A low-cost/high-performance semiconductor solution for

China’s growing electronics production market Initiative

Innovation. Initiative. Intellectual Honesty.

March 2012

ICube: Technology  

|ICube 2012 2

ICube’s Harmony Unified Processor Technology genuinely integrates two different processor types: a central processing unit (CPU) and a

graphics processing unit (GPU), into one unified core.

This technology consists of the Multi-Thread Virtual Pipeline parallel computing core (MVP), an independent instruction set architecture (ISA), an optimizing compiler and the Agile Switch

dynamic load balancer.

Bringing the most cost efficient and power efficient performance semiconductor solutions to the market.

The Harmony Unified Processor Technology

和谐统调处理技术

Value Proposition

•  Filling a technological void by independently developing the first core processor architecture in China: ICube’s MVP -The first in the world to truly integrate CPU +GPU functionality in one core

•  Develop, market and sell System-On-Chip (SOC) semiconductor solutions, based on independently developed parallel computing stream processor core (MVP)

IP Strategy

•  Contain independent intellectual property with deep entrance barrier and high growth potential, a Genuine “China Core” to pioneer a new level of technological development in China’s semiconductor design space

Structure

•  Fabless organization with lean and efficient operations structured on an international level of professionalism, creativity, and intense focus on execution

Top Talent

•  Team of top talents in China led by long-time Silicon Valley veterans who have over 25 years of experience in CPU/GPU design and compiler development

   

ICube Executive Summary

|ICube 2012 3

ICube: Executive Summary  

ICube’s Technical Leaders

Innovation. Initiative. Intellectual Honesty.

Simon Moy: Chief Technical Officer

|ICube 2012 5

ICube: Talent  

Simon Moy has 20 years of semiconductor experience, mainly in the area of architecture/design of CPU and GPU. From 9-1997 to 9-2004, Simon was a Principal Engineer at NVIDIA, responsible for the architecture and hardware design of the vertex shader and stream processor in several generations of NVIDIA’s GPU chips, from the first GeForce, first Xbox, to G80. Prior to that, Simon had been a key engineer in several microprocessor projects at various Silicon Valley companies such as SGI, IBM and LSI logic. Simon holds 30+ US Patents, including 3 that led to the first GPU, first programmable CPU and first general-purpose (compute) GPU (GGPU) respectively. All are significant industry milestones. Simon received his B.S. and M.S. degrees in computer engineering from the University of Illinois at Urbana-Champaign.

Fred Chow: Chief Scientist

|ICube 2012 6

ICube: Talent  

Fred Chow has over 30 years of experience working on compilers and related tools from graduate research, product implementation, industrial R&D to engineering management.

With an international reputation in production optimizing compilers, Fred is the chief architect behind the open-sourced Open64 compiler suite and the creator of the widely accepted PathScale version of the Open64 compiler.

Positions Held: 1）SGI（Silicon Graphics Inc.): Chief Scientist 2）MIPS: Principal Engineer

3）PathScale: Director of Compiler Engineering Fred holds 8 US patents and has written over 20 professional publications.

Fred received his B.S. degree in Computer Science from the University of Toronto and received his M.S. in Computer Science and his Ph.D in Electrical Engineering from Stanford University (under the current Stanford President, Dr. John Hennessy). Fred maintains a position as faculty mentor at Tsinghua University.

The first Unified Processor Unit (UPU) in the world that integrates CPU and GPU into one parallel computing core!  

|ICube 2012 7

ICube: UPU  

CPUChip

GPUChip

CPUDie

GPUDie

CPUCore

GPUCore

MVP

Decouple

Hybrid

APU

UPU

Computer System

Package

Silicon

Core

From Heterogeneous Platforms to UPU

|ICube 2012 8

ICube: UPU  

ICube’s UPU

UPU offers: •  The best price performance •  The best power-consumption performance •  The best scalable performance

UPU integrates: •  CPU and GPU into one ISA with unified fix/float GPR •  CPU and GPU into one execution pipeline •  CPU and GPU into one Harmony scheduler

UPU threads can be used as any combination of: •  SMP cores •  Pthreads •  Ithreads

|ICube 2012 9

ICube: UPU  

Efficiency Comparison: Core Processor

|ICube 2012 10

ICube MVP

(2 core)

MIPS 1004K

(3 cores)

MIPS 1074K

(2 cores)

ARM Cortex A9 (2 core)

ARM Cortex A9 (2 cores)

Process (nm) 65 40 40 65 40

MAX Clock (MHz) 600 1100 1200 830 1100

Area with Mem. (mm2) 6.0 4.7 4.5 5 5.5

Operating Power (mW) 600 1000 900 1500 900

Peak GFLOPS 7.2 6.6 4.8 3.3 4.4

Coremarks 10800 9600 6000 4868 6453

DMIPS 5160 5100 4800 4150 5500

DMIPS/MHz. 8.6 4.6 4 5 5

DMIPS/mm2 860 1085 1067 830 1000

DMIPS/mW 8.6 5.1 5.3 2.8 6.1

CPU+GPU ✔ ✗ ✗ ✗ ✗

ICube’s MVP: Competitive Analysis  

ICube Vision and Development Plan

Leveraging the superior performance, power and price efficiency of the UPU Technology

To provide revolutionary semiconductor solutions to the industry

ICube Product Positioning

With unique parallel computing and multi-threading our product increases the price/performance ratio by 3 times the current

solution while offering the customization, manufacturability, die size, power consumption, time-to-market, and versatility benefits

of an integrated high-performance SoC solution.

ICube offers SoC solutions based on our UPU to applications that require high computing power while

maintaining a substantial power and price/performance advantage in the industry.

ICube: Product Positioning  

|ICube 2012 12

The first chip in the world that combines CPU and

GPU into one truly integrated core.

The first chip in China with multi-core processors based on parallel computing with

advanced simultaneously-multi-threading (SMT) design

technique.

The first chip in China based on a domestically developed Instruction Set Architecture

(ISA) and domestically patented stream processor cores.*

ICube’s IC1 contains 2 MVP cores that provide high computing power while

maintaining a substantial price/performance advantage in the

industry.

ICube’s First SOC: IC1

ICube: Product Review IC1 *Patent Applications Pending  

|ICube 2012 13

IC1 Features  

IC1 A high-performance, general-purpose processor on 65nm process, with a maximum clock frequency of 600MHZ, a maximum operating power consumption of 1.2-1.5W and a die size of 33.6 mm2

CPU

Dual-MVP •  Simultaneously-multi-threading (SMT) to efficiently accelerate •  Symmetrical-multi-processing (SMP) •  Homogeneous parallel programs •  Java applications •  Support Pthread, OpenMP

GPU

•  Data parallel, Task parallel, and/or Function parallel computing as programmable unified shader, multi-standard and media processor, and heterogeneous GPGPU applications

•  Support OpenGL ES2.0, OpenCL •  60 million triangles/second, 300 million pixel/second

System Clock 600MHz Multi-thread Processing Simultaneous 8 threads

Processing Power 5160DMIPS, a peak performance similar to a 4.8GHz single serial core processor

Display System LCD: Maximum pixel clock: 165MHz@16.7M (24-bit) true color, HDMI/DVI output capable Camera 8/10 bit camera data interface Video Support HD 720p all format decoding Audio Max. 5.1 channel audio

Memory Support SD, HCSD, MMC card, USB mass storage device, Nand flash, NOR flash, DDR2 SDRAM Power Control 9 independent power domain, 3 low power modes Supported OS Android, Embedded Linux

Supported Connectivity USB host/slave, WiFi, UART, 3G modem, GPS

Keypad 12 keypad I/O for Qwerty keyboard

|ICube 2012 14

ICube: Product Review IC1  

Competitive Comparison: SOC 　 ICube IC1 Nvidia Tegra 2 Apple A5

CPU MVP – Dual core ARM Cortex A9 – Dual

core ARM Cortex A9 – Dual

core Die size (mm2) 33.6 49 122.2 Process 65nm 40nm 45nm SMT per core 4 1 1 Frequency per core 600Mhz 1Ghz 1Ghz L2 Cache 256kB 1MB ~1.1MB L1 Cache (I/D) (64KB/64KB) per core (32KB / 32KB) per core (32KB/32KB) per core

Local Memory 64KB local SRAM per core NA NA

Coremark 10800 5866 5866 DMIPs 5160 5000 5500 Operating Power (mW)@ MPU full loading 1200 900 1000

Coremark/MHz 18 5.87 5.87 Coremark/mm2 321 119.7 48 Coremark/mW 9 6.5 5.86

GPU MVP Unified CPU + GPU

Architecture ULP GeForce (333Mhz) PowerVR SGX543MP2

(Dual SGX543) (200Mhz / 300Mhz)

GPU cores 8 8 8 SIMDs + 4 texturing unit

OpenGL ES 2 2 2

|ICube 2012 15

ICube: Product Review IC1  

ICube Product Roadmap

0

10

20

30

40

50

60

70

2011.Q2   2012.Q3   2013.Q3   2014.Q3  

IC1: - 2 MVPs - 8 threads - CPU+GPU - 600MHz - Android - OpenGL

IC2: - 4 MVPs - 16 threads - CPU+GPU - 1 GHz - Android - OpenGL

IC3: - 8 MVPs - 32 threads - CPU+GPU - 1.2 GHz - Android - OpenGL

IC4: - 8 MVPs - 32 threads - CPU+GPU - 2 GHz - Android - OpenGL P

roce

ss (n

m)

|ICube 2012 16

2012 2013 2012 2014

ICube: Product Road Map  

ICube’s SOCs: New Silicon Solution for Mobile Devices Market Implications ICube’s SOCs

• Based on independently developed and proprietary UPU technology

• MVP is the first processor that genuinely integrates CPU and GPU into one ISA and hardware core, based on parallel computing technology

• MVP based SOCs deliver the best price performance and power efficient semiconductor solution to the mobile computing and mobile communication market place

• A dual-core MVP-based SoC for mobile communication and computing devices

• A multi-core MVP-base SoC will be an open-system platform capable of running more computational intensive applications

|ICube 2012 17

• Parallel computing is an inevitable trend as Moore’s Law rolls out chips with multiple cores and/or multiple threads instead of higher clock speeds  

• Migration from PC to handheld computing devices creates a fertile ground for innovation tailored for mobile device market

• Demands for highly efficient silicon with better price performance and power consumption drives the need for cost-efficiency

• The worldwide technology trend towards mobility is also contributing to China’s increasing share of worldwide electronic systems production:

•  In 2010, China claimed 31.4% of the global electronic equipment production

•  While the semiconductor content of that production averaged 27%

ICube: Conclusion  

Market Overview

The Semiconductor Market

   

Semiconductor Market Growth Trends

$344 Billion •  Global semiconductor market estimated to reach US$344 billion by 2014.

China

•  Representing more than 40% of the worldwide semiconductor consumption, China's semiconductor market grew by 30.4% in 2010 to reach a new record of US$132 billion.

IC Design

•  IC design is the fastest growing segment of China's semiconductor industry for the past decade and also the one segment that achieved positive year-over-year growth for every year of the past decade.

$42.1 Billion

•  By 2012, US$42.1 billion worth of Chinese-designed semiconductors will be purchased for use in electronic equipment made in the nation, up 63.4 percent from US$25.8 billion in 2007.

Market Review Source: IDC 2010, iSuppli 2008, CSIA 2010  

|ICube 2012 19

   

China’s Semiconductor Consumption Growth Has Continuously Outrun the Rest of the World

In 2010 China claimed a 40.5% share of the total worldwide semiconductor consumption,

reflecting a 24.8% CAGR since 2000, the peak of the prior

semiconductor business cycle…

Market Review Source: PWC 2011  

|ICube 2012 20

…while the total worldwide consumption

has grown at a comparatively anemic

3.9% CAGR.

   

China’s Semiconductor Market Growth 2000-2010

Market Review Source: PWC 2011  

|ICube 2012 21

China’s semiconductor market grew by 30.4% in 2010 to reach a new record of US$132B.

   

Driving Factors to China’s Consumption Growth

Market Review Source: PWC 2011  

The  worldwide  technology  trend  towards  mobility  is  also  contribu

… The Shift to China Global Macro Growth Trends…  

In 2010, China claimed 31.4%

of the global electronic equipment production, showing an increase of 10.6% from 2009.

Growth in Electronic Equipment Production:

The semiconductor content of the electronic equipment produced in China rose to 27% in 2010 and is still significantly higher than the worldwide average of 19%.

Growth in Electronics' Semiconductor Content:

Market Review Source: PWC 2011, SIA CCID  

|ICube 2012 23

The World is “Going Mobile” New Computing Cycles: better processing power leading to 10x more devices

|ICube 2012 24

Tablet

Market Review Source: Morgan Stanley 2009  

China’s Electronic Production and Worldwide Share of Main Electronic Products 2008-2010

Production Growth: China’s Key Electronic Products

Market Review Source: CSIA, MIIT, Digitimes Reasearch 2010-2011  

|ICube 2012 25

China’s claims over 70% of the worldwide production of Mobile Phones and Computers, over 60% of the worldwide production of Digital Cameras and nearly 50% of the worldwide production of Color TVs.

Mobile Computer

Smart Phones

Feature Phones

Market Applications Source: Mobile Market Global Estimates: ARM estimates 2012  

Growth in Global Mobile Opportunities 2015 estimates

750 Million

Devices in 2015

1.1bn

Devices in 2015

650 Million

Devices in 2015

|ICube 2012 26

Appendix

Market Landscape China’s growth in semiconductor demand

Worldwide Semiconductor Market by Region 2003-2010 (total worldwide billions of US Dollars)

|ICube 2012 Appendix 1

*Source: CCID, CSIA  

• Representing more than 40% of the worldwide semiconductor consumption, China's semiconductor market grew by 30.4% in 2010 to reach a new record of US$132 billion.

Growth in China’s Semiconductor Consumption

•  IC design revenues grew from US$178M in 2001 to US$5.4B in 2010—experiencing a CAGR of just over 46%.

IC design, the fastest growing segment of China's semiconductor industry for the past decade, is also the one segment

that achieved positive year-over-year growth for every year of the past decade

• Companies in the communications sector, particularly mobile phones, achieved rapid growth in revenue and size.

Mobile devices became the major products for China’s IC design industry

in 2010

• China's annual IC consumption/production gap increased by more than $20 billion in 2010 to a new record level of $87.3 billion.

One of the consequences of the semiconductor recovery in 2010 was the

resumed growth of China’s IC consumption/production gap

Key    Market    Drivers  

*Source: PWC 2010 (China’s impact on the semiconductor industry: 2011 update)  

|ICube 2012 Appendix 2

|ICube 2012 Appendix 3

Notably, China’s IC design sector dollar revenues grew by 36% in 2010, exceeding the worldwide market growth rate of 32%. Most of the revenue in this sector can be attributed to China’s fabless semiconductor companies, which in 2010 constituted more than 7% of the US$74B worldwide fabless IC industry—up from a 1% share in 2001 and a 4% share in 2004.

China’s Integrated Circuit Design Industry Revenue and Growth, 2000-2010

*Source: CCID, CSIA  

Domestic Consumption & Export Market

*Source: PWC, Gartner Dataquest 2011      

|ICube 2012 Appendix 4

The Chinese semiconductor consumption market includes: the domestic market and the much larger export market:

Domestic: •  Since 2003, China’s domestic market—the value of semiconductors consumed in China that are used in components of finished products

assembled and sold in China—has grown at a 23% CAGR •  Largely driven by China’s economic stimulus package with its focus on increased consumption of electronic consumer products, China’s

domestic market grew to represent more than 15% of the worldwide semiconductor market for the past two years. This is up from 13.5% in 2008 and 11% in 2007

Export: •  Almost two thirds of all the semiconductors consumed in China in 2010 were used in components of finished products assembled in China

and exported for sale in other countries •  Since 2003, the consumption of semiconductors for export products has increased by US$65B, constituting 65% of the overall growth of

China’s semiconductor market •  During 2009, semiconductor exports decreased by more than US$3B, even as the consumption of semiconductors for domestic products

increased by just under US$1B

China’s export and domestic semiconductor consumption markets (in billions of US dollars)  

China’s Domestic Buying Power

*Source: PWC 2011 (China’s impact on the semiconductor industry: 2011 update)  

The growth of China’s semiconductor market—which consists primarily of electronics manufacturing services (EMS) companies, original design manufacturers (ODMs) and original equipment manufacturers (OEMs) that consume chips in China—continues to be a major catalyst for change in the industry.

|ICube 2012 Appendix 5

Chinese OEMs by electrical equipment revenue and semiconductor consumption 2009–2010 (in billions of US dollars)

China Compared with Worldwide Semiconductor Market by Application, 2010

Computing and Communications Driving China’s Semiconductor Consumption

*Source: PWC 2011, Gartner, Dataquest  

China’s 2010 semiconductor consumption continued to be somewhat more concentrated in the computing and communications application sectors. Since 2003, China’s consumption of semiconductors for computing applications has grown at a 24% CAGR, while consumption for communications and consumer applications has grown at 22% and 17%.

|ICube 2012 Appendix 6

Innovation Initiative Innovation. Initiative. Intellectual Honesty.