NEW 3D Laser Scanning MicroscopeVK-X100/X200 Series

A Microscope, SEM and

Roughness Gauge in a Single UnitPerform profile and roughness measurements with a click of a button

2

Providing Non-contact Profile and Roughness

Measurements on Nearly Any Material

NEW

3D Laser Scanning MicroscopeVK-X100/X200

3

OPTICAL MICROSCOPEIt is impossible to focus on a target with an uneven surface at high magnifi cation.

SEMObservation can only be performed in black and white, sample size is limited and pre-processing is time consuming.

ROUGHNESS GAUGEProjections and depressions cannot be measured without damaging the target area.

For overall observation and measurement of a target

High-speed and high-precision image stitching with WIDE-Scan eliminates field-of-view limitations at high magnification.

Wide-view

Ensure uniform measurements from user to user

Per form fully-automated measurements with a single-click of the mouse.

Measurement

All of these limitations are overcome with a laser scanning microscope

NEW Two New Functions

WIDE-Scan

AI-ScanFULLY-AUTOMATED MEASUREMENTS

with one push of a button

Enlarged (1000x)

4

Disadvantages

OPTICAL MICROSCOPE

SEM

ROUGHNESS GAUGE

Poor resolution, low contrast

Monochrome image only

Sample scratched due to contact with probe

Shallow depth-of-fi eld

Time-consuming preparation and observation

Diffi cult to measure target areas

No support for traceability

Restricted sample size

Resolution is limited by stylus tip diameter

1

1

1

2

2

2

3

3

3

Disc pits (6000x)

Ink toner (1000x)

Blade edge (1000x)

PREPARATIONSample processingDeposition To stage

Approx. 20 min

OBSERVATIONStart-up VacuumingObservation

Approx. 25 minObservation may not be possible due to the size of the sample because it cannot fi t in the sample chamber.

Hitting the desired area of a target with a stylus can be problematic for targets like screw thread crests.

It is not possible to measure surfaces that are smaller than the tip of the roughness gauge’s stylus.

Contact-type surfaceroughness gauge

R: 2 μm

Aluminium surface (200x)

Horizontal indenta-tions on screen.

COMMON PROBLEMS WITH CONVENTIONAL EQUIPMENT

5

Problems Solved with a Laser Microscope

Disc pits (6000x)

High resolution, 24000x magnifi cation

High-defi nition colour image

Non-contact design can be used on soft targets

1

1

1

Blade edge (1000x)

Fully-focused image

No sample preparation

Easily locate area of interest

2

2

2

Traceability compatible

Measure samples of any size and nearly any material

Small beam-spot laser

3

3

3

Ink toner (1000×)

Detachable head unit allows for a variety of sample sizes to be measured, can be integrated with other devices and supports remote operation.

HIGH-RESOLUTION, LARGE DEPTH-OF-FIELD OBSERVATION

RAPID 3D COLOUR IMAGING

NON-DESTRUCTIVE PROFILE AND ROUGHNESS MEASUREMENTS

Z X-Y

Independent administrative agency/National Institute of Advanced Industrial

Science and Technology (AIST)

National Institute of standards and Technology

(NIST)

JCSS Accredited Laboratories

Height difference gauge Coordinate measurementinstrument

Calibration block Calibration chart

3D Laser Scanning Microscope (VK Series)

Measurement results obtained using the VK Series are highly reliable and comply with national traceability standards.

PREPARATIONPlace your sample directly on the stage

0 min

OBSERVATIONStart-up Observation

Approx. 3 min

LED pad (1000x)

2D image 3D image

Laser microscope

R: 0.4 μm

Laser beam diameter is signifi cantly smaller than a roughness gauge stylus, enabling more accurate measurement of irregular shapes.

Easily achieves full-focus observation

High resolution, high magnifi cation observation

Optical observation

Full-focus image

High-resolution laser monochrome image

The Next Step in the Evolution of Optical Observation

High-speed auto focusInstantly obtain a focused image of a sample with a single click, even at

high magnifi cation. Additional focus adjustments are unnecessary.

IC pattern (1000x) Blade edge (1000x)

NEW Digital microscope observationCapture high-resolution images with true colour

Built-in camera with 3CCD imaging mode

21.6 megapixel imageWhat is the pixel shift method?Records a total of 9 images by shifting the CCD both vertically and horizontally by 1/3 of a pixel. Furthermore, it obtains RGB data for each pixel, thus allowing for clear observation with superior colour reproduction.

Full-focus observation

Capture fully-focused images, even on three-

dimensional objects or at high magnifi cation.

Super high-resolution observation

6

VK-X100/X200 Fea tu res .01

OBSERVATIONObservation of unparalleled clarity

Colour SEM-like observation

3D observation

Industry’s Best 16-bit laser colour image

Sandpaper (400x)

By scanning the entire surface with a

short-wavelength laser, full-focus

observation is achieved from 200x to

24000x* at resolutions that can not be

attained with an optical microscope.

* When using the VK-X200 Series

Disc pits (6000x)Optical image

Monochrome laser image

Laser image

16-bit laser colour image Ink toner (1000x)

Industry’s Best 16-bit laser colour imageAchieve fully-focused observation with unparalleled resolution

SEM-like resolution with real colour

By scanning a laser in XYZ directions

over a target, users can capture fully-

focused colour images with accurate

height information associated with each

pixel.

7

* If settings are performed without this adjustment, refl ections on angled surfaces and dark surfaces will be weaker and cause errors.

Now Anyone can Perform High-Quality Measurements

Developed with years

of experience and

technical knowledge.

Easy Mode and

AI-Scan allow anyone

to perform expert

measurements.

World’s First The 3 functions of AI-Scan

1. AAG functionAutomatically selects the two best settings for the laser light-receiving element to allow for accurate measurements to be made on angled surfaces and targets with varying levels of contrast.

* AAG=Advanced Auto Gain

Start measurement with a single click

Conventional method AAG function

Diamond tool (400x)

(1) Sensitivity adjustmentChanges the sensitivity of the light-receiving element to prevent saturation when scanning a sample.

(2) Sensitivity readjustment*Automatically adjusts to raise the sensitivity to a level just below the level that will produce saturation.

8

VK-X100/X200 Fea tu res .02

RECORDINGIntuitive and easy-to-use interface

Glare

Exists

Absent Conventional systems only adjust the laser sensitivity at a certain height, making it impossible to account for changes in the surface of the target throughout the entire measurement range.

Field of View Field of View

Me

asu

rem

en

t ra

ng

e

AAG FUNCTION

AAG ORIGINAL

CONVENTIONAL ALGORITHM

1-1. Automatic adjustment of the laser sensitivity 1-2. Optimal adjustment at each height

FULLY-AUTOMATED MEASUREMENTS

with one push of a button

2. Auto setting of the upper and lower limitsAutomatically recognises and sets the upper and lower limits of the measurement range, and then collects measurement data by scanning the target throughout that range.

The upper and lower limits on the screen are recognised and automatically set as the measurement range

The lens scans automatically

When using single scan After double scan

3. Double scan function Adjusts the measurement and capture settings and automatically re-scans the target to obtain information that wasn’t detected during the fi rst scan.

9

By simply clicking the “Start measurement” button, the AI-Scan function will automatically scan an object using the optimal settings.

Solder (200×)

Upper limit

Lower limit

Robust measurement software provides flexibility for analysis

Surface area measurement of a solar battery (1000x)

Optical film (1000x)Height, width, angle and cross-section measurement (1000×)

Radius-of-curvature of a micro lens (1000x)

LED pad unit - 3D comparison (1000x) Differential measurement of sample A and B

Sample A

Sample A Sample B

Sample B

Perform profi le, height, area and volume measurements

3D image and profi le comparisonProfi le and 3D measurement

3D comparison viewAligns two three-dimensional images to allow for comparative

evaluation.

Profi le and 3D measurement

Height, width, angleand cross-section measurement

The VK-Analyser software can measure the height, width,

cross-section, angle or radius-of-curvature of any user-

specifi ed line or curved cross-section profi le.

Surface area and volume measurementMeasures volume, surface area and surface area to area ratio

of objects in any specifi ed location on the screen.

Compare profi les on two different images

Comparative measurementOverlay and compare profi le measurements on two different

targets. Differences in height are automatically displayed in

the profi le graph.

10

VK-X100/X200 Fea tu res .03

MEASUREMENTMeasure any surface shape

Film - surface roughness comparison (3000x)

Resist pattern (6000x) Optical fi lm (1000x) Colour fi lter (1000x)

Electronic device pattern (1000x)

Sample A: Ra 1.5 μm Sample B: Ra 3.2 μm

Evaluate and characterise surface topography

Automatically record and measure multiple samples at once

Quantify line and surface roughness

Line roughness measurementCalculate roughness on a 2D or 3D image for a given line.

Surface roughness measurementQuantitatively determine differences in surface conditions by

measuring the surface roughness of a target.

Automatically measures targets that have a repeating pattern

Automatic width and height measurementAutomatically measures the width and height of targets that

have a repeating pattern. Since measurement is automatic, no

user errors are generated, allowing for rapid, accurate

measurement.

Performs consecutive measurements of multiple areas

Automatic measurement of multiple areas on multiple samples

Using the motorised stage (optional), multiple areas of a single

sample or specifi c areas of multiple samples are automatically

measured.

2. Surface-roughness of blue filter1. Surface-roughness of red filter

11

Achieves the measurement of shapes that are at or below a micron. Enables a range of observation, from optical microscope to SEM observation, in a single unit.

Light receiving element

Laser Scanning Microscope History

16-bit

5 nm0.005 μm

10 nm0.01 μm

14-bit

8-bit

PHO

TOM

ULT

IPLI

ERPH

OTO

DIO

DE

CCD

Improved operability

VK-8500 Series

VK-7500 Series

Enables the measurement of surface shapes from lines to planes

Performs area scanning with a red semiconductor laser and achieves 3D shape analysis as well as colour confocal images.

VK-9500 Series

A short wavelength violet laser that achieves high measurement precision with a 14-bit light receiving element

Equipped with a violet laser as well as a 14 bit photomultiplier to achieve high measurement precision with 18000x observation.

VK-8700 Series

A red semiconductor laser that greatly improves versatility with a variety of observation and measurement options.

VK-X100 SeriesNEW

The fusion of a laser displacement metre and a microscope

Achieves both microscope observation and profi le measurement by using a laser to perform line scanning.

From lines to planes

12

One-click AI-Scan

Flow chart format

Evolution to an easy-to-use, high-precision instrumentThe shift from a laser microscope to a laser scanning microscope

FULLY-AUTOMATED MEASUREMENTS

with one push of a button

Greatly improved accuracy

TYPE VF-7500 VK-8500 VK-9500 VK-8700 VK-9700 VK-X100 VK-X200

Obse

rvat

ion

func

tion Light-receiving

element Line CCD, 8-bit Photodiode, 8-bit Photomultiplier, 14-bit Photomultiplier, 14-bit Photomultiplier, 16-bit

Magnifi cation 250x to 2500x 200x to 8000x 200x to 18000x 200x to 12000x 200x to 18000x 100x to 16000x 200x to 24000xOptical zoom None 1x, 2x, 4x 1x to 6x 1x to 6x 1x to 8xLaser scanning method Line (488 pixels × 1 pixel) Area (1024 × 768 pixels) Area (1024 × 768 pixels) Area (2048 × 1536 pixels) Area (2048 × 1536 pixels)

HDR function None None None OTC function (14-bit) HDR function (16-bit)

Reco

rdin

g fu

nctio

n

Linear scale module resolution None 10 nm

(0.01 μm)10 nm

(0.01 μm)10 nm

(0.01 μm)1 nm

(0.001 μm)5 nm

(0.005 μm)0.5 nm

(0.0005 μm)Measurement method setting Manual Manual Manual Manual or Beginner Mode

(AAG function)Manual settings/

Built-in Easy modeDetection algorithm Peak algorithm Peak algorithm Peak algorithm Peak algorithm, RPD algorithm Peak algorithm, RPD algorithmAI-Scan function None None None None YesImage stitching function None None Yes (AIA system) Yes (FAST algorithm) Yes (Built-in WIDE algorithm)

Navigation function None None None None Yes

Mea

sure

men

t fun

ctio

n Traceability compatible None Yes Yes Yes Yes

Repeatability (σ) 0.03 μm 0.03 μm 0.02 μm 0.03 μm 0.014 μm 0.02 μm 0.012 μmTop surface fi lm thickness of a transparent object

None None None Yes Yes

Film thickness measurement

Yes (line fi lm thickness measurement)

Yes (line fi lm thickness measurement)

Yes (line fi lm thickness measurement)

Yes (line and area fi lm thickness measurement)

Yes (line and area fi lm thickness measurement

The world’s most advanced laser scanning microscope with 24000x magnifi cation and 0.5 nm resolution.

Resolution of the linear scale module

1 nm0.001 μm

0.5 nm0.0005 μm

A built-in 16-bit light receiving element, along with AI-Scan mode, enables simple, high-accuracy measurements with high-resolution image capture.

VK-9700 Series

VK-X200 SeriesNEW

Further increases the versatility of observation and measurement functions and can be operated by non-experienced users.

Extremely versatile with 1 nm resolution and the ability to observe transparent objects.

Themic0.5 

NE

er increases the versatility of observat

By improving the light-receiving element,

response capabilities have improved dramatically.

13

Linear scale module

[Conventional]0.01μm

[VK-X200]0.0005μmAchieves an ultra high precision that is 20x greater than conventional models.

Resolution

Conventional

16-bit & AAG

New features of laser scanning microscopes Part.1

Higher Precision

* If settings are performed without this adjustment, refl ections on angled surfaces and dark surfaces will be weaker and cause errors.

(1) Sensitivity adjustmentChanges the sensitivity of the light-receiving element to prevent saturation when scanning a sample.

(2) Sensitivity readjustment*Automatically adjusts to raise the sensitivity to a level just below the level that will produce saturation.

Glare

Exists

Absent

AAG ORIGINAL

Diamond tool (400x)

14

VK-X100/200

Conventional

12-bit (4096 levels)

* Dynamic Range Comparison

256x more than a CCD

16x more than

conventional models

16-bit (65536 levels)

8-bit (256 levels)

CCD

16 times the dynamic range of conventional laser scanning microscopesIndustry’s Best 16-bit photomultiplier

When it comes to obtaining accurate data, the element responsible for detecting the refl ected laser light is the most important component

of a laser scanning microscope. Boasting the world’s greatest dynamic range, the 16-bit photomultiplier of the VK-X Series is able to

accurately detect both faint and strong refl ected light, even on highly-angular surfaces.

Achieves even higher precisionIndustry’s Best 0.5 nm linear scale module

Automatically adjust the sensitivity of the 16-bit photomultiplier to its optimal settings

World’s First AAG function*

This function automatically adjusts the sensitivity of the laser receiving element

throughout the entire measurement range to account for variations in material, shape

and refl ectance.

Detect position

information in the z-axis

with an ultra high-

precision 0.5 nm linear

scale module that is 20x more accurate than conventional

systems. This newly developed linear scale module can

achieve high-resolution measurement and boasts a

reliability that can be traced back to national standards.

* AAG = Advanced Auto Gain

Higher Speeds

❚ Z-I curve after measurement

The RPD algorithm enables high-precision measurement results while reducing the time it takes to scan a target.

Intensity of received reflected light (Intensity)

Can detect the real peak.

Cannot detect the real peak.

Detected peak

Detected peak

Conventional method

RPD method

Positio

n in Z

-axis

direction

(Z p

ositio

n)

15

0 05 510 Measurement speed (sec)

2x faster than conventional models

8x faster than conventional models

Conventional

[Measurement mode: High-precision] [Measurement mode: Ultra high-speed]

Conventional

VK-X VK-X

Measurement speed (sec)

Perform high-precision measurements in a shorter amount of time

RPD* algorithmThe VK-X’s original algorithm detects the true peak position using the Z-I curve after measurement. It enables high resolution with a

signifi cant reduction in measurement time.

* RPD=Real Peak Detection

Achieves measurement speeds that are at least 2x faster than conventional systems

NEW Equipped with an ultra high-speed scan mode with a top-speed of 120 Hz

Measurement speeds have been improved to 2x that of conventional systems while also improving the measurement accuracy. For

applications that require even higher speeds, a newly developed 120 Hz ultra high-speed scan mode can be equipped.

* Reference data from measuring a 10 μm step with a 50x objective lens

Conventional method

RPD method

0.053 μm standard step sample measurement result (Comparison with conventional method)

A narrow fi eld-of-view prevents a user from understanding the target as a whole and restricts the measurement range.

New features of laser scanning microscopes Part.2

High-speed,

high-precision

Solution

16

Resolve narrow fi eld-of-view issues with image stitching

Issue.1

Europe on a 5 cent coin of the Euro (100x)

Conventional measurement method

High-magnification makes it difficult to understand what and where you are looking at.

Use WIDE-Scan mode to easily understand the overall structure of a target.A high magnifi cation image allows users to perform measurements with high-precision. However, as the magnifi cation

is increased, the fi eld-of-view reduces, making it diffi cult to understand where you are looking or what you are looking

at. WIDE-Scan allows users to quickly and easily generate a wider fi eld-of-view image by stitching together multiple

images.

WIDE-Scan

Measuring only a single area often leads to incorrect data when applied to the entire target.

High-speed,

high-precision

Solution

17

Issue.2

Conventional measurement method

Each location being measured exhibits variations in the result.

20.5 μm height

18.5 μm height

22.5 μm height

Average height 20.5 μm

Multiple areas can be measured and averaged with WIDE-Scan.If only measuring a limited number of areas, the numerical values may vary depending on the locations being

measured. WIDE-Scan obtains a wide-fi eld, high-resolution 3D image and allows users to average data collected

from a much larger sample area.

WIDE-Scan

Measurement, processing and stitching

speed are dramatically improved with

AI-Scan and WIDE algorithm.

New features of laser scanning microscopes Part.2

High-speed,

high-precision

Solution

18

Conventional image stitching

PCB (200x)

10 60 Measurement speed (min)

By combining AI-Scan and WIDE-Scan, images can be

seamlessly stitched together at speeds over 6x faster than

conventional systems.

High-precision stitching with the WIDE algorithm

Quickly stitches together images without the

appearance of seams or incorrect measurement

information. Automatically corrects all XYZ data by

evaluating the light intensity and height data of

overlapping areas.

6x the measurement speed of conventional models

Measurement, processing and stitching speed are

dramatically improved with AI-Scan and WIDE -Scan

algorithms.

* Reference data from measuring an approx. 4 mm square

Conventional

VK-X

WIDE-Scan NEW

Image stitching applicationVK-H1XJE

Optional

VK-X100/X200 image stitching

Easily perform high-speed image stitching and wide-fi eld measurements with WIDE-Scan

6x faster than conventional models

Image assembly - manual operationIt’s possible to stitch together several images without the need of a motorised stage.

Just drag and drop multiple images into the software, and the VK-X will automatically

complete the merge.

19

Easy stitching Free measurement

If an arbitrary range is set, the motorised stage will be

used to automatically perform continuous

measurement and stitching within that range.

Even for stitched images, it’s possible to perform any

measurement by clicking on the image.

Step.1 Step.2

Built-in navigation systemUse the wide-fi eld image that was stitched

together as a reference when navigating

around a target at higher magnifi cation.

20

A new function captures subtle features that were previously impossible to image

Light guide plate(1000x)

Conventional 8-bit gradationHDR

16-bit

Normal image

Laser, full-focus image Rear face of a wafer(1000x)

C-laser DIC 2D image C-laser DIC 3D image

Printing (400x)

❙ The range of obtainable brightness is narrow, resulting in the glaring of areas beyond the range.

❙ Subtle contrast cannot be rendered because of coarse resolutions.

❙ The range of obtainable brightness is wide, diminishing the perceived glare.

❙ Subtle contrast can be rendered because of detailed gradation.

Difficulties Solutions

Gradations obtained by capturing a single image

Gradations obtained by capturing multiple images

Conventional 256x levels

Conventional method HDR function(256 levels of grey) (65536 levels)8-bit 16-bit

New features of laser scanning microscopes Part.3

NEW 16-bit gradation dramatically enhances image contrast and eliminates glare

High Dynamic Range (HDR) FunctionThis function optimises the appearance (texture and contrast) of targets with unclear or low-contrast surfaces.

It enables higher contrast, and an unprecedentedly clear observation that fully captures the details of the target

object.

Differential observation and profi le measurement without the need to remove and insert prisms or fi lters

C-laser DIC display function [Function for observing minute surface features]This function combines the laser image and height information. This enables effective observation of target objects previously diffi cult to

observe when using contrast information, such as mirrored samples and samples with little variation in surface texture. It lets you observe

nano-level indentations and projections, which were diffi cult to observe with conventional laser microscopes.

WORLD’S FIRST

After HDR processing

Low-contrast gradations are shown in detail

21

Capture data from the top, bottom and intermediate layers of a transparent object

Area Film Thickness Measurement functionAnalyse multiple layers at all points in the

observation fi eld. You can display 3D

images and cross-section profi les of a

selected single layer or multiple layers, and

measure shapes or fi lm thicknesses of

user-specifi ed locations.

Capture the top surface of a transparent object

Transparent Top Surface Observation functionTransparent Top mode acquires information on the outermost surface of a transparent object, while being

unaffected by light that refl ects from other layers within the target.

Conventional model VK-X100/X200

In the case of transparent targets, transmitted light goes through the peak (focal point) on the front face and detects the peak (focal point) on the rear face. The difference in both peak positions can be measured (fi lm thickness).

Received reflected light intensity [Intensity]

Rear face

Transparent film surface

Substrate surface

Transparent film thickness

Transparent film surface

Substrate surface

Front face

Laser lightFront surface film

Rear surface film

Position in the Z axis [Z position]

Film thickness

Ink jet nozzle (1000x)

Resist (1000x)

22

Half mirrorColour CCD camera

Half mirror

Half mirror

Objective lens

Observed target object

X-Y scanning optical system

White light source for illumination

Light receiving element (photomultiplier)

Pinhole

Condensing lens

Short wavelength laser light source

Three types of images built from laser scan

Colour + Laser imageFully-focused colour image that SEMs and optical microscopes cannot provide.

Laser intensity imageGrey-scale, high contrast image similar to what SEMs provide. Shows changes in refl ected laser intensity.

Height-Colour MapDifferent heights are marked by changes in colour.

Colour + laser intensity information Laser intensity information Height information

The laser scanning microscope employs two light sources: a laser source and a white light source. These two types of light sources enable the acquisition of laser intensity, colour, and height that are required to construct fully-focused colour images, fully-focused laser images and height information.

[Detects refl ected-light intensity and height with a short-wavelength laser]The light that is emitted from the laser light source of the laser scanning microscope is focused on the target via the XY scanning optical system and the objective lens. The focused beam spot then performs a surface scan of the target within the observation fi eld through the XY scanning optical system. The target within the observation fi eld is split into 1024 x 768 pixels, scanned, and then refl ected light for each pixel is detected with the light receiving element. The objective lens is then driven in the Z-direction and surface scanning is repeated. This acquires the refl ected-light intensity of every z-axis position for each pixel. After this, the height information and refl ected-light intensity is detected, with the z-axis position of the highest refl ected-light intensity as the focal point. This makes it possible to acquire full-focus light intensity images and height images (information) in which the entire target is in focus.

[CCD camera obtains colour information] The data collected from the laser is then coupled with the refl ected light from the white light source to produce an image with height and colour information. This gives a user an image that rivals the resolution of an SEM, yet also provides real colour observation.

Uses two light sources to acquire information

Diagram of the measurement principle

Move the objective lens in the Z-axis direction and scan with the laser again.

Scan with the laser in the X and Y direc-tions.

1

2

3

4

Short wavelength laser light

Me

asu

rem

en

t ra

ng

e

1024 X 768 pixels

Repeat for the entire measurement range.

Measurement complete.

Principle structure

23

Disadvantages of Interferometers

1. Unable to detect steep anglesWhen using interferometers to measure objects with steep angles, due

to the concentration of interference patters in those areas, accurate

information is unable to be gathered.

3. Slope correction is requiredBefore measurement, slope correction of the sample with a goniometer

stage is required. Because interference patterns become crowded when

the sample is at an angle, proper measurement cannot be performed.

VK-X100/X200

Because interference patterns are not used, direct

measurement is possible even if the sample is at an angle.

Slope correction can also be applied after image capture.

2. The targets that can be viewed are limitedWith light interference, if the surface does not refl ect well, measurement

is difficult to perform, so support for a variety of targets is not provided.

Measurement also cannot be performed if there is an extreme difference

between the refl ected light from the reference surface and the refl ected

light from the measurement surface (Works well with mirrored-surfaces,

but is difficult to measure samples with extreme projections and

depressions and samples without much of a refl ective surface).

4. The lateral resolution is the same as an optical microscopeSince interferometers operate on white light, the lateral resolution of these

systems will be the same as a conventional optical microscope -

approximately 0.43 μm.

VK-X100/X200

The confocal range fi nding system, which uses laser

refl ection intensity for detection, can measure shapes that

have high angular characteristics with low noise.

VK-X100/X200

Because it uses a photomultiplier element (PMT) with a wide

sensitivity range, targets that include areas of both high and

low refl ectivity can be accurately measured.

VK-X100/X200Using short-wave lasers and pinhole optics, a lateral

resolution of 0.13 μm can be obtained.

1 Device 4 Benefits

Difference between a pinhole confocal system and conventional systems

Peak detection (focal point) comparison between a pinhole confocal system and conventional system.

Z-I curve of conventional optical system

Light intensity peaks at focal points are spread out in conventional optical systems

Received reflected light intensity [Intensity]

Ambient light from points other than the peak focal point

Z-I curve of the pinhole confocal optical system

Conventional system

Target

Laser light

Lens Lens

MirrorMirror

Lens CCD PMTLens

Target

Laser light

VK-X100/X200 system

Pinhole

Conventional optical systems receive refl ected light from areas

outside of the peak focal point. With a confocal system, only

light from the focal point is collected, producing a sharper

image.

Optical film (1000x)

Image from a conventionaloptical microscopeDefocused light and flare cannot be removed.

Confocal image the VK-X100/X200Only displays the area that’s in focus, while eliminating defocused information.

Po

sitio

n in

th

e Z

axis

[Z p

ositio

n]

Focalposition

High accuracy measurement with the pinhole confocal optical systemConventional pseudo-confocal optical systems that use a CCD

as the light receiving element are limited in their ability to

provide either high-accuracy measurements or high-defi nition

images. Since these systems do not employ a pinhole

mechanism, unfocused light is able to be collected by the

CCD. However, with a pinhole confocal system, light is only

received when it is at its focal point, creating very sharp

images with high-resolution measurement data.

Tilted Automatically corrected

Metal surface (1000x)

Bump (2000x)

Wire bonding (1000x)

Microlens (1000x)

Analyses the difference between two images as a solid 3D image. Enables surface-based image analysis that can capture minute changes.

SOFTWARE OPTIONS

2D & 3D Measurement Tools

PROJECTION MEASUREMENT

Divide areas above (projections) or

below (indentations) a specifi ed height

threshold value into separate zones,

and take measurements for each area.

Indentation/projection measurement

HEIGHT DIFFERENCE ANALYSIS FUNCTION

This software module complies with

ISO 25178 and allows users to complete

measurements of several surface

parameters. Parameters that can be

measured include height, spatial, hybrid,

functional, and functional volume

measurements.

Automatically counts and measures

circular objects within the microscope fi eld.

Preprocessing such as automatic

separation of adjacent particles, counting,

diameter, etc can be performed.

Automatically extracts the radii of

circular objects in a specifi ed area.

Since the measurements are calculated

automatically, this function reduces

variations in measurements between

users.

SPHERE MEASUREMENT

Sphere/surface angle measurement

When a standard sample has been registered and a different image is opened in a

template, the VK-Analyser automatically adjusts the image position so that the image

opens at the same position as the registered sample. This function is effective when

measuring large sample populations.

AUTOMATIC POSITION COMPENSATION

Position compensation function Industry’s First

Analysis expansion module VK-H1XPSurface texture measurement module VK-H1XR

Particle analysis module VK-H1XG

NEW ISO 25178

24

A highly-rigid, adjustable-height stand attaches to the back of the

VK microscope, allowing the measuring head to be adjusted to any

height. Inserting a spacer between the measuring head and the

base improves the stability and enables high accuracy

measurement.

A large selection of lenses are available, including high N.A., APO,

long focal distance, and low magnifi cation lenses.

The motorised stage is essential to automatic image assembly and

programmable operation. Easy-to-mount design.

Non-destructive examination and analysis of any point on

large-sized targets by mounting the head on a 3rd-party stage.

An entire 300 mm wafer can be examined and analysed. Easy-to-

mount design.

VK LASER SCANNING MICROSCOPE OPTIONS

Adjustable-height stand for the VK SeriesThe unique structure of the VK-X allows for the measuring head to be separated from the base, making targets that were previously too tall to measure easily possible. (Max 128 mm) (OP-82693)

Objective lensesWide magnifi cation range

Motorised stageAutomatic image assembly (VK-S100K/VK-S105/VK-S110)

Separate measuring headNon-destructive examination of large-sized targets

300 mm wafer stageSupport larger wafer sizes (OP-51498)

* Optional 100mm x 100mm motorised stage also available.

25

Stand for the VK Series

128 mm

Turning the knob adjusts the height as desired.

The spacer improves the stability.

155

12.5

70.2

160

405

285

63.5

22

416.4

13.3171.3

159

2 x M6 Heli-Coil 1.5D

23.5

190

182

80

(40)

20.5

80

63.5

2 x ø6.6 through hole

4 x M6Depth 10

56.5

(Depth 8)

6

405

100 77.5108

159

53.2

13.3

415.4

7.3

249.9

378.5270.5

165.520.5

35130

108

165.5

95

249.9

366.5

96.5

145

166.566.5 112

155

96.5 270

52.2397.1

295.4150

7

13

168

190

(40)

150

119.2

164357 6

119.2160

164357

295.4 398.4

22

270.5

171.3

4 x M6 Depth 10

7

172

2 x M6 Heli-Coil, 1.5D

(Depth 8)20.5

77.5

80

2 x ø6.6 through hole

285

7

183

6

26

Unit: mm

DIMENSIONS

Measurement unit

VK-X210

Measurement unit

VK-X105/110

Measuring head

Measuring head

Controller

VK-X200K

Controller

VK-X100K

SYSTEM CONFIGURATION

27

SPECIFICATIONS

ModelMeasurement unit VK-X210 VK-X110 VK-X105

Controller VK-X200K VK-X100K VK-X100K

Magnifi cation on a 15” monitor 200x 400x 1000x 3000x 200x 400x 1000x 2000x 100x 200x 400x 1000x

Objective lens magnifi cation 10× 20× 50× 150× 10× 20× 50× 100× 5x 10x 20x 50x

Observation/measuring range 1.

Horizontal (H): μm 1350 675 270 90 1350 675 270 135 2700 1350 675 270

Vertical (V): μm 1012 506 202 67 1012 506 202 101 2025 1012 506 202

Working distance: mm 16.5 3.1 0.35 0.2 16.5 3.1 0.54 0.3 22.5 16.5 3.1 0.54

Numerical Aperture (N.A.) 0.3 0.46 0.95 0.95 0.3 0.46 0.8 0.95 0.13 0.3 0.46 0.8

Optical zoom 1x to 8x

Total magnifi cation 200x to 24000x 200x to 16000x 100x to 8000x

Optical system for observation/measurement Pinhole confocal optical system

Height measurement

Measuring range 7 mm 7 mm 7 mm

Display resolution 0.0005 μm 0.005 μm 0.005 μm

Repeatability σ 0.012 μm 2. 0.02 μm 2. 0.02 μm 2.

Width measurementDisplay resolution 0.001 μm 0.01 μm 0.01 μm

Repeatability 3σ 0.02 μm 3. 0.03 μm 4. 0.05 μm 5.

Frame memory

Pixel count 2048 x 1536, 1024 x 768, 1024 x 64

For monochrome image 16-bit

For colour image 8-bit for RGB each

For height measurement 24-bit 21-bit 21-bit

Frame rate*8Surface scan 4 Hz to 120 Hz

Line scan 7900 Hz

Auto function AAG (Auto gain), Auto focus, Auto upper/lower limit setting, Double Scan brightness settings

Laser beam light source for measurement

Wavelength Violet laser, 408 nm Red semiconductor laser, 658 nm

Output 0.95 mW

Laser Class Class 2 Laser Product (IEC 60825-1, FDA (CDRH) Part1040.10 6.)

Laser light-receiving element PMT (Photoelectron Multiplier Tube)

Light source for optical observation

Lamp 100 W halogen lamp

Colour camera for optical observation

Imaging element 1/3" Colour CCD image sensor

Recording resolution Super high resolution (3072×2304)

Auto adjustment Gain, Shutter speed

Data processing unit Dedicated PC, supplied by KEYENCE with the VK-X (OS: Windows 7 Professional Edition) 7.

Power supplyPower-supply voltage 100 to 240 VAC, 50/60 Hz

Current consumption 450 VA max.

WeightMeasurement unit

Approx. 26 kg (Measuring head detached: approx. 10 kg)

Approx. 25 kg (Measuring head detached: approx. 8.5 kg)

Approx. 25 kg (Measuring head detached: approx. 8.5 kg)

Controller Approx. 11 kg

1. The observation/measuring range is the minimum visual fi eld range.2. When a standard height difference of 2 μm is measured with the 50x objective lens.3. When the KEYENCE reference chart line width of 1 μm is measured with the 150x objective lens in line peak mode (image averaging: 8 times).4. When the KEYENCE reference chart line width of 1 μm is measured with the 100x objective lens in line peak mode (image averaging: 8 times).5. When the KEYENCE reference chart line width of 1 μm is measured with the 50x objective lens (optical zoom 2x) in line peak mode (image averaging: 8 times).6. The laser classifi cation for FDA (CDRH) is implemented based on IEC60825-1 in accordance with the requirements of Laser Notice No.50.7. Windows 7 is a registered trademark of Microsoft, U.S.A.8. At top speed when using a combination of measurement mode/measurement quality/lens magnifi cation. When line scan has a measurement pitch that is within 0.1 μm.

• Viewer software

VK-H1XVE• Analysis software

VK-H1XAE• Analysis expansion module VK-H1XP (Optional)

• Image stitching software VK-H1XJE (Optional)

• Particle analysis module VK-H1XG (Optional)

• ISO 25178 Surface texture measurement module

VK-H1XR (Optional)

• Motorised XY stage for image stitching VK-S105/S100K (50 mm)VK-S110/S100K (100 mm)

• Stage for 300 mm wafer OP-51498 (Optional)

• VK Series stand OP-82693 (Optional)

* Please contact KEYENCE for large-sized sample stage.

VK-X200K

VK-X100K

VK-X110VK-X105

VK-X210

Measurement unit Controller

Control PC Monitor (Optional)

Copyright (c) 2011 KEYENCE CORPORATION. All rights reserved. VKX-WW-C-E 1033-4 600947 Printed in Japan

The information in this publication is based on KEYENCE’s internal research/evaluation at the time of release and is subject to change without notice.

* 6 0 0 9 4 7 *

New principle that has realised overwhelming observation

Digital Microscope

NEW VHX-2000

❙ Exceeding the resolution capabilities of an optical microscope

❙ Realises vivid 3D observation with large depth-of-fi eld

❙ Simple operation using 3-axis (XYZ) motorised control

❙ High-speed image stitching function

❙ Advanced automatic measurement functions

❙ Quick Depth Composition function & 3D composition