9 Basic Ic

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I NT EGRAT ED CI RCUI T

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I C FABRI CAT I ON PROCESS

I C Fabrication Process

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I C DENSI T Y

1. Small Scale I C (SSI )

2. Medium Scale I C (MSI )3. Large Scale I C (LSI )

4. Very Large Scale I C (VLSI )

Relative Component Count of I C’s

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I C PACKAGES

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I C PACKAGE

Dual I nline Package (DI P)

Pin Grid Array (PGA)

Ball Grid Array (BGA)

Small Outline I C(SOI C)

Plastic Lead Chip Carrier (PLCC)

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I C

Complete Circuit in One Package

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DI P I C

1. COMMON LOGI C I C (14- and 16-pin)

2. MEMORY IC (16-, 18-, 24- and 28-pin)

3. MI CROPROCESSOR I C (40-, 44- and 48-pin)

DI P IC PIN NUMBERI NG

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DI P I C

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74 SERI ES I C CODE

DM 7400 xxx NDM 7400 xxx N

Manufactur e Code

Denotes Specif icat ion and T ype of I C :L = Low Power (I C T T L)

LS = Low Power, Schottky (I C T T L)

ALS = Advanced, Low Power, Schottky (I C T T L)

H = High Speed (I C T T L)

C = Complementary MOSFET (I C CMOS)

HC = High Speed, Complementary MOSFET (I C CMOS)HCT = High Speed, Complementary MOSFET , I nput T T L (I C CMOS)

Denotes I C Special Funct ion

Denotes improvements f rom manufacture

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74 SERI ES I C FAMI LY

1. 7400 = NAND

2. 7402 = NOR

3. 7404 = NOT / INVERT ER

4. 7407 = YES / BUFFER

5. 7408 = AND

6. 7432 = OR

7. 7447 = 7 SEGMENT DI SPLAY DRI VER (COMMON CAT HODE)8. 7448 = 7 SEGMENT DI SPLAY DRI VER (COMMON ANODE)

9. 7474 = D FLIP-FLOP

10. 7490 = DECADE COUNT ER

11. 74138 = 3 T O 8 DECODER

12. 74153 = 4 T O 1 MULT I PLEXER13. 74157 = 2 T O 1 MULT I PLEXER

14. 74160 = SYNCHRONOUS BI NARY COUNT ER

15. 74164 = SHI FT REGI STER

16. 74174 = D FLI P-FLOP WI T H COMPLEMENT OUT PUT

17. 74193 = SYNCHRONOUS UP/DOWN BI NARY COUNT ER

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40 SERI ES I C CODE

CD 4001 B ECD 4001 B E

Manufactur e Code

Denotes Plast ic for Double I nput

Denotes I C Special Funct ion

Denotes improvements f rom manufacture

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40/45 SERI ES I C FAMI LY1. 4011 = NAND

2. 4001 = NOR

3. 4009 = NOT / INVERT ER

4. 4010 = YES / BUFFER

5. 4017 = DECADE COUNT ER

6. 4021 = 8 BIT STAT I C SHIFT REGI ST ER

7. 4052 = 4 CHANNEL MULT I PLEXER

8. 4053 = 2 CHANNEL MULT I PLEXER

9. 4071 = OR

10. 4081 = AND

11. 40147 = 10 T O 4 LI NE BCD PRI ORI T Y ENCODER

12. 40174 = D FLI P-FLOP13. 4510 = PRESET T ABLE UP/DOWN BCD COUNT ER

14. 4511 = 7 SEGMENT DRI VER (COMMON CAT HODE)

15. 4513 = 7 SEGMENT DRI VER (COMMON ANODE)

16. 4515 = 4 T O 16 LI NE DECODER

17. 4518 = BCD UP COUNT ER

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I C PROPAGAT I ON DELAY

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LOGI C LEVEL

HI GH

HI GH

LOW

LOW

T HERESHOLD

T HERESHOLD

VCC VDD

GND VS S

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CONT ROL CI RCUI T

Active High

Active Low

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T T L I C

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T T L I C

T T L (T ransistor-T ransistor Logic) is the best

established and most diversified I C family. LS(Low-power Schottky) is functionally identical toT T L but is slightly faster and use 80% less power.T T L/LS chips require a regulated 4,75 – 5,25 voltpower supply. Here’s a simple battery supply :

T he diode drops the battery voltage a safe level.Both capacitors should be installed on the T T L/LS

circuit board. Circuit with lots of T T L/LS chips canuse lots of current. Use a commercial 5 volt linepowered supply to save batteris.

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T T L LOGI C I NPUT

Active High

Active Low

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T T L I C DRIVER

T T L I C Driver

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CMOS I C

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CMOS I C

MOS (Metal Oxide Semiconductor) I Cs can contain more

functions per chip than T T L/LS and very easy to use. Mostchips in this section are C-MOS (Complementary MOS).T hey consume very little power and operate over a 3-15volt range.

CMOS can be powered by this :

Or you can use a line powered supply made from an I CVoltage Regulator 7805/7812/7815.

I ncidentally, you can power a CMOS circuit from two seriesconnected penlights cells, but a 9-12 volt supply will givebetter performance.

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CMOS OPERAT I ON

1. T he input voltage should not exceed VDD (except 4049

and 4050)2. Avoid, if possible, slowly rising and falling input signals

since they can cause excessive power consumption.Rise-time faster than 15 microseconds are best.

3. All unused input must be connected to VDD (+) or VSS(GND). Otherwise erratic chip behavior and excessivecurrent consumption will occur.

4. Never connect an input signal to a CMOS circuit whenpower is off.

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CMOS PRECAUT I ON

1. Never store MOS I Cs in non-conductive plastic

snow, trays, bags or foam.2. Place MOS I Cs pins down on an aluminum foil

sheet or tray when they are not in a circuit or

stored in conductive foam.3. Use a battery powered iron to solder MOS

chips. Do not use an AC powered iron.

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CMOS LOGI C I NPUT

Active High

Active Low

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SCHMI T T T RI GGER

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9 Basic Ic