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A 26Gbps 3D-Integrated Silicon Photonic Receiver in BiCMOS-55nm and PIC25G with -15.2dBm OMA Sensitivity Farhad Bozorgi 1 , Melchiorre Bruccoleri 2 , Matteo Repossi 2 , Enrico Temporiti 3 , Andrea Mazzanti 1 and Francesco Svelto 1 1 University of Pavia, 2 STMicroelectronics, 3 eSilicon Pavia, Italy [email protected] September 25, 2019 ESSCIRC/ DE , Cracow, Poland ESS RC 2019 1 of 18

A 26Gbps 3D-Integrated Silicon Photonic Receiver in BiCMOS … · 2019-10-24 · A 26Gbps 3D-Integrated Silicon Photonic Receiver in BiCMOS-55nm and PIC25G with -15.2dBm OMA Sensitivity

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A 26Gbps 3D-Integrated Silicon Photonic Receiverin BiCMOS-55nm and PIC25G with -15.2dBm

OMA Sensitivity

Farhad Bozorgi1, Melchiorre Bruccoleri2, Matteo Repossi2, Enrico Temporiti3, Andrea Mazzanti1 and Francesco Svelto1

1University of Pavia, 2STMicroelectronics, 3eSiliconPavia, Italy

[email protected]

September 25, 2019

ESSCIRC/ DE , Cracow, PolandESS RC 2019 1 of 18

Outline

Introduction Optical Receiver TIA Design Implementation Measurement Performance summary Conclusion References

2 of 18ESSCIRC/ESSDERC 2019, Cracow, PolandFarhad Bozorgi

Introduction – Data Communication

Huge Volumes of data is created each year By varoius breakthrough applications (5G, cloud computing, IOT)

Majority of data take place in DataCenter (DC) They will occupy acres of acres of lands with continued growth of data

Mid-Range optical transceiver in datacenters leveraged in DC• long reach (up to 10km), low channel loss, low cost Higher data-rate (>100Gbps)

ESSCIRC/ DE , Cracow, PolandESS RC 2019 3 of 18

[1,2]

Farhad Bozorgi

Introduction - Why Silicon Photonics?

Bottlenecks of the current technology Limited performances in terms of size and range (up to 100m) High packaging Cost

Role of Silicon Photonics Monolithic integration of optical devices together with electronic

components Reduce cost by going to larger wafer diameter (300mm) Scaling down the form factor Solving interconnect limits (Embedded transceivers on processor memories

and switches)

ESSCIRC/ DE , Cracow, PolandESS RC 2019 4 of 18

[2]

Farhad Bozorgi

Introduction - 3D Assembly

ESSCIRC/ DE , Cracow, PolandESS RC 2019 5 of 18

Maximizes both EIC and PIC design flexibility Realizing the 3D dice assembly through copper pillars

The 3D structure has to be assembled on the substrate of the PIC

[3]

Farhad Bozorgi

PICEIC

Optical Receiver - System Topology

Block diagram of a 3D-Integrated Silicon-Photonic Optical Receiver Design, tape-out and measurements of Analog Front-End is presented

BiCMOSS-55nm for the EIC

ESSCIRC/ DE , Cracow, PolandESS RC 2019 6 of 18Farhad Bozorgi

EICPIC

Board

DC BondwiresUnderfill

Copper Pillars

SMF

Waveguide DH Ge-PD

2D PSGC

PIC

SMF

dem

ux1330 nm

1310 nm

Supply & Digital &

Bias Circuit

DC Bondwires

GSGSG

EIC

Analog Front End

Filtering Caps

Prob

e

Optical PathElectrical Path

5.2 dB Loss

Optical Receiver - AFE

ESSCIRC/ DE , Cracow, PolandESS RC 2019 7 of 18

TIA Limiting Amplifier Buffer

LPFOTA

IinvOUT

Fully Differential resistive Shunt Feedback TIA is proposed Tapered stage amplifiers

to limit the voltage level ECL buffer with emitter degeneration to drive off-chip loads Automatic DC offset cancellation loop

Farhad Bozorgi

TIA Design – Classical TIA

ESSCIRC/ DE , Cracow, PolandESS RC 2019

Trans-impedance limit imposes upper limit for DC gain as: There is stringent compromise:

input-referred noise, BW and transimpedance gain

8 of 18

𝒁𝒁𝟎𝟎𝟎𝟎𝟎𝟎𝟎𝟎 = 𝑹𝑹𝑭𝑭

𝑩𝑩𝑩𝑩 =𝟐𝟐𝟎𝟎𝟎𝟎

𝟐𝟐π𝑹𝑹𝑭𝑭𝑪𝑪𝟎𝟎

𝑪𝑪𝟎𝟎 = 𝑪𝑪𝒊𝒊𝒊𝒊 + 𝑪𝑪𝑷𝑷𝑷𝑷

𝒁𝒁𝟎𝟎𝟎𝟎𝟎𝟎𝟎𝟎 ≤𝟎𝟎𝟎𝟎𝒇𝒇𝟎𝟎

𝟐𝟐π𝑪𝑪𝟎𝟎𝑩𝑩𝑩𝑩𝟐𝟐

𝟎𝟎𝟐𝟐𝒊𝒊,𝒊𝒊𝒊𝒊,𝑺𝑺𝑭𝑭 =𝟒𝟒𝟒𝟒𝟎𝟎𝑹𝑹𝑭𝑭

+𝑽𝑽𝟐𝟐𝒊𝒊,𝒊𝒊𝒊𝒊,𝒄𝒄𝒄𝒄𝒄𝒄𝒄𝒄

𝑹𝑹𝑭𝑭𝟐𝟐𝟏𝟏 + ω𝟐𝟐𝑪𝑪𝟎𝟎𝟐𝟐 +

𝑽𝑽𝟐𝟐𝒊𝒊,𝒊𝒊𝒊𝒊,𝑳𝑳𝟎𝟎

𝒁𝒁𝟎𝟎𝟎𝟎𝟎𝟎 𝟐𝟐Input Referred Noise:

Iin

Cin 𝐴0 𝑓0

+ - + - LACPD

[4]

Farhad Bozorgi

TIA Design – Proposed FD-SF TIA

ESSCIRC/ DE , Cracow, PolandESS RC 2019 9 of 18

𝒁𝒁′𝟎𝟎𝟎𝟎𝟎𝟎𝟎𝟎 = 𝟐𝟐𝑹𝑹′𝑭𝑭

𝑩𝑩𝑩𝑩′ =𝟏𝟏𝟐𝟐

𝟐𝟐𝟎𝟎𝟎𝟎𝟐𝟐π𝑹𝑹′𝑭𝑭𝑪𝑪′𝟎𝟎

𝑪𝑪′𝟎𝟎 =𝑪𝑪𝒊𝒊𝒊𝒊𝟐𝟐

+ 𝑪𝑪𝑷𝑷𝑷𝑷

𝟎𝟎𝟐𝟐𝒊𝒊,𝒊𝒊𝒊𝒊,𝑺𝑺𝑭𝑭 =𝟒𝟒𝟒𝟒𝟎𝟎𝟐𝟐𝑹𝑹′𝑭𝑭

+𝑽𝑽𝟐𝟐𝒊𝒊,𝒊𝒊𝒊𝒊,𝒄𝒄𝒄𝒄𝒄𝒄𝒄𝒄

𝟐𝟐𝑹𝑹′𝑭𝑭𝟐𝟐 𝟏𝟏 + ω𝟐𝟐𝑪𝑪′𝟎𝟎

𝟐𝟐 +𝑽𝑽𝟐𝟐𝒊𝒊,𝒊𝒊𝒊𝒊,𝑳𝑳𝟎𝟎

𝒁𝒁′𝟎𝟎𝟎𝟎𝟎𝟎 𝟐𝟐Input Referred Noise:

Cin

CB

inNIininP

+ -

Iin

Iin

Iin

Cin

𝐴0 𝑓0

-

+

2+ -

LA+

-CPD

𝟎𝟎𝟐𝟐𝒊𝒊,𝒊𝒊𝒊𝒊,𝑭𝑭𝑷𝑷−𝑺𝑺𝑭𝑭 =𝟒𝟒𝟒𝟒𝟎𝟎𝟐𝟐𝑹𝑹𝑭𝑭

+𝑽𝑽𝟐𝟐𝒊𝒊,𝒊𝒊𝒊𝒊,𝒄𝒄𝒄𝒄𝒄𝒄𝒄𝒄

𝟐𝟐𝑹𝑹𝑭𝑭𝟐𝟐+ 𝑽𝑽𝟐𝟐𝒊𝒊,𝒊𝒊𝒊𝒊,𝒄𝒄𝒄𝒄𝒄𝒄𝒄𝒄

ω𝟐𝟐𝑪𝑪𝟎𝟎𝟐𝟐

𝟒𝟒+𝑽𝑽𝟐𝟐𝒊𝒊,𝒊𝒊𝒊𝒊,𝑳𝑳𝟎𝟎

𝟒𝟒 𝒁𝒁𝟎𝟎𝟎𝟎𝟎𝟎 𝟐𝟐

if 𝑪𝑪𝒊𝒊𝒊𝒊 ≫ 𝑪𝑪𝑷𝑷𝑷𝑷 , then 𝑪𝑪′𝟎𝟎 = 𝑪𝑪𝒊𝒊𝒊𝒊𝟐𝟐

, 𝑹𝑹′𝑭𝑭 = 𝑹𝑹𝑭𝑭, 𝑩𝑩𝑩𝑩′ = 𝑩𝑩𝑩𝑩

Farhad Bozorgi

Implementation

ESSCIRC/ DE , Cracow, PolandESS RC 2019 10 of 18

𝑹𝑹𝑭𝑭 = 𝟏𝟏𝟒𝟒Ω

Minimum 𝑽𝑽𝑪𝑪𝑪𝑪 = 𝟏𝟏.𝟔𝟔𝑽𝑽

𝑪𝑪𝑩𝑩 = 𝟏𝟏𝟎𝟎 𝒑𝒑𝑭𝑭

2mA 7mA 14mA Circuit detail of AFE

Capacitive degeneration technique used for equalization purpose Emitter degeneration in buffer to reduce the capacitive load for precedent stage

Farhad Bozorgi

TIA Design - Simulation

ESSCIRC/ DE , Cracow, PolandESS RC 2019 11 of 18

The Frequency where CB effects

in FD-SF TIA

Simulated 𝒁𝒁𝟎𝟎𝟎𝟎𝟎𝟎 and equivalent Input Referred Noise (IRN): SF TIA vs FD-SF TIA (with same BW)

Farhad Bozorgi

22hp

F

fR CBπ

=

Implementation

12 of 18

2.5*0.3mm2

Chip Microphotograph and Layout

ESSCIRC/ESSDERC 2019, Cracow, PolandFarhad Bozorgi

Measurement - Setup

13 of 18

MZM1310nm Laser Attenuator

90/10Splitter

Power Meter

PPG&

BERT

Clock

MZM Driver

DCA

GSGSG Probe

DUT

LightwaveProbe

ESSCIRC/ESSDERC 2019, Cracow, PolandFarhad Bozorgi

Measurement – Output Eye Diagram

14 of 18

26Gbps @-15.2 dBm OMA 26Gbps @-12 dBm OMA 26Gbps @-9 dBm OMA

32Gbps @-14dBm OMA 32Gbps @-11 dBm OMA 32Gbps @-8 dBm OMA

ESSCIRC/ESSDERC 2019, Cracow, PolandFarhad Bozorgi

Measurement

15 of 18

Receiver Chain Transfer FunctionMeasurement vs. Simulation with

30GHz BW, 76dBΩ Simulated DC Gain

Bathtub curve @sensitivityfor 26Gbps, 0.18 UI

horizental eye opening

ESSCIRC/ESSDERC 2019, Cracow, PolandFarhad Bozorgi

Sensitivity vs. input OMA

Comparison with Other 25Gbps RX

16 of 18ESSCIRC/ESSDERC 2019, Cracow, PolandFarhad Bozorgi

Conclusion

17 of 18

A 26Gbps 3D-integrated silicon photonics receiver has been presented.

Very low noise performance is demonstrated by leveraging a FD-SF TIA as well as low parasitic cap. in silicon photonic tech.

The sensitivity at the fiber output is aligned with state-of-the-art receivers employing discrete photonics

The lowest sensitivity reported among the published 25Gbps receivers exploiting silicon photonics, to authors’ best knowledge

ESSCIRC/ESSDERC 2019, Cracow, PolandFarhad Bozorgi

References

[1] Plant, David V, et al. "Optical communication systems for datacenter networks." 2017 OFC [2] D. Mahgerefteh and et al., “Techno-Economic Comparison of Silicon Photonics and Multimode VCSELs,” Journal

of Lightwave Technology, vol. 34, no. 2, pp. 233–242, Jan 2016. [3] Temporiti, Enrico, et al. "Insights into silicon photonics Mach–Zehnder-based optical transmitter architectures."

IEEE JSSC 51.12 (2016): 3178-3191. [4] Säckinger, Eduard. Broadband circuits for optical fiber communication. John Wiley & Sons, 2005. [5] T. Takemoto and et al., “A 25-to-28 Gb/s High-Sensitivity (-9.7 dBm) 65 nm CMOS Optical Receiver for Board-

to-Board Interconnects,” IEEE JSSC, vol. 49, no. 10, pp. 2259–2276, Oct 2014. [6] S. Huang and W. Chen, “A 25 Gb/s 1.13 pJ/b -10.8 dBm Input Sensitivity Optical Receiver in 40 nm CMOS,”

IEEE JSSC, vol. 52, no. 3, pp. 747–756, March 2017. [7] H. Andrade and et al., “Monolithically-Integrated 50 Gbps 2pJ/bit Photoreceiver with Cherry-Hooper TIA in

250nm BiCMOS Technology,” OFC March 2019, pp. 1–3. [8] H. Jung and et al., “A 25-Gb/s Monolithic Optical Receiver With Improved Sensitivity and Energy Efficiency,”

IEEE Photonics Technology Letters, vol. 29, no. 17, pp. 1483–1485, Sep. 2017. [9] E. Temporiti and et al., “A 3D-integrated 25Gbps silicon photonics receiver in PIC25G and 65nm CMOS

technologies,” ESSCIRC, Sep. 2014, pp. 131–134. [10] S. Gudyriev and et al., “Fully-differential, DC-coupled, self-biased, monolithically-integrated optical receiver in

0.25„m photonic BiCMOS Technology for multi-channel fiber links,” IEEE BCTM, Oct 2017, pp.110–113.

ESSCIRC/ DE , Cracow, PolandESS RC 2019 18 of 18Farhad Bozorgi

Thanks for Your Attention!

Farhad Bozorgi ESSCIRC/ESSDERC 2019, Cracow, Poland