344sentation Matu YieldLine General en 121211) · Matusewicz Budowa Maszyn s.j. | | [email protected] Our SpectrumforWetProcessing Systems PCB includes: CleaningSystems (chemicalandmechanical)

Yield Line General

Matusewicz Budowa Maszyn s.j. | www.matusewicz.pl | [email protected]

YIELD LINES: Advanced Wet Processing

Conveyorized horizontal and vertical Precision Machinery in

� Printed Circuit Boards, Multilayers, Flexible Circuits etc.

� Precision Metal Forming, Chemical Milling, Electroforming etc.

� PhotoVoltaic, Thin Film, Wafering, Semiconductor etc.

Extravagating Limitations for Ultra Fine Line Structures

� Leading Edge Precision and basic, robust Design.

� High Definition, High Impact, HF-Pulse Spraying Systems

� Highly sophisticated Wet Processing Techniques

Yield Line General

� Processes subtractive and additive

� Thin Flexibles 17 µm (½ Mil) and under

� Large Multilayers (Backplanes) 5 mm (0.5”) thick

� > 60 Layers and sizes > 600 x 1000 mm

� Flex- Rigid combinations (connections)

� BOOKBINDERS Flex-Rigid Multilayers

Printed Circuit Boards

� Processes are both: subtractive and additive

� The variety of materials is high and different the processes.

� Base material can be a sheet or Foil, Dielectric or Metal.

� In- Line Sheet by Sheet processing is State of the Art.

� Reel to Reel processing is also possible.

Precision Metal Forming

� Special Conveyors for Wafer processing, extremely precise and smooth

� Processing double and one- sided. Surface “touchfree”

� PV- lines with a capacity of 4 – 8.000 Wafers/h running 5 to 10 lanes

� PV- Thin Film Flexibles processed reel to reel.

� Thin Film on Glass special cleaning machines with brushes.

� All machines are typically Clean Room class 1000 and higher.

PhotoVoltaic


Our Spectrum for Wet Processing Systems PCB includes:

� Cleaning Systems (chemical and mechanical)

� Developing Systems (Dry Film, Liquid Film, LDI and Soldermask)

� Etching Systems (alkaline, acidic, ferric also with Recycling)

� Stripping Systems (Dry film, Liquid Film, Ink, Tin, Tinlead)

� Oxidation ans alternatives (black and brown oxide, alternatives for all chemicals)

� Desmear Systems

� PTH Systems (Processes: electroless Cu, Polymere, Graphite, Palladium)

� Final Surface Finishing (OSP, chem. Tin, chem. Silver)

� Special Processing according to customers request

Yield Line Processes


Individual Process planning by engineering team with long experience in PCB, PMF

and PV business

Yield Line General

Example:

Elgoline order - PTH system - Shadow process Single step


YieldLine Highlights:

Top and Bottom Module separated

Advantages:

• Machine buildable modular or as

segments

• Volumes can be easily changed to

process needs

• Rinse for access possible in top

module

• 2 tank solution possible

• Reduced problems by thermic

movement

• reduction of chemistry consumption

by reduced extraction of fumes out

of tank

• Easy process enlongation without

changing tank volume

Yield Line General



Extention Zone for each Module

Yield Line General



Double Side Conveyor Drive

Yield Line General

• Slim spay angle (15°) for fine resolution

• Medium pressure (2 bar - 29 psi)

• High flow rate (2 l/min - 1/2 gallon/min)

• Integrated flow guides

• Uniform flow across surface

• Staggered spray nozzle configuration

• Provides uniform and reproducible fine line

structures

• Inline quick release mesh filters with safety

switch

• Nozzles aligned to spray in conveyor gap

High Definition Spray

High Impact Spray SystemStandard Spray System

no puddling effect → uniform stucturing

standard nozzles → puddling effect

High Definition Spray

Power Wash-System

� Power Wash-spray system installed instead of standard nozzle system� Optimized process results on panel surface and inside holes by higher number of

nozzles with reduced spray angle� Reduced distance between nozzle outlet and product for higher spray impact on

product� Nozzle tubes with setup top to bottom, aligned to spray in conveyor gap, for

better hole cleaning effect

� Nozzle tubes equipped with Impulse-spray system instead of standard nozzle system

� Optimized process results on panel surface and inside holes by high efficient Impulse-spray nozzles

� Nozzle tubes with setup top to bottom, aligned to spray in conveyor gap, for better hole cleaning effect

Impuls Spray Technology

US Cleaning Machine


US Cleaning Machine


US Cleaning Machine



US Cleaning Machine

Thank You.


Oxidation Machine IL 25 µm

Installation on Site

Front View

Thank You.


Oxidation Machine IL 25 µm

Installation on Site

Rear View


Oxidation Machine Touchless


Oxidation Machine Touchless

Thank You.


Electrical Installation

Electrics installed decentralin easy accessible boxeson rear side


PLC control CTP

PLC - Control Version PLC-CTP

Programmable logic controller with 10” Colour Touch Panel for operation and display of machine functions:� selection of aggregates� start and stop of the line by

function keys� display and regulation of each

other existing analogue parameter with min./ max. limit control

� display of each malfunction of the line in clear text

� stand-by-system for automatic economy stop in production break times� programmable timer for heaters � operator panel installed in console at input or output of the machine


PLC control CPC

� display of each malfunction in clear text� stand-by-system for automatic economy stop in production break times� programmable timer for heaters � 99 storable programs for different processing steps � software for graphic visualisation SPC-data on screen

PLC - Control Version PLC-CPC

Programmable logic controller SIMATIC with operation and display on PC according to following specification:� selection of aggregates, start and stop of

the line� setting, control and display of each existing

analogue parameter with min./ max. limit control via PC, in connection to PLC

� limits settable on PC� visualisation on PC� line graphic for fast line operation and

localisation of malfunctions screen


Option:

Dosing containers for accuratedosing and optical function control, visible on front side

Option: Dosing Installation

Option:

Dosing Cabinet with leakagecontrol for protection ofproduction area against chemistryand fumes


Option: Cooling Aggregate

Option:

We are able to supply together with themachine also a cooling aggregate forcooling down process solution

Our Customers


Order no. Final Customer Country Town Base Process Process Detail Product Delivery

7033 ElectroOptic USA Alpharetta, GA Etch Etcher FeCl3 CM 2011

7058 Alion USA Richmond, CA Develop Dry Film Solar TF 2011

7058 Alion USA Richmond, CA Clean Solar TF 2011

7178 Aselsan TR Istanbul Clean MEC Etch PCB 2012

7178 Aselsan TR Istanbul Clean MEC Etch PCB 2012

7250 Infineon D Regensburg Oxidation MacDermid Multibond Semiconductors 2012

7253 MOS D Neuweiler Clean MEC Etch PCB 2011

8034 Beta Board D Aarbergen Clean MEC Etch PCB 2012

8035 Eldos PL Wroclaw Etch alkaline Replenisher PCB 2012

8038 MB Wafertec CH Thun Clean Ultrasonic Clean Wafer Solar Wafer 2012

8041 Optiprint CH Berneck Oxidation MEC V-Bond PCB 2012

8060 Wink D Neuhaus Etch Etcher FeCl3 CM 2012

8077 Würth Electronic D Niedernhall Recycling Sigma alkaline PCB 2012

8202 Elgoline SLO Cerknica PTH OMG Shadow PCB 2013

References

Thank You

Documents

344sentation Matu YieldLine General en 121211) · Matusewicz Budowa Maszyn s.j. | | [email protected] Our SpectrumforWetProcessing Systems PCB includes: CleaningSystems (chemicalandmechanical)