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HVIC/IGBT Half-Bridge ConverterEvaluation Circuit
The HVIC high voltage integrated circuit is designed to
drive
n-channel IGBTs or MOSFETs in a half-bridge configuration
up to 500VDC. Power supply and motor control inverters can
be configured for voltages up to 230VAC using the HVIC,IGBTs and
a few other components.
A few precautions should be taken in using the circuit. Lead
lengths between the external power circuit (including gate
and pilot leads), the 15V bypass capacitor (CDD), the boot-
strap diode (DF) and capacitor (CF) and the HVIC should be
minimized.
The basic components required to evaluate the features of
the SP601 are shown in the simplified schematic. The rec-
ommended load is largely resistive so that the largest cur-
rent component will flow through the IGBTs, IGT1 and IGT2.
The flyback diodes, D1 and D2, rated 8A, will carry a much
smaller flyback current component. A small amount of load
inductance will cause the switching waveforms to simulate
the conditions which would normally be observed with motor
or transformer loads, while limiting the current carried by
the
lower rated flyback diodes in this circuit.The values for RPUa,
RPUb, etc., have been chosen to result
in overcurrent trip at approximately 25Apk. At this level of
current, heat sinking for the IGTs and flyback diodes is
required. The series resistance of the upper and lower pilot
resistor dividers would be approximately 1K; the divider
ratio should cause 0.1V at the tap at the desired trip
current.
When first energizing your evaluation circuit, begin with a
reduced bus voltage of about 20VDC to 30VDC to verify
proper circuit operation before proceeding to higher
voltages.
More specific information can be found in File Number 2428
and File Number 2429 Half-Bridge 500VDC Driver data
sheets and in the Application Note, AN-8829.1.
Simplified Schematic
HVIC- Intersil Part # SP601 (Formerly GS601) D1, 2 - Intersil
Part # RUR860 RPUa, RPLa - 910, 1.8W C1 - 0.1F, 600VDC
IGT1, 2 - Intersil Part # HGTA24N60D1C DF - Intersil Part #
A114M RPUb, RPLb - 68, 1.8W RL - 20, 3KW 13 -50
CF
RPBa
VBS D1U
TRIPL
G1U
G2U
PHASE
TRIPU
CL2
D1L
G1L
G2L
CL1
VOUT
VDF
VBIAS
UP/DOWN
ENABLE
VDD VSS
HVIC
15V PULSEGEN+15V
FAULT
FAULTLED
+15V
0.22
RPUb
RPLa
RPLb
IGT1
D1
1mH
LL
IGT2
RL
3KW20
D2
C1
100
50
100
50
25VDC VLINK 3 500VDC
VLINK2
DF
CDD 10F
VLINK2
+
+
+
+
Application Note May 1992 AN9105.1
Author: George Danz
Copyright Intersil Corporation 1999
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All Intersil semiconductor products are manufactured, assembled
and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only.
Intersil Corporation reserves the right to make changes in circuit
design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that
data sheets are current before placing orders. Information
furnished by Intersil is believed to be accurate andreliable.
However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or
other rights of third parties which may result
from its use. No license is granted by implication or otherwise
under any patent or patent rights of Intersil or its
subsidiaries.
For information regarding Intersil Corporation and its products,
see web site http://www.intersil.com
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Intersil Corporation
P. O. Box 883, Mail Stop 53-204Melbourne, FL 32902
TEL: (407) 724-7000
FAX: (407) 724-7240
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Mercure Center100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
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Intersil (Taiwan) Ltd.
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Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
Application Note 9105
