Ane-Li Jow, President - Qualcomm Developer Network · PDF fileInput to wake module from hibernate or dormant. J38 : GND . Power : Ground . J39 : RF . Antenna : 50 Ohm impedance

EnzyTek Technology, Inc. 7F, No. 35, Hsueh Fu Rd., Hsinchu 300,

Taiwan , R.O.C. TEL：886-3-573-6708 FAX： 886-3-573-8749

1

EnzyTek EnzyTek Technology , Inc .

BTM-C1011-2

Datasheet

Issued date: September 20, 2016



2


EnzyTek Bluetooth® Low Energy Module BTM-C1011-2

OVERVIEW

Highly integration BT 4.0 Low Energy module, CSR CSR1011 + Memory + Filter + X’Tal.

Wireless communications module conforming to Bluetooth Version 4.0.

UART, SPI interfaces available to various applications.

24 GPIO ports available for user’s application.

3 Analog IO ports available for user’s application.

BT Chipset : CSR CSR1011

Standards : Bluetooth 4.0 Low Energy

Frequency : 2402 ~ 2480 MHz

TX Output Power : 4.5 +/- 1 dBm (max)

RX Sensitivity : -88 dBm (min)

Range : > 10 m (line-of-sight at open space)

Memory : EEPROM (512K Bits)

Operation Voltage : 3.3V

Dimension : 19.05 x 13.46 x 2.2 (max) mm3 (L×W×H)

Environmental Range : Operation Temperature : 0~+85oC, Relative humidity : 0~95%



3


System Block Diagram

CSR CSR1011

EEPROM

Filter

16MHz XTAL

UART (PIO[1:0])

SPI (PIO[8:5])

PIO[4:3]

PIO[31:9]32KHz XTAL

AIO[2:0]

Antenna



4


Pinout Diagram / Dimension Unit : mm

Note: Please contact EnzyTek to get the detail footprint of the module to do the PCB design.

J13 VDD_INIO

PIO_21

1.2 mm

0.4mm

AIO_2

PIO_20

PIO_15

J7 PIO[3]IO

PIO_11

J32PIO[10] IO

2.2 mm

J22

PIO

[23

]IO

PIO_16

J9 PIO[15]IO

PIO_3

J11 PIO[17]IO

PCB thickness:1mm

0.3mm

UART_RX

J31PIO[27] IO

PIO_10

J20

PIO

[21

]IO

J23

PIO

[24

]IO

J24PIO[25] IO

0.57mm

13.462 mm

0.8mm

J38

GND

IO

PIO_30

1.93 mm

J26PIO[26] IO

PIO_24

SPI_CLK

PIO_22

J6 PIO[14]IO

PIO_25

SPI_EN

SPI_MISO

J5 AIO[0]IO

1.93mm

PIO_17

AIO_0

H2HOLE_1mm

1

J25PIO[9] IO

J28SPI_MOSI IO

J27SPI_CSB IO

J3 AIO[2]IO

J2 PIO[13]IO

J33PIO[28] IO

VDD_IN

RFJ

15

PIO

[18

]IO

PIO_14

WAKE

1.93 mm

J30SPI_MISO IO

SPI_MOSI

PIO_26

PIO_9

PIO_28

H1HOLE_1mm

1

PIO_13

J14 GNDIO

PIO_12

TP1

0.8MM_PAD

1

2J10 PIO[16]IO

J4 AIO[1]IO

J8 PIO[4]IO

PAD Size

J16

PIO

[19

]IO

J21

PIO

[22

]IO

J34PIO[11] IO

PIO_23

J19

PIO

[20

]IO

J37WAKE IO

19.05 mm

J1 PIO[12]IO

Bottom

AIO_1

SPI_CSB

J39

RF

IOPIO_29

UART_TX

PIO_27

1.2mm

J40

GND

IO

J35PIO[29] IO

PIO_4

J17

PIO

[1]/

UA

RT

_R

XIO

J18

PIO

[0]/

UA

RT

_T

XIO

PIO_18 PIO_19

0.57mm

Top

J36PIO[30] IO

0.4mm

J12 SPI_ENIO

J29SPI_CLK IO

1.2 mm



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I/O PIN LISTING Pin No. Pin Name Type Description

J1 PIO_12 Bi-directional with programmable strength

internal pull-up/down

Programmable input/output line




J3 AIO_2 Analog bi-directional Programmable input/output line





















J12 SPI_EN Input with internal pull-down Enable SPI interface for debugging, NC.

J13 VDD_IN Power 3.3V input (BTM-BC4E03-2H)

J14 GND Power Ground







J17 UART_RX (PIO_1) CMOS input with weak internal pull-down UART data input, optional PIO1 which is

defined by FW.

J18 UART_TX (PIO_2) CMOS output, tri-state, with weak internal

pull-up

UART data output t, optional PIO1 which is

defined by FW.






6























J27 SPI_CSB CMOS input with weak internal pull-up Chip select for Synchronous Serial Interface

active low

J28 SPI_MOSI CMOS input with weak internal pull-down Serial Peripheral Interface data input

J29 SPI_CLK CMOS input with weak internal pull-down Serial Peripheral Interface clock

J30 SPI_MISO CMOS output, tri-state, with weak internal

pull-down

Serial Peripheral Interface data output



















J37 WAKE Input has no internal pull-up or pull-down,

use external pull-down

Input to wake module from hibernate or

dormant.


J39 RF Antenna 50 Ohm impedance



7





8


Electrical Characteristics Absolute Maximum Ratings : Min. Typ. Max. Unit

Supply Voltage - - 3.6 V

Storage Temperature -40 - 85 oC

Recommend Operation Conditions : Min. Typ. Max. Unit

Supply Voltage 1.8 - 3.6 V

Operating Temperature 0 - 85 oC

Input/Output Terminal Characteristics :

Min. Typ. Max. Unit

Digital (UART, PIO)

VIL Input Voltage Low -0.4 - +0.4 V

VIH Input Voltage High 0.7xVDD - VDD+0.4 V

VOL Output Voltage Low, (IO is 4mA) - - 0.4 V

VOH Output Voltage High, (IO is -4mA) 0.75xVDD - - V



9


Radio Characteristics VCC = 3.3V

Min Typ Max Limits(BLE SPEC) Unit

Output Power

Max Power 4

<10 dBm

Min Power -20

>-20 dBm

Peak to Average

0

<3 dBm

Carrier drift

Fn -150 150 <=150 kHz

Drift rate -20 20 <20 kHz/50us

Max Power -50 50 <50 kHz

Modulation Characteristic

F1avg','F1max' 225 275 225<= <=275 kHz

F2avg','F2max' 185 >=185 kHz

F1/F2 Ratio

0.8

>=0.8

Sensitivity (-88dBm)

Frame Error Rate 0 30.8 <=30.8(-70dBm) %

PER Integrity

Frame Error Rate 50 65.4 50<= <=65.4 %

Max Input Power

Frame Error Rate

0

<=30.8(-40dBm) %



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Current Consumption

HW BTM-C1011-2

FW version F-Serial_Port-v003

FW configuration Role Gatt Server, device side

Service SPS Service

Baud Rate 2400

Default Power Scale 0

BT BLE Host iPhone 4S (ios5)

Current Meter Fluke 189

Min. Avg. Max.

Power On No connection 5.93 uA 6.79 uA 39.90uA

Power On advertising 202 uA 365 uA 567 uA

Connected No Data Transfer 15 uA 69 uA 143 uA

Connected TX Temperture/sec

(from module to host) 17 uA 184 uA 1210 uA

Connected TX Temperture/500ms

(from module to host) 17 uA 275 uA 1213 uA



11


PCB Layout Guide



12


Application Schematic

L1 NC

J2 CO

N21 2

LS1

SPEA

KER

L2 NC

SPI_

MIS

O

TP3

SW2

TAC

T Sw

itch

LED

1LE

D_B

LUE

R1

0

UAR

T_R

X

R2

680

U1

BTM

-C10

X1-2

4 5 6 7 8 9 10 11 12 13 14151617181920212223

34 33 32 31 30 29 28 27 26 25 24

403938

1 2 3

37 36 35

AIO

[1]

AIO

[0]

PIO

[14]

PIO

[3]

PIO

[4]

PIO

[15]

PIO

[16]

PIO

[17]

SPI_

ENVD

D_I

NG

ND

PIO[18]PIO[19]PIO[1]/UART_RXPIO[0]/UART_TXPIO[20]PIO[21]PIO[22]PIO[23]PIO[24]PI

O[1

1]PI

O[2

8]PI

O[1

0]PI

O[2

7]SP

I_M

ISO

SPI_

CLK

SPI_

MO

SISP

I_C

SBPI

O[2

6]PI

O[9

]PI

O[2

5]

GNDRF

GND

PIO

[12]

PIO

[13]

AIO

[2]

WAK

EPI

O[3

0]PI

O[2

9]

SPI_

CSB

C2

100u

F

50-ohm

TP1

RF_

TEST

1

2

PIO

[16]

VBAT

C1

0R/N

C

SW1 O

n/O

ff S

witc

h

12

Antenna Matching

component

SPI_

CLK

TP2

J1C

ON

4

1 2 3 4R

368

0PI

O[1

5]SP

I_M

OSI

LED

2

LED

_RED

ANT1

Ante

nna

VBAT:DC3.6V~DC1.8V

(EEPROM Version)

UAR

T_TX

Documents

Ane-Li Jow, President - Qualcomm Developer Network · PDF fileInput to wake module from hibernate or dormant. J38 : GND . Power : Ground . J39 : RF . Antenna : 50 Ohm impedance