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8/8/2019 Beyond Moore NXP
1/21
Beyond Moore the challenge for Europe
Dr. Alfred J. van Roosmalen
Vice-President Business Development, NXP Semiconductors
Company member of MEDEA+/CATRENE/AENEAS/Point-One
FIT-IT 08 Spring Research
Wien, May 8, 2008
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Agenda
Value chain de-verticalization
Expanding European strengths
Ecosystem collaboration
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The semiconductor value chain has become
very complex and very multinational e.g.
designcenter
waferfab
assemblycenter
customersite
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The semiconductor landscape is changing
Increasingly demanding market Disparity in innovation life cycle between semiconductor technologies
(typically 3 yrs) and final applications (down to 6 months)
Complete reference designs required, first-time-right and zero-defect
Leading to ongoing value chain de-verticalization Increasing outsourcing of shareable tasks to Original Design
Manufacturers (IP) and Electronic Manufacturing Services (foundries)
Growing role of semiconductor companies in defining the final applications
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Chip makers are moving up the value chain
Semiequipment
Semimaterials
Wafer foundry
Software
Systemmgmt
Chip maker
Application
Content
protection
Infrastructure
Systemintegrator
Service
provider
Contentprovider
Deliverynetwork
Gateway
mgmt
Legislatorregulations
From the hardware supply sideinto the final application
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Why are CMOS foundries so successful?
Ramp-up of any new wafer fab must be as fast as possible to allow for
quick learning and rapid yield improvement
To be cost-effective, the scale of CMOS wafer fabs must increasesignificantly in each new technology node (every 2-3 yrs)
Foundries can reach the necessary volume in ramp-up AND final
production by combining many chip designs in one unified technology
For individual chip makers, this foundry / fablite model is becoming the
most cost-effective way to manufacture CMOS digital logic
Early engagement in manufacturing technology R&D continues to be
needed to guide future chip design methodologies and architectures
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The growing role of chip makers
Building intelligent systems for the future requires close collaboration
between the innovation teams of chip suppliers and chip customers
The electronic part of final applications is increasingly determined anddesigned by semiconductor chip makers
Customer interface is shifting to the boundary between the embedded
code in the semiconductor device and the application software
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Intelligent systems need a brain, but they
also need arms, legs, ears and eyes
PowerSensor
Actuator
Storage
Processor
Radio
Multiple solutionsare possible
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Following Moores Law is one approach:
Monolithic CMOS logic System-on-Chip
PowerSensor
Actuator
Storage
Processor
Radio
Advantage:-Smallest footprint
Disadvantage:
-Limited functionality
More Moore
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Adding More-than-Moore is another:
System-on-Chip and System-in-Package
PowerSensor
Actuator
Storage
Processor
Radio
Advantage:-Full functionality
Disadvantage:
-Complex supply chain
More than Moore
More Moore
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M
oreMoore:Miniat
urization
More-than-Moore adds a non-scaling dimension
Bas
elineCMOS:CPU,Me
mory,Logic
130nm
90nm
65nm
45nm
32nm
22nm
Beyond Moore
More than Moore: Diversification
Analog/RF Passives HV / PowerSensors
ActuatorsBio-logic
InformationProcessing
Digital contentSystem-on-Chip
(SoC)
Interacting with people and environmentNon-digital content System-in-Package (SiP)
CombiningSoCandSiP: HigherValueSyst
ems
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Creating value in important new applications
InfotainmentCommunicationEnergy
SecurityHealth Transport
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Addressing key societal challenges in the
21st century
Ageing society
Personal health monitors Ambient intelligence care
Global warming / CO2 emission
Intelligent power control Electric vehicles and solar power
All-day traffic jams
Electronic road tolling Systems for guided individual transport
Terrorism
ePassport
Public security while retaining personal privacy
More-than-Moore is the essential element everywhere!
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Building on European strengths
Europe has a successful history of structured
collaboration between equipment and materials suppliers,
chip makers, and final application designers Mobile communication, smartcards, automotive, avionics
Europe has a strong fabric of large multinationals,
innovative SMEs, and renowned academic institutes, and
a broad expertise in setting standards Industries: e.g. semiconductors, lithography, SOI
Institutes: e.g. IMEC, CEA-LETI, FhG
Standards: e.g. GSM, MPEG, DVD, Bluetooth, DVB, NFC
More-than-Moore can be sourced from past generation
CMOS infrastructures, thereby enabling effective reuse of
existing wafer fabs
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More-than-Moore dimensions are lagging
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It is much more than just miniaturization
and cost-effective packaging
Multi -functionality
Multi -discipline
Multi -scale
Multi -technology
Multi -process and design
Multi -material and interface
Multi -variability
Multi -failure mode
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Need for leveraging critical workforce skills
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Collaboration of all stakeholders is needed
The number of More-than-Moore options increases, while the
availability of resources (money and people) in Europe is limited
Regional competence clusters (e.g. PdCs, Silicon Saxony, PointOne)provide a fertile breeding ground by bringing all R&D actors together
Transnational collaboration creates the economy of scale needed to
address the growing diversity of More-than-Moore
Public-private partnership is a key element in harnessing the European
innovation ecosystem vis-a-vis global competition
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Because we are not alone
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Summary
Semiconductor industry in Europe
is healthy
More-than-Moore adds competitivevalue through new functionalities
More-than-Moore supports
European public priorities and
application strongholds
More-than-Moore builds on know-
how and infrastructure in Europe
Public-private partnership is acritical enabler for global success
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