg,Linnea Ericsson,Anna Nilsson,Lena Nyberg, Behroz Ohady, Johan Svensson, Björn Carlberg, Christiana M.Cooper-Kuhn, Teng Wang and Yihua Zhu, Proceedings of the 2009 Electronic Components and Technology Conference, pp1080-1085. May 26-29, San Diego, USA.

196. Influences of Filler Geometry and Content on Effective Thermal Conductivity of Thermal Conductive Adhesive, Cong Yue, Yan Zhang, Johan Liu, Masahiro Inoue, Sijia Jiang, Zhaonian Cheng, 2009 Electronic Components and Technology Conference, pp.2056-2059, May 26-29, San Diego, USA.

197. Thermal Conductivity of Electrically Conductive Adhesives Containing Fillers with Multi-modal Particle Size Distributions, Inoue M. and Liu J, ICEP Japan, April, 2009, pp. 643-648.

198. Carbon Nanotubes as Cooling Fins in MicroelectronicSystems,Yifeng Fu, Teng Wang, Johan Liu, XiaojingWang and Yan Zhang, proceedings of the 9th Nanotechnology Conference: IEEE NANO 2009, Genova, Italy, July 26-30, 2009. Pp.10-14.

199. FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives, Nabi Nabiollah1, Johan Liu, Zhu Hilli, Yan Zhang, Yue Cong, Zhaonian Chen and Masahiro Inoue, proceedings of the 9th Nanotechnology Conference: IEEE NANO 2009, Genova, Italy, July 26-30, 2009. pp.511-514.

200. Study of the filler effect of the effective thermal conductivity of thermal conductive adhesive, Yan Zhang, Cong Yue, Johan Liu, Zhaonian Cheng and Fan-jin Yu, ICEP Japan, April, 2009, Session number: 16B1-1-39, pp638-642.

201. Multiscale Delamination Modeling of an Anisotropic Conductive Adhesive Interconnect Based on Micropolar Theory and Cohesive Zone Model, Yan Zhang, Jing-yu Fan and Johan Liu, Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 10-13,2009, Beijing, China, pp.160-163.

202. A Study of the Heat Transfer Characteristics of the Micro-channel Heat Sink, Shun Wang, Yan Zhang, Yifeng Fu, Johan Liu, Xiaojing Wang and Zhaonian Cheng, Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 10-13,2009, Beijing, China, pp.255-259.

203. Modeling of Nanostructured Polymer-Metal Composite for Thermal Interface Material Applications, Zhili Hu, Björn Carlberg, Cong Yue, Xingming Guo and Johan Liu, Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 10-13,2009, Beijing, China, pp.481-484.

204. Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA, Cong Yue, Yan Zhang, Zhili Hu, Johan Liu and Zhaonian Cheng, Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 10-13,2009, Beijing, China, pp.851-855.

205. Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging, Li Xu, Xiuzhen Lu, Johan Liu, Xinyu Du, Yan Zhang and Zhaonian Cheng, Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 10-13,2009, Beijing, China, pp.1039-1042.

206. Studies on Microstructure of Epoxy Molding Compound (EMC)-Leadframe Interface after Environmental Aging, Xiuzhen Lu, Li Xu, Huaxiang Lai, Xinyu Du and Johan Liu and Zhaonian Cheng, Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 10-13,2009, Beijing, China, pp.1051-1053.

207. The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder Si Chen, Zhaonian Cheng, Johan Liu, Yulai Gao and Qijie Zhai, Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP),August 10-13,2009, Beijing, China, pp.1240-1245.

208. Development of a test platform for thermal characterisation using a Through-Hole Via Technoloyg, Yifeng Fu, Teng Wang and Johan Liu, Proceedings of the Annual Nordic Conference in Microelectronics and Packaging (IMAPS Nordic), Tönsberg, Norway, September 13-15, 2009, pp 35-38.

209. Evaluation of new and improved thermal interface materials and surface roughness effect on thermal interface resistance, Carl Zandén, Björn Carlberg and Johan Liu, Proceedings of the The International 3rd Swedish Production Symposium, (SPS), December 2-3, 2009, Göteborg, Sweden, Edited by B-G Rosen, ISBN No: 978-91-633-6006-0, pp.88-96.

210. A Novel Isotropic Conductive Adhesive with AG Flakes, BN and SiC Nanoparticles,Huaxiang Lai, Xiuzheng Lu, Si Chen, Chune Fu and Johan Liu, Proceedings of the 2010 International Symposium on Advanced Packaging Materials: (APM) MicroTech, UK, Feb 28- March 2, 2010, pp.49-53

211. Optimisation of stiffness for conductive materials, Chune Fu, Si Chen, Pär Berggren, Qiong Fan, Wenhui Du, Balan Ganesh and Johan Liu, Proceedings of the 2010 International Symposium on Advanced Packaging Materials: (APM) MicroTech, UK, Feb 28- March 2, 2010, pp.29-33.

212. Reliability study for high temperature stable conductive adhesives,Wenkai Tao, Si Chen, Pär Berggren and Johan Liu, Proceedings of the 2010 International Symposium on Advanced Packaging Materials: (APM) MicroTech, UK, Feb 28- March 2, 2010, pp.74-77.

213. Interpenetrating phase polymer-metal composite for thermal interface material applications, Björn Carlberg1 andJohan Liu, IEEE CPMT Electronics System Integration Conference (ESTC), September 13-16, 2010, Berlin, Germany,E-ISBN:978-1-4244-8554-3.

214. MDS Investigation on the Heat Transfer Properties of CNT Micro-Channel Cooler, Yan Zhang, Shun Wang, Jing-yu Fan, Johan Liu, Proceedings of the IEEE CPMT Electronics System Integration Conference (ESTC), September 13-16, 2010, Berlin, Germany, E-ISBN:978-1-4244-8554-3.

215. Anisotropic Thermal Conductivity in Electrically Conductive Adhesives with Single- and Bimodal Filler-size Distributions Containing Ag Flakes and Micro-particles, Masahiro Inoue, Hiroaki Muta, Shinsuke Yamanaka, and Johan Liu, IEEE CPMT Electronics

System Integration Conference (ESTC), September 13-16, 2010, Berlin, Germany,E-ISBN:978-1-4244-8554-3.

216. Nanofiber based composites for thermal management, Johan Liu and Björn Carlberg, International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference, Taipei, Nangang Exhibition Center October 20 to 22, 2010, Taiwan.

217. Effects of BN and SiC Nanoparticles on Properties of Conductive Adhesive, Huaxiang Lai, Xiuzhen Lu, Huiwang Cui, Xiaohua Liu, Si Chen, Huiwang Cui, Tianan Chen and Johan Liu, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xian, China, ISBN Number: 978-1-4244-8141-5, August 16-19, 2010, pp 235-239,

218. Enhancing the mechanical reliability of miniaturized thermoelectric cooler using nanotechnology underfill, Xingrui Chen, Teng Wang, Joachim Nurnus, Mike Benkendorf and Johan Liu, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xian, China, ISBN Number: 978-1-4244-8141-5, August 16-19, 2010, pp1250-1254

219. MDS study on the adhesive heat transfer in micro-channel cooler, Shun Wang, Yan Zhang, Zhili Hu amd Johan Liu, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xian, China, ISBN Number: 978-1-4244-8141-5, August 16-19, 2010, pp 630-633.

220. New Fast Curing Isotropic Conductive Adhesive for Electronic Packaging Application, Wenhui Du, Chune Fu, Si Chen, Huiwang Cui, Xiaohua Liu, Tianan Chen and Johan Liu, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xian, China, ISBN Number: 978-1-4244-8141-5, August 16-19, 2010, pp199-201

221. Numerical Investigation on the Thermal Properties of the Micro-cooler, Yangming Liu, Yan Zhang, Shun Wang and Johan Liu, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xian, China, ISBN Number: 978-1-4244-8141-5, August 16-19, 2010, pp634-638.

222. Reliability Characterisation of Bi-modal High Temperature Stable Isotropic Conductive Adhesives, Wenkai Tao, Si Chen, Xiaohua Liu, Huiwang Cui, Tianan Chen and Johan Liu, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xian, China, ISBN Number: 978-1-4244-8141-5, August 16-19, 2010, pp225-228.

223. The Effect of Modulus on the Performance of Thermal Conductive Adhesives, Zhili Hu , Cong Yue, Xingming Guo and Johan Liu, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xian, China, ISBN Number: 978-1-4244-8141-5, August 16-19, 2010, pp648-651.

224. Aging effects on electrical and thermal conductivities of electrically conductive adhesvies of composed of a heat resistant epoxy binder, Masahiro Inoue, H Muta and Johan Liu, ICEP Proceedings, Tokyo, Japan May 12-14, 2010, pp523-528.

225. Future Emerging Packaging Technology Using Carbon Nanotubes, Johan Liu, Yiheng Qin, Carl Zandén, Yifeng Fu, Teng Wangand LileiYe, ELTE 2010 & 34th IMAPS-CPMT, Poland, Wroclaw, September 22-23, 2010

Conference paper submitted: Surface properties of electrospun polyurethane-based elastomer networks for biomedical applications,, C Zanden, C-T Wang, H Agheli,J Liuand M Voinova, Hybrid Materials, March, 2011.

Book chapters 1. ”Manufacturability, reäliability and failure mechanisms in conductive adhesive joining for

flip-chip and surface mount applications, Johan Liu and Pontus Lundström ”Conductive adhesives in Electronics Packaging”, edited by Johan Liu, Electrochemical Publications, UK, June1999, ISBN No 0 901 150 37 1, pp 212-255.

2. ”Overview of display interconnect of LCD and COG using conductive adhesives”, Helge Kristiansen and Johan Liu, ”Conductive adhesives for Electronics Packaging ”, edited by Johan Liu, Electrochemical Publications, UK, ISBN No 0 901 150 37 1, June 1999, pp376-399.

3. Overview of Conductive adhesive joining and bumping technology for direct chip attach applications, Helge Kristiansen and Johan Liu, in ”Materials, Fracture Mechanics and Micro Mechanics,” edited by T Winkler and A Schubert,, Berlin/Chemnitz, Germany, 1999, pp106-126.

4. “Fundamentals of Packaging Materials and Processes” 694-747, Pulugurtha Markondeya Ray, Johan Liu and Per Öchlckers, in “Fundamentals of Microsystems Packaging”, Editor: Rao Tummala, McGraw-Hill, ISBN-0-07-137169-9, May 2001

5. Overview of Conductive Adhesive Joining and Bumping Technology for direct chip attach applications, Helge Kristiansen and Johan Liu, Area Array Interconnection Handbook, edited by Karl Putlitz and Paul Totta, September 2001, ISBN No: 0-7923-7919-5, Kluwer academic publishers, MA, USA.

6. Electron conduction through nano particles in electrically conductive adhesives, Y Fu and J Liu, Micromaterials and Nanomaterials, Issue 2, 2003 pp40-45. Ddp goldenbogen druckvorstufe verlag, Germany.

7. Conductive adhesives, Ying Fu, Johan Liu and Magnus Willander, in “Lead free electronics”, edited by Sanka Ganesan and Michael Pecht, CALCE EPSC Press, University of Maryland, College Park, Maryland, USA, 2004 edition, International Standard book Number: 0-9707174-7-4, pp285-351.

8. Reliability of Conductive adhesives, Johan Liu and Zhimin Mo, in Lead-Free Solder Interconnect Reliability edited by Dongkai Shangguan, ASM International, Materials Park, Ohio, USA, 2005, ISBN Number: 0-87170-816-7

9. Conductive adhesives, Ying Fu, Johan Liu and Magnus Willander in “Lead free electronics” edited by Sanka Ganesan and Michael Pecht, IEEE Press, Wiley Interscience, A John Wiley & Sons Inc. Publication, USA, 2006, ISBN Number: 10 0-471-78617-9

10.Electrically Conductive Adhesives (ECAs), James E. Morris and Johan Liu in “Micro- and Opto-Electronic Materials and Structures – Physics, Mechanics, Design, Reliability, Packaging, Volume II: Physics Design – Reliability and Packaging”, edited by Ephraim Suhir, Y C Lee and C P Wong, ISBN 0-387-27974-1, 2007, Springer, pp. 527-570.

11.Development of Nanomaterials and Devices for Electronics Cooling and Interconnect, Johan Liu, Teng Wang, Björn Carlberg,Wanbing Guan, Martin Jönsson, Cristina Andersson, Yulai Gao, Qijie Zhai and Eleanor E.B. Campbell, Proceedings of the Ecology in Electronics Conference in “Progress in Eco-Electronics”, as Monongraphies of Tele, Radio Institute, Vol. 1, edited by Krystyna Bukat, Josef Gomek and Marek Gonera, Warsaw, Poland, ISBN 978-83-926599-0-7, May 25, 2008, pp33-47.

12.A METHOD STUDY OF CFD SIMULATION FOR CNT MICROCOOLER, Xiaolong ZHONG , Yan ZHANG , Johan LIU and Zhaonian CHENG , Proceedings of the Ecology in Electronics Conference in “Progress in Eco-Electronics”, as Monongraphies of Tele, Radio Institute, Vol. 1, edited by Krystyna Bukat, Josef Gomek and Marek Gonera, Warsaw, Poland, ISBN 978-83-926599-0-7, May 25, 2008, pp48-55.

13.Carbon Nanotubes for thermal management of Microsystems, Johan Liu and Teng Wang, in Nanopackaging, edited by James E. Morris, Springer, 2008, ISBN Number: 978-0-387-

47325-3, pp377-394. 1. Book Chapter accepted Display book, Shanghai University, Johan Liu and Yan Zhang, October 2007.

Patent granted 1. The production method for metallic fibres, H. Tomioka, J. Liu, S. Savage and S.

Furukawa, Japanese patent file No. 63-332268, December, 1988. 2. Use of a composite material as thermal interface material for microelectronics component

(Användning av ett kompositmaterial som termiskt kontaktmaterial för mikroelektroniska komponenter), Johan Liu and Dongkai Shangguan, Swedish patent number: SE 531 018 C2, Nov 18, 2008

3. A method for manufacturing of metal nano powders using consumable electrodes and electrical arching, Zhai Qijie, Gao Yu Lai, Guan Wanbin, Gong Yong Yong, Li Ren Xin, Hon Xue and Johan Liu, Chinese patent, ZL 200610026216.0.

4. A method of producing low melting point nano lead free solder alloy, Yu Lai Gao, Qijie Zhai, Changdong Zhou, Li Ren Xin, Xia Xin Zhi, Gong Yong Yong and Johan Liu, Chinese patent no: ZL 200710042756.2。

5. Thermally conductive metal/polymer nanocomposite and its related manufacturing methods (Termiskt ledande metall/polymer nanokompositfilm samt tillhörande tillverkningsmetoder), Johan Liu, Swedish patent number: 532 248, Nov 24, 2009.

6. Nanosolder paste, Johan Liu, Li Li Zhang, Si Chen, Yan Zhang, Qijie Zhai and Yulai Gao, Chinese patent, ZL 2008 1 0200302.8, 2010, Nov 17.

Patent pending 1. A method to produce low Sn based nano lead free solders with large melting point

depression, Yu Lai Gao, Qijie Zhai, Changdong Zhou，Bin Yang and Johan Liu，Chinese patent file no:200810200289.6

2. Bimodal Nano Lead free solder paste，Johan Liu，Lili Zhang，Si Chen，Yan Zhang，Qijie Zhai and Yu Lai Gao，Chinese patent file number：200810200297.0, Oct 2008

3. High Temperature Stable Electrically Conductive Adhesives, Johan Liu, Chinese patent file number: 2008100400348.0

4. Metod för fotolitografisk framställning av definierade monster I elektrospnnen film, Johan Liu,Swedish Patent File number: 0901207-1, Sept 23, 2009.

5. Flexible Conductive Adhesives, Johan Liu, Chinese patent application Number: 200910198199.2, November 2009

6. Manufacturing method and use of nano liquid for microchannel cooler, Johan Liu, Yan Zhang, Xiaojin Wang and Yi Fan, Chinese patent application Number :200910198195.4, November 2009.

7. CNT Bumps for electronics packaging, Johan Liu, Teng Wang and Xia Zhang, Chinese patent application Number: 200910199683.7. December 2009.

8. A method for filling through-hole silicon via using carbon nano tubes, Johan Liu, Chinese patent file number: 200910199682.2, December 2009

9. A method for densifying Carbon Nanotubes, Chinese patent file number, Johan Liu, 201010201218.5, June 2010.

10. A method for low temperature transfer for Carbon Nanotubes, Johan Liu, Chinese patent file number, 201010201137.5, June 2010.

Keynote papers and talks

1. Use of adhesives for electronics packaging and interconnecting applications, Johan Liu, plenary session, presented at the International Conference and Exhibition, Micro Materials (Micro Mat´97), Berlin, Germany, Apr, il 16-18, 1997, pp76-83.

2. "Overview of Conductive Adhesive Joining Technology in Electronics Manufacturing", Johan Liu, Zonghe Lai, Helge Kristiansen and Cynthia Khoo, Proceedings of the Third International Conference on Adhesive Joining Technology in Electronics Manufacturing ”Adhesives in Electronics”, Binghamton, USA, September 27-30, 1998, pp 1-18.

3. Overview of ACA joining technology in electronics packaging applications, Johan Liu, Key-note paper. Proceedings of the 4th Adhesive joining and Coating Technology in Electronics Manufacturing, 18-21 June 2000, Helsinki University of Technology, Espoo, Finland, pp1-15.

4. Electrical, thermal and mechanical aspects of system-in-a-packaging using low-cost liquid crystalline polymer substrate, Eurosime conference, Electrical, thermal and mechanical aspects of system-in-a-packaging using low-cost liquid crystalline polymer substrate, Johan Liu, Liu Chen, Gang Zou and Jorma Kivilahti, Eurosime conference, Aix-en-Provence, France, March 30 till April 2, 2003, pp 123-127.

5. Trends in Electronics Packaging, Johan Liu, Key note talk at the 8th Academic Conference on Microsystem Packaging May 19, 2005, Vienna, Austria

6. Nano-Solders, Nano-Thermal Interface Materials and Cooling Devices Based on Carbon Nanotubes for Electronics Manufacutring and Packaging Applictions, Johan Liu, Teng Wang, Wanbing Guan, Michael Olugbenga Olorunyomi, Martin Jönsson, WenXuan Wang, Tomas Aronsson1, Xiuzhen Lu, Yulai Gao, Qijie Zhai, Eleanor E.B. Campbell and Dongkai Shangguan, 2nd International Eco-Electronics Conference, December 7-8, 2006, Beijing, China.

7. Use of Nanotechnology for Potential Electronics Packaging Applications, Micronanoreliability 2007, Berlin 3-5, 2007, Germany.

8. Development of Nanomaterials and Devices for Electronics Cooling and Interconnect, Johan Liu, Teng Wang, Björn Carlberg,Wanbing Guan, Martin Jönsson, Cristina Andersson, Yulai Gao, Qijie Zhai and Eleanor E.B. Campbell, Proceedings of the Ecology in Electronics Conference in “Progress in Eco-Electronics”, as Monongraphies of Tele, Radio Institute, Vol. 1, edited by Krystyna Bukat, Josef Gomek and Marek Gonera, Warsaw, Poland, ISBN 978-83-926599-0-7, May 25, 2008, pp33-47.

9. New nanomaterials and processes for Potential Electronics Packaging Applications, Johan Liu, IeMRC annual workshop, Loughborough University, UK, September 2, 2009.

10. Reliability study for high temperature stable conductive adhesives, Wenkai Tao, Si Chen, Pär Berggren and Johan Liu, Proceedings of the 2010 International Symposium on Advanced Packaging Materials: (APM) MicroTech, UK, Feb 28- March 2, 2010, pp.74-77.

11. Future Emerging Packaging Technology Using Carbon Nanotubes, Johan Liu, Yiheng Qin, Carl Zandén, Yifeng Fu, Teng Wangand LileiYe, ELTE 2010 & 34th IMAPS-CPMT, Poland, Wroclaw, September 22-23, 2010

12. Nanofiber Based Composites for Thermal Management of Electronics Products, Johan Liu, Björn Carlbergand LileiYe, International Microsystems, Packaging, Assembly and Circuits Technology ( IMPACT) Conference, Taipei, Taiwan, October 20 - 22, 2010.

Invited papers 1. Production and properties of rapidly solidified atomized powders. L. Arnberg and J. Liu,

invited paper presented at the MRS meeting on Advanced Materials, May 30-June 3, 1988, Tokyo, Japan.

2. Reliability of surface mounted devices using anisotropically conductive adhesives, J. Liu, invited paper, Proceedings Supplement of International Conference on Electronic Components and Materials, November 11-14, 1992, Hangzhou, China.

3. Joining of displays using thermo-setting anisotropically conductive adhesives, Johan Liu and Roger Rörgren, presented at the International seminar "Kleben mit anisotrop leitfähigen kleben in der mikrosystemstechnik", November 23-24, 1993, Berlin, Germany, organized by VDI/VDE Technologiezentrum & Informationstechnik GmbH,

4. Avoiding environmental regulation by using conductive adhesives, Johan Liu, invited paper, Proceedings of the European Surface Mount Conference organized by the SMART group November 16-17 1994, Old Ship Hotel, Brighton, UK.

5. Solderless Multichip Modules - A reliable and environmentally compatible high volume Flip-Chip interconnecting technology using conductive adhesives, Johan Liu, Invited talk, presented at the IEEE Computer Society Computer and Systems Packaging Workshop, January 23-25, 1995, Cork, Ireland.

6. Use of conductive adhesives in electronics applications-world wide achievements and future challenges, presented at the First Conference of Materials Science and Technology for Domestic and Oversea Chinese Young Scientists, October 4-8, 1995, Xián, China, Chinese Journal of Materials Research, Vol 9, Suppl., December 1995, pp521-531.

7. Polymeric electronic packaging using conductive adhesives, invited paper, presented at the 2nd Conference on Electronic Pacakging Technology Eupac´96, Essen, Germany, January 31-February 2, 1996.

8. Recent Advances in Conductive Adhesives for Direct Chip Attach Applications, Johan Liu, Semicon West´97, Packaging Materials Conference, July 16, 1997, San Jose Convention Center, USA.

9. A System Packaging Concept for Radio Base Station Product, Katrin Gustafsson, Arne Tolvgard and Johan Liu, IEEE Computer and System Packaging Workshop, Granlibaken Lodge, Lake Tahoe, USA, June 1-4, 1997.

10.”Examples of use of conductive adhesives and their failure analysis in Electronics Packaging Applications, ” Johan Liu, given at the first International Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing, August 13-15, 1998, Shanghai, China.

11.”Overview of anisotropically conductive adhesive flip-chip joining technology - Applications and reliability, ” Johan Liu, given at the first International Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing, August 13-15, 1998, Shanghai, China.

12.Future packaging trend for Cellular, June 28-30, 1999, Johan Liu, given at the Second International Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing, Shanghai, China.

13.State of the art of conductive adhesive joining technology, Invited paper, Proceedings of the International Conference on Mechanics, Reliability and Processes on Polymeric Materials in Electronics and Photonics Packaging, Poly´99, December 12-15, 1999, Paris, France, Johan Liu and James Morris, pp. 159-181.

14.Modelling of Heat Transfer for System in Package (SIP), Jiemin Zhou, Xitao Wang, Liu Chen, and Johan Liu, EurosimE/2001, Paris, France, April 9-11,2000, pp89-94.

15.Future Microelectronics Manufacturing and Packaging Trend for Swedish Electronics Industry, Johan Liu, Symposium on Recent Progress in Packaging Research, The University of Tokyo, Japan, April 17, 2001.

16.Thermal cycling of CBGA assembly with Sb-Sn and Zn-Sn lead-free solder joints, C M L Wu and Johan Liu, Proceedings of the The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing

(HDP´02), June 30 – July 3, 2002, Shanghai, China, pp 5-10, ISBN No: 0-7803-9823-8. 17.System-on-Packaging: A Broad Perspective from System Design to Technology

Development, Li- Rong Zheng and Johan Liu, Proceedings of The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP´02), June 30 – July 3, 2002, Shanghai, China, pp183-191, ISBN No: 0-7803-9823-8. Microelectronics Reliability, 43 (8): 1339-1348, August 2003.

18.A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic conductive adhesive joining technology, Johan Liu, Liqiang Cao, Min Xie, Thong-Ngee Goh and Yong Tang, Proceedings of the Polytronik04, September 13-15, 2004, Portland, USA

19.Research on Lead-Free Solders at Chalmers University of Technology, Sweden, and Shanghai University, China, September 5, 2007, Johan Liu, Cristina Andersson and Qijie Zhai to be seen at MRS International Congress, Chong Qing, June 9-11, 2008, http://materialstechnology.tms.org/Hometest.asp?PageNum=0&community=Pbfree.

20.Recent Development of Nano-solder Paste for Electronics Interconnect Applications, Johan Liu, Cristina Andersson, Yulai Gao and Qijie Zhai, Proceedings of the IEEE 10th Electronics Packaging Technology Conference, Dec 9-12, 2008, Singapore, pp84-93.

Invited talk 1. Future electronics manufacturing and packaging trend for Swedish Electronics Industry,

Johan Liu, open lecture given at the City University of Hong Kong, December 20, 1999, Hongkong.

2. Education Status in the Area of Electronics Production and Packaging in Sweden, Margareta Pontén, Xitao Wang and Johan Liu, given at the academic Conference on Micrielectronics Packaging, March 5-7, 2001, City University of Hongkong, Hongkong.

3. Thermal cycling of CBGA assembly with Sb-Sn and Zn-Sn lead-free solder joints, C M L Wu and Johan Liu, Proceedings of the The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP´02), June 30 – July 3, 2002, Shanghai, China, pp 5-10, ISBN No: 0-7803-9823-8.

4. System-on-Packaging: A Broad Perspective from System Design to Technology Development, Li- Rong Zheng and Johan Liu, Proceedings of The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP´02), June 30 – July 3, 2002, Shanghai, China, pp183-191, ISBN No: 0-7803-9823-8.

5. Overview of system integration technology of active and passive components on low-cost substrate, Johan Liu, given at the 1st IEEE Emerging technologies Workshop in Berlin, Adlershof, Germany, January 24, 2003

6. Use of Carbon Nanotubes in electronics Packaging, International Symposium on Carbon based electronics, Oct 19-21, 2008, Korea.

7. Use of Carbon Nano Tubes in Potential Electronics Packaging Applications, Johan Liu, Xia Zhang and Teng Wang, IEEE nanotech, 2009, Genoa, Italy, July 26-30.

8. Development and challenges in commercialization of new nanotechnology based materials for microsystem heat dissipation applications, Johan Liu and Björn Carlberg and Lars Olsen, International Conference on Commericalisation of Micro and Nano Systems, COMS August 30 – Sept 2, 2009, Frederiksberg, Copenhagen, Denmark. Publication in trade magazine

1. Reliability of isotropic conductive adhesive joints, Electronics Environment, Lilei Ye and Johan Liu, November 2010, Sweden