Amphenol THE PCB MANUFACTURER DELIVERING TOMORROW…

Amphenol THE PCB MANUFACTURERDELIVERING TOMORROW’S

TECHNOLOGY TODAY

www.amphenol-invotec.com

Our Business Strategy

Our MarketsWe have a diverse European customer base encompassing key growth. Regardless of application, our customers rely on Invotec to provide a total solution to their business needs. Key markets include:

Amphenol Invotec Ltd

Operating from facilities in the UK, we are one of Europe’s leading manufacturers of time critical, advanced technology and high reliability printed circuit boards.

The company manufactures a wide range of multilayer, HDI, sequential lamination, fl ex and fl ex-rigid PCBs using a variety of advanced materials, fi nishes and technologies to meet exacting customer specifi cations.

• Customer satisfaction - central to everything we do• Business & Manufacturing Excellence underpinned by Lean Manufacturing & Continuous Improvement• HDI, Flex & Flex-Rigid, advanced substrates and materials• Thermal management solutions• Signifi cant QTA Capability• High mix – Mid Volume • NPI support• DFM best practice and applications support• Engagement in customer/supplier development programs

Military Civil Aviation Industrial Space Oil & Gas

Automotive Communication Security/Encryption Power/Energy Rail/Transportation

30% 18% 14% 9% 7%

5% 5% 3% 3% 2%

Sales %

www.amphenol-invotec.com 3

Services

Research and Technological Development

We work in partnership and share knowledge with customers at the earliest opportunity.We add value through our expertise, experience, flair and ingenuity, enabling customers to convert their visions into viable products.

Design for Manufacture

Our DFM team proactively assesses customer designs to ensure optimum performance and value.Through this methodology, we deliver robust design solutions leading to enhanced quality and an accelerated time to market

New Product Introduction

Our strength is rooted in flexibility.While we have the manufacturing capabilities and scale to ensure the rapid delivery of high volume orders, we also work as a development partner with many customers.We produce prototypes and pilot batches, which are proven for manufacturability prior to batch launch.

Quick Turnaround (QTA)

We offer a broad range of technologies on accelerated lead-times:- IMS – 24 hrs- PTH – 2 days- Multi-Layer (Including HDI) – 3 days- Sequential lamination – 5 days- Flex-Rigid – 5 days

Knowing Our Customers

Local Account Managers backed by our Customer Service team work with you to provide a customised service program.

The Value of Knowledge

Our technical resource on site and in field applications provides you with answers you want when and wherever you need them.

Relationship Management

Successful commercial relationships are built on being open, honest and fair.

16% Flex & Flex Rigid

31% HDI

38% Rigid M/L

49% Sequential Lamination

15% Thermal Management

10% RF

Sales Mix

TechnologyProduct Profi le

For advice on any of these topics please contact us and we will be happy to provide you with the necessary support to all your questions.

5

Capability

Inner layer

Outer layer

Laser via pads

Mechanical via pads

Aspect ratio

Solder resistSolder mask clearance

Copper thickness

Min Dielectric thickness

HDI

Max panel sizeStandard

Max panel thickness

Max layer count

Min mechanical holeBuried pair mechanicalMin diameter laser viaBuried pair laser

Mechanical depth control

Control impedance

Tracks

External PadsInternal Pads

External PadsInternal Pads

MinMax

MinMax

MinMax

MinMinMinMin

+/-

%

Current

50 micron - 2 mils50 micron - 2 mils


0.250 mm - 10 mils300 micron - 12 mils


10:1

40 micron

12 micron210 micron

25 micron

1+N+15+N+5

24x2124x18

5.00mm

40

0.250 mm - 10 mils0.150 mm - 6 mils0.10 mm - 4 mils0.070 mm - 2.8 mils

+/- 25 microns

+/- 10%

Advanced

38 microns - 1.5 mils 38 microns - 1.5 mils

63 micron - 2.2 mils63 micron - 2.2 mils



11:1

38 micron

9 Micron 210 micron

25 micron

1+N+16+N+6

24x2124x18

5.3mm

50

0.200 mm - 8 mils0.150 mm - 6 mils0.075 mm - 3 mils<0.070 mm - 2.8 mils

+/- 15 microns

+/- 7%

Road Map

25 microns - 0.8 mils 25 microns - 0.8 mils




12:1

20 micron

5 Micron >210 micron

<25 micron

1+N+1>6+N+6

>24x21>24x18

>5.3mm

>50

0.150 - 6 mils0.150 mm - 6 mils0.050 mm - 2 mils<0.070 mm - 2.8 mils

+/- 10 microns

+/- 7%


Products

New applications are often developed in partnership with customers to deliver optimum performance under extreme conditions.

Unrivalled technical capabilities coupled with innovation and close customer/supplier relationships ensure a comprehensive and competitive service-backed offering.

Products

Single & double sided Rigid

Single & Double sided flex

Rigid Multi layer

Multi layer Flexible

Multi layer Flexi-rigid

Mixed composite multilayer

Mixed composite Flex rigid multilayer

IMS (Insulated metal substrates)

Bonded External heat sinks

Product Technology

Blind via

Micro via

Buried via

Copper filled vias

Stacked micro via

Stepped micro via

Controlled Impedance

Embedded Resistors

Embedded devices

CTE- CIC / Carbon / Aramid / Molybdenum

Resin filled through vias

Resin filled buried vias

Resin filled blind vias

Plugged vias

Thermal Management: up to 400 Microns of CU

External heat sinks: Copper / Aluminium

Heat exchangers

Metal backed substrates

Products

Single & double sided Rigid

Single & Double sided flex

Rigid Multi layer

Multi layer Flexible

Multi layer Flexi-rigid

Mixed composite multilayer

Mixed composite Flex rigid multilayer

IMS (Insulated metal substrates)

Bonded External heat sinks

Product Technology

Blind via

Micro via

Buried via

Copper filled vias

Stacked micro via

Stepped micro via

Controlled Impedance

Embedded Resistors

Embedded devices

CTE- CIC / Carbon / Aramid / Molybdenum

Resin filled through vias

Resin filled buried vias

Resin filled blind vias

Plugged vias

Thermal Management: up to 400 Microns of CU

External heat sinks: Copper / Aluminium

Heat exchangers

Metal backed substrates

7

We continue to set ourselves ever more demanding targets for excellence as we pursue an overall company objective of zero defects.

This commitment is fully embedded throughout the company; it is our passion to continually satisfy stringent customer requirements and satisfaction.

In this pursuit we also need to meet the expectations of all relevant industry and regulatory standards. Our quality management system adapts to meet all such changes; regulatory and contractual requirements are assessed, audited and incorporated on an ongoing basis.

Quality

• AS9100 Rev C

• ISO 9001

• NADCAP (Electronics) flex-rigid multi-layers and microvia technologies

• ESA approved according to ECSS-Q-ST-70-10C in accordance with: PID SM18T iss. 02 - sequential rigid polyimide PID SM19T iss. 02 - sequential rigid-flex polyimide

• SC21 Silver Award

• IECQ / CECC (BS EN / 123000, 100, 200, 300, 400, 500, 600, 700, 800)

• Underwriters Laboratories (UL 796 / UL94 / Group UL file number E72693(M)

Group Approvals


Tamworth

Hedging Lane, Dosthill, Tamworth,Staffordshire, England, B77 5HH

T +44 (0) 1827 263000F +44 (0) 1827 263250

Sales Enquiries:[email protected]

General Enquiries:[email protected]

RFQ:[email protected]

Telford

Halesfield 4, Telford, Shropshire, England,TF7 4AP

T +44 (0) 1827 263000F +44 (0) 1827 263250

Sales Enquiries:[email protected]

General Enquiries:[email protected]

RFQ:[email protected]

UK Sales

Matthew Bowman - Sales Director

M +44 (0)7774 788279E [email protected]

Jeremy BrookM +44 (0)7710 145672E [email protected]

Terry DowlingM +44 (0)7909 535247E [email protected]

Mark SykesM +44 (0) 7534 909762E [email protected]

Technical Support

Howard SwarbrickM +44 (0)7810 317589E [email protected]

Ram PallM +44 (0)7770 698201E [email protected]

European Sales

Monique Berckvens - Benelux - European Sales Support

M +32 496 28 82 41E monique.berckvens@@amphenol-invotec.com

Thomas Witt - Germany

T +49 7452 8 444 192M +49 160 94 90 95 08F +49 7452 8 444 193E [email protected]

Monika Braun - Germany

T +49 7452 8 444 192F +49 7452 8 444 193E [email protected]

Frédéric Dupont - France

T +33 6 07 08 60 68F +33 1 69 94 05 17M +33 6 0708 60 68E frédé[email protected]

Fabio Visaggio - Italy

T +39 02 93254 208F +39 02 93254 444M +39 34 08213 852E [email protected]

Giuliano Iguera - Italy

T +39 02 93254 209F +39 02 93254 444 M +39 34 99045 682E [email protected]

Nordic Region - Elmatica

NorwayTorger EdlandCountry Manager - Norway

M +47 91 84 73 00E [email protected]

DenmarkTorben HajslundCountry Manager

M +4532161826E [email protected]

FinlandMika KupiainenCountry Manager

M +358-44-3204588E [email protected]

SwedenJan PerssonCountry Manager

M +46 705819616E [email protected]

Keyhani Bendix, Esmail - Spain

T +34 91 6407 302F +34 91 6407 307M +34 62 9054 629E [email protected]

mailto:[email protected]






















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Amphenol THE PCB MANUFACTURER DELIVERING TOMORROW…