ART FILM - L1_TOP

ART FILM - L1_TOP

ART FILM - ASSY_PRIM

ART FILM - ASSY_PRIM

1

TP7

P2

1P1

TP17

TP4

1

EXT01

RT1

RT2

TP11

J4

MATE ENTRY

1

LK1

LK2

C4

C5

JMP2-1JMP2-2

E1E2

C1

USB

P9

R5

R4

U4

C11TP13

U1

J1

J3

C7

TP18

TP15TP16

TP1

C9

TP5

C8

TP8C10TP14

TP9U2

J6

TP10

J5

1J7

U3

D1

TP6

TP12

R1

TP2TP3

1P4

1P3

ASSEMBLY

ART FILM - L4_BOT

ART FILM - L4_BOT

ART FILM - ASSY_SEC

ART FILM - ASSY_SEC

ART FILM - SKT

ART FILM - SKT

EXT01

GND2

TP7

6P2

1P1

LTC2862A + ADuM6421A

8

A

TP17

GND

TP4

Fault Protected RS-485Arduino Shield Board

EXTERNAL 5V VIN

1

P9

LK1

RT1

RT2

E2TP11

6J4

GND ARD_DE TXDEN

5

1

LK2

C5 JMP2-1JMP2-2

E1

C4

DE

C2

C1

2

5V

6

5

J3

ARD5V EXT_VIN USB

USB

R5

TP18

R4

3.3V5V C11

C3

VDD1 SRC+3.3V_ARD

2

5V SRC

C7

E3

B

C10

U4

DI_ISO

TP13

TP16

U1

J6

VDD1

TP1

DE ARD_RE VDD1 GND

2J1

C9

TP5

3

4

DS1

DS2

C8

R2

R3

TP8

VDD2

TP14

RO_ISO

DE_ISO

TP15

TX

INPUT_SEL

TP9

VDD1 GND SEL_MODE

RE_N TP10

3.3V 5V

J5

J7

U3

TP6

GND2

RE_N_ISO

D1

RX

TP12DE

REC6

2U2

P4

R1

P3

GND1

2TP3

TP2

18

110

ART FILM - SMT

ART FILM - SMT

ART FILM - SKB

ART FILM - SKB

61

P1

TP7

P2

18

TP17

TP4

1EXT01

6 J4

TP11

5

1

LK2

LK1

2

6

5

P9

TP13

2J3

J1

TP18

TP16

TP1

2

TP5

3

4

TP8

TP14

TP15

6 J6 TP95

TP10

J7

J5

D1TP6

TP12

P4

2

P32

TP3

TP2

18

110

ART FILM - SMB

ART FILM - SMB

ART FILM - PMT

ART FILM - PMT

ART FILM - PMB

ART FILM - PMB

ART FILM - FAB

ART FILM - FAB

A

B

C

D

TEST REQUIREMENTS;

INTENTIONAL SHORTS;

SURFACE FINISH;

SILK SCREEN;

SOLDER MASK;

CLADDING;

MATERIAL FAMILY;

MATERIALS;

SPECIFICATIONS:

8

8

70.4

0.0762um - 0.127um (3-5 MICRO INCHES) GOLD 2.54um (100 MICRO INCHES) NICKEL/

"GERBER DATA" IS PROVIDED. THIS VERIFICATION ALSO

REQUIRED FOR "ODB++" DATA PER EMBEDDED NETLIST.

SUPPLIED IPC-D-356 NETLIST FOR OPENS AND SHORTS WHEN

100% NETLIST ELECTRICAL VERIFICATION USING CUSTOMER

DOES NOT MATCH "READ_ME.2" FILE PROVIDED.IS REQUIRED IF SUPPLIED DATA REPORTS ANY CONDITION THATINTENTIONAL NET SHORTS EXIST. CUSTOMER REVIEW AND APPROVALIF SUPPLIED DATA INCLUDES A FILE "READ_ME.2", THEN

ENIG (Electroless Nickel/Immersion Gold)

COLOR: WHITESYNTHETIC INKJET PRINTING ALLOWED FOR DENSE BOARDS,SHALL BE PERMANENT NON-CONDUCTIVE EPOXY INK, COLOR: WHITE

(LATEST REV.) CLASS 3. COLOR GREEN.OVER BARE COPPER OR GOLD AND SHALL MEET IPC-SM-840SHALL BE LIQUID PHOTOIMAGEABLE (LPI) APPLIED ON BOTH SIDES

TAKE PRECEDENCE.

NOTE: IF THE LAYER STACKUP CONFLICTS WITH THE ABOVECLADDING SPECIFICATIONS THEN THE LAYER STACKUP SHALL

INTERNAL PLANE LAYERS 1 OZ. COPPER.INTERNAL SIGNAL LAYERS .5 OZ. COPPER.EXTERNAL LAYERS .5 OZ. COPPER, OVERPLATE TO 1.5 OZ.

ISOLA 370HR OR EQUIVALENT

U.L. RATING OF 94 V-0IPC-4101 OR IPC-4103, MINIMUM Tg>130degC, Td>300degC,ALL LAMINATES AND BONDING MATERIALS SHOULD BE SELECTED FROM

52.9

7

7

8

DESIGN CROSS SECTION CHART___________________________TOTAL THICKNESS 1.595 MM

1-2

L2 BOTTOM CONDUCTOR - 0.0525 MM

* SURFACE - 0 MM

* DIELECTRIC - 1.49 MM

* SURFACE - 0 MM L1 TOP CONDUCTOR - 0.0525 MM

6

6

15. THRU VIAS FILLED WITH NON-CONDUCTIVE EPOXY AND PLATED OVER. COPLANAR ON BOTH SIDES WITHIN .001 INCH PRIOR TO FINAL PLATING.

14. REPAIRS PER IPC-7711/21 (LATEST REV.) ARE ALLOWED.

C. LOT NUMBER B. DATE CODE (STAMP). E. SUCCESSFUL ELECTRICAL TEST. A. U.L. CODE-FLAMMABILITY RATING D. MFGR LOGO

UNLESS OTHERWISE INDICATED;

13. MFGR. TO LEGIBLY ETCH OR STAMP/SCREEN WITH PERMANENT NON-CONDUCTIVE INK ON SECONDARY SIDE IN A CLEAR AREA

MASK OR INTERNAL COPPER PLANES.

ALL OTHER FEATURES TO BE 5.08MM (0.200 INCH) MINIMUM. B. THERE SHALL BE NO THIEVING IN ANY AREAS FREE OF SOLDER

A. THIEVING TO CARD EDGE, FIDUCIALS, NON-PLATED THROUGH HOLES,

THE CUSTOMER: AREAS ON THIS DESIGN ONLY AFTER REVIEW AND APPROVAL FROM12. THIEVING MAY BE ADDED TO COMPENSATE FOR LOW COPPER DENSITY

INTERSECTION ONLY AND ELECTRICAL INTEGRITY MUST BE MAINTAINED.) TEAR DROP PADS TO MAINTAIN ANNULAR RING. (AT PAD TO TRACE ANNULAR RING REQUIREMENT, MFGR. MAY REQUEST APPROVAL TO11. IF PAD SIZES PROVIDED ARE NOT LARGE ENOUGH TO MAINTAIN

PERFORMED AFTER CUSTOMER APPROVAL.10. NON-FUNCTIONAL PAD REMOVAL FROM INNER SIGNAL LAYERS MAY BE

9. MINIMUM DESIGN SPACING IS 0.2mm.

8. MINIMUM DESIGN LINE WIDTH IS 0.15mm.

CONDUCTOR THICKNESS.

7. FINISHED CONDUCTOR WIDTHS SHALL NOT BE REDUCED FROM THE NOMINAL INDICATED ON THE MASTER PATTERN, BY MORE THAN THE

6. HOLE DIAMETERS APPLY AFTER PLATING.

CROSS SECTION. MINIMUM AVERAGE, WITH NO READING LESS THAN 20um (.0008) BY 5. PLATED HOLE WALL THICKNESS SHALL NOT BE LESS THAN 25um (0.001 INCH)

A DIAMETER OF 0.127mm (0.005 INCHES) FROM THEIR TRUE POSITION. 4. HOLE PATTERN TOLERANCES FOR UNDIMENSIONED HOLES SHALL BE

WRITTEN AUTHORIZATION. 3. MODIFICATIONS TO THE ARTWORK ARE NOT ALLOWED WITHOUT

(LATEST REVISION.) 2. ACCEPTABILITY PER ANALOG DEVICES, INC. SPECIFICATION TST00115,

FABRICATION UNLESS OTHERWISE SPECIFIED. 1. REFER TO IPC-6010 SERIES (LATEST REV.), CLASS 2 FOR

REQUIREMENTS:

5

5

PRIMARY SIDE

FIGUREALL UNITS ARE IN MILLIMETERSDRILL CHART: TOP to BOTTOM

FINISHED_SIZE

NON PLATED: +/- .001

0.10160.1524

PLATED: +/- .003UNLESS SPECIFIED

4

1.0161.1431.271.397

HOLE TOLERANCE

4

PLATEDPLATEDPLATEDPLATEDPLATEDPLATEDPLATED

3

230

QTY

3

4

186962

2

2

.XX +-0.25

.XXX +-0.127

DECIMALS

DIMENSIONS ARE IN MMUNLESS OTHERWISE SPECIFIED

+- 1/32

FRACTIONS

TOLERANCES

+/- 2

ANGLES

A

REV

PADDY DUIGNAN

ASSEMBLY

25/02/19

INITIAL RELEASE

DESCRIPTION

A2

SDP-K1 TEST BOARD

REVISION

1/1

1

01-056538-01

1

ANALOG DEVICES INTERNATIONAL

ERDC Building

Raheen Business Park

Raheen, LIMERICK, IRELAND

DATE

1

APPROVED

1

A

A

B

C

D