Background Statement for SEMI Draft Document 5943 Revision to …downloads.semi.org/web/wstdsbal.nsf/de4d7939711aeedf... · 2017. 6. 21. · SEMI E49.5, and SEMI E49.6 for information

Background Statement for SEMI Draft Document 5943

Revision to SEMI E49.2-1104:

GUIDELINE FOR THE QUALIFICATION OF POLYMER ASSEMBLIES USED IN ULTRAPURE WATER AND LIQUID CHEMICAL SYSTEMS IN SEMICONDUCTOR PROCESS EQUIPMENT

with title change to

GUIDE FOR THE QUALIFICATION OF POLYMER ASSEMBLIES USED FOR LIQUID CHEMICAL SYSTEMS IN SEMICONDUCTOR EQUIPMENT Notice: This background statement is not part of the balloted item. It is provided solely to assist the recipient in

reaching an informed decision based on the rationale of the activity that preceded the creation of this Document.

Notice: Recipients of this Document are invited to submit, with their comments, notification of any relevant

patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this

context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the

latter case, only publicly available information on the contents of the patent application is to be provided.

Background

This Guide is overdue for its mandatory five-year review (last reviewed 11-04) and has been rewritten to be brought

up-to-date with the latest known technology, including the title change to bring title into alignment with current

SEMI policy and to clarify actual subject.

Review and Adjudication Information

Task Force Review Committee Adjudication

Group: High Purity Liquid Assemblies & Systems

Task Force

Liquid Chemicals NA TC Chapter

Date: Monday, April 3, 2017 Tuesday, April 4, 2017

Time & Time Zone: 1:00 PM to 3:00 PM PDT 3:00 PM to 6:00 PM PDT

Location: SEMI HQ SEMI HQ

City, State/Country: Milpitas, CA/USA Milpitas, CA/USA

Leader(s)/Authors: Koh Murai (Megafluid Systems) Frank Flowers (PeroxyChem)

Standards Staff: Inna Skvortosva ([email protected]) Inna Skvortosva ([email protected])

Meeting details are subject to change, and additional review sessions may be scheduled if necessary. Contact Standards

staff for more information.

Telephone and web information will be distributed to interested parties as the meeting date approaches. If you will

not be able to attend these meetings in person but would like to participate by telephone/web, please contact Standards

staff.

Check www.semi.org/standards on calendar of event for the latest meeting schedule.

NOTICE: This Document is a complete rewrite.

http://www.semi.org/standards

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

Page 1 Doc. 5943 SEMI

Semiconductor Equipment and Materials International 673 S. Milpitas Boulevard Milpitas, CA 95035 Phone: 408.943.6900, Fax: 408.943.7943

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DRAFT Document Number: 5943

Date: 1/16/2017

SEMI Draft Document 5943

Revision to SEMI E49.2-1104:

GUIDELINE FOR THE QUALIFICATION OF POLYMER ASSEMBLIES USED IN ULTRAPURE WATER AND LIQUID CHEMICAL SYSTEMS IN SEMICONDUCTOR PROCESS EQUIPMENT

with title change to

GUIDE FOR THE QUALIFICATION OF POLYMER ASSEMBLIES USED FOR LIQUID CHEMICAL SYSTEMS IN SEMICONDUCTOR EQUIPMENT

NOTICE: This Document is a complete rewrite.

NOTICE: This document was rewritten in its entirety in 2004, and is a replacement for the previous versions of both

E49.2 & E49.3.

NOTICE: Paragraphs entitled NOTE are not an official part of this document and are not intended to modify or

supercede it.

1 Purpose

1.1 The objective of this document is to provide a guideline by which the purity and mechanical integrity of all

ultrapure water and liquid chemical assemblies as shipped to end users may be qualified. It is also the purpose of this

guide is to complement the following:

SEMI F57: Specification for High Purity Polymer Materials and Components Used in Ultrapure Water and

Liquid Chemical Distribution Systems, and;

SEMI E49.7: Guide for the Design and Manufacture of Polymer Assemblies Used for Liquid Chemical

Systems in Semiconductor Equipment.

2 Scope

2.1 To ensure the purity and mechanical integrity of ultrapure water and liquid chemical Assemblies the following

tests and quality guidelines are recommended:

Hydrostatic Pressure Tests – See Table 1, Section 10.1, 10.2 and Section 10.3.

Ultrapure Water Flush Test – See Table 1 Section 10.1, and Section 10.4.

Particle Test – See Table 1, Section 10.1 and Section 10.5

Ionic and Metallic Contamination Tests – See Table 1, Section 10.1, and Section10.6

Certification – See Section 12 for defining, establishing, executing, and maintaining a certification program.

Traceability – See Section 13 for the responsibilities for suppliers to verify compliance with SEMI F57,

SEMI E49.7, and this document.

2.2 Typical ultrapure water and liquid chemical delivery components and systems are addressed in SEMI F57 and

F61. All clean room equipment requiring high purity UPW and liquid chemical assemblies are covered by this guide.

Liquid chemical assemblies used in non-clean room systems that still require high quality and purity include, but are

not limited to the following:

BCD/PCD equipment

Chemical and/or slurry Filtration/Mixing Skids provided by OEM

Post CMP Cleaning equipment




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Metrology equipment

Ancillary equipment provided with the process equipment.

NOTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their use.

It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and determine

the applicability of regulatory or other limitations prior to use.

3 Assumptions

3.1 This guide represents current industry best practice(s). If a user of this document has a process or criteria that is

more stringent than the practices in this guide, then some of the criteria in this document may not be applicable.

3.2 Users – assembly supplier to OEM, Fab owner (end user), facilitizing group.

3.3 The document implies testing of the most critical assembly. The definition of the most critical assembly is to be

defined by the end user. Non-critical assemblies may be tested using less stringent techniques.

3.4 This document applies to the entire supply chain, starting from the sub-component supplier, to the tool vendor

supplier of assemblies, to the semiconductor end-user tool install works. (The entire supply chain needs to do whatever

necessary to ensure the assembly will meet the qualification criteria of this document).

3.5 Under particle measurement methods, both static and dynamic condition(s) of the assembly should be tested. In

the case of complex assemblies (complete chemical blend/dispense tools) the dynamic conditions should correspond

to the normal operating states of the assembly.

3.6 If the assembly is for components being qualified for an application or end use, this document can be used. If the

assembly is being tested for material quality and handling, then SEMI F57 would be appropriate to use.

3.7 This guide content is applicable for both initial assembly qualification as well as post start up trouble shooting

and analysis.

4 Limitations

4.1 For the purposes of this document, qualification recommendations are limited to the purity and mechanical

integrity of Assemblies as outlined in the purpose and scope. Qualification recommendations are not intended to

address any other operational parameters (for example, flow capacity, flow rates, reliability, chemical compatibility

etc.).

4.2 This guideline does not define the purity performance requirements of individual components, which are expected

to be addressed by SEMI F57. Nor does this document provide guidelines for the design and manufacture of

Assemblies, which may be addressed by SEMI E49.7.

4.3 Facility distribution systems are also outside the scope of this guideline. Tool hook up piping and controls are

outside the scope of this guideline. Reference SEMI F61 for UPW systems.

4.4 Stainless steel or other non-polymeric Assemblies are outside the scope of this document. Refer to SEMI E49.4,

SEMI E49.5, and SEMI E49.6 for information on stainless steel components and Assemblies.

4.5 This guideline is not intended to apply to Assemblies used in the delivery of liquids that do not contact the wafer’s

or other critical surfaces, for example drainage and remediation assemblies.

5 Referenced Standards and Documents

5.1 SEMI Standards and Safety Guidelines

SEMI C59 Specifications and Guidelines for Nitrogen

SEMI E49.4 Guide for High Purity Solvent Distribution Systems in Semiconductor Manufacturing Equipment

SEMI E49.5 Guide for Ultrahigh Purity Solvent Distribution Systems in Semiconductor Manufacturing Equipment




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SEMI E49.7 Purity Guide For the Design and Manufacture of Ultrapure Water and Liquid Chemical Systems in

Semiconductor Process Equipment

SEMI F57 Specification for Polymer Components Used in Ultrapure Water and Liquid Chemical Distribution

Systems

SEMI F61 Guide for Ultrapure Water System Used in Semiconductor Processing

5.2 ASTM Standards1

ASTM D5542 – Standard Test Method for Trace Anions in High Purity Water by Ion Chromatography

ASTM D5127 – Standard Guide for Ultra-Pure Water Used In the Electronics and Semiconductor Industries

ASTM D5673 – Standard Test Method for Elements in Water by Inductively Coupled Plasma -Mass Spectrometry.

ASTM D6317 – Standard Test Method for Low Level Determination of Total Carbon, Inorganic Carbon and Organic

Carbon in Water by Ultraviolet, Persulfate Oxidation, and Membrane Conductivity Detection

ASTM D5997 – Standard Test Method for On-Line Monitoring of Total Carbon, Inorganic Carbon in Water by

Ultraviolet, Persulfate Oxidation, and Membrane Conductivity Detection

ASTM F1094 – Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and

Microelectronic Devices by Direct Pressure Tap Sampling Valve and by Presterilized Plastic Bag Method.

5.3 Other Standards-References

Hydrostatic Pressure and Leak Testing of Polymer Piping Systems Used in High-purity Water Applications2

NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

6 Terminology

6.1 See Section 4 of SEMI E49.

6.2 For the purposes of this document, an “Assembly” or “Assemblies” is defined as a combination of two or more

ultrapure water or liquid chemical delivery components and is always capitalized when used in this manner.

6.3 For the purposes of this document Assemblies shipped to end users are those Assemblies sent to semiconductor

manufacturers which will not undergo any additional testing, cleaning, or other qualification processes. The

semiconductor manufacturer may perform additional testing outside the tests outlined by this document.

6.4 For the purposes of this document “supply chain” is defined as those manufacturers involved in producing

components, integrating or assembling components, and testing Assemblies.

6.5 For the purposes of this document components include but are not limited to all product covered by SEMI 57 as

well as product not covered by SEMI F57 such as pumps, storage tanks, drums, pressure vessels, sensors, monitors,

and purification equipment.

6.6 NIST is the National Institute of Standards and Technology.

6.7 MAWP = Maximum Allowable Working Pressure- Maximum pressure (based on the applicable design codes)

that the weakest component of a system can withstand.

6.8 Rated Pressure - Maximum desirable pressure at which a device/component will function properly over the

lifetime of the assembly. (Note that this may be less than or equal to MAWP. One example may be an air-op

diaphragm valve. The body of the valve may have a MAWP of ~200psig prior to burst, but the actuator may not be

able to keep the valve closed above 150psig.)

6.9 MAOP = Maximum Allowable Operating Pressure = Maximum pressure that the system may be operated at. This

is usually the lowest value of the considered rated pressure and MAWP of all system components.

1 American Society for Testing and Materials, 100 Barr Harbor Drive, West Conshohocken, Pennsylvania 19428-2959, USA. Telephone: 610.832.9585, Fax: 610.832.9555, Website: www.astm.org 2 Mayer, Burkhart, Rydzewski, UltraPure Water Journal, May/June 2002, pp. 27-40




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6.10 Manufacturer’s Recommended Operating Pressure = MAOP

6.11 Manufacturer’s Absolute Pressure = MAWP

6.12 For the purposes of this document, with respect to hydrostatic pressure testing, “Welded or machined assembly”

- Any assembly or sub-assembly comprised of primarily of commercially-available pipe, tube, and fittings which are

joined by thermal welding processes. Such assemblies may also contain fittings or elements that are machined from

polymer rod, bar, or sheet stock. These assemblies, once welded together, may not be disassembled except by

destructive processes (such as cutting or sawing). Examples of these assemblies include pipe spools, tube assemblies,

valve manifolds, filter housings, and the like.

6.13 For the purposes of this document, with respect to hydrostatic pressure testing, “Mechanically-connected

assembly” - Any assembly which may be separated without the use of destructive processes into smaller non-separable

components and then reassembled. Such assemblies usually incorporate welded or machined assemblies having pipe

or tube union fittings at various connection points. An example of a mechanically-connected assembly may be a fluid

system which utilizes several smaller welded pipe assemblies, with each pipe assembly connected to the next via a

pipe union.

7 Performance Guidelines

Table 1 Overview of Recommended Tests

Test Frequency Performance Guideline Test Method

Hydrostatic Pressure:

Welded or machined

assemblies

Every Assembly shipped to

the end user

No visible leakage & < 2.5%

pressure decay in 15 minutes. Test

pressure to be 1.5 times the normal

operating pressure, but should not

exceed the Maximum Allowable

Working Pressure rating of each

component in the assembly.

Section 10.1

Section 10.2

Hydrostatic Pressure:

Mechanically connected

assemblies

Every Assembly shipped to

the end user or entire system

No visible leakage & < 2.5%

pressure decay in 4 hours. Test

pressure to be 1.3 times the normal

operating pressure, but should not

exceed the Maximum Allowable

Working Pressure rating of each

component in the assembly.

Section 10.1

Section 10.3

Ultrapure Water Flush Every Assembly shipped to

the end user.

Resistivity: > 18 meg ohm-cm @

25°C (77°F)

Allowable TOC adders (ppb): < 7.5

Section 10.1

Section 10.4

Particle Periodic testing – see Section

12.7 (at end user site)

Allowable Particle adders

(Particules/L > 0.1 µm) : < 120

Section 10.1

Section 10.5

Ionic Contamination Periodic testing – see Section

12.7

Allowable ionic adders (ppb):

F-: < 7.5

Cl-: < 0.40

NO2-, Br-, NO3-, HPO4=, SO4= <

0.05

Section 10.1

Section 10.6

Metallic Contamination Periodic testing – see Section

12.7

Allowable metallic adders (ppb):

Al, Ba, B, Ca, Cr, Cu, Fe, Pb, Li, Mg,

Mn, Ni, K, Na, Sr, and Zn: < 0.02

Section 10.1

Section 10.6

NOTE 1: Table 1 provides an overview of the tests recommended within this document and associated performance criteria. For

detailed explanations of testing frequency, test methods, and some examples of tests, refer to the sections identified within the

table.




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NOTE 2: TOC – For practical purposes, the grab sample technique may be preferred in some cases. In this case ASTM D6317

method should be used and the lab analytical sensitivity capability should be confirmed. (minimum detection limit of 5 ppb)

NOTE 3: Resistivity – Resistivity sensors have known accuracy limitations. Therefore, local site quality manager should take into

account the results of the ionic and metallic contamination test data when evaluating the final outcome of a specific instrument

used to qualify/measure resistivity.

NOTE 4: Resistivity – the selection of the resistivity sensor should take into account vendor installation and operation

requirements; this can affect the sensitivity of the readings.

NOTE 5: Particles – Dead legs (areas of no flow) in the test set up will affect the duration to achieve the desired cleanliness level.

They should be eliminated in the test set up, especially if these would not be present in normal operation of the assembly.

NOTE 6: Particles – It is expected that reaching the target level of particles will take some time, possible as much as several days.

For very complex assemblies this time line can be weeks in duration. The duration is function of the assembly components and

cleanliness level desired. Higher velocity will assist in reducing the duration of the qualification (see Related Information RI-1)

NOTE 7: Particles – While this guide recommends particle analysis on all assemblies, this may not be practical in all situations.

The local site quality manager may have to select the most critical or representative assembles for testing in order to meet site

requirements.

8 Utility Recommendations

NOTE 8: These are minimum utility recommendations for the media used during qualification of an Assembly.

8.1 Nitrogen

Nitrogen quality should meet requirements of SEMI C59.

Particle filtration should be 99.99999% removal of 0.003 micron particles.

8.2 Ultrapure Water

Resistivity 18 Mohm-cm @ 25°C (77°F)

TOC — < 5 ppb

Silica — < 5 ppb

Particles — (> 0.1 µm) < 500 particles/L

Anions (F-, Cl-, NO2-, Br-, NO3-, HPO4-, SO4-) < 0.10 ppb

Metals (Al, Ba, B, Ca, Cr, Cu, Fe, K, Li, Mg, Mn, Na, Ni, Pb, Sr, Zn) < 0.05 ppb

Bacteria — < 10 colonies/100 milliliter

NOTE 9: If testing requirements dictate, access to higher quality Ultrapure Water may be appropriate. Additional information

related to Ultrapure Water facility design and terminology may be obtained in SEMI F61, Guide for Ultrapure Water System Used

in Semiconductor Processing.

NOTE 10: For initial qualifications the preferred method for bacteria analysis is ASTM F1094.

8.3 Clean Dry Air (CDA) or Oil Free Air — Uses include pneumatic control and air actuation. CDA is not

recommended for use on cleaned wetted surfaces. Nitrogen is recommended for drying cleaned wetted surfaces

because the purity level is clearly defined and controlled.

9 Related Documents

9.1 ASTM Documents

ASTM D5997 – Standard Test Method for On-Line Monitoring of Total Carbon, Inorganic Carbon in Water by

Ultraviolet, Persulfate Oxidation, and Membrane Conductivity Detection

ASTM D6317 – Standard Test Method for Low Level Determination of Total Carbon, Inorganic Carbon and

Organic Carbon in Water by Ultraviolet, Persulfate Oxidation, and Membrane Conductivity Detection

ASTM F1094 – Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and

Microelectronic Devices by Direct Pressure Tap Sampling Valve and by Presterilized Plastic Bag Method.

http://www.astm.org/Standards/D5997.htm







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10 Sampling and Analysis Methodology

10.1 General Recommendations for all Tests

10.1.1 Trained and qualified personnel should perform all sampling and testing.

10.1.2 Assemblies tested can be by either grab sample or online measurement. Refer to Section 7, Table 1, for

recommended tests and performance guideline.

10.1.3 All instrumentation shall be calibrated with standards traceable to NIST or the equivalent national standard

where those standards exist. The type of instrument(s) manufacturer, model #, serial # or I.D #, and most recent

calibration date should be available.

10.1.4 If using two separate online instruments for inlet and outlet testing, determine any difference in the two

readings and include that in the final calculations.

10.1.5 Incoming and outgoing water should be sampled as close as possible to the Assembly’s liquid supply point

and the Assembly’s delivery point respectively. Where there are multiple inlets and/or outlets for an Assembly, a

single representative inlet and outlet should be selected for this testing. However, all inlets and outlets should be

flushed in a consistent manner such that the tests are representative of the Assembly performance.

10.1.6 For optimum results, the distance between a sample port and an instrument should be minimized. It is

recommended that components comply with SEMI F57 and the assembly and design should be in accordance with

SEMI E49.7.

10.1.7 Operate valves to ensure there is no entrapment and to displace any air prior to beginning a test.

10.1.8 Filter elements contained within the Assembly under test should not be included during a test as they may

mask results and will need to be replaced following the test.

10.1.9 Assemblies should be dried with Nitrogen and capped following any testing with ultrapure water and prior to

shipment.

10.2 Hydrostatic Pressure Test (Welded or Machined Assembly) – This test is required for every Assembly shipped

directly to an end user. This test may also be required periodically at other points in the supply chain.

10.2.1 The intent of this test is to eliminate Assembly leaks when an assembly is initially exposed to pressure and

temperature (up to and including the manufacturer’s maximum recommended operating pressure and temperature) at

the end user’s facility. The user of this test is encouraged to review “Hydrostatic Pressure and Leak Testing of

Polymer Piping Systems Used in High-purity Water Applications” (Mayer, Burkhart, Rydzewski) for a thorough

discussion of standards, and how the physical properties of polymers impact testing practices.

10.2.2 The Hydrostatic Pressure Test conditions are the manufacturer’s maximum recommended pressure at ambient

temperature. However, it is incumbent upon the manufacturer to ensure that the assembly will be leak free when

exposed to maximum pressure and maximum temperature at the end user’s facility. If the test conditions

recommended here do not result in initial leak free operation for the end user, it is incumbent upon the end user and

manufacturer to agree on appropriate corrective action(s) to comply with the intent of this Hydrostatic Pressure Test.

This may include testing at elevated media temperatures.

NOTE 11: In situations where testing with DI/UPW is undesirable due to possible contamination or incompatibility issues, an

alternate inert gas testing method may be considered.

10.2.3 Test Method

Test Media — Ultrapure Water at ambient temperature.

Test Pressure — Actual or pre-Manufacturer’s maximum recommended operating pressure.

Test Procedure

Flush system at maximum rated flow to remove entrapped air.

Keep assembly at constant temperature during test.

Pressurize to the Manufacturer’s maximum recommended operating pressure and wait 15 minutes.

Re-pressurize to Manufacturer’s maximum recommended operating pressure and wait 15 minutes.

Re-pressurize to Manufacturer’s maximum recommended operating pressure and wait 30 minutes.




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Re-pressurize to Manufacturer’s maximum recommended operating pressure.

Monitor the pressure for 15 minutes to ensure compliance with Table 1 requirement of < 2.5% decay in

pressure.

Record pressure readings at the beginning and end of each waiting period.

10.2.4 Hydrostatic Pressure Test Example

Figure 1

Hydrostatic Pressure Test Example

Test Media: Ultrapure Water

Test Media Temperature: 20C

Manufacturer’s maximum recommended operating pressure: 40 psig.

Assembly is pressurized to 40 psig for 15 minutes.

Assembly is repressurized to 40 psig for 15 minutes.

Assembly is repressurized to 40 psig for 30 minutes.

Assembly is repressurized to 40 psig.

During the next 15 minutes the Assembly pressure is monitored to ensure that no visible leakage or

pressure loss in excess of 1 psi (2.5%) is observed.

10.2.5 As noted in Table 1, the requirement to pass this test is no visible leakage and pressure decay of less than or

equal to 2.5% of maximum recommended operating pressure. The actual pressure decay and results of a visible

inspection should be noted on the test report.

10.3 Hydrostatic Pressure Test (Mechanical Assembly) – This test is required for every assembly at the end user site

or at the integrator’s site.

10.3.1 The intent of this test is to eliminate Assembly leaks when an assembly is initially exposed to pressure and

temperature (up to and including the manufacturer’s maximum recommended operating pressure and temperature) at

the end user’s or integrator’s facility. The user of this test is encouraged to review “Hydrostatic Pressure and Leak

Testing of Polymer Piping Systems Used in High-purity Water Applications” (Mayer, Burkhart, Rydzewski) for a

thorough discussion of standards, and how the physical properties of polymers impact testing practices.

10.3.2 The Hydrostatic Pressure Test conditions are the manufacturer’s maximum recommended pressure at ambient

temperature. However, it is incumbent upon the manufacturer to ensure that the assembly will be leak free when

exposed to maximum pressure and maximum temperature at the end user’s facility. If the test conditions

recommended here do not result in initial leak free operation for the end user, it is incumbent upon the end user and

manufacturer to agree on appropriate corrective action(s) to comply with the intent of this Hydrostatic Pressure Test.

This may include testing at elevated media temperatures.

10.3.3 Test Method

Test Media — Ultrapure Water at ambient temperature.

Hydrostatic Pressure Test Example

0

5

10

15

20

25

30

35

40

45

0 15 30 45 60 75

Time (minutes)

Pre

ssu

re (

psig

)




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Test Pressure — Actual or pre-Manufacturer’s maximum recommended operating pressure.

Test Procedure

Flush system at maximum rated flow to remove entrapped air.

Keep assembly at constant temperature during test.

Pressurize to the Manufacturer’s 1.3 X maximum recommended operating pressure and wait 30 minutes.

Check for visible leak(s), tighten as needed. Check all connection points for proper tightness/torque, correct

as needed.

Re-pressurize to Manufacturer’s 1.3 X maximum recommended operating pressure and wait 60 minutes.


as needed.

Re-pressurize to Manufacturer’s 1.3 X maximum recommended operating pressure and wait 120 minutes.


as needed.

Re-pressurize to Manufacturer’s 1.1 X maximum recommended operating pressure.

Monitor the pressure for 4 hours to ensure compliance with Table 1 requirement of < 2.5% decay in pressure.

Record pressure readings at the beginning and end of each waiting period.

10.4 Ultrapure Water Flush Test — This test consists of resistivity and TOC tests and is required for every critical

Assembly shipped directly to an end user. The suppliers of the assembly should make sure the materials are of high

purity and assembled in a clean or cleanroom environment. Those responsible for the material handling and

prequalification of the critical assemblies need to ensure that the assembly will meet the quality requirements at the

end user’s site. During the test apparatus design and set up the location of the sensor(s) in the test set up may have a

significant effect on the results reported. The limitations of the sensor(s) selected may have a direct impact on the

validity of the results reported. These tests may also be required periodically at other points in the supply chain.

10.4.1 Resistivity Testing Recommendations

The test flow rate should be no less than the manufacturer’s recommended minimum flow rate for the

instrument(s) being used. The test flow rate should be no more than the maximum recommended flow for the

Assembly under test or the instrument(s) being used. If the maximum flow rate capability the assembly does not meet

the minimum requirement of the online metrology, then a grab sample method is recommended.

Following recommended manufacturer procedures, measure resistivity just prior to the Assembly and at the

Assembly outflow.

Allow the reading just prior to the Assembly to stabilize until no change outside the precision of the device

is observed for at least 5 minutes and the resistivity meets or exceeds the specification in Section 8.2. Repeat the

procedure at the Assembly outflow.

Temperature just prior to the Assembly must not differ more than +/- 0.5 C when compared to the

temperature at the Assembly outflow. Otherwise, a correction may need to be performed

Ensure that instrument connections are leak tight to avoid positive bias from atmospheric CO2.

The requirement to pass this test are listed in Table 1. The test report should include inlet at outlet resistivity

measurements.

10.4.2 TOC Testing Recommendations

The test flow rate should be no less than the manufacturers recommended minimum flow rate for the


Assembly under test or the instrument(s) being used.

Refer to ASTM Method D5997 when including UV persulfate oxidation or ASTM 5173 when using UV

without persulfate. It should be noted which method is incorporated.

Ensure that the instrument connections are leak tight to avoid interference from atmospheric CO2. Because

TOC is determined by the difference of Total Carbon (TC) and Total Inorganic Carbon (TIC), the TOC detection limit

can be no lower than 10% of the TIC reading.




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Allow the readings to stabilize until at least two successive readings agree within +/- 5% and the TOC adders

are < the value specified in Table 1.

The procedure should be performed just prior to the Assembly and at the Assembly outflow.

As noted in Table 1, the requirement to pass this test is TOC adders (ppb) of < 7.5. Both the inlet and outlet

TOC measurements should be included in the test report.

Alternatively TOC can be measured by grab sample analysis. If this is done, the sample should be taken in

duplicate. The detection limit of the method should be at least 5 ppb. Clean sampling should ensure minimum CO2

level introduced to the sample from the ambient environment.

10.5 Particle Testing Recommendations — These tests are required periodically to establish that the Assembly design

is typically capable of meeting the performance criteria in Table 1.

10.5.1 The test flow rate should be no less than the manufacturers recommended minimum flow rate for the


Assembly under test or the instrument(s) being used. Similarly it should be no less than the normal operational flow

rate.

10.5.2 Prior to testing the end user and equipment supplier should agree on the conditions for the test to be completed.

10.5.3 Active components such as valves should be evaluated for particle performance at the component level to

supplement this test.

10.5.4 The UPW supplied to the Assembly under test should have low particle background. If not it should be filtered

with a maximum 0.05 micron filter with a retention value such that filtered particle concentration is < 10 particle/liter

> 0.1 µm.

10.5.5 Particle contribution testing will measure the Assembly outlet particle concentration and assumes all particles

are generated within the Assembly under test. Periodic verification of the inlet particle concentration specified in

Section 10.5.4 should be performed and reported in accordance with Section 11. Allowable particle adders are outlined

in Table 1.

10.5.6 Follow the manufacturer’s recommended procedures for the optical particle counter.

10.5.7 Allow the reading to stabilize from rinse down until there is no change within the expected noise for 2 or more

intervals (i.e. no change in slope). An appropriate sample interval should be chosen such that intervals with very small

counts are not taken. In addition, the user should remain cognizant of the requirement in Table 1 for allowable particle

adders.

10.5.8 The requirement to pass this test is shown in Table 1. The outlet particle concentration and date and

concentration of most recent inlet particle concentration verification should be noted on the test report.

10.6 Anions and Metals Testing Recommendations — These tests are required periodically to establish that the

Assembly design is typically capable of meeting the performance criteria in Table 1.

10.6.1 The test flow rate should be no more than the maximum recommended flow for the Assembly under test or

the instrument(s) being used.

10.6.2 Grab Sample Methodology for Assembly supply: [the lab performing the analysis should be ISO17025

certified]

10.6.3 Flush assembly to be tested with UPW

Use pre-cleaned and qualified bottles; use a separate bottle (one each) for anions and metals.

Use a 4 fill/empty sampling technique following best practices for minimizing contamination and aeration.

10.6.4 Grab Sample Methodology for Assembly Outflow:

Under standard assembly operation, allow outflow to run at least 5 minutes.

Use pre-cleaned and qualified bottles one each for anions and metals. Note that for convenience, outflow

bottles may be pre-rinsed using inflow UPW.




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Follow best practices for minimizing contamination and aeration.

10.6.5 Use ASTM D5542 to analyze anions.

10.6.6 Use ASTM D5673 for ICP-MS to analyze metals.

10.6.7 Required precision for each analyte is such that the difference of the incoming and outgoing reading has an

error of no more than +/- 25%.

10.6.8 As noted in Table 1, the requirements to pass this test are dependent on the ionic or metallic adder. The inlet

and outlet concentrations for each analyte (or copies of laboratory reports) should be maintained and available upon

request.

11 Reporting

(See Appendix 1 for example report)

Reporting of results of testing from Section 10 should include the following as a minimum:

11.1 Report total flush volume flowed to achieve the specified guide result.

11.2 Confidence intervals and detection or reporting limits,

11.3 All units of measure,

11.4 As detailed a description as possible of the Assembly tested including part number and manufacturing date,

11.5 Date of test and initials of person performing test,

11.6 Additional information as specified in the specific test recommendations within this document,

11.7 Any and all relevant data collected during testing should be summarized and included,

11.8 Recording of Ultrapure Water and Nitrogen quality used to perform test, and

11.9 For Sections 10.4 through 10.6 inlet and outlet water quality.

12 Certification

12.1 The supplier of an Assembly shipped to an end user is responsible for defining, establishing, executing, and

maintaining a certification program based on the performance guidelines in Section 7.

12.2 By default all of the requirements within this document apply unless another agreement is made between supplier

of an Assembly shipped to an end user and an end user.

12.3 Qualification tests and certification documents shall reflect current production practices.

12.4 The certification program will specify any necessary corrective action plan in the event that an Assembly fails

to meet these requirements during testing.

12.5 Upon request, the supplier of an Assembly shipped to an end user is responsible for supplying documentation

that proves the Assembly consistently meets the requirements of this document. Current best practices would be to

require a Certificate of Conformance to document assembly compliance.

12.6 As stated in the purpose, this document is a “guideline by which the purity and mechanical integrity of all

ultrapure water and liquid chemical Assemblies shipped to end users may be qualified”. To ensure the purity and

mechanical integrity of Assemblies shipped to end users is maintained, these guidelines must also be implemented

throughout the supply chain. Section 12.7 provides recommendations for Assemblies shipped directly to an end user

and Section 12.8 provides recommendations for the remainder of the supply chain.

12.7 The certification program for an Assembly delivered directly to an end user will specify the frequency of testing

and the test Assembly(s).

12.7.1 Each individual Assembly delivered directly to an end user shall have the following tests performed:

Hydrostatic test (See Table 1 and Sections 10.1, 10.2, and 10.3)

Ultrapure Water Flush test (see Table 1 and Sections 10.1, and 10.4)

Particle Test (See Table 1 and sections 10.1 and 10.5)




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12.7.2 To avoid the cost involved in performing the Particle test (Section 10.5) and Ionic and Metallic Contamination

tests (Section 10.6) on every Assembly delivered directly to an end user, Assemblies may be selected which represent

all unique components and production techniques. The Assemblies will be certified as meeting the requirements

within Table 1 based on the outcome of the representative tests and a periodic testing program.

12.7.3 Particular attention and increased testing frequency are recommended for Assemblies that include components

not covered by SEMI F57.

12.7.4 The supplier of an Assembly shipped directly to an end user should specify which components do, and which

components do not, comply with SEMI F57 where SEMI F57 is applicable.

12.8 The certification program for Assemblies not delivered directly to an end user will specify the frequency of

testing and the test Assembly(s).

12.8.1 To avoid the cost involved in performing Hydrostatic testing (Section 10.2), the Ultrapure Water Flush test

(Section 10.4) the Particle test (Section 10.5) and the Ionic and Metallic Contamination tests (Section 10.6) on every

Assembly, test Assemblies may be selected which represent all unique components and production techniques. The

Assemblies will be certified as meeting the requirements of Table 1 based on the outcome of the representative tests

and periodic testing program. Particular attention and increased testing frequency are recommended for Assemblies

that include components not covered by SEMI F57.

12.8.2 The supplier chain should specify which components must, and which components may not, comply with

SEMI F57 where SEMI F57 is applicable.

13 Supply Chain Traceability

a. It will be the responsibility of all Assembly suppliers to verify that all components covered by SEMI F57

comply with the specifications set forth in SEMI F57.

b. It will be the responsibility of all Assembly suppliers to ensure that all components have been handled and

assembled in accordance with the recommendations set forth in SEMI E49.7.

c. It will be the responsibility of all Assembly suppliers to maintain records that show all assemblies comply

with Section 12 of this document.

d. It will be the responsibility of all Assembly suppliers to ensure that their sources of Assemblies are controlled

to the extent that they support the requirements within Section 12.




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APPENDIX 1 EXAMPLE TEST REPORT FORM

NOTICE: The material in this Appendix is an official part of SEMI E49.2 and was approved by full letter ballot

procedures on [A&R approval date].

A1-1 SEMI F49.2 Ultrapure Water Rinse-up Test Report

Date:

To:

From:

Report number:

Test component description:

Component description including drawing if available

Packaging

Other relevant information

Table I. Assemblies I.D. Information

Sample #1 Sample #2 Sample #3

Customer Part Number

Additional ID information

Testing protocol:

Description of test system including schematic

Instrumentation used.

Test system background measurements with spool piece installed

Number of components tested

Test flow rate

Sample times (ionic and metallic contamination)

Test date

Test duration

The incoming water properties are presented in Table II. The instruments used for the testing are described in Table

III. The results of the testing are found in Tables IV to VI and Figures A1-1 to A1-8. Figures include results from

the spool piece for reference. Analyses for anions and trace metals for each test sample are presented in Tables VII

and VIII at the end of this report. All testing was conducted at room temperature. Testing was initiated on xx/xx/xxxx

and concluded on xx/xx/xxxx.

Table II. Background measurements

Contaminant Concentration

Mean Standard deviation

TOC (ppb) 0.81 0.08

Resistivity (M-cm) 18.16 0.02

Particles (#/ml 0.05 µm) 0.125 -




Ambient Temperature 20oC ± 1oC

UPW Temperature 25oC ± 0.5oC




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Table III. Test instrumentation

Property Instrument Calibration Dates

TOC GE Sievers Model 500 RL xx/xx/xxxx

Resistivity Thornton Model CR200 xx/xx/xxxx

Particle Concentration Particle Measuring Systems HSLIS M50e xx/xx/xxxx

Table IV. Flush volumes required to achieve TOC cleanliness levels

Contaminant Volume required to achieve specified concentration added (liters)

1 ppb 0.1 ppb

Test sample

ID Sample #1 Sample #2 Sample #3 Sample #1 Sample #2 Sample #3

TOC < 1 < 1 < 1 < 1 570 < 1

Table V. Flush volumes required to achieve inorganic cleanliness levels

Contaminant Volume required to achieve specified resistivity decrease (liters)

1.0 M-cm 0.1 M-cm

Test sample


Resistivity 8 7 6 30 30 30

Table VI. Flush volumes required to achieve particulate cleanliness levels

Particle size Volume required to achieve specified concentration added (liters)

10/ml 1/ml

Test sample


0.05 µm 8 5 5 51 24 24

0.10 µm 5 5 5 42 8 24

0.15 µm 5 <2 <2 8 8 5

0.20 µm 5 <2 <2 8 5 5




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Figure A1-1. TOC Addition with Flush Volume

Figure A1-2. Resistivity Degradation with Flush Volume

Flush volume (liters)

0.1 1 10 100 1000

TO

C a

dded

(ppb)

-0.4

-0.2

0.0

0.2

0.4

0.6

0.8

1.0

Sample #1Sample #2Sample #3Spool piece


0.1 1 10 100 1000

Res

istiv

ity D

ecre

ase

(MO

hm-c

m)

0.001

0.01

0.1

1

10

100

Sample #1Sample #2Sample #3Spool Piece




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Figure A1-3. Resistivity Recovery with Flush Volume

Figure A1-4. Particle Shedding with Flush Volume

Spool Piece

Resistivity Flush-Up Curve


0.1 1 10 100 1000

Res

istiv

ity (

MO

hm-c

m)

1

2

3

4

5

6

789

10

20

30

Sample #1Sample #2Sample #3Spool Piece

background


1 10 100 1000 10000

Cum

ulat

ive

par

ticle

conc

entr

atio

n ad

ded

(#/L

)

10

100

1000

10000

100000particles > 0.05 m

particles > 0.10 m

particles > 0.15 m

particles > 0.20 m




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Test Sample #1


Test Sample #2


1 10 100 1000 10000

Cum

ulat

ive

par

ticle

conc

entr

atio

n ad

ded

(#/L

)

10

100

1000

10000

100000 particles > 0.05 m

particles > 0.10 m

particles > 0.15 m

particles > 0.20 m


1 10 100 1000 10000

Cum

ulat

ive

par

ticle

conc

entr

atio

n ad

ded

(#/L

)

10

100

1000

10000


particles > 0.10 m

particles > 0.15 m

particles > 0.20 m




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Test Sample #3


(Summary for particles > 0.10 m)


1 10 100 1000 10000

Cum

ulat

ive

par

ticle

conc

entr

atio

n ad

ded

(#/L

)

10

100

1000

10000


particles > 0.10 m

particles > 0.15 m

particles > 0.20 m


1 10 100 1000 10000

Cum

ulat

ive

par

ticle

conc

entr

atio

n ad

ded

(#/L

)

10

100

1000

10000

100000Sample #1Sample #2Sample #3Spool Piece




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Table VII. Anion and Results

Parameter Reporting

Limit (ppb)

Background

(#1)

Background

(#2)

#1 - 1 hour #2 - 1 hour #3 - 1 hour

Fluoride (F-) 0.03 * * * * *

Chloride (Cl-) 0.02 * * * * *

Nitrite (NO2-) 0.02 * * * * *

Bromide (Br-) 0.02 * * * * *

Nitrate (NO3-) 0.02 * * * * *

Phosphate (HPO4=) 0.02 * * * * *

Sulfate (SO4=) 0.05 * * * * *

* indicates measurement below the detection limit




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Table VIII. Trace Metal Results Element Reporting

Limit (ppb)

Background

(#1)

Background

(#2)

#1 - 1 hour #2 - 1 hour #3 - 1 hour

Aluminum (Al) 0.003 * * * * *

Antimony (Sb) 0.002 * * * * *

Arsenic (As) 0.005 * * * * *

Barium (Ba) 0.001 * * * * *

Beryllium (Be) 0.003 * * * * *

Bismuth (Bi) 0.001 * * * * *

Boron (B) 0.05 0.67 0.64 0.70 0.68 0.71

Cadmium (Cd) 0.003 * * * * *

Calcium (Ca) 0.2 * * * * *

Cerium (Ce) 0.001 * * * * *

Cesium (Cs) 0.001 * * * * *

Chromium (Cr) 0.004 * * * * *

Cobalt (Co) 0.001 * * * * *

Copper (Cu) 0.003 * * * * *

Dysprosium (Dy) 0.001 * * * * *

Erbium (Er) 0.001 * * * * *

Europium (Eu) 0.001 * * * * *

Gadolinium (Gd) 0.001 * * * * *

Gallium (Ga) 0.002 * * * * *

Germanium (Ge) 0.003 * * * * *

Gold (Au) 0.006 * * * * *

Hafnium (Hf) 0.001 * * * * *

Holmium (Ho) 0.001 * * * * *

Indium (In) 0.001 * * * * *

Iridium (Ir) 0.002 * * * * *

Iron (Fe) 0.02 * * * * *

Lanthanum (La) 0.001 * * * * *

Lead (Pb) 0.003 * * * * *

Lithium (Li) 0.002 * * * * *

Lutetium (Lu) 0.001 * * * * *

Magnesium (Mg) 0.002 * * * * *

Manganese (Mn) 0.002 * * * * *

Mercury (Hg) 0.02 * * * * *

Molybdenum (Mo) 0.004 * * * * *

Neodymium (Nd) 0.001 * * * * *

Nickel (Ni) 0.004 * * * * *

Niobium (Nb) 0.001 * * * * *

Osmium (Os) 0.002 * * * * *

Palladium (Pd) 0.002 * * * * *

Platinum (Pt) 0.009 * * * * *

Potassium (K) 0.1 * * * * *

Praseodymium (Pr) 0.001 * * * * *

Rhenium (Re) 0.003 * * * * *

Rhodium (Rh) 0.001 * * * * *

Rubidium (Rb) 0.001 * * * * *

Ruthenium (Ru) 0.002 * * * * *

Samarium (Sm) 0.002 * * * * *

Scandium (Sc) 0.01 * * * * *

Selenium (Se) 0.02 * * * * *




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Silicon (Si) 0.5 0.6 0.8 0.8 0.8 0.7

Silver (Ag) 0.001 * * * * *

Sodium (Na) 0.007 * * * * *

Strontium (Sr) 0.001 * * * * *

Tantalum (Ta) 0.004 * * * * *

Tellurium (Te) 0.005 * * * * *

Terbium (Tb) 0.001 * * * * *

Thallium (Tl) 0.006 * * * * *

Thorium (Th) 0.003 * * * * *

Thulium (Tm) 0.001 * * * * *

Tin (Sn) 0.005 * * * * *

Titanium (Ti) 0.002 * * * * *

Tungsten (W) 0.005 * * * * *

Uranium (U) 0.002 * * * * *

Vanadium (V) 0.003 * * * * *

Ytterbium (Yb) 0.001 * * * * *

Yttrium (Y) 0.001 * * * * *

Zinc (Zn) 0.005 * * * * *

Zirconium (Zr) 0.005 * * * * *

* indicates measurement below the detection limit




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Table VIII. Trace Metal Results (Continued)

ElementReporting

Limit (ppb)

#3 - 30

minutes#3 - 1 hour

#1 - 30

minute#5 - 1 hour

Aluminum (Al) 0.003 * *

Antimony (Sb) 0.002 * *

Arsenic (As) 0.005 * *

Barium (Ba) 0.001 * *

Beryllium (Be) 0.003 * *

Bismuth (Bi) 0.001 * *

Boron (B) 0.05 0.68 0.71

Cadmium (Cd) 0.003 * *

Calcium (Ca) 0.2 * *

Cerium (Ce) 0.001 * *

Cesium (Cs) 0.001 * *

Chromium (Cr) 0.004 * *

Cobalt (Co) 0.001 * *

Copper (Cu) 0.003 * *

Dysprosium (Dy) 0.001 * *

Erbium (Er) 0.001 * *

Europium (Eu) 0.001 * *

Gadolinium (Gd) 0.001 * *

Gallium (Ga) 0.002 * *

Germanium (Ge) 0.003 * *

Gold (Au) 0.006 * *

Hafnium (Hf) 0.001 * *

Holmium (Ho) 0.001 * *

Indium (In) 0.001 * *

Iridium (Ir) 0.002 * *

Iron (Fe) 0.02 * *

Lanthanum (La) 0.001 * *

Lead (Pb) 0.003 * *

Lithium (Li) 0.002 * *

Lutetium (Lu) 0.001 * *

Magnesium (Mg) 0.002 * *

Manganese (Mn) 0.002 * *

Mercury (Hg) 0.02 * *

Molybdenum (Mo) 0.004 * *

Neodymium (Nd) 0.001 * *

Nickel (Ni) 0.004 * *

Niobium (Nb) 0.001 * *

Osmium (Os) 0.002 * *

Palladium (Pd) 0.002 * *

Platinum (Pt) 0.009 * *

Potassium (K) 0.1 * *

Praseodymium (Pr) 0.001 * *

Rhenium (Re) 0.003 * *

Rhodium (Rh) 0.001 * *

Rubidium (Rb) 0.001 * *

Ruthenium (Ru) 0.002 * *

Samarium (Sm) 0.002 * *

Scandium (Sc) 0.01 * *

Selenium (Se) 0.02 * *

Silicon (Si) 0.5 0.8 0.7

Silver (Ag) 0.001 * *

Sodium (Na) 0.007 * *

Strontium (Sr) 0.001 * *

Tantalum (Ta) 0.004 * *

Tellurium (Te) 0.005 * *

Terbium (Tb) 0.001 * *

Thallium (Tl) 0.006 * *

Thorium (Th) 0.003 * *

Thulium (Tm) 0.001 * *

Tin (Sn) 0.005 * *

Titanium (Ti) 0.002 * *

Tungsten (W) 0.005 * *

Uranium (U) 0.002 * *

Vanadium (V) 0.003 * *

Ytterbium (Yb) 0.001 * *

Yttrium (Y) 0.001 * *

Zinc (Zn) 0.005 * *

Zirconium (Zr) 0.005 * * * indicates measurement below the detection limit




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RELATED INFORMATION 1 FLOW CONSIDERATIONS FOR ULTRAPURE WATER SYSTEMS

NOTICE: This related information is not an official part of SEMI E49.2 and was derived from North American

Liquid Chemicals. This related information was approved for publication by full letter ballot on April 30, 2002.

R1-1 Ultrapure Water Considerations

R1-1.1 An ultrapure water system may benefit from maintaining continuous flow with a velocity greater than or equal

to those listed in the following table:

Table R1-1

Nom.

Tube OD

Size

Tube ID

(inches)

V (ft/s) ύ (gpm) Tube ID

(cm)

V (cm/s) ύ (lpm)

¼” 0.156 4.2 2.0 0.396 126.7 7.7

3/8” 0.250 2.6 8.8 0.6350 79.0 33.4

½” 0.375 1.7 29.3 0.9525 52.7 111.0

¾” 0.625 1.0 138.1 1.5875 31.6 522.9

1” 0.875 0.7 386.4 2.2225 22.6 1,462.7

1-1/4” 1.100 0.59 722.9 2.795 18.0 2,736.3

1-1/2” 1.328 0.49 1,289.7 3.374 14.9 4,802.1

The values in Table RI-1 are based on the standard wall thickness for the nominal size. Values will differ if different wall thicknesses are utilized.

R1-1.2 For reference this information is based on the following equations, using a Reynolds number of 5000 and

water at an ambient temperature.

Where:

Re is Reynolds number (dimensionless)

is density (g/cm3)

V is fluid velocity (cm/sec)

D is tube diameter (cm)

is viscosity (g/cm-s)

1.1589982.03175.0

01002.05000V

:example

D

ReV

DVRe




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NOTICE: SEMI makes no warranties or representations as to the suitability of the Standards and Safety Guidelines

set forth herein for any particular application. The determination of the suitability of the Standard or Safety Guideline

is solely the responsibility of the user. Users are cautioned to refer to manufacturer’s instructions, product labels,

product data sheets, and other relevant literature, respecting any materials or equipment mentioned herein. Standards

and Safety Guidelines are subject to change without notice.

By publication of this Standard or Safety Guideline, SEMI takes no position respecting the validity of any patent rights

or copyrights asserted in connection with any items mentioned in this Standard or Safety Guideline. Users of this

Standard or Safety Guideline are expressly advised that determination of any such patent rights or copyrights and the

risk of infringement of such rights are entirely their own responsibility.