AN OVERVIEW OF SUSTAINABLE PACKAGING

AN OVERVIEW OF SUSTAINABLE PACKAGING.Green Packaging also known as sustainable packaging, cares to safe guard the environment, leaving minimum or no carbon footprints.

The role of Inks and coatings is to

improve eco-efficiency in the

pressroom and deliver value that

benefits brand owners and

consumers According to Asia Pulp & Paper,

56% of US consumers want more

sustainable packaging, while the trend is

also noticed that consumers are hesitant to

simply trust a brand claiming to be

“GREEN”. Consumers today are savvy.

With all kinds of hard data right at their

fingertips to investigate whether a green

claim is true or not, brands need to do more

than simply use phrases like “green,”

“environmentally friendly” or “sustainable” in

their marketing. Packaging printers, in

particular, have to show a willingness to

follow the guidelines and standards set by

global retailers, who give priority to partner

with brands that utilize printing converters

who integrate environmentally friendly

practices.

Retailers wants packaging that is safe,

affordable, recyclable and optimized, while

promoting sustainable materials. Target

expects packaging to meet the guidelines of

the Environmental Protection Agency’s

Greener Living Sustainable Packaging

Program, utilizing recycled or renewable

content and no chemical of “high concern.”

A brand that takes dedicated steps to

vet and study the environmental practices

implemented by their suppliers and partners

will be rewarded by consumer and retailer

loyalty.

Sustainable – Printing Inks

Using printing inks as an example, a

converter’s definition of a successful

“sustainable ink” could be as simple as how

well the ink and materials interact with each

other to synergize the printing process. For

example, inks that improve productivity on

press or reduce waste could be seen in a

converter’s eyes as green.

Jan-Mar | 202052 | InkNews

AN OVERVIEW OF SUSTAINABLE PACKAGING.Green Packaging also known as sustainable packaging, cares to safe guard the environment, leaving minimum or no carbon footprints.






















practices.

Retailers wants packaging that is safe,

affordable, recyclable and optimized, while

promoting sustainable materials. Target

expects packaging to meet the guidelines of

the Environmental Protection Agency’s

Greener Living Sustainable Packaging

Program, utilizing recycled or renewable

content and no chemical of “high concern.”

A brand that takes dedicated steps to

vet and study the environmental practices

implemented by their suppliers and partners

will be rewarded by consumer and retailer

loyalty.

Sustainable – Printing Inks

Using printing inks as an example, a

converter’s definition of a successful

“sustainable ink” could be as simple as how

well the ink and materials interact with each

other to synergize the printing process. For

example, inks that improve productivity on

press or reduce waste could be seen in a

converter’s eyes as green.


Three key regulatory terms that are

commonly used in the packaging industry

are biodegradable, bio-renewable and

eco-friendly.

Biodegradability is the ability of a

mater ia l to be broken down by

microorganisms. More relevant for

sustainability is compost ability, where that

microorganism breakdown occurs within a

set time, and with the important parameters

of water, oxygen and temperature defined.

In order for one final packaging product

to be home compostable and/or industrially

compostable, the substrate and all of the

applied components also need to be home

compos tab le and /o r indus t r ia l l y

compostable.

According to the USA National

Association of Printing Ink Manufacturers

(NAPIM), a bio-renewable ink is derived

from tree, plant, insect and/or animal

materials. These can include resins, gums,

oils, waxes, solvents and other polymer

building blocks. NAPIM’s Bio-renewable

Content (BRC) program assigns inks an

index number, which gives an independent

verification that an ink contains a certain

percentage of bio-renewable content. An

index number of 60, for example, means

that the ink contains 60% bio-renewable

content. For the purposes of the BRC

program, NAPIM also considers water as a

renewable component in an ink.

Organizations like NAPIM already rate

water-based inks highly because water is

renewable; but by moving beyond just water

with higher levels of bio-renewable resin

content, these inks truly do meet the smell

test of environmental claims of a “greener

ink.”

Inks that meet these requirements

should be free of, or only have trace levels

of, heavy metals and reduce volatile organic

compounds that are released in the

atmosphere. They certainly shouldn’t

include any EPA-designated toxins, such as

mercury, polychlorinated biphenyl (PCB)

and chlorofluorocarbons.

Designing Inks that Improve the Eco-

efficiency of Processes

It is understood that on a macro scale,

printers need to deliver packaging to their

brand-owner customers that meets retailer

green scorecard demands, including lower-

weight packaging to reduce gas usage in

trucks, extended shelf life and waste

reduction, improved recycling streams, the

ability to meet composability standards and

more. On a micro scale, printers also need

to do their part to show environmental

stewardship by reducing volatile organic

compounds and waste, streamlining

processes, and reducing inventory.

Inks and coatings are manufactured to

both improve eco-efficiency in the

pressroom and deliver value that benefits

the brand owner and, ultimately, the

consumer.

For example, many converters use a

variety of ink systems for the different

printing presses in their shop. Having a

single ink that can be used on multiple

platforms would not only help printers

improve their environmental positioning but

allow them to maximize pressroom

efficiency and productivity, which ultimately

improves the bottom line.

The packaging market’s need for

products that deliver enhanced shelf life, as

well as sustainable and compostable metal-

free solutions, can be addressed through a

revolutionary approach that replaces

current barrier technology with printable

oxygen-barrier coatings.

Consumers and brand owners alike

expect PET bottles to be recycled, but far

too many end up in landfills because the

label wouldn’t come off. To solve this

challenge, Sun Chemical developed a

desirable adhesive that helps recyclers

i m p r o v e r e c y c l e d p o l y e t h y l e n e

terephthalate (PET) yield without process

changes or investments in new equipment.

Acknowledged as a “Responsible

Innovation” by the Association of Plastic

Recyclers (APR), this technology enables

the removal of the shrink sleeve label from

the container during the whole bottle wash

step, prior to sorting, in the wet recycling

process.

Meeting the Compliance Challenge


Three key regulatory terms that are

commonly used in the packaging industry

are biodegradable, bio-renewable and

eco-friendly.

Biodegradability is the ability of a

mater ia l to be broken down by

microorganisms. More relevant for

sustainability is compost ability, where that

microorganism breakdown occurs within a

set time, and with the important parameters

of water, oxygen and temperature defined.

In order for one final packaging product

to be home compostable and/or industrially

compostable, the substrate and all of the

applied components also need to be home

compos tab le and /o r indus t r ia l l y

compostable.

According to the USA National

Association of Printing Ink Manufacturers

(NAPIM), a bio-renewable ink is derived

from tree, plant, insect and/or animal

materials. These can include resins, gums,

oils, waxes, solvents and other polymer

building blocks. NAPIM’s Bio-renewable

Content (BRC) program assigns inks an

index number, which gives an independent

verification that an ink contains a certain

percentage of bio-renewable content. An

index number of 60, for example, means

that the ink contains 60% bio-renewable

content. For the purposes of the BRC

program, NAPIM also considers water as a

renewable component in an ink.

Organizations like NAPIM already rate

water-based inks highly because water is

renewable; but by moving beyond just water

with higher levels of bio-renewable resin

content, these inks truly do meet the smell

test of environmental claims of a “greener

ink.”

Inks that meet these requirements

should be free of, or only have trace levels

of, heavy metals and reduce volatile organic

compounds that are released in the

atmosphere. They certainly shouldn’t

include any EPA-designated toxins, such as

mercury, polychlorinated biphenyl (PCB)

and chlorofluorocarbons.

Designing Inks that Improve the Eco-

efficiency of Processes

It is understood that on a macro scale,

printers need to deliver packaging to their

brand-owner customers that meets retailer

green scorecard demands, including lower-

weight packaging to reduce gas usage in

trucks, extended shelf life and waste

reduction, improved recycling streams, the

ability to meet composability standards and

more. On a micro scale, printers also need

to do their part to show environmental

stewardship by reducing volatile organic

compounds and waste, streamlining

processes, and reducing inventory.

Inks and coatings are manufactured to

both improve eco-efficiency in the

pressroom and deliver value that benefits

the brand owner and, ultimately, the

consumer.

For example, many converters use a

variety of ink systems for the different

printing presses in their shop. Having a

single ink that can be used on multiple

platforms would not only help printers

improve their environmental positioning but

allow them to maximize pressroom

efficiency and productivity, which ultimately

improves the bottom line.

The packaging market’s need for

products that deliver enhanced shelf life, as

well as sustainable and compostable metal-

free solutions, can be addressed through a

revolutionary approach that replaces

current barrier technology with printable

oxygen-barrier coatings.

Consumers and brand owners alike

expect PET bottles to be recycled, but far

too many end up in landfills because the

label wouldn’t come off. To solve this

challenge, Sun Chemical developed a

desirable adhesive that helps recyclers

i m p r o v e r e c y c l e d p o l y e t h y l e n e

terephthalate (PET) yield without process

changes or investments in new equipment.

Acknowledged as a “Responsible

Innovation” by the Association of Plastic

Recyclers (APR), this technology enables

the removal of the shrink sleeve label from

the container during the whole bottle wash

step, prior to sorting, in the wet recycling

process.

Meeting the Compliance Challenge


It may be noted that the Brand owners and

their supply chain partners have the

responsibility to ensure safe packaging and

compliance with all regulations worldwide.

Focus on food safety is now at an all-time

high, and brand owners need to scrutinize

their supply chain from all angles to

minimize risk.

The term “migrat ion-compl iant

packaging” is commonly used to designate

materials used in the packaging structure

that don’t contain components that move

from the packaging into the product. The

levels of compounds that do migrate should

be below the amount that has an effect on

the properties of the packaged product.

New UV and electron-beam inks for

primary and secondary food packaging

need to be compliant with the strictest global

standards in the marketplace, including

Nestlé food packaging requirements and

Swiss Ordinance chemical composition

requirements. They also need to meet the

latest photo initiator-safe packaging

guidelines, including no inks made with

Bisphenol A (BPA)-based materials.

Ink suppliers, converters and other

converter partners can play a key role in

helping achieve a brand, retailer and/or

consumer’s sustainability initiatives or

requirements. No matter the desired

approach — biodegradable, bio-renewable

or eco-friendly — working together to

achieve sustainability objectives is really a

win-win for everyone. Consumers have

peace of mind. Retailers and brands are

trusted for going above and beyond simple

greenwashing. Converters and suppliers,

such as ink manufacturers, benefit too,

because being sustainable is also good for

business.

The personal care packaging, food and

beverages packaging and health care

packaging are the primary market on the

basis of application apart from other

segments. The primary packaging by layers

has been the widest market in the recent

past

The working group and youth of today

India has given a big impetus to the demand

of sustainable packaging with higher

income group and working class leaving

behind the farming and their traditional

family business. Similar has been the trend

in the whole of Asian region. The

sustainable packaging is popularly adopted

by the health care sector in today’s market.

According to the Market analysis

materials such as Paper & Paperboard,

Plastic, Metal, Glass, wood are basic and

major packaging materials. Sustainable

packaging accounts the Processed

recycled contents of packaging, Reusable

packaging and Degradable packaging. The

Flexible Packaging, Rigid Packaging and

Packaging Accessories also have separate

large markets as well as the primary,

secondary, tertiary and multiple layer

packaging market. Similarly, the packaging

market is classified by application like Food

& Beverage packaging, Healthcare

packaging, Personal care packaging,

Industrial & Others.

It can be reemphasised that public

concern for environmental and growing

public awareness about eco-friendly

products would be playing great role and

shall be the factors for the remarkable

growth of sustainable packaging market.

In addition to India the world rising

consumer demand for the use of green

packaging especially for food and health

care products is poised to increase the

demand for sustainable packaging. The

Central State and local Governments in

India have also realised the importance of

Sustainable packaging and have taken up

seriously the concerns to deal with the

waste generation by imposing strict policies

at the same time to create the demand for

eco-friendly packaging materials which

would certainly being positive results

towards the growth of sustainable

packaging market. The innovative

sustainable packaging products are adding

better scope the sustainable packaging

market to flourish.

The only factors such as high cost of

materials required for making the

sustainable packaging including biofuels

etc. may pose a threat to the growth of the

sustainable packaging market worldwide.


It may be noted that the Brand owners and

their supply chain partners have the

responsibility to ensure safe packaging and

compliance with all regulations worldwide.

Focus on food safety is now at an all-time

high, and brand owners need to scrutinize

their supply chain from all angles to

minimize risk.

The term “migrat ion-compl iant

packaging” is commonly used to designate

materials used in the packaging structure

that don’t contain components that move

from the packaging into the product. The

levels of compounds that do migrate should

be below the amount that has an effect on

the properties of the packaged product.

New UV and electron-beam inks for

primary and secondary food packaging

need to be compliant with the strictest global

standards in the marketplace, including

Nestlé food packaging requirements and

Swiss Ordinance chemical composition

requirements. They also need to meet the

latest photo initiator-safe packaging

guidelines, including no inks made with

Bisphenol A (BPA)-based materials.

Ink suppliers, converters and other

converter partners can play a key role in

helping achieve a brand, retailer and/or

consumer’s sustainability initiatives or

requirements. No matter the desired

approach — biodegradable, bio-renewable

or eco-friendly — working together to

achieve sustainability objectives is really a

win-win for everyone. Consumers have

peace of mind. Retailers and brands are

trusted for going above and beyond simple

greenwashing. Converters and suppliers,

such as ink manufacturers, benefit too,

because being sustainable is also good for

business.

The personal care packaging, food and

beverages packaging and health care

packaging are the primary market on the

basis of application apart from other

segments. The primary packaging by layers

has been the widest market in the recent

past

The working group and youth of today

India has given a big impetus to the demand

of sustainable packaging with higher

income group and working class leaving

behind the farming and their traditional

family business. Similar has been the trend

in the whole of Asian region. The

sustainable packaging is popularly adopted

by the health care sector in today’s market.

According to the Market analysis

materials such as Paper & Paperboard,

Plastic, Metal, Glass, wood are basic and

major packaging materials. Sustainable

packaging accounts the Processed

recycled contents of packaging, Reusable

packaging and Degradable packaging. The

Flexible Packaging, Rigid Packaging and

Packaging Accessories also have separate

large markets as well as the primary,

secondary, tertiary and multiple layer

packaging market. Similarly, the packaging

market is classified by application like Food

& Beverage packaging, Healthcare

packaging, Personal care packaging,

Industrial & Others.

It can be reemphasised that public

concern for environmental and growing

public awareness about eco-friendly

products would be playing great role and

shall be the factors for the remarkable

growth of sustainable packaging market.

In addition to India the world rising

consumer demand for the use of green

packaging especially for food and health

care products is poised to increase the

demand for sustainable packaging. The

Central State and local Governments in

India have also realised the importance of

Sustainable packaging and have taken up

seriously the concerns to deal with the

waste generation by imposing strict policies

at the same time to create the demand for

eco-friendly packaging materials which

would certainly being positive results

towards the growth of sustainable

packaging market. The innovative

sustainable packaging products are adding

better scope the sustainable packaging

market to flourish.

The only factors such as high cost of

materials required for making the

sustainable packaging including biofuels

etc. may pose a threat to the growth of the

sustainable packaging market worldwide.


INKOMETER 1100

The Inkometer 1100 measures

the apparent tack of printing ink

under condi t ions c losely

approximating the dynamic

conditions of the ink-distribution system of a

printing press. The testing instrument

provides the highest accuracy and

efficiency for research and development,

quality control and process evaluation to

verify, test and improve quality.

The instrument measures the integrated

forces involved in ink film splitting and the

effects of roller speed, film thickness,

temperature and solvent evaporation.

The Inkometer 1100 consists of three

rollers.

The center roller is a temperature

controlled brass roller. The bottom roller is

an osci l lat ing rubber composit ion

distribution roller. The top roller is a rubber

composition roller attached to the

measuring system which measures tack.

Rollers are available for testing standard

and UV inks. The brass roller temperature is

controlled by circulating a coolant mixture

provided by a Constant Temperature

Circulator (CTC).

The tack is reported in gram-meters and

represents the torque required to “work” the

ink film at a known rate with predetermined

film thickness and temperature.

The Inkometer 1100 multi-line display

shows the temperature, tack, roller speed

and test time. Tack readings can be

exported to the RS-232 port, the integrated

printer or to a USB flash drive. Statistical

reports can be viewed directly from the

display. The Inkometer provides four test

methods based on ASTM D-4361 as well as

five user configurable methods that are

stored in non-volatile memory

Features:

• Reliable data about ink tack

• Digital keypad with simplified setup

menus

• 4 Preset methods based on ASTM

D-4361

• Create and save 5 custom test methods

• Store up to 180 tack readings

• Preset & programmable speed options

• Built-in printer for instant results

• Portable data via USB port

• Calibration weights included

• Emergency stop button

P hysical Specifications

Instrument Dimensions:

18 in D x 36 in W x 18 in H

(460 mm x 915 mm x 460 mm)

Shipping Dimensions

Inkometer 1100:


TEST EQUIPMENT

ELECTRONIC INK TESTER


INKOMETER 1100

The Inkometer 1100 measures

the apparent tack of printing ink

under condi t ions c losely

approximating the dynamic

conditions of the ink-distribution system of a

printing press. The testing instrument

provides the highest accuracy and

efficiency for research and development,

quality control and process evaluation to

verify, test and improve quality.

The instrument measures the integrated

forces involved in ink film splitting and the

effects of roller speed, film thickness,

temperature and solvent evaporation.

The Inkometer 1100 consists of three

rollers.

The center roller is a temperature

controlled brass roller. The bottom roller is

an osci l lat ing rubber composit ion

distribution roller. The top roller is a rubber

composition roller attached to the

measuring system which measures tack.

Rollers are available for testing standard

and UV inks. The brass roller temperature is

controlled by circulating a coolant mixture

provided by a Constant Temperature

Circulator (CTC).

The tack is reported in gram-meters and

represents the torque required to “work” the

ink film at a known rate with predetermined

film thickness and temperature.

The Inkometer 1100 multi-line display

shows the temperature, tack, roller speed

and test time. Tack readings can be

exported to the RS-232 port, the integrated

printer or to a USB flash drive. Statistical

reports can be viewed directly from the

display. The Inkometer provides four test

methods based on ASTM D-4361 as well as

five user configurable methods that are

stored in non-volatile memory

Features:

• Reliable data about ink tack

• Digital keypad with simplified setup

menus

• 4 Preset methods based on ASTM

D-4361

• Create and save 5 custom test methods

• Store up to 180 tack readings

• Preset & programmable speed options

• Built-in printer for instant results

• Portable data via USB port

• Calibration weights included

• Emergency stop button

P hysical Specifications

Instrument Dimensions:


(460 mm x 915 mm x 460 mm)

Shipping Dimensions

Inkometer 1100:


TEST EQUIPMENT

ELECTRONIC INK TESTER


TEST EQUIPMENT

CTC: 23 in D x 14 in W x 28 in H

Approx. Gross Weight:

300 lbs (136.08 kg) including CTC

Technical Specifications

Speed Range: 150-3100 RPM

Roller Testing Speeds - Preset 400, 800,

1200 and 2000 RPM

(314, 628, 942 and 1570 feet per

minute) Rol ler Test ing Speeds -

Programmable 0 to 3000 RPM

Roller Speed Accuracy: ± 2 RPM

Display Temperature Range:

0°C to 50°C (32°F to 122°F)

Display Temperature Resolution:

0.06°C (0.1°F)

Distribution Time:

1 second to 30 seconds

Sample Rate: 10 seconds to 10 minutes

Test Duration: 10 seconds to 30 minutes

Tack Accuracy: ± 0.2 gram-meters

Power Requirements

Input Voltage:

Part Number 01100-2001: 120 VAC,

50/60 Hz Part Number 01100-2002: 220

VAC, 50/60 Hz

Operating / Storage Environment Air

Temperature:

Operating:

15° C to 25° C (59° F to 77° F)

Storage: 25°C to 70°C (-13°F to 158°F)

Relative Humidity:

Operating: 20% to 60% non-condensing

Storage: 5% to 90% non-condensing

Add: 15th floor,151, Jolly Maker Chambers II, Nariman Point, Mumbai -400 021. Email:[email protected]

Website : www.khushbooscientific.comContact : Praveen Bachhawat (M.D) – 9820230835 / +91-22-4884-4810


TEST EQUIPMENT

CTC: 23 in D x 14 in W x 28 in H

Approx. Gross Weight:

300 lbs (136.08 kg) including CTC

Technical Specifications

Speed Range: 150-3100 RPM

Roller Testing Speeds - Preset 400, 800,

1200 and 2000 RPM

(314, 628, 942 and 1570 feet per

minute) Rol ler Test ing Speeds -

Programmable 0 to 3000 RPM

Roller Speed Accuracy: ± 2 RPM

Display Temperature Range:

0°C to 50°C (32°F to 122°F)

Display Temperature Resolution:

0.06°C (0.1°F)

Distribution Time:

1 second to 30 seconds

Sample Rate: 10 seconds to 10 minutes

Test Duration: 10 seconds to 30 minutes

Tack Accuracy: ± 0.2 gram-meters

Power Requirements

Input Voltage:

Part Number 01100-2001: 120 VAC,

50/60 Hz Part Number 01100-2002: 220

VAC, 50/60 Hz

Operating / Storage Environment Air

Temperature:

Operating:

15° C to 25° C (59° F to 77° F)

Storage: 25°C to 70°C (-13°F to 158°F)

Relative Humidity:

Operating: 20% to 60% non-condensing

Storage: 5% to 90% non-condensing

Add: 15th floor,151, Jolly Maker Chambers II, Nariman Point, Mumbai -400 021. Email:[email protected]

Website : www.khushbooscientific.comContact : Praveen Bachhawat (M.D) – 9820230835 / +91-22-4884-4810


Sartomer

Oligomers & Monomers

Polyetheramine expoxy hardner, Mono Nonylphenols, Accelerator

Specialty amines & carbonates

LAB STOCK TECH SUPPORTCONSULTATION

ONE STOP SOLUTION FOR ALL ADDITIVE

REQUIREMENT

One St or all your Coa , Cons e & Sealan

SEMI PRESIDENT & CEO AJIT MANOCHA BEING INDUCTED INTO SILICON VALLEY ENGINEERING HALL OF FAMESVEC honoring Manocha for ‘championing industry collaboration and driving manufacturing efficiency in multiple leadership roles.’






















practices.

The World Print & Communication

Forum (WPCF) 2020 Conference was held

on January 08, 2020, on the sidelines of

PAMEX 2020, at The Westin Mumbai

Garden City, with host of leaders redefining

the future for the printing industry, referring

to research, finding and instances in their

countries and the message was very clear –

Evolve your selves and adapt to changes.

The conference provided a common

platform to discuss new industry trends and

opportunities as Printers gear themselves to

meet the growing challenges posed by

shrinking traditional business and changing


SEMI PRESIDENT & CEO AJIT MANOCHA BEING INDUCTED INTO SILICON VALLEY ENGINEERING HALL OF FAMESVEC honoring Manocha for ‘championing industry collaboration and driving manufacturing efficiency in multiple leadership roles.’






















practices.

The World Print & Communication

Forum (WPCF) 2020 Conference was held

on January 08, 2020, on the sidelines of

PAMEX 2020, at The Westin Mumbai

Garden City, with host of leaders redefining

the future for the printing industry, referring

to research, finding and instances in their

countries and the message was very clear –

Evolve your selves and adapt to changes.

The conference provided a common

platform to discuss new industry trends and

opportunities as Printers gear themselves to

meet the growing challenges posed by

shrinking traditional business and changing



customer expectations along with latest

trends and technologies that are expected

to shape the industry in the coming years

Wishing ‘Happy Birthday’ to everyone

present at the inaugural session of WPCF

2020 Conference Prof. Kamal Chopra,

Chairman, PAMEX, announced that the

conference would in all its essence give

birth to everyone in the industry and the

sessions in the conference were designed

to reshape the future of the printing industry

thus help them upgrade their businesses

and that’s akin to New Janam (rebirth)

Other speakers in the session,

Dibyajyoti Kalita, President, AIFMP (All

India Federation of Master and Raveendra

Joshi Chairman, Organizing Committee

WPCF, said the future is shining with highly

advanced technologies and so is the

printing industry.

Amongst the notable speakers at the

World Print and Communication Forum

(WPCF) conference included Dr Ashutosh

Tripathi, R&D Group, National Centre for

Flexible Electronics at IIT Kanpur. He

highlighted through his presentation that the

future growth for printing industry will come

from printing flexible and printed electronics.

Narendra Paruchuri, Chief Managing

Director of Pragati Offset PLC and the

recipient of ‘VirenChhabra Print

Leadership Award 2019’ shared his

thoughts on how the print has transitioned

seamlessly through Kal,Aaaj, Aur Kal –

literally meaning through the past, the

present, and the future. He suggested

everyone to update themselves with digital

collaboration and new technologies.

“Change is the only constant in life.

Otherwise every one of us will be thrown

out,” Paruchuri reaffirmed.

Prof. Rajendrakumar Anayath, Vice

Chancellor of DeenbandhuChhotu Ram

University of Science and Technology

introduced the audience of the WPCF

conference to the importance of artificial

intelligence and data analytics in printing.

Kaz Arai, General Manager Public

Relations, The Japan Federation of Printing

Industries in his speech explained about the

current trends in the Japanese ‘Printing’

industries and how innovations in printing

will bring new direction in future will bring

new direction in future. According to him

growth was intact but they did not have

people to sustain growth in the industry at

large including Printing industry.

In the following session,Abdool Majid

Mahomed, Chief Executive Officer,

PRINTING SA, talked about the challenges

facing the industry in South Africa and their

new value proposition for members of

PIPSA. Beatrice Klose, Secretary General,

Intergraf, The European Federation for Print

and Digital Communication, in her

presentation on current trends in Europe

and legislative challenges facing the printing

industry, talked about the Circular

Economy, which is designed to reduce

single use plastics. Speakers in the

successive sessions were Michael Makin,

President & CEO, Printing Industries of

America; Chang Xioxia, General Manager,

CCDC Culture Co Ltd and Beijing Keyin

Media & Culture Co Ltd, and Dr Markus

Heering, Managing Director, German

Association of Printing and Paper

Technology.


customer expectations along with latest

trends and technologies that are expected

to shape the industry in the coming years

Wishing ‘Happy Birthday’ to everyone

present at the inaugural session of WPCF

2020 Conference Prof. Kamal Chopra,

Chairman, PAMEX, announced that the

conference would in all its essence give

birth to everyone in the industry and the

sessions in the conference were designed

to reshape the future of the printing industry

thus help them upgrade their businesses

and that’s akin to New Janam (rebirth)

Other speakers in the session,

Dibyajyoti Kalita, President, AIFMP (All

India Federation of Master and Raveendra

Joshi Chairman, Organizing Committee

WPCF, said the future is shining with highly

advanced technologies and so is the

printing industry.

Amongst the notable speakers at the

World Print and Communication Forum

(WPCF) conference included Dr Ashutosh

Tripathi, R&D Group, National Centre for

Flexible Electronics at IIT Kanpur. He

highlighted through his presentation that the

future growth for printing industry will come

from printing flexible and printed electronics.

Narendra Paruchuri, Chief Managing

Director of Pragati Offset PLC and the

recipient of ‘VirenChhabra Print

Leadership Award 2019’ shared his

thoughts on how the print has transitioned

seamlessly through Kal,Aaaj, Aur Kal –

literally meaning through the past, the

present, and the future. He suggested

everyone to update themselves with digital

collaboration and new technologies.

“Change is the only constant in life.

Otherwise every one of us will be thrown

out,” Paruchuri reaffirmed.

Prof. Rajendrakumar Anayath, Vice

Chancellor of DeenbandhuChhotu Ram

University of Science and Technology

introduced the audience of the WPCF

conference to the importance of artificial

intelligence and data analytics in printing.

Kaz Arai, General Manager Public

Relations, The Japan Federation of Printing

Industries in his speech explained about the

current trends in the Japanese ‘Printing’

industries and how innovations in printing

will bring new direction in future will bring

new direction in future. According to him

growth was intact but they did not have

people to sustain growth in the industry at

large including Printing industry.

In the following session,Abdool Majid

Mahomed, Chief Executive Officer,

PRINTING SA, talked about the challenges

facing the industry in South Africa and their

new value proposition for members of

PIPSA. Beatrice Klose, Secretary General,

Intergraf, The European Federation for Print

and Digital Communication, in her

presentation on current trends in Europe

and legislative challenges facing the printing

industry, talked about the Circular

Economy, which is designed to reduce

single use plastics. Speakers in the

successive sessions were Michael Makin,

President & CEO, Printing Industries of

America; Chang Xioxia, General Manager,

CCDC Culture Co Ltd and Beijing Keyin

Media & Culture Co Ltd, and Dr Markus

Heering, Managing Director, German

Association of Printing and Paper

Technology.

SEMI RELEASES GLOBAL SEMICONDUCTOR EQUIPMENT SALES FORECASTSales will drop 10.5% to $57.6 billion in 2019 from last year’s historic peak of $64.4 billion but stage a 2020 recovery, per SEMI.

Gl o b a l s e m i c o n d u c t o r

manufacturing equipment

sales will drop 10.5% to

$57.6 billion in 2019 from last

year’s historic peak of $64.4 billion but stage

a 2020 recovery and set a new high in 2021,

SEMI, the global industry association

representing the electronics manufacturing

and design supply chain, reported in its

Year-End Total Equipment Forecast.

Released at SEMICON Japan 2019, the

forecast shows equipment sales registering

a 5.5% increase to $60.8 billion in 2020 and

continued expansion into 2021, with record

revenues of $66.8 billion as leading device

manufacturers invest in sub-10nm

equipment, especially for foundry and logic.

The SEMI year-end forecast shows

sales of wafer fab equipment – consisting of

wafer processing, fab facility and mask/

reticle equipment – falling 9% in 2019 to

$49.9 billion. The assembly and packaging

equipment segment is on track to decline

26.1% to $2.9 billion in 2019, while

semiconductor test equipment is forecast to

drop 14% to $4.8 billion this year.

Taiwan will dethrone Korea as the

largest equipment market and lead the

world with 53.3% growth this year, followed

by North America with a 33.6% uptick.

China will maintain the second spot for the

second consecutive year, and Korea will fall

to third after throttling back capital

expenditures. All regions tracked except

Taiwan and North America will contract this

year.


SEMI RELEASES GLOBAL SEMICONDUCTOR EQUIPMENT SALES FORECASTSales will drop 10.5% to $57.6 billion in 2019 from last year’s historic peak of $64.4 billion but stage a 2020 recovery, per SEMI.

Gl o b a l s e m i c o n d u c t o r

manufacturing equipment

sales will drop 10.5% to

$57.6 billion in 2019 from last

year’s historic peak of $64.4 billion but stage

a 2020 recovery and set a new high in 2021,

SEMI, the global industry association

representing the electronics manufacturing

and design supply chain, reported in its

Year-End Total Equipment Forecast.

Released at SEMICON Japan 2019, the

forecast shows equipment sales registering

a 5.5% increase to $60.8 billion in 2020 and

continued expansion into 2021, with record

revenues of $66.8 billion as leading device

manufacturers invest in sub-10nm

equipment, especially for foundry and logic.

The SEMI year-end forecast shows

sales of wafer fab equipment – consisting of

wafer processing, fab facility and mask/

reticle equipment – falling 9% in 2019 to

$49.9 billion. The assembly and packaging

equipment segment is on track to decline

26.1% to $2.9 billion in 2019, while

semiconductor test equipment is forecast to

drop 14% to $4.8 billion this year.

Taiwan will dethrone Korea as the

largest equipment market and lead the

world with 53.3% growth this year, followed

by North America with a 33.6% uptick.

China will maintain the second spot for the

second consecutive year, and Korea will fall

to third after throttling back capital

expenditures. All regions tracked except

Taiwan and North America will contract this

year.



SEMI expects the 2020 equipment

market recovery to be fueled by advanced

logic and foundry, new projects in China,

and, to a lesser extent, memory. In Europe,

equipment sales will surge by 45.9% to $3.3

billion. Taiwan is forecast to remain the top

equipment market next year on the strength

of $15.4 billion in sales, with China second

at $14.9 billion and Korea third at $10.3

billion.

More upside is l ike ly i f the

macroeconomy improves and trade

tensions subside in 2020.

In 2021, all sectors tracked are

expected to grow and the memory spending

recovery will hit full stride. China is expected

to ascend to the top position with equipment

sales of more than $16 billion, followed by

Korea, and Taiwan.

The Year-End Total Equipment

Forecast is based on SEMI’s industry-

recognized World Fab Forecast database

and input from equipment manufacturers.

Total equipment includes wafer processing,

fab facilities, mask/reticle, total test, and

assembly and packaging equipment.

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SEMI expects the 2020 equipment

market recovery to be fueled by advanced

logic and foundry, new projects in China,

and, to a lesser extent, memory. In Europe,

equipment sales will surge by 45.9% to $3.3

billion. Taiwan is forecast to remain the top

equipment market next year on the strength

of $15.4 billion in sales, with China second

at $14.9 billion and Korea third at $10.3

billion.

More upside is l ike ly i f the

macroeconomy improves and trade

tensions subside in 2020.

In 2021, all sectors tracked are

expected to grow and the memory spending

recovery will hit full stride. China is expected

to ascend to the top position with equipment

sales of more than $16 billion, followed by

Korea, and Taiwan.

The Year-End Total Equipment

Forecast is based on SEMI’s industry-

recognized World Fab Forecast database

and input from equipment manufacturers.

Total equipment includes wafer processing,

fab facilities, mask/reticle, total test, and

assembly and packaging equipment.

For advertising contact us on

Tel.: +91 22 29253907 / 7454 or Email : [email protected]

Printing Ink Industry

just a click away

www.aipima.org

SEMI-FLEXTECH LAUNCHES SIX NEW FHE PROJECTSOrganizations including UTEP, American Semiconductor, PARC, Tekscan, Alertgy and SAFI-Tech will lead the initiatives.

SEMI-FlexTech announced the

launch of six projects to

accelerate sensor and sensor

system innovations for new

applications in industries, including

healthcare, automotive, industrial and

defense.

In collaboration with the U.S. Army

Research Laboratory (ARL), FlexTech, a

SEMI Strategic Association Partner, will

provide more than $2.3 million in funding for

the projects aimed at maturing the flexible-

hybrid electronics (FHE) technology

ecosystem. Organizations including the

University of Texas El Paso (UTEP),

American Semiconductor, PARC, Tekscan,

Alertgy and SAFI-Tech will lead the

initiatives.

“Flexible hybrid electronics give product

designers new ways to use sensors to

collect data and deliver actionable insights

that improve how we work and live,” said

Melissa Grupen-Shemansky, CTO of SEMI

and executive director of SEMI-FlexTech.

“This new round of projects epitomizes the

wide range of ap-plications enabled by

innovations in flexible hybrid electronics.

We expect this body of work to unearth new

product roadmaps across the electronics

industry.”

Projects

American Semiconductor, Inc. will develop

500 FHE ultra-thin, lightweight and

configurable sensor systems with wireless

capability for environmental sensing

applications. ASI will partner with Boise

State University, DuPont, HD Microsystems

and ITN Energy Systems on the 15-month

project.

The University of Texas at El Paso will

opt imize structural and electr ical

performance and develop sculpted

dielectrics for FHE 3D printing. The

12-month project will generate performance

data and new algorithms for smarter 3D

printing. A proof-of-concept, journal article

and presentation will cap the pro-ject.

Tekscan will develop a functioning

sensorized glove made of a durable resin

with flexible-conductive and pressure-

sensitive inks. The glove advances the state

of the art for FHE pressure and force

measurements and analysis, critical in

design evaluation for automotive,

consumer, packaging, robotics and medical

devices. The 18-month project includes

examinations of novel substrates and

materials, hard-ware integration strategies,

and manufacturing methods.

PARC, a Xerox Company, will integrate

a flexible and adaptable multi-sensor

system (consisting of temperature,

humidity, impact and gas sensors) with a

single processor for data capture and both

wire-less and audio output capabilities. The

system will target applications in the

wearables, medical moni-toring, Internet of

Things (IoT), automotive and industrial

markets. PARC will partner with Purdue

University in this 12-month project.

Alertgy will develop a curved, flexible

and lightweight wrist-mounted FHE for non-

invasive glucose monitoring. The wristband

will incorporate electrical impedance

spectroscopy (EIS), a transducer and a

printed battery. The device interface will

enable the integration of other sensors into

its multipurpose design. A demonstration of

the platform will culminate the 16-month

project.

SAFI -Tech w i l l deve lop and

demonstrate screenprinted, supercooled

liquid metal particles for use in electrical

interconnects at low temperatures as a

replacement for electrically conductive

adhesives (ECAs). Lower temperatures in

electronics manufacturing can reduce heat

generation, processing costs and thermal

damage to components while enabling

higher throughput for devices in defense,

automotive, healthcare and other industries.

SAFI-Tech will partner with Iowa State

University on the18-month project.









defense.











initiatives.












industry.”

Projects








project.









































project.















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defense.











initiatives.












industry.”

Projects








project.









































project.















2020 FLEX/MSTC BEGINS WITH KEYNOTE, CONCURRENT SESSIONSTopics include flexible and hybrid electronics, sensors, displays, materials and applications. By David Savastano, Editor

The 2020 FLEX/MSTC opens

today at the DoubleTree by

Hilton in San Jose, CA, with two

Keynote Sessions and a wide

range of concurrent sessions covering the

fast-growing world of flexible and hybrid

electronics (FHE).

Organized by SEMI-FlexTech, this

year’s conference moved to San Jose from

its recent home in Monterey, CA, and early

indications are that attendance is up and

booth space is sold out. The MEMS &

Sensor Technical Congress (MSTC) will

again be co-located with FLEX.

Melissa Grupen-Shemansky, executive

director, SEMI-FlexTech, said the keynote

speakers should all be terrific.

“In terms of individual speakers, it is

really difficult to single out individual ones,

as all have value to the bigger picture – our

electronics industry is so very complicated,”

Grupen-Shemansky said. “The keynotes

usually set a great tone for the event and get

referenced frequently throughout. They will

be followed by a panel discussion designed

to draw out more observations on the

impact of these technologies on broader

trends, as well as challenges that still exist

on the integration roadmaps.”

Keynote Talks

FLEX/MSTC Session 1: Keynotes, will

begin with introductory remarks by SEMI

Americas president Dave Anderson, SEMI

president and CEO Ajit Manocha will follow

with his talk on “Sensors, MEMS and FHE:

Going Beyond Smart to Real ize

Imagination.”

Continental Corporation VP Anil


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2020 FLEX/MSTC BEGINS WITH KEYNOTE, CONCURRENT SESSIONSTopics include flexible and hybrid electronics, sensors, displays, materials and applications. By David Savastano, Editor

The 2020 FLEX/MSTC opens

today at the DoubleTree by

Hilton in San Jose, CA, with two

Keynote Sessions and a wide

range of concurrent sessions covering the

fast-growing world of flexible and hybrid

electronics (FHE).

Organized by SEMI-FlexTech, this

year’s conference moved to San Jose from

its recent home in Monterey, CA, and early

indications are that attendance is up and

booth space is sold out. The MEMS &

Sensor Technical Congress (MSTC) will

again be co-located with FLEX.

Melissa Grupen-Shemansky, executive

director, SEMI-FlexTech, said the keynote

speakers should all be terrific.

“In terms of individual speakers, it is

really difficult to single out individual ones,

as all have value to the bigger picture – our

electronics industry is so very complicated,”

Grupen-Shemansky said. “The keynotes

usually set a great tone for the event and get

referenced frequently throughout. They will

be followed by a panel discussion designed

to draw out more observations on the

impact of these technologies on broader

trends, as well as challenges that still exist

on the integration roadmaps.”

Keynote Talks

FLEX/MSTC Session 1: Keynotes, will

begin with introductory remarks by SEMI

Americas president Dave Anderson, SEMI

president and CEO Ajit Manocha will follow

with his talk on “Sensors, MEMS and FHE:

Going Beyond Smart to Real ize

Imagination.”

Continental Corporation VP Anil



Rachakonda, head of R&D, North America,

Systems & Technology, will focus his

Keynote talk on “Consumer Applications

Driving Smart Mobility Use Cases,” a look

at the changing world of mobile technology,

AI and more.

Antti Vasara, president and CEO, VTT

Technical Research Centre of Finland Ltd.,

who follow with “Beyond Flexible Hybrid

Electronics: Biodegradable Electronics and

Interfacing Bio+Electronics.” Vasara will

offer insights into three use cases:

biodegradable diagnostic sensors, skin

conformal flexible hybrid electronics, and

interfaces between biological media and

electronics.

FLEX/MSTC Session 2: Keynotes will

start with “The Art of the Possible,” a look at

next generation devices and developments

that will be given by Michael Wiemer, VP of

engineering, CTO and co-founder of Mojo

Vision.

Zhenan Bao, K.K. Lee Professor of

Chemical Engineering, and by courtesy

professor of chemistry, materials science

and engineering, Stanford University, will

close the Keynotes with a talk on “Skin-

Inspired Electronics,” a look at how organic-

based materials can imitate skin funcitions.

Co-moderators Melissa Grupen-

Shemansky of SEMI and Stephen Whalley

of Microtech Ventures will then moderate a

Panel Discussion featuring all of the

Keynote speakers.

Concurrent Sessions

The conference then heads into four

concurrent sessions, three for FLEX and

one for MSTC. FLEX Session 3: FHE

Applications, chaired by Kei Hyodo, Yuasa

System Co. Ltd., opens with Benjamin

Leever, technical director for manufacturing

technology, Air Force Research Laboratory.

He will be followed by John Rogers, senior

electrical engineer, The Boeing Company;

Michael Mitchell, electrical engineer, The

Boeing Company; Gregory Whiting,

associate professor, University of Colorado

Boulder; and Wei Wu, principal investigator

at DuPont.

Session chair Robert Praino of Chasm

Advanced Materials will lead FLEX Session

4, Materials. The segment will feature

presenters Shenqiang Ren, professor, The

State University at Buffalo; Morten

Lindberget, VP business development,

CondAlign AS; SAFI-Tech CTO Ian Tevis;

Niveditha Nagarajan, applications engineer,

MacDermid Alpha Electronics Solutions;

and Nizamidin Jappar, marketing manager,

Kimoto Tech.

FLEX Session 5, Displays &

Optoelectronics I, be moderated by E Ink’s

Michael McCreary. Speakers will include

Robert Poser, director of product

management, Plastic Logic; FlexEnable

Ltd. CEO Chuck Milligan; E Ink CTO CC

Tsai; Antonio Facchetti, founder and CTO of

Flexterra; and Erica Montbach, manager,

R&D, Kent Display.

MSTC Session 3, Industry Trends and

Applications of MEMS & Sensors, will

feature Carmelo Sansone, director of

MEMS and Sensors Industry Group, SEMI;

Dr. Armen Mkrtchyan, senior engagement

manager, McKinsey; Andrew Kelly, director

of applications engineering, Cirtec Medical;

Dr. Brett Goldsmith, co-founder and CTO,

Cardea Bio, Inc.; and Angela Suen, director

of automotive product line management,

Lumentum.

There will also be two TechTALKS in the

afternoon. Paul Drysch of PreAct

Technologies will discuss “Successfully

Leveraging Novel Sensing Approaches to

Create New Markets in Automotive and

Robotics,” and Jeffrey Krotosky of Tronics

MEMS/TDK Electronics will focus on

“Biosensor Needs and Considerations for

Underserved Communities.” A networking

session will follow the concurrent sessions.

For more information on FLEX2020, see

FlexTech’s web site at flex.semi.org.


Rachakonda, head of R&D, North America,

Systems & Technology, will focus his

Keynote talk on “Consumer Applications

Driving Smart Mobility Use Cases,” a look

at the changing world of mobile technology,

AI and more.

Antti Vasara, president and CEO, VTT

Technical Research Centre of Finland Ltd.,

who follow with “Beyond Flexible Hybrid

Electronics: Biodegradable Electronics and

Interfacing Bio+Electronics.” Vasara will

offer insights into three use cases:

biodegradable diagnostic sensors, skin

conformal flexible hybrid electronics, and

interfaces between biological media and

electronics.

FLEX/MSTC Session 2: Keynotes will

start with “The Art of the Possible,” a look at

next generation devices and developments

that will be given by Michael Wiemer, VP of

engineering, CTO and co-founder of Mojo

Vision.

Zhenan Bao, K.K. Lee Professor of

Chemical Engineering, and by courtesy

professor of chemistry, materials science

and engineering, Stanford University, will

close the Keynotes with a talk on “Skin-

Inspired Electronics,” a look at how organic-

based materials can imitate skin funcitions.

Co-moderators Melissa Grupen-

Shemansky of SEMI and Stephen Whalley

of Microtech Ventures will then moderate a

Panel Discussion featuring all of the

Keynote speakers.

Concurrent Sessions

The conference then heads into four

concurrent sessions, three for FLEX and

one for MSTC. FLEX Session 3: FHE

Applications, chaired by Kei Hyodo, Yuasa

System Co. Ltd., opens with Benjamin

Leever, technical director for manufacturing

technology, Air Force Research Laboratory.

He will be followed by John Rogers, senior

electrical engineer, The Boeing Company;

Michael Mitchell, electrical engineer, The

Boeing Company; Gregory Whiting,

associate professor, University of Colorado

Boulder; and Wei Wu, principal investigator

at DuPont.

Session chair Robert Praino of Chasm

Advanced Materials will lead FLEX Session

4, Materials. The segment will feature

presenters Shenqiang Ren, professor, The

State University at Buffalo; Morten

Lindberget, VP business development,

CondAlign AS; SAFI-Tech CTO Ian Tevis;

Niveditha Nagarajan, applications engineer,

MacDermid Alpha Electronics Solutions;

and Nizamidin Jappar, marketing manager,

Kimoto Tech.

FLEX Session 5, Displays &

Optoelectronics I, be moderated by E Ink’s

Michael McCreary. Speakers will include

Robert Poser, director of product

management, Plastic Logic; FlexEnable

Ltd. CEO Chuck Milligan; E Ink CTO CC

Tsai; Antonio Facchetti, founder and CTO of

Flexterra; and Erica Montbach, manager,

R&D, Kent Display.

MSTC Session 3, Industry Trends and

Applications of MEMS & Sensors, will

feature Carmelo Sansone, director of

MEMS and Sensors Industry Group, SEMI;

Dr. Armen Mkrtchyan, senior engagement

manager, McKinsey; Andrew Kelly, director

of applications engineering, Cirtec Medical;

Dr. Brett Goldsmith, co-founder and CTO,

Cardea Bio, Inc.; and Angela Suen, director

of automotive product line management,

Lumentum.

There will also be two TechTALKS in the

afternoon. Paul Drysch of PreAct

Technologies will discuss “Successfully

Leveraging Novel Sensing Approaches to

Create New Markets in Automotive and

Robotics,” and Jeffrey Krotosky of Tronics

MEMS/TDK Electronics will focus on

“Biosensor Needs and Considerations for

Underserved Communities.” A networking

session will follow the concurrent sessions.

For more information on FLEX2020, see

FlexTech’s web site at flex.semi.org.

Documents

AN OVERVIEW OF SUSTAINABLE PACKAGING