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Brian Moore Scanimetrics, Inc. June 5, 2007 June 5, 2007 San Diego, CA USA San Diego, CA USA Advanced Probecard Architecture for Advanced Probecard Architecture for Lower Lower - - cost RF Wafer Testing cost RF Wafer Testing

Advanced Probecard Architecture for Lower-cost RF … · Advanced Probecard Architecture for Lower-cost RF Wafer Testing. ... Active RF Probe IC LF RF Tester Interface: Power

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Brian MooreScanimetrics, Inc.

June 5, 2007June 5, 2007San Diego, CA USASan Diego, CA USA

Advanced Probecard Architecture for Advanced Probecard Architecture for LowerLower--cost RF Wafer Testingcost RF Wafer Testing

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 222

OverviewOverview• Existing Issues Time/Cost/Thru-put• The RF Testing Challenge • The Multi-site Challenge• Cantilever Solution• Test and Simulation Results• Architecture/Test Changes• Summary

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 333

The RF testing wall The RF testing wall Time/Cost/Complexity ChallengeTime/Cost/Complexity Challenge

Test:

- 1 RF Channel

- x1 parallelism

- 1 function/format (Tx, Rx, GSM, CDMA, etc.)

Test:

- 5 RF Channels

- x8 parallelism

- GSM and CDMA and BlueTooth etc.

Multiband, Multi-protocol

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 444

Signal Integrity ChallengeSignal Integrity Challenge• RF is tough to do in the best of circumstances.

– Load Board, Probe Card, Wiring, Needles all mask true nature of high speed and RF signals.

• Specific signal integrity issues involve: – Slew and delays due to low pass nature of long

convolved signal paths. A 2GHz signal turns into a 200 MHz signal

– Differential timing due to different signal path lengths. A signal edge arrives too early or late compared to its companion signals.

• Impairments See K. Helmreich ……..… SWTW 2001

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 555

The GoalThe GoalLower cost RF device TestLower cost RF device Test

• Provide a method to efficiently measure RF devices on the wafer level– High parallelism possible– No RF resources required from tester– Allow fast verification of basic RF signals

• No modifications to the circuit are required

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 666

MultiMulti--site Cost Advantagesite Cost Advantage

Test Cost per device as much as x10 less

Wafer Test Cost per deviceTest Times x1.5

$0.0000

$0.0100

$0.0200

$0.0300

$0.0400

$0.0500

1 2 4 8 16 32 64 128

Paralellism

$

"Active Probe""Traditional

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 777

The RF MultiThe RF Multi--site Challengesite Challenge• ATE

– Limited RF ports – generally 2 to 8 – Cost of RF ports - $100K to $500K

• Probecard – Probes– Controlled impedance traces, SMA connectors– Cross-talk, interference

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 888

The MultiThe Multi--site Solutionsite Solution• Keep all the RF signals close to the DUT

– Bring the RF measure / source resources to the probecard

“Active RF”Probes ICs

Power, Digital,LF, Power To/ From

ATE

Power, Digital,LF, Power To/ From

ATE

Use Big IRON and multiple “Little

IRONs” to break down problem

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 999

Signal IntegritySignal Integrity• If RF signals don’t leave the probecard most of

the issues “Go Away”– Load Board, Probe Card Traces, Pogo Tower signals

are now Low Frequency.

• Probe Pins are all that is left in the RF path.

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 101010

So what about the Needles?So what about the Needles?• Model Needles with Sonnet (3D planar EM) solver • Interested in bandwidth and effect of guard (GND)

needles used to emulate (coplanar) RF probes.• Why try? Standard RF probecards are too expensive,

complex and have too much plumbing. – If Standard needle (or Cobra) can work (even badly) then Active

RF probe can overcome initial loss.• Using standard Cantilever or Cobra enables multi-site

testing.

• See other modeling work by – R. Rincon ..(TI/Ansoft)………….… SWTW 1998.– R. Robertazzi..micro-coax(IBM)………SWTW 2002.

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 111111

Cantilever NeedleCantilever Needle3D planar EM simulation3D planar EM simulation

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 121212

Cantilever Double NeedleCantilever Double Needle

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 131313

Cantilever Double Needle, Matched ImpedanceCantilever Double Needle, Matched Impedance<0.25dB at 5 GHz !<0.25dB at 5 GHz !

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 141414

Active RF Probe ICActive RF Probe IC

RFLF

Tester Interface:Power

LF/IF

Logic

DUT Interface:Power

RF

Logic

Tester Probecard

LF < 100MHz HF/RF > 500MHz-3GHz+

Probe PinsLoadboard

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 151515

Example Example -- Simple RF Source ICSimple RF Source IC

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 161616

What about Complex Signals ?What about Complex Signals ?• Yes e.g. QAM 256 via Baseband AWG on Tester

Complex RFUpconversionIC

Tester AWG

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 171717

Five Five -- 1.5GHz Tx sources1.5GHz Tx sourceson one Dieon one Die

• Wide range source IC covers 0.5-1.8GHz (180nm CMOS)– Use AWG tester channel for modulation on RF.

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 181818

Rx Testing of Simple Modulation At IQ Rx Testing of Simple Modulation At IQ (baseband) (baseband) -- added impairmentsadded impairments

Reasonably easily measured/calculated by a good Mixed Signal Tester at IF/LF

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 191919

Rx Testing Complex Modulation QAMRx Testing Complex Modulation QAM--256256At IQ (baseband) Complex data and receiver At IQ (baseband) Complex data and receiver

(non(non--lock)lock)

Very complex analysis required Is it really needed?Complex RF modulation is difficult to decode, lock and measure. Need really-really good tester resources, Software Processing, Speed, etc.

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 202020

Rx Testing Simple Modulation At IQ (baseband) Rx Testing Simple Modulation At IQ (baseband) added impairmentsadded impairments

Virtually the same answer with 1/64th the work

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 212121

The RF Testing Wall ConqueredThe RF Testing Wall Conquered

Big IRON Tester

Helps “Little IRON” RF active probes to Achieve:

- Parallel testing

- Complex signal Analysis

While maintaining parallel Power, Logic, housekeeping, etc.

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 222222

MultiMulti--site Cost Advantagesite Cost Advantage

ParallelismATE RF Ports

LF SourceLF Measure

ATE CostTest Time/Touchdown

Test Cost / Device

Traditional

x2400

$925K5 Sec.

2.3 cents

“Active RF Probes”

x16088

$800K5 Sec.

0.37 Cents

Case Study GSM Transceiver1 RF input, 1 RF Output500K devices / month

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 232323

ConclusionsConclusions• Bring RF processing resources close to RF

signals• Use standard (modified) cantilever/cobra probe

card to enable Multisite testing• Use Mixed signal tester (LF+logic) resources

appropriately• Simplify tests, if possible (e.g. CW or EVM vs.

IIP3 or ACLR) to achieve test coverage parity

June 3-6, 2007June 3June 3--6, 20076, 2007 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop 242424

Thank YouThank You• Acknowledgements

Chris Sellathamby, Ph.D.VP [email protected]

Jeff HintzkeDir. of [email protected]

Clayton HouseholderDir. of [email protected]

Brian MooreDir. of R&[email protected]