Arm Future Perspective

8/6/2019 Arm Future Perspective

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The State of the Future:ARMs Perspective

Emre Ozer

ARM R&D, Cambridge

Nov 16, 2009


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ARMIP Company

Processor IP Physical IP Fabric and Peripheral IP Development Tools

Processor Family M-Class (Ultra-low power and very low-power)

Microcontrollers R-Class (Real-time and embedded processors)

Automotive, control, critical-safety, military and space A-Class (Application processors)

Mobile, Smartphone, Consumer Electronics, Netbooks andServers

look at the power characteristics

of A-class ARM


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Current R&D ActivitiesProcess, Voltage and Temperature Variations

Project: Razor- Energy-efficient adaptive processor aiming atTechnology and Environment variations and fault toleranceCustom Processors

Project: Reconfigurable Array and Fabric Tool design forapplication-specific custom processor

System-level Performance and Power Modelling Project: Accurate Modelling of SoC Detailed models of memory

controllers and system power

Memory Bandwidth Project: EuroCloud - 3D DRAM on Logic

Cloud Computing and low-power Servers Project: EuroCloud Low-power server using multi-core Cortex A9

for Mobile Cloud apps


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Challenges

1.Process Variations, Reliability andFault Tolerance

2.Power Dark Silicon Problem3.

Memory Wall4.Scalability5.Cloud Computing


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Challenge 1: Variations, Reliability and Fault Tolerance

Variations Process, voltage, temperature and dynamic From die to die, wafer to wafer Yield is a concern

Soft errors Single-event transients, Single event upsets, Single-event latchups

and etc.

Hard errors Aging, wear-out, NBTI and etc.

Reliable Execution Hardware and software solutions required

Fault tolerance techniques Beyond 22nm, operating requirements forsafety-critical and space

applications may also be true forgeneral-purpose apps


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Challenge 2: Power Dark Silicon Problem

Area

Peak freq

Year

Node 45nm

1

2008

1

22nm

~1/4

2014

1.6

11nm

~1/16

2020

2.4

Power

@ 45nm freq@ peak freq

1

1

0.6

1

0.3

0.6

Exploitable Si(equivalent Power)

24% 10%


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Challenge 2: Power Dark Silicon Problem

How to fill the Dark Silicon

On-chip memory (cache, DRAM or other)Turn off when not used

Hardware accelerators (Video, audio,encryption and etc)

Only activate the required accelerators


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Challenge 3: Memory Wall

DRAM Bandwidth & Latency cannot keep up with the

computational demands Get worse with increasing number of many cores

Solution to Bandwidth 3D DRAM Integration

Solution to Latency Alternative Memory technologies

Phase-change RAM, MRAM and etc

3D Integration


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Challenge 4: Scalability

Future is homogeneous many cores. Good! but Performance Scalability

Programming and Tools Interconnection network

Power Scalability May not power all the cores at the same time!

Heterogeneous many cores ormany accelerators could bemore power-scalable option in the future Corollary to the

Dark Silicon Problem


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Challenge 5: Cloud Computing

The cloud will define the software platform

The client will be a server (and vice versa)


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20122011

1Q 2Q 3Q 4Q1Q 2Q 3Q 4Q1Q 2Q 3Q 4Q

2010

EuroCloud Roadmap = Deliverable= Vision

2013 2014 2015

Nokia80M users ?

ARM nextgen CPUrelease 1 ?



Wide DRAMproto chips ?

Multi-Linuxnon-coherentserver systemreport

Scalablecaches andinterconnectsreport

Non-coherentserver-on-chiparch report

Comparisonof standardvs. EuroCloudservers report

3D DRAMcontrollerdesign

Off-chipNICdesign

Server PMdesign +Heterogeneousnode arch report

Standardvs. EuroCloudserverdemonstration

Faults/errorsanalysis report

Reliability ofcores/clustersreport

Reliability ofcaches/DRAMreport

Reliability of3D interconnectreport

Race-free/lock-freememory orderingreport

Nokia300M users

Nokia800M users?

Wide DRAMstandard ?

Early physicalprotospecification

TSV orinterposerproto

Thermalprotoanalysis

Cost/yieldanalysis

ARM

IMEC

OtherRelatedSpeculation

EPFL

UCY

Wide DRAMin volumeproduction ?s

Ovi serverinstrumentationsetup

Server apps

and x86 servercomparisonreport

Cloud arch andruntime protocreated

Ovi server loadanalysis report

Server HWaccelerationreport

EuroCloudserver boardsready

1st Cloud appdemo ready

Cloud appready forpublic trials

Cloud apptrial report

EuroCloudservers involumeproduction ?

Green Nokiadata centergoes online ?

CommercialEuroCloudoutsourceddesign start ?

CommercialEuroCloudserverprototypes ?

NOKIA

Elpida 1GBTSV DRAMin volumes


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Main Topics EC could focus on

Dark silicon problem On-chip memory, HW accelerators, perhaps new battery technologies

Custom accelerators Tools and novel HW structures (e.g. reconfigurable fabric and arrays)

Reliability and Fault tolerance Beyond 22nm

Memory Technologies 3D integration, novel memory elements and etc.

Cloud computing HW and SW Low-power servers in the Data Centres Mobile devices are also Cloud servers Cloud Standardization Virtualization


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EC could encourage Physical prototype development rather than virtual prototypes:

FPGAs and even ASICs To understand the variation effects beyond22nm Unfortunately, not having a Euro foundry is a concern for both researchers and

industry

There is ST, NXP and Infineon but GlobalFoundries could be alternative Euro fab (e.g. Dresden fab)

Addressing the Dark silicon problem Heterogeneity, custom accelerators, on-chip memory and etc.

Memory Technologies Almost no European memory vendor In the short term, the focus should be on 3D DRAM Integration

Cloud Computing converges with Embedded Computing Embedded systems will become future Cloud client and Cloud server SW, Virtualization, Infrastructure Standardization


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Industrys View on EC Projects

In the industry, the general view on EC projects is that theyare not very successful.

Underlying reasons: Too many partners in the consortia

In ARM, we believe that STREP like (3-to-5 partner) projects aremore agile and successful than the IP projects

Due to previous experiences, ARM avoids participating IP-typeprojects Most of the projects led by the academia with academic agenda

pushes away the industrial participation

No real product comes after the project ends


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Arm Future Perspective