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Back-End BondingH&K 710 bonder
Glue Pitch AdaptorsRobot
I&J2500Glue Beetle Chip to
Hybrid
Mike Wormald [email protected]
2
Robot I&J2500
The I&J2500 has a work area of 510 x 510mm. We mount a turn plate to the work holder that allows us to hold the hybrid for accurate dispensing of the glue.
Mike Wormald [email protected]
3
Requirements
Glue pitch adaptors to LHCB hybrids.
• Making sure all the bond pads are supported with glue, as bonding is impossible with bounce under the pads.
• Even spread of glue for planarity. (Bonding jigs vacuum this area down)
• Ensure no overspill of glue that would hinder the position of the sensors or cover bond pads for the chips
• Correct location of the pitch adaptors.
Mike Wormald [email protected]
5
Process
•Apply Weights •Leave to cure•In oven at 40◦c for 1hour.•Visually inspect.•Remove any excess or fill unsupported areas.•Chips can be mounted at this stage•Place back in oven for further two hours
Mike Wormald [email protected]
6
Glue chips to Hybrid
Requirements
• Planarity, 710 bonder only has one touchdown per reference system but chips are bonded on all three faces.
• No overspill of conductive glue that may cause shorts on the hybrid
• Accurate placement –ease of bonding front end-