Backend Turnkey

Services

Gary Liu

UMC\TPES

May 27, 2015

UMC © 2015

Agenda

2

• IoT Backend Features & Requirement

• Testing Solutions Development & Services

• Packaging Solutions Development & Services

• Value-Added Backend Turnkey Services

• Summary

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IoT Backend Features & Requirement

3

• IoT Applications & Component Features

• IoT Component Testing Requirements

• IoT Component Packaging Requirements

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IoT Applications & Component Features

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Smart Car

Smart Band

STEP

Smart Watch

Smart TV

Smart Glasses

Smart Phone

IoT / Wearable MEMS Memory PMIC AP / MCU RF

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IoT Component Testing Requirements

• Automotive as a microcosm of IoT applications

• Comprehensive test solution & program development services

• –40C to 125C probing solution ready for automotive devices testing

• MEMS testing needs joint development

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MEMS Memory PMIC AP / MCU RF

8/12” Wafer

Hardware Design

High Parallelism

High Frequency

High Temp. 100C

Low Temp. –40C

Stimulator

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IoT Component Packaging Requirements

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MEMS Memory PMIC AP / MCU RF

Wire Bond

Flip Chip

WLP

SiP / MCP

PoP

2.5D TSI / 3D TSV

• Comprehensive solutions by joint development with OSATs

• Wire Bond and Flip Chip solution ready for Automotive devices

• Experienced SiP packaging development for various IoT applications

• 2.5D TSI in production, 3D TSV in engineering process

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Testing Solutions Development & Services

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• Testing Development & Services

• Major Tester Solutions

• Professional Testing Solution Development

• Automotive Testing Solutions

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Testing Development & Services

• Test Solution Development

• Align with customer for tester platform

• Program development & validation

• Test hardware design

• Multi-DUT migration

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• Yield Management

• Fast yield analysis & diagnosis

• Best-in-class FA capability

• Volume Production

• Real-time data feedback

• Yield monitor

• SBC* implementation

* SBC : Statistical Bin Control

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Major Tester Solutions

• Experienced on diversified tester solutions development for customer

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Vendor

Application

Tester Model

Memory Consumer Computing Communication

SR

AM

eF

las

h

DT

V /

ST

B

FP

GA

MC

U

LC

D-D

CIS

PM

IC

HD

D

GP

U

CP

U

AP

/ B

B

4G

/ L

TE

2.5

G /

3

G

WIF

I /

BL

E

UFlex / UFlex-HD

J750 / J750Ex

IP750Ex

HP93K / PinScale

ND1 / 2 / 3 / 4

T5335P / T5371 / T5377

D10

Quartet / SC312

3650 / 3650EX

3380

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Professional Testing Solution Development

• Excellent and diverse experience in program development

• Professional hardware design and probe card making

• Experienced translation from simulation patterns to ATE vectors

• Expedited validation thru remote access tester

• Quick silicon validation and wafer level cycling service

• Proactive customized test / alert report for yield monitoring

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Product Specs

Simulation Patterns

Test Plan

Pad Information

Production

Program Coding

Pattern Conversion

Hardware Design

Probe Card Making

Program Debugging

1st Silicon Validation

Recipe Optimization

Characterization by

Corner Wafers

Expansion

Correlation

Testing Optimization

Version Management

Test / Alert Report

Validation Development Engagement

Typically 2 weeks from coding to 1st silicon program debugging.

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Automotive Testing Solutions

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Development

Validation

Production

• −40C~200C ATE ready for production

• Early IP verification in high temp. conditions

• High temp. probe card & accessory design

• Dedicated EDA system for outlier screening

• Dedicated machine for automotive device

• Dedicated licensed engineers & operators

• Data traceability > 15 years

• BOAC probing window verification

• Probing & cleaning recipe optimization

• Characterization & correlation by corner

wafers

* BOAC : Bond Over Active Circuit

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Packaging Solutions Development & Services

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• IoT Component Packaging Solutions

• Automotive Package Requirement & Solutions

• Packaging Solution Development & Service

• 2.5D TSI Development Achievement

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IoT Component Packaging Solutions

• Key Features

• Small Form Factor

• Low Power

• High Performance

• Multi-Function

• Turnkey service by ecosystem for IoT packaging solutions

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Application Component Package Type

Wire Bond Flip Chip WLP SiP / MCP POP TSV / TSI

Smart Watch

Smart Glasses

Smart Band

Logic (MCU)

Memory

PMIC

RF (BLE/WiFi)

MEMS

• Requirement

• Fine Pad Pitch & Small Pad Open

• Wire Material: Au Cu or Ag

• Bump Material : Eu LF Cu Pillar

• SiP Integration (Heterogeneous)

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14

Automotive Package Types & Requirement

• Automotive package must endure extreme stress in harsh conditions

• Various categories apply different package type with different Grades

• AEC-Q100 Grade 0~3 packaging solutions are ready in major OSATs

* AEC: Automotive Electronics Council

Engine Control

Driving Control

Comfort

Infotainment

Motor Driver, PMIC

Safety

• HSOP • HQFP

Grade 0 ~ 1

• HSOP • HQFP

• TQFP • QFN

Grade 0 ~ 1

• HSOP • HQFP

• TQFP • QFN

Grade 1 ~ 3

• HSOP • HQFP

• TQFP • QFN

• PBGA • FCBGA

• SiP / MCP

Grade 1 ~ 3

• HSOP • HQFP

• TQFP • QFN

• PBGA • FCBGA

• SiP / MCP

Grade 1 ~ 3

• HSOP • HQFP

• TQFP • QFN

Grade 0 ~ 1

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Automotive Package Solutions

• Diversified automotive grades packaging solution in major OSATs

• Early CPI qualification in grade 0 level before production

• Joint development for customer’s application with OSAT

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OSATs Package Solution

HSOP HQFP TQFP QFN PBGA FCBGA SiP / MCP

ASE

Amkor

J-Devices

JCET / jcap

NFME

SPIL

: Grade 0, : Grade 1, : Grade 2~3

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Packaging Solution Development & Service

• Early CPI Qual ensure package quality for every tech. nodes

• Experienced mass production & quality management

• Professional simulation & PFA capability enable quick yield ramping

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Customer UMC Backend Ecosystem Solution

Customer

Requirement

Mass Production Quality Management Total Package

Solutions

• GDS & Netlist

• Package Requirement

• BD*, Substrate & Bump

Mask Design & Tooling

• Verify FAB, OSATs BKM /

BOM

• Dedicated Package

Engineering Service

• SPC Trend Chart

• PFA & CIP

• Quality Monitor

• Regular Audit

• Yield Improvement

• Cycle Time Reduction

• PCN Management

* CPI: Chip Package Interaction, BD: Bonding Diagram

CPI Qualification Package Design

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2.5D TSI Development Achievement

• Leading foundry with 2.5D TSI in Production

• 3+ customers in production, 5+ customers in engineering engagement

• “Outstanding Performance Award” by customer

• Various Reliable TSI Solutions

• High production flexibility in proven ecosystem

• Passed wafer & package level reliability test

• Collaboration with OSATs for FEoL/MEoL/BEoL

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Device TSI size

(mm2) Stacked die

A 500~600 Heterogeneous

(3 top dies)

B 700~800 Homogeneous

(4 top dies)

C 800~900 Heterogeneous

(5 top dies)

FEoL

TSV + FSRDL

MEoL BEoL

Dies Stacking + FCBGA UBM / Cu Pillar

Wafer Thinning

TSV Reveal

BSRDL / C4 Bump TSV reveal

Cu Pillar

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Value-Added Backend Turnkey Services

18

• Automotive Quality Management

• Testing Data Automation & Yield Management

• Multiple FA & Inhouse Wafer Sort Sites

• Worldwide Backend Ecosystem

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Automotive Quality Management

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Process • NPI

• FMEA

• Control Plan

• MSA

• SPC

• PPAP

Production • ZD CIP

• 100% AVI

• Dedicate Machine

• Dedicate License

• Rework Control

People/Mindset

• ZD culture

5+ years

• Quality Assurance

• Operator Level

Management

System Management

• SYL

• SBL

• PAT

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Real Time Data Automation System

UMC Inhouse

OSATs

1hr

WIP/Yield

Feedback

MES

EDA 2 min

WIP/Yield

Feedback

FTP Site

Summary File

Map File

Inkless File

STDF/OTDF

Hold Lot Report

Customized Report

Real-time

WIP Status

Logistic Report

Yield Report

EDA Analysis

Worldwide Customer

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Proactive Yield Management

Yield Trend Chart

Composite Wafer Map

In-line Data Link

Electrical Analysis

Physical Analysis Memory Bitmap

Logic Scan Diagnosis

Yield to WAT Correlation

Continue Yield

Improvement

Automatic Test

Yield Monitor

Failure Mode

Analysis EFA & PFA

Continuous Yield

Improvement

Scan Diagnosis

Memory Fail Bit Map CP Bin Map

ATE Data Log Failure Analysis

Transmission Electron

Microscopy (TEM)

Poly-TEM

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Fab 8C

Fab 8AB

Fab 8D

12A

12i

8N

6A

8E

8S

8F

World Class FA Services

• Proactive electrical & physical analysis to identify causes

• Professional & efficient FA at multi-site FA labs help yield learning

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Singapore

Hsinchu

SuZhou

Tainan

UMC © 2015

• Inhouse CP facility close to Fabs

• Timely engineering analysis for

quick yield enhancement

• All sites TS16949 are certified

• Hsinchu Site since 1997

• Tainan Site since 2003

• Singapore Site since 2005

Multiple Inhouse Wafer Sort Sites

23

Singapore

12i

Hsinchu

8” Fabs

Tainan

12A

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Worldwide Backend Ecosystem

24

• Experienced geographic OSATs turnkey management for customers

J-Device Amkor STATSChipPAC

ChipBond UTAC Ardentec GT

ASE Amkor SPIL KYEC

SPIL ChipMore KLT UTAC

JCET / jcap NFME ASE Amkor

ASE Ardentec PTI

Bump

WLP CP Package FT

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Summary

• IoT & Automotive Backend Solutions Ready for Ramping

• Testing Solutions Development & Services

Fulfill IoT & Automotive Requirements

• Packaging Solutions Development & Services

Enable IoT & Automotive Quick Production

• Take Advantage of UMC’s Backend Turnkey Services to

Mutually Prosper

25

UMC © 2015

Thank You !

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