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#3-Febr. 2004
Production, Process & Test Technology for the Semiconductor Industry
#3-Febr. 2004
• 1949 Founded as Karl Süss GmbH
• 1999 IPO as SUSS MicroTec AG
• 2001 Changed Company name from Karl Süss to SUSS MicroTec
• Production Sites: 5
• Employees 2003: 720
Global Overview
#3-Febr. 2004
Global Presence
•3•0•°
Dresden
MunichSt. JeoireWaterbury
TempeYokohama
Bangkok
Over 30 Sales & Service Centers
Vaihingen
Production/Sales Service Sites Worldwide
Shanghai
SUSS MicroTec HeadquartersGarching /Munich,Germany
Hsinchu
Wokingham
#3-Febr. 2004
Exposure
Substrate Bonding
Spin/Spray CoatingDeveloping
Product Offerings
Inspection Wet Processing (Cleaning, Etching, Lift-off)
Device Bonding ( Flip Chip)
Testing
Hyperlinks: Click on each productimage
Nanoimprint Lithography
#3-Febr. 2004
Spin/Spray Coater /Developer
Manual / Basic
Delta SeriesCoat, Develop
Manual & Pre-Production
Respect 600/800Coat, Develop
Automated
AltaSpraySpraycoat
Back to product offerings
Fab Automation (200&300mm)
Automated
Gamma60/80Coat, Develop
ACS200/300 PlusCoat, Develop
Lithograhy Cluster
#3-Febr. 2004
Mask Aligner
Fab Automation (200&300mm)
Manual / Basic
MJB4
Manual & Pre-Production
MA/BA 6/8
Automated
MA150/200e MA200/300Plus
Lithograhy Cluster
MA1006
Back to product offerings
#3-Febr. 2004
Inspection System
Inspection tool for verifying alignment on 2“ to 8" wafers.
DSM8
Back to product offerings
#3-Febr. 2004
Substrate Bonder / Wafer Mounter
Manual & Pre-Production
SOI300CL200 SB8e Substrate Bond Cluster
Waferbonding
Surface ActivationPrealign, Clean, FB Bond, Align,Waferbonding,
Back to product offerings
Cleaning
Pre-Production Semiautomated
Fab Automation (200&300mm)
#3-Febr. 2004
Probe Systems
300mm Systems
Shielded environments
Fully automated systems
Customized solutions
Manual lab systems
Back to product offerings
#3-Febr. 2004
Device Bonder
Low Cost Device BonderFC6
Automated Device BonderFC150
Production Device BonderFC250
Loading Alignment Placement Bonding Unloading
Component and Substrate in Bonded device out
FL
IP C
HIP
CY
CL
EE
QU
IPM
EN
T
Back to product offerings
Fab Automated Device BonderTRIAD 05AP
#3-Febr. 2004
Our Commitment Worldwide infrastructure for:
Service, applications Training, spare parts
Wide variety of after sales support programs to match production needs
Regional spare parts stocking options
Man-on-site option Applications support & process
development capability Detailed service training and
certification Operator/User training
#3-Febr. 2004
Customer List (extract)