17
ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

Embed Size (px)

DESCRIPTION

ILC-FPCCD Pixel size : 5  m Thickness : 15  m Signal level : ~500e for penetration with large angle → Readout ASIC must be low noise. Wafer size  L1, L2 : 10 x 65 mm 2  L3-L6 : 20 x 100 mm 2 Readout channel : 16 or 32 ch  L1, L2 : 13,000 x 128 pix/ch  L3-L6 : 20,000 x 128 pix/ch ILC vertex detector is constructed with FPCCD wafers.

Citation preview

Page 1: ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

ASIC Development for Vertex Detector

’07 6/14 Y. Takubo(Tohoku university)

Page 2: ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

Introduction

Motivation to develop readout ASIC• A large number of FPCCD channel must be read with ASIC.

• Test sample will be delivered within 2007.

• Readout ASIC is necessary to test the FPCCD test sample.

Today’s talk• Requirement to the readout ASIC

• Chip design

• Schedule

Page 3: ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

ILC-FPCCDILC-FPCCD• Pixel size : 5m

• Thickness : 15m

• Signal level : ~500e for penetration with large angle→ Readout ASIC must be low noise.

• Wafer size L1, L2 : 10 x 65 mm2

L3-L6 : 20 x 100 mm2

• Readout channel : 16 or 32 ch L1, L2 : 13,000 x 128 pix/ch L3-L6 : 20,000 x 128 pix/ch

ILC vertex detector is constructed with FPCCD wafers.

Page 4: ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

FPCCD vertex detector

Size (mm2) ch/wafer # of wafers # of chL1, L2 10 x 65 16 15 x 2(z) 480

L3, L4 20 x100 32 16 x 2(z) 1024

L5, L6 20 x 100 32 24 x 2(z) 1536

Total 220 6080

cos = 0.95

cos = 0.9

L1

L6

FPCCD vertex detector• # of wafers : 220

• Readout channel : ~6000ch

• All pixels in one channel is read within 200ms

• Required power consumption : < 100W.

to be investigated

Structure and performance of FPCCD determines requirement to the readout ASIC.

Page 5: ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

Requirement to the readout ASICRequirement to the readout ASIC• Amplifier, LPF, CDS, ADC and DSP are mounted on one chip.

• Readout rate : >10 Mpix/sec [20000 x 128 pix]/[0.2 s]

• Total noise level including the CCD : <50 electrons

• Power consumption : < 10mW/ch (~100W/6000ch)

• Channel width : 0.64 mm 5m x 128pix

To achieve these requirement, readout ASIC is designed by Ikeda-san.

Page 6: ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

Block diagram of readout ASICDesign concept was made by Ikeda-san.

From CCD Voltage

amplifierLow-pass filter

Charge-sharing ADC (6bit)

Charge-sharing ADC (6bit)

LVDS driver

Reset

Gain control

Band-width control

Track/Hold

Conversion

CK(100MHz)

Serial output

2 ADCs are activated alternatively.

Specification of the ASIC design is summarized.

Page 7: ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

Specification of readout ASICSpecification of readout ASIC• 0.35 m process by TSMC• Size : 3 x 3 mm2

• # of pad : 80• # of signal channels : 4• AD conversion rate : 10 MHz x 2• Clock frequency : 100 MHz• Data width : 6bit + sign bit• Power rail : ±1.65 V• Analog gain : adjustable• Frequency bandwidth : adjustable• Interface : LVDS/LVTTL Performance of the readout ASIC

is estimated.

Page 8: ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

Expected performanceExpected performance• Power consumption < 5 mW

Charge-sharing ADC realizes low power and fast AD conversion.

• Readout rate : 20 Mpix/sec Data conversion rate : 10x2 MHz 130 ms/ch : [20000 x 128 pix/ch] x [5 x 10 - 8 s/pix]

• Channel width : 0.75mm (=3/4)

To be evaluated• Determination of signal scale• Estimation of noise level

Page 9: ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

Schedule• ~ August in 2007

Simulation study Determination of chip design Ordering the readout chip

• ~ January in 2008 The chip will be delivered. Response test of the readout chip Readout test of FPCCD with readout ASIC Improvement of the chip design for the 2nd prototype.

Page 10: ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)
Page 11: ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

23/05/14 Conceptual Design for FPCCD ASIC 11

C1

C2

Gain= -C1/C2

To be arrange as a binary weighted arrayLocated to improve peakingcharacteristics

Switch for DC restoration

Low noise amplificationelement

Bias voltagegenerator

To mitigatethe clock-feedthru

Source followerfor DC level-shift

Voltage amplifier

Page 12: ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

23/05/14 Conceptual Design for FPCCD ASIC 12

To subtract DC levelduring rest phase(CDS)

Second-order low—passfilter with gm-C filter technique

Band-pass node

Low-pass node

G=1

Low-pass filter

Page 13: ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

23/05/14 Conceptual Design for FPCCD ASIC 13

INPUT

Parallel out

Serial out

Data valid

Reference voltage

Shift register

Switch control and bit-storage

For settleing

OUTP

OUTM

Charge sharing successive approximation AD converter

Page 14: ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

23/05/14 Conceptual Design for FPCCD ASIC 14

MSB LSB0.4 pF + 0.4 pF 0.0625 pF

Capacitor bank

Page 15: ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

23/05/14 Conceptual Design for FPCCD ASIC 15

Driven by clock

Low-assertedfor meta-stable transients

Comparator

Page 16: ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

23/05/14 Conceptual Design for FPCCD ASIC 16

Driver Reciever

LVDS interface

Page 17: ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)

23/05/14 Conceptual Design for FPCCD ASIC 17

Driver Receiver

LVTTL interface