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Appendix: Commercially available polyimides
P.M. HERGENROTHER, H. STENZENBERGER and D. WILSON
Introduction
Since the early 1960s, numerous polyimides in various forms have been available. Several of these materials have had short lives on the marketplace, due either to an unfavourable combination of processability, price and performance, or an elusive market-in some instances, a company's interest in polyimides simply waned.
Although a polymer may have been developed for a specific use, it may often be suitable for a number of applications. Some companies offer a polyimide in several grades, perhaps with different filler content, particle size, solvent or molecular weight. The list of commercially available polyimides presented in this Appendix is intended to familiarise the reader with representative examples of the various forms, rather than provide a detailed, comprehensive summary. Further information on any particular material can, of course, be obtained from the suppliers, details of whom are given. For convenience, the Appendix is divided into two sections, the first dealing with polyimides and the second with bismaleimides.
A.l Polyimides
A.l.I Adhesives
American Cyanamid Company, Havre de Grace, Maryland, USA
Condensation polyimide adhesives such as FM34B-18, BR34B-18 and FM-36. PMR-15 type polyimide adhesive (FM-35) Polyimide adhesives, primarily for electronic applications
Mitsui Toatsu Chemicals Inc., Kasumigaseki, Chiyodaku, Tokyo, Japan and MTC America, Inc., New York, USA
LaRC-TPI
National Starch and Chemical Corporation, Bridgewater, New Jersey, USA
Thermid 600 adhesives
Rogers Corporation, Manchester, Connecticut, USA
Durimid (LaRC-TPI)
286 POL YIMIDES
A.\'2 C oatilllfs
Cemota, 69-Solaize, France, or, IFP Enterprises, New York, USA
Various polyimides.
Ciba-Geigy Corporation, Santa Clara, California, USA
Polyimides XU-2IS series Photo imagable polyimide (Probimide 300)
Du Pont Company, Industrial Films Division, Wilmington, Delaware, USA (E.1. du Pont de Nemours and Co. Inc.)
PYRE-ML (wire coating) and various other polyimides such as 2555 and 2545
Ethyl Corporation, 451 Florida Blvd., Baton Rouge, Louisiana, USA
Polyimides Eymyd series
General Electric, Plastics Business Group, 11400 S.E. 8th St., Suite 410, Bellevue, Washington 98004, USA
Polyimide siloxanes
Hitachi Chemical Company Ltd, Hitachi, Japan
Photo imagable polyimide (PAL) Polyimides containing iso-indoloquinazolinedione (PIQ)
M & T Chemicals Inc., Ranway, New Jersey, USA
Polyimide Siloxanes such as 2065, 3500 and 4605-40
National Starch and Chemical Corporation, Bridgewater, New Jersey, USA
Thermid materials such as EL-5000 and EL-9000 series
A.1.3 Fibres
Lenzing AG, A-4S60, Lenzing, Austria
Polyimide fibre (PS4), based upon Polyimide 20S0
A.\.4 Films
Du Pont Company Industrial Films Division, Wilmington, Delaware, USA
Kapton Polyimide films
Kanegafuchi Chemical Industry Co. Ltd., Sakamoto, Shiga Prefecture, Japan, and Allied-Signal Engineered Plastics, Morristown, New Jersey, USA
Apical Polyimide films
APPENDIX: COMMERCIALLY AVAILABLE POLYIMIDES 287
Mitsubishi Kasel Corporation, 5-2, Marunouchi, 2-chome Chiyodaku, Tokyo '100, Japan
Novax polyimide films
Mitsui Toatsu Chemicals Inc., Kasumigaseki 3-2-5, Chiyodaku, Tokyo, Japan
Polyketoneimide films
Nitto Electric Industrial Co. Ltd., 919, Fuke-cho, Klimeyama-shi, Mie-ken 519-01, Japan
Polyimide films
A.\.5 Foams
CYRO Industries, Clifton, New Jersey, USA
Polymethacrylimide foams (Rohacell)
Ethyl Corporation, 451 Florida Blvd., Baton Rouge, Louisiana, USA
Polyimide foams (Soli mid)
Monsanto, 800 N. Lindbergh Blvd., St. Louis, MO 63167, USA
Polyimide foams (Skybond)
A.\.6 Powders and mouldings
Amoco Performance Products Inc., 38C Grove St., Ridgefield, CT 06877, USA
Polyamideimide (Torion) moulding powders
Dow Chemical Company, Midland, Michigan, USA
Polyimide 2080 moulding powders
Du Pont Company, Wilmington, Delaware, USA
Polyimide mouldings ('Vespel')
General Electric Specialty Plastics, 11400 S.E. 8th St., Suite 410, Bellevue, Washington 98004, USA
Polyetherimide (Ultem) moulding powders
High Technology Services, Troy, New York, USA
Polyimide sui phones (Techimer)
Hysol Composites, Cleveland, Ohio, USA
PMR-15 powders
288 POLyrMIDES
Mitsui Toatsu Chemicals Inc., Kasumigaseki, 3-2-5, Chiyodaku, Tokyo, Japan
LaRC-TPI moulding powders
Rogers Corporation, Manchester, Connecticut, USA
Durimid and Enrex moulding powders and mouldings
A.I. 7 Prepregs
American Cynamid Company, Havre de Grace, Maryland, USA
Prepregs such as Cypac 7005 and 7156-1
Amoco Performance Products Inc., Danbury, Connecticut, USA
Torlon series of polyamideimide prepregs
BP Chemicals (Hitco) Inc., Santa Ana, California, USA and Ferro Corporation (Composites Division), Culver City, California, USA
LaRC-160 prepreg
Ciba-Geigy Corporation, Composite Materials Department, Fountain Valley, California, USA
Matrimid 5218 polyimide prepregs
Du Pont Company, Composites Division, Wilmington, Delaware, USA
A vimid K prep reg A vimid N prepreg
Ethyl Corporation, Commercial Development Division, Baton Rouge, Louisiana, USA
Eymyd prepregs
Fiberite Corporation, Advanced Materials Business Group, ICI Americas Inc., Wilmington, Delaware, USA
Skybond prepregs
General Electric Plastics, 11400 S.E. 8th St., Suite 410, Bellevue, Washington 98004, USA
Ultem series of polyetherimides
Hysol Composites, 179600 Englewood Dr., Cleveland, Ohio 44130, USA
PMR-II
APPENDIX: COMMERCIALLY AVAILABLE POLYIMIDES
Monsanto Company, 800 N. Lindbergh Blvd., St. Louis, MO 63167, OSA
Skybond condensation polyimides
289
National Starch and Chemical, Finderne Av., Bridgewater, New Jersey 08807, USA
Thermid 600 series of prepregs
A.1.8 Others
Mitsui Toatsu Chemicals Inc. 2 Grand Central Tower, 140 East 45th St., New York, NY 10017, USA
New TPI Polyimide
A.2 Bismaleimides
A.2.1 Bismaleimide adhesives
American Cyanamid Company, Engineered Materials Department, 1300 Revolution St., Havre de Grace, Maryland, MO 21078-3899, USA
Bismaleimide based adhesives such as FM-32
Hysol/Dexter Corporation, Pittsburg, California, USA
Bismaleimide based adhesives such as EA9655, EA9673 and LRlOO-74
A.2.2 Bismaleimide resins
Ciba-Geigy Corporation, Hawthorne, New York 10532
Matrimide 5292 A, B, a two component resin system compnsmg 4,4' -bismaleimidodiphenylmethane (M5292A) and Diallylbisphenol-A (M5292B)
RD85-101, a BMI building block based on diaminodiphenylindane. These materials are designed for hot melt prepregging.
Araldite XU5292, a bismaleimide resin solution for PCB-applications.
Du Pont Company, Wilmington, Delaware, USA
Bismaleimide building block MV-A2 which, chemically, IS 1,3 Bismaleimidobenzene.
Mitsubishi Gas Chemicals Co. Inc., Mitsubishi International Corporation 520 Madison Av., 11th Floor, New York, NY 10022, USA
A series of BT - resin grades which are blends of Bismaleimide (B) and Triazine (T) resins. Main use in printed circuit boards.
290 POLYIMIDES
Mitsui Toatsu Chemicals, Inc., Kasumigaseki, Chiyodaku, Tokyo, Japan, and MTC America, Inc., New York, USA.
Bismaleimide-S which, chemically, is 4,4'-bismaleimidodiphenylmethane. Th.: company also offers other BMI-building blocks.
Rhone-Poulenc Chimie, Lyon, France (Rhone-Poulenc Inc., Seattle, U.S.A.)
Kerimide 601, a soluble BMI powder for multilayer board application, plus a series of research and development products under the designation FE 70000.
Rhodimid M3 (4,4'-Bismaleimidodiphenylmethane).
Reichhold Chemicals, Inc., Warren, New York 07060.
A line of 1M-AD bismaleimide resins engineered for high performance applications in the manufacture of printed circuit boards and aerospace composites and laminates.
1M-AD 94-308 (4,4'-Bismaleimidodiphenylmethane).
Amoco Chemical UK (Europe) S.A., 15 rue Rothschild, CH-1211 Geneva 21, Switzerland.
Various bismaleimide resins
BASF, Ludwigshafan, FRG
Narmco 5250-2, 5250-3, 5250-4 - a series of proprietary BMI prepreg resins. Narmco 5250-4 - is the toughest system. Narmco 5250-2 - has the highest Tg (glass transition temperature) of this series.
BASF, Structural Materials Inc., Anaheim, California.
Narmco 5250-2, 5250-3, 5250-4, a series of proprietary BMI prepreg resins. Duratool™ 450, a carbon fibre BMI carbon fabric prepreg system designed for
the fabrication of composite tools.
Brochier S.A., Lyon, France (a subsidiary of Ciba-Geigy)
Vicotex 5564-\, a proprietary BMI prepreg formulation for autoclave moulding.
Ciba-Geigy, Composite Materials Division, Anaheim, California.
R6450, R6452 proprietary BMI formulations. R6453 high compression after impact BMI formulation.
Ciba-Geigy Composites, Duxford, UK
Fibredux DLS 811 and Fibredux 6451, two proprietary formulations for low pressure autoclave moulding.
APPENDIX: COMMERCIALLY AVAILABLE POL YIMIDES 291
Cyanamid Aerospace, Wrexham, UK Various bismaleimide resins.
Shell Chemical Company, Houston, Texas 77252-2463.
A complete series of bismaleimide building blocks, unformulated BMI-resins, formulated BMI products for aerospace and electronic applications commercialised under the trademark COMPIMIDE":
Building block:
Unformulated BMI-resins; Formulated Products:
Comonomers for BMI resins:
BMI resin solution:
COMPIMIDE MDAB = high purity 4,4' -Bismaleimido-diphenyl-methane
COMPIMIDES 353, 353A, 796 COMPIMIDE 15 MRK for injection and compression moulding COMPIMIDE 65 FWR is a filament wind able bismaleimide resin
COMPIMIDE 121, a liquid Bis(allylphenyl) compound and COMPIMIDE 123 (chemically Bis-(opropenyl) phenoxy benzophenone.
COMPIMIDE 1206-F55, a 55-60% by weight solution of bismaleimide for prepregging
Technochemie GmbH-Verfahrenstechnik. Dossenheim. FRG (a member of the Royal Dutch shell Group of Companies).
Same products as Shell Chemical Company, Houston, Texas, COMPIMIDE resins are commercialised in Germany by Deutsche Shell Chemie GmbH, Eschhorn.
A.2.3 Bismaleimide Prepregs
American Cyanamid, Havre de Grace, MD 21078
Carbon Fibre UD and fabric prepreg based on Cycom 3100 BMI resins, a proprietary formulation.
FM32, a bismaleimide film adhesive.
Amoco Performance Products, Bound Brook, New Jersey 08805.
MR54-4, a tough BMI resin formulation with a cured resin Tg of 260°C, low water uptake, 180°C hot/wet service MR56-2, a BMI resin formulation for high service temperature (Yg 350°C).
These prep regs are also available through American Cyanamid.
292 POLYIMIDES
Hexcel, Dublin, California
F 178, a first generation high 1'g BMI-resin formulation F 650, a high 1'g BMI-resin system. F 652, tough controlled flow BMI-resin formulation F 655, controlled flow tough BMI-system for intermediate modulus fibres
Hitco Materials Division, Anaheim, California (now BP Chemicals (Hitco) Inc.)
see U.S. Polymeric
Hysol (The Dexter Corporation), Pittsburg, Ca 94565-3299, California, USA
EA 9655 and EA 9763, adhesive formulations based on bismaleimide chemistry
ICI/Fiberite, Tempe, ArizonajWinona, MN 55987 or Greenwich, Tx 75401
Fiberite X86, a high temperature laminating system based on bismaleimide resin
U.S. Polymeric, Santa Ana, California (a Subsidiary of BP Chemicals (Hitco) Inc.)
V 378A, a high 1'g hot/wet resistant resin V 390, a toughened high 1'g BMI-formulation V 398, a tough BMI-system V 391, a BMI-thermoset with toughness properties of thermoplastics
Index
acetylene terminated polyimides 108 -112 adhesives 181-182 aspartimides 111 composites 215-216 ethynyl terminated 11 0 isoimides 111 Thermid 600 109, 216
additives 62 adhesives
acetylene terminated imide oligomers 181-182
addition polyimide adhesives 180-181 adhesive specimens 160-163 bismaleimides 182 -183 characterisation 149 condensation polyimide adhesives 167-178
electronic 239 - 240 for bonding Kapton film 178 future research and development directions 184
LaRC-CPI 176-178 LilRC-TPI and modifications 170-174,
179 LaRC-13 180-181 nadic terminated imide oligomers 180-181
partially fluorinated polyimide 170 polyimides containing aliphatic segments 174-176
polyimide containing oxyalkylene units 169
polyimidesulphone 174 polyimide synthesis, general 165 -167 processability 167 -168 requirements 158 semi-crystalline polyimides 176 -178 specimen preparation 163 substrate preparation 164
advanced composites 187 - 226 aldimines, polyimides from 51 alpha-ray shielding 242 - 244 analysis scheme for resin development 142 aromatic nucleophilic displacement 38 arylene ether containing polyimides 69, 269
arylimides 88 aryloxyphthalimides 42
293
Avimid KlII 217-218 Avimid N 170, 218
Beaman relationship 68 benzocyclobutenes 54, 103 -105
benzocyclobutene terminated polyimides 112-113
bis(allylnadimides) 113-115 bis(etheranhydrides) 39, 40 bishaloimides 38 bis(heteroaryl)bisimides 42 bismaleimides 81
adhesives 182-183 allyl phenol copolymers 90-91 allylphenyl copolymers 90-91 amino benzoic acid hydrazide, reaction with 98
anionic polymerisation 90 bisbenzocyclobutene copolymers 103-105
bispropenylphenoxy copolymers 93, 94 bismaleimidodiphenylmethane 83 building blocks 83 comonomers 89 - 92 COMPIMIDE TM 121 90-92 COMPIMIDE 183 98, 99 COMPIMIDE 795 100 COMPIMIDE 796 98 composites 190-199
applications 195 -196 drawbacks 197 fabrication 191-194 outlook for 198 -199 prepregging 191 properties 194-195
copolymerisation 89 CTBN-rubber copolymers 105 cyanate copolymers 102 Diels-Alder copolymers 92, 95 ENE reactions 91 epoxy copolymers 99, 151 ether containing 87 ether - ketone containing 87 filament winding 92, 192-193 fracture toughness 97, 106 formulation 90 homopolymerisation 86 isomer effects 86- 87
294 INDEX
maleimide terminated oligomers 88 - 89 Michael-Addition copolymers 96 - 99 monomaleimides 107 -108 oligomers 88 printed circuit boards 98, 99, 102 resin transfer moulding 92, 193 -194 siloxane containing 152 structure and properties 85 - 87 styrene copolymers 94 sulphone-ether containing 86 sui phone containing 86 synthesis 83 - 88
bisnitroimides 38 bisphenol salts 38 biphenylene endcapped polyimides 122,
123 breakdown voltage 238 - 239 bridging group effects 64 buffer coatings 246
catenation effects 62, 72 chain-chain interactions 58, 61, 268 characterisation 129 -157
adhesives 149 chromatography 131, 146 combined techniques 133, 135, 144-145 dielectric analysis 147 differential scanning calorimetry 151,
152 -153, 178 dynamic mechanical analysis 148 high performance liquid chromatography (HPLC) 142, 146
infrared spectroscopy 17, 138 light scattering 135 -138 mass spectroscopy 145 molecular weight 129 monomer purity and reactivity 142 NMR 153 polymerisation and cure kinetics 145 polymer structure 149 supercritical fluid chromatography 144 X-ray analysis 69
charge-transfer complex 2, 58, 268 coatings 282-283 colour 72 - 73 commercially available polyimides 286-292 compact tension test specimens 163 composites 187
acetylene terminated polyimides 215 Avimid KIll 217 Avimid N 218 bismaleimides 190-199
applications 195 -196 drawbacks 197 fabrication 191-194 outlook 198-199 prepregging 191 properties 194-195
condensation polyimides 217 future for 222-224 LaRC-TPI 219 LaRC 160 214 Matrimid 5218 220 PMR-15 199-214
applications 205 - 207 chemistry 199-200 fabrication 202 - 204 limitations 207 - 213 outlook for 213 - 214 prepregging 200-202 properties 204 - 205
PMR-II 214 polyamideimides 221 polyetherimides 221 Pyralin resins 217 Skybond resins 217
crosslin king, in linear polyimides 19-20
crystalline melt 68 relation to Tg 68
crystallinity 68 - 70 cure cycle devlopment 146 cyclophnne endcapped polyimides 123
diamines basicity 7 ionisation potential 60 rate constants 8
dianhydrides commercially available 6 electron affinity 6, 59
dielectric constant 74 effect of structure on 75 -76
dielectric analysis 147 Diels-Alder
cycloaddition of bismaleimides and cyclopentadienones 53
reverse reaction in P:\IIR polyimides 199-200
di-isocyanates 43 - 46 diphenylpyromellitimide process additive 268
dynamic mechanical analysis 148
electrochemical polymerisation 48 electronic applications 227 - 251 electronic interactions 60 - 61 electron irradiation 73 endcapping 68, 152 equilibrium 2 ether exchange 42 exchange reactions 42 Eymyd resins 219
6F-BDAF polyimides, characterisation of 135-138
fabrication autoclave moulding 192,203-204 compression moulding 191-192, 202 filament winding 192 resin transfer moulding 193 -194
fibres 271- 278 BPDA based 273, 274
INDEX
benzidine copolyimide fibres 275 oriented polypyromellitmide fibres 276,
277 production 271 properties of 273, 274
fibre resin interface characterisation by SEM 149 polyimide sizing 221- 222
films 252-260 block copolymers 260 casting methods 252-253 chlorinated films 257 - 258 Kapton 253, 254, 256, 257 Novax 253, 256, 257 ODA-ODPA films 257, 258 orientation 259 - 260 properties 253 Upilex 253, 255, 256
flow 61 foams 282 future requirements and development directions 123, 184, 222, 224
gel permeation chromatography (GPC) 131-133,153
glass transition temperature iactors affecting 62 influence of diamine 63 - 64 influence of dian hydride 65 - 66
high performance liquid chromatography (HPLC) 142-143, 146
honeycomb bonding 160 hydrogen transfer addition 50-51
imidisation, chemical 28 kinetics 31 mechanism 29 molecular weight effects 32 rate constants 32
imidisation, thermal 16 changes in properties during 26 characterisation of 134 - 138 cyclisation 22 degree of 17, 48, 135 -138, 209 kinetics 21- 26 mechanism 18 molecular weight effects 26 - 28, 134- 138, 209
solvent effects 24 - 25 infrared spectroscopy 138 -140, 209
295
diffuse reflectance 147, 149, 150 interactions 58 isoimide 60, 216
Kapton 67 - 68, 253, 254, 256, 257 bonding of 178 -179
ketimines, polyimides from 51 kinetics
of polyamic acid formation 5
LaRC-CPI 176-178 LaRC-TPI 67 - 68, 70
adhesives 170-174, 179 composites 219-220 film 261, 264
LaRC-I60 ageing studies 145, 149 characterisation 147 composites 214 toughness improvements 153
LaRC-13 180-181 low angle laser light scattering 131
maleimide terminated oligomers 88 - 89 Matrimid 5218 220 mechanism
of polymerisation 1-14 melt polymerisation 47 membranes 278 membrane osmometry 131 molecular weight 3,7, 129-141
changes followed by IR 138 -141 conversion of poly(amic acid) to
polyimide 134- 138 distribution in polyamic acids 133 - 134
molecular weight determination 129-141 gel permeation chromatography (GPC)
131-133 light scattering 131 of PMR-15 by NMR 153 osmometry 131 sedimentation velocity 131 solution viscosity 129 UV-VIS spectroscopy 131
monomers order of addition 7 purity by HPLC 142 -143, 146
moulding powders 260 - 271 Avimid N 266 block copolymers 268 chemical imidisation 29 codiamines, use of 265 Durimid 264 ethylenedioxy containing 268 LaRC-TPI 261, 264 monomeric additives 268 ODA-ODPA 261 partially fluorinated 266
296
moulding powders cont'd polyamideimides 268 - 269, 270 polyetherimides 269, 271 polyimide 2080 267
INDEX
polyimides containing carbonyl and ether groups 269
process ability 264 - 268 siloxane containing 267 Vespel 260-263
multilevel metallisation 242
nitro displacement polymerisation 39 NMR 4,143 norbornene terminated polyimides
115 -1I8, 152 adhesives 180-181 characterisation 146-147 endo and exo isomers 146-47, 149
nucleophilic attack 6
osmometry 131
partially fluorinated polyimides 170, 136-138,219, 266
patterning 240- 241 photosensitive polyimides 231- 233 phthalimides 40 pin hole density 238 PIQ resin 230, 231, 235, 237, 248, 249 planarity 236- 237 plasticity 67 PMR-polyimides 199- 216
acetylene terminated polyimides 215 -216
LaRC-160 214 PMR-II 153.214-215 toughened versions 214
PMR-15 48-49, 1I5-121, 199-214 adhesives 180 ageing studies 153 applications 205 - 206 autoclave moulding 203 - 204 composite properties 120, 204-205 compression moulding 202 cure mechanism 1I6-1I8, 147, 151, 21I cure temperature 121, 211- 212 endcaps 121 fabrication 202 - 204, 211 - 212 flow control 212 future R&D 214 health and safety considerations 211 imidisation 147. 208-209 limitations 207 - 214 microcracking of composites 209-21I model compounds 117 modified with phenyl nadimide 148-149 molecular weight 118. 153, 208 - 209 molecular weight distribution 1I8
monomer purity and reactivity 142-145, 207-208
monomer stability 143 NMR studies 143, 153 prepolymer molecular weight and relation to flow 153. 208 - 209
prepregging 200 - 202 prepreg tack control 212 processability 120, 121 properties 204 - 205 resin modification 120-121, 214- 215 rheometric dynamic spectroscopy (RDS)
143, 144. 148. 208 thermal ageing 206, 213 thermooxidative degradation 150 thermooxidative stability 120, 212 - 213
polyamic acid conversion to polyimide 134 - 138 chemical imidisation of 28 effect of reaction conditions on
formation of 7 effect of side reactions on formation of
10 kinetics of formation 5 mechanism of formation I molecular weights 13 -14 molecular weight distribution 133 - 134 rate constants 13 -14 solution properties 14 storage effects 15 thermal imidisation of 16
polyamideimides 45. 221. 268, 270 polyetherimides 38-39,220,269,271,272 polyimides
aliphatic containing 174-176 high humidity resistance 249 oxyalkylene containing 119 partially fluorinated 170, 214, 219 semi-crystalline 176 - 178
polyimide silicone 231 polyimidesulphone 174 polyisoimides 52, 216 polymerisation
electrochemical 48 hydrogen transfer addition 50- 51 interfacial 9 mechanisms 146-147 melt 47 rates 5 solvent effects 3, 5
polythioetherimides 38 pyralin resins 217
reaction kinetics 145 rheometric dynamic spectroscopy (RDS) 143, 144, 148, 208
self-condensation 48
semi-conductor applications 227 adhesion strength 239 alpha ray shielding 242 barrier effect 240 breakdown voltage 238 buffer coatings 246 high humidity resistance 249 impurity 236 low thermal expansion coefficients 248
mechanical strength 238 multilevel metallisation 242 patterning 240 pin-hole density 238 planarity 236
separation membranes 278 - 282 hollow fibres 281 permeability 280, 281 selectivity 278, 279
short-chain amide acids/imides 62 sizing 221- 222 Skybond resins 217 solubility 70-72
structure effects 70-72 structure - property relationships 58
chain - chain interactions 58 colour 72 crystallinity 68 dielectric constant 74 glass transition temperature 62 plasticity 67 solubility 70 thermo-oxidative stability 67
synthesis adhesives 165 -167
INDEX
aromatic nucleophilic displacement 38, 166
bismaleimides and biscyclopentadienones 53
dianhydrides and diamines I, 165 diisocyanates and dian hydrides 43,
165 ether exchange 42 exchange reactions 40, 166 one step method 32 summary 165 -167 tetracarboxylic diesters and diamines I,
165
transimidisation 40 two step method I
tetracarboxylic acids 47 Tg 62
297
thermal expansion coefficients 210, 248 Thermid® IP-600 52, 216 thermooxidative stability 67
effect of molecular weight 68 influence of diamine 67 influence of dian hydride 66
TORLON polyamideimide 221, 270 transimidisation 40 types
acetylene terminated polyimides 52, 108, 181-182
aliphatic containing 174-176 benzocyclobutene imides 112 bis(allylnadic)imides 113 bismaleimides 81-108, 182-183 LaRC-CPI 176-178 LaRC-TPI 170-174, 179 LaRC-13 180-181 oxyalkylene containing 119 partially fluorinated 139, 170, 218, 219 photosensitive polyimides 232 PMR polyimides 115, 180, 199-216 polyamideimides 45, 221, 270 polyetherimides 38-40,47, 220-221, 269, 271, 272
polyimide-isoindoloquinazolinedione 231 polyimide silicone resin 231 polyimidesulphone 174 polyisoimides 52, 53 polythioetherimides 38 - 40 semi-crystalline 176 -178
Ultem polyetherimide 220-221,269,271, 272
urethanes, polyimides from 51
viscosity dilute solution 7, 129-131 methods 130 polyelectrolyte effects 130
X-ray wide angle scattering 69
