ATLAS Inner Detector MO_B 2013 to-date status 2014 approve budget

ATLAS Inner Detector MO_B 2013 to-date status

2014 approve budget

H. Pernegger / Pixel PL & ID Resource CoordinatorD. Robinson / SCT PL and ID PL

A. Romaniouk / TRT PL

31/10/2013 1

2013 Budget

2231/10/2013 H. Pernegger / CERN ID IB Oct 2013

Mid-year spending

• So-far spent about xx% of the budget• Pixel L2 and SCT TX still to come• Expenses to-date include much of 2013 manpower commitments


Balance 2013

ID Pixel SCT TRT TotalBudget (kCHF)

Budget carry-over from 2012 42 10 -94 192 149

2013 Budget 673 610 637 545 2465

Spent (31Oct 2013) 674 493 353 556 2076 Open 39 101 152 38 330Remaining 2 26 38 143 208

Main Cost Drivers and LS1 activities

• LS1 scheduled work:• Pixel : Integration of IBL and Pixel detector new Service

Quarter Panel replacement and nSQP off-detector items (cables, power)

• ID: Installation of the new thermo-siphon C3F8 cooling system

• TRT: Address leak issue and consolidate gas system• Consolidation of SCT readout: Order of new TX plug-ins and

production of new BOC card.• This consolidation of SCT readout is carried out with the

current budget during the shutdown. • The overall budget of the SCT is maintained at 637 kCHF


Pixel nSQP and Connection

• All nSQPs are installed• Sequence is

– each nSQP is tested before and after installation

– Connection of pipes and type 0 cables at PP0– Testing of the full supply and readout chain

row by row verification of the functionality of the Pixel Package before it will be brought to the Pit

• From pit operation we had 92 /1744 modules that had issues

• Failures cleared by nSQP or

type-0 cable repairs


Pixel nSQP mounting


Pixel today


Pixel status on surface after refurbishment

as of 2013/10/17

• 1725 of 1744 modules are working , i.e. 99%

• B-layer impressive recovery


IBL Status

• IBL Module production is completed– Produced mainly from beginning of this year to September

since the move to Panasonic flip chip– Total number 412 DC and 263 SC modules built in 12 batches

• IBL staves: 12 staves built so far– 9 staves are in SR1– 3 staves in Geneva– Have material to built up to 18 staves (incl. reworked modules) – Produced staves essentially from ~May to now at rate of 50 DC

fully accepted and 30 SC fully accepted modules/month– Test results in general good– However recently identified a problem with wire bonds (see

later slide)


IBL Module test results

• Performance very good • Noise ~120e- for planar

and 125-140e- for 3D• Dead channels 0.23%

(3D-CNM), 0.47% (3D-FBK) and 0.32% (Planar CiS)

10

Noise distribution Breakdown voltage distribution

Bad pixels/chip(batch 4-12)


Atlas week

Module loading to staves

• Bare staves prepared with stave flex and tested• Staves assembled with 12 DC and 8 SC

modules per stave

117/10/2013 H. Pernegger1129/10/213 H. Pernegger Pixel week

Observations

• Observe clear signs of corrosions on Wire bonds wing area and FE-bonds caused by water+catalyst (halogene)– White remanants, which are likely Al(OH)3– Detected corroded Al bond wires directly on stave – confirmed through high-

resolution images• Detailed analysis of remnants and wires was carried out to understand

cause of corrosion together with detailed dedicated tests on many samples

• IBL Stave task force investigates causes and remedies


Corrosion

• Based on the current understanding we deal with– Corrosion on bond wires (~1%-level distributed over ¼ to

½ of all chips)– Corrosion caused by condensation on stave with

accelerating component somewhere on module (find significant amounts Cl, F, of yet unknown origin)

• Recovery plan – Build 8 more staves using existing, repaired or class-2

type components on the last staves– Clean and repair the existing affected staves (priority on

less affected ones)– Consider to buy more components as backup (to be

ordered now so that we can get them in-time)


SCT DAQ Expansion

100kHz at m~87

Maximum sustainable L1 rate as a function of pileup, 14TeV, 25ns

FEROD8176 data links

RODROSExisting 90 Slinks

RODROSWith 128 Slinks and data compression

✗ 100kHz at m~33

100kHz at m~87

SCT adapt the existing DAQ system to cope with the high pileup conditions in Run2• 90128 RODs and BOCs• Improved data compression on RODBoth FE and ROD bandwidth compatible with pileup close to 90 at 100kHz 1431/10/2013 H. Pernegger / CERN ID IB Oct 2013

SCT New Optical Transmitters (TX)

1 2 3 4 5 6 7 8 9 10 110

1

2

3

4

5

6

7

8

9

10

Currently installed VCSELs were operationally robust during 2012,but two significant issues developed which impact on future operation:

1. 10% drop in optical power 2. Small but significant death rate

Optical power (IPIN data) vs Date Number of deaths vs channel number

SCT will move to commercially packaged optical array assemblies, back engineered to match the mechanical and connectivity constraints of the

existing BOC hardware and fibresInstallation scheduled for Spring/Summer 2014 1531/10/2013 H. Pernegger / CERN ID IB Oct 2013

Consolidation of Pixel readout

• Pixel readout: • During next run LHC will reach “beyond-design luminosity” which

will lead to data rates for which the Pixel readout was not built. • The beyond-design peak luminosity leads to saturation on backend

electronics

• This caused pixel detector inefficiency already in Layer 2 and will later cause inefficiency on Layer 1

• The saturation and resulting inefficiency is a function of Luminosity, L1A rate, hit rate per double column, error rate and number of FE-chip with hits


Pixel Readout

The bandwidth between module and ROD depends on the layer:• 160 Mb/s (2x80Mb/s) on two optical fibers for the B-layer• 80 Mb/s on one fiber for layer 1 and disks• 40 Mb/s on one fiber for layer 2

17

.

.

. 16 FE

.

.

16 x 40 Mb/s FE/MCC links

Col pairs

EOC bufferand logic

..9..

MCC

..16..

ROD40, 80 or 160 Mb/s

MCC/ROD links

MCC buffers ROD buffers


Link occupancy at future luminosities

• Pixel readout link Link Occupancy for different luminosities : 7x1033 at 50ns 1x1034, 2x1034 and 3x1034 at 25ns

• MCCROD link occupancy at 75 and 100 KHz LVL1 rate:

• At and above 2x1034 first Layer 2 will saturate, then followed by Layer 1– Run 1 limitations at start of fill and due to ROD computing power limits when m>> design

• Priority for consolidation: Fix now Layer 2, followed later by Layer 1 18

µ B-Layer Layer 1 Layer 2 Disks50 ns 37 39% 34% 52% 30%

25 35% 31% 48% 27%51 53% 59% 66% 39%76 71% 73% 111% 64%

Link occupancy at 75 kHz L1 Trigger

25 ns; 13 TeV

µ B-Layer Layer 1 Layer 2 Disks50 ns 37 51% 45% 69% 40%

25 47% 42% 65% 37%51 71% 67% 88% 52%76 95% 97% 148% 75%

Link occupancy at 100 kHz L1 Trigger

25 ns; 13 TeV


Layer 2 limitations already in 2012

• Observed already limitations during Run 1 at start of fill– Observe high number of desynchronized modules in Layer at start of fill.

Decrease follows luminosity decrease


Consolidation of Pixel readout

• Consolidation of Pixel Layer 2 readout system by using IBL ROD/BOC for Layer 2/1.

– Bandwidth increase:– L2: from 40 Mb/s to 80 Mb/s on a single fibre– L1: from 80 Mb/s to 160 (2x 80) Mb/s on two fibres

• Usage of IBL boards for Pixel readout consolidation– Boards provide bandwidth and computing power safety margin

also at high pileup– Adoption to Pixel can be done in firmware

• B-Layer and disks shall remain with present ROD/BOC – opto packages will need replacements

• Cost estimate based on IBL production number is 315 kCHF for Layer 2 consolidation

• 120kCHF included in 2013 MO_B budget• Requested additional 70kCHF for 2014 and 100kCHF

for 2015 which was approved in Oct RRB


This pipe should be repaired.

Access outside is blocked. The only way to repair is from inside of the pipe.

Pictures from inside of the PEEK pipes taken

with Endoscope.

A special tool was developed andAll active pipes at the exit of the TRT ECs were replaced

(including not leaking ones).

However some leaks were in inaccessible areas.and only way to keep leaks under control is a modification of

the TRT Active Gas System.

TRT Gas system


Modification of TRT Active Gas system

• Modification or replacement of different parts of the gas system to allow parallel operation with Argon

• Distribution racks in UX area which includes a remote control of the gas flows through individual gas supply lines (80 channels).

• Fully controlled Ar-mixer rack and analysis system to supply some parts of the TRT with Ar-mixture

• Distribution module for Ar mixture (UX area) direct supply (without circulation) of some parts of the TRT with Xe-mixture with detailed monitoring of the gas consumption

• Pressure control system in the gas return lines (USA area)

• Improvements for better stability2231/10/2013 H. Pernegger / CERN ID IB Oct 2013

Projection to end 2013

• XX% of the budget spent to date;– Spending in 2014: Pixel consolidation of readout for

Layer 2 component order– SCT order placed for Lightable VCSEL arrays for TX

plug-ins and BOC cards and will be able to compensate negative carry-over of -94kCHF

• Integration of IBL and new Pixel services integration, the change of the ID C3F8 cooling system and the TRT leak fixes are the core activities of the LS1 shutdown. Those activities dominate the manpower expenses


Budget for 2014

Budget numbers in kChF24

EXPERIMENT: ATLAS request 2014Subsystem: ID Pixel SCT TRT IDGEN Total

Mechanics 0 0 0 0 0Gas-system 0 0 70 0 70Cryo-system 0 0 0 0 0Cooling system 0 0 0 0 0FE electronics (spares) 0 0 0 0 0Standard electronics, PS (LV, HV) 70 115 40 10 235Standard electronics, Crates 35 60 50 0 145Standard electronics, RO Modules 130 110 15 35 290Controls, (DCS, DSS) 10 20 10 5 45Sub-Detector Spares 0 0 0 0 0Areas SR-maintenance facility (buildup) 30 0 0 0 30 SR-maintenance facility (operation) 30 20 30 120 200 Testbeam and irradiation 30 0 0 0 30 Systemtests 0 0 0 0 0Communications 1 5 5 8 19Store Items 24 30 30 80 164Hired Manpower @ CERN (CHF) 0 0 0 0 0 Standard tasks 150 177 195 215 737 Special interventions 100 100 100 200 500TOTALS [kCHF] (excl. FTEs) 610 637 545 673 2465Technical Manpower [FTE] , OTP 48 24 27 30 129


2015 and beyond

• For 2015 and beyond preserve a flat MO budget– Add IBL core electronics maintenance into 5% model of pixel.

The readout of Layer 2/1 with IBL ROD/BOC will still contribute to 2015 expenses


Summary• Present spending to date is

• Approved 100 kCHF IDGEN manpower increase for 2014 as the shutdown is now the full two years

• Request of additional 70+100 kCHF in 2014 and 2015 for electronics for Pixel readout consolidation was approved– This is consolidate the Layer 2 readout ready for Run-2


Balance 2013

ID Pixel SCT TRT TotalBudget (kCHF)

Budget carry-over from 2012 42 10 -94 192 149

2013 Budget 673 610 637 545 2465

Spent (31Oct 2013) 674 493 353 556 2076 Open 39 101 152 38 330Remaining 2 26 38 143 208

Documents

ATLAS Inner Detector MO_B 2013 to-date status 2014 approve budget