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Chang Gung UniversityChang Gung University
2.4GHz EMP Protection Circuit with Micro Strip Filter Configuration
Liann-Be Chang1, Atanu Das1, Ching-Chi Lin1, J. C. Liu2,Yi-Cherng Ferng1, Chien-Fu Shih1 and Sheng-You Liao1
Liann-Be Chang1, Atanu Das1, Ching-Chi Lin1, J. C. Liu2,Yi-Cherng Ferng1, Chien-Fu Shih1, Sheng-You Liao1
1Department of Electronic Engineering & Green Technology Research Center, Chang Gung University, Taiwan, R.O.C.
2Department of Electrical Engineering, Ching Yun University, Taiwan, R.O.C.
1Department of Electronic Engineering &
Green Technology Research Center, Ch G U i it T iChang Gung University, Taiwan
2Department of Electrical Engineering, Ching Yun University, Taiwan
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Chang Gung UniversityChang Gung University About Taiwan
Taiwan
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Chang Gung UniversityChang Gung University Chang Gung University
Funded by Formosa Plastics Group (FPG) in 1987
FPG:Refinery, plastics, semiconductor, machinery, power plant, transportation, biotechnology, hospital, education, etc.
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,
2
Chang Gung UniversityChang Gung University Outline
IntroductionIntroductionMotivationD i d F b i tiDesign and FabricationMeasurement setupResults and DiscussionConclusionConclusion
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Chang Gung UniversityChang Gung University What is EMP?
• Electro Magnetic Pulse is a burst of electromagnetic radiation from an explosion or a suddenly fl t ti ti fi ldfluctuating magnetic field.
• EMP from a solar storm.o a so a sto
• EMP from a nuclear explosion high above the t h
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atmosphere.
4
Chang Gung UniversityChang Gung University Types of EMP
• E1 Pulse – very fast t f l EMP Itcomponent of nuclear EMP. It
is too fast for ordinary lightning protectors.
• E2 Pulse – many similarities to pulses produced by lightning.
• E3 Pulse – much slower pulse
Source: EMP Environment (MIL-STD-464, "Electromagnet Environmental Effects Requirements For Systems", http://www.tscm.com/MIL-STD-464.pdf ).
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Requirements For Systems , http://www.tscm.com/MIL STD 464.pdf ). Note log-log axes used on this graph.
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Chang Gung UniversityChang Gung University Effects of E1 Pulse
• E1 Pulse travels at 90% of the speed of light
• Peaks after 5 - 10 nanoseconds, over in 1 microsecond
• Normal circuit breakers do not work this fast.
Amplitude up to 50 000 volts/meter• Amplitude up to 50,000 volts/meter
• Will cause integrated circuits connected to cables to overheat and give false readings, be damaged or destroyed.
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y
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Chang Gung UniversityChang Gung University Purpose of EMP Protection
• The purpose of the electromagnetic pulse (EMP) p p g p ( )protection system is to protect critical electrical systems from the effect of intense electromagnetic (EM) pulseelectromagnetic (EM) pulse.
• Medical instruments are very critical.• Can not be affected by any kinds of EMP.Can not be affected by any kinds of EMP.• Therefore, We have some study on this area.
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Chang Gung UniversityChang Gung University MotivationEMP Wave front
The frequency spectrum may extend from below 1 Hz to
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The frequency spectrum may extend from below 1 Hz to above 300 MHz
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Chang Gung UniversityChang Gung University Why MSF( Microstrip Filter)?
In normal operation, signal can easily couple tothe next stage.g
When the surge intruding( in general, they arein the frequency range <300MHz) the MSFin the frequency range <300MHz), the MSF specially using high thermal conductive substrate is good enough to block the transient surge.
Material Properties
Less expensiveAl2O3(Alumina) Less expensiveMedium thermal conductivity (~20W/m·K)
AlN ( Alumina Nitride) High thermal conductivity (180~200W/m·K)
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(180 200W/m K)
Chang Gung UniversityChang Gung University Objectives
The aim of this study is to design and fabricated EMP t ti i it th ta cascade EMP protection circuit that can
suppress fast introduced over voltage surges.
The basic configuration of this circuit iscomposed of three element, the traditional
GDT d i dsurge arrester GDT and semiconductor processcompatible micro strip filter (MSF) and an ESDdevice ( we used MOV varistor here).( )
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Chang Gung UniversityChang Gung University Design and Fabrication
Circuit diagram
MSF
ESDTVS/MOV/ZenerLEMP
Pulse voltage inject Protected
Arrestor(GDT)
side
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Chang Gung UniversityChang Gung University
Component for ESD and EMPprotection
Gas Discharge Tube( GDT)• Wide use in telecom for primary protection
Hi h bilit 20 000 A• High surge capability: > 20 000 Amps • Shunt capacitance ~2 pF • Response time: < 5 microseconds
Metal-oxide varistor (MOV)• Ideal for AC power line• Ideal for AC power line• Sub nanosecond response • Up to 70 000 Amps surge
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Chang Gung UniversityChang Gung University MSF design and Fabrication• Simulation of Microstrip filter Using HFSS• Fabrication 2.4 GHz Microstrip filter on AlN
( Al i Nit id ) Al O b t t( Aluminum Nitride) or Al2O3 substrate.• Deposition of Ti (Titanium)/Au(Gold) on
both side of substrate by Electron beamboth side of substrate by Electron beam evaporation.
• Lithography and etching to make final ttpattern.
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MSF on Al2O3 MSF on AlN
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Chang Gung UniversityChang Gung University MSF design and FabricationProcess facility for AlN/Al2O3 MSF Fabrication
Lithography facility Electron Beam Evaporation system
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Chang Gung UniversityChang Gung University Measurement Setup
Measurement for Frequency response
HP 8753DNetwork Analyzer30 KH 6 GH30 KHz-6 GHz
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Chang Gung UniversityChang Gung University
Arrangement of ESD and Surge Pulse injection
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Chang Gung UniversityChang Gung University Measurement for ESD Pulse
(1GHz OSC)
ESD
Attenuator
ESD Simulator(6KV)
MOVGDT
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MSFGDT
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Chang Gung UniversityChang Gung University Measurement for Surge Pulse
EMC-PARTNER MIG-systemSurge Testers
Test spec.
1.2us/50us
4KV surge pulse
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Chang Gung UniversityChang Gung University Results and Discussion
Frequency response(MSF)S(2,1)-SimulationS(4,3)- only MSF
S(1,1)-SimulationS(3,3)- only MSFS(4,3) only MSF
S(6,5)- MSF+GDT+MOV
-20
0
S(3,3) only MSFS(5,5)- MSF+GDT+MOV
-10
0
-60
-40
dB(S
(2,1
))dB
(S(4
,3))
dB(S
(6,5
))
-30
-20
dB(S
(1,1
))dB
(S(3
,3))
dB(S
(5,5
))
2 3 4 51 6-80
freq, GHz2 3 4 51 6
-40
freq, GHz
The frequency response of MSF is not affected by adding GDT and MOV in I/P and O/P port of the MSF respectively.
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Chang Gung UniversityChang Gung University
ESD wave absorption characteristic
R id l V lResidual Voltage: GDT
12
14 ESD pulse Injected
12
14
GDT
ESD Pulse Injected12
GDT+MSF+MOV
Residual Voltage: GDT+MSF+MOV
4
6
8
10
12 p j
olta
ge(V
) Peak to peak Voltage ~12.2 V/6000V
4
6
8
10
12
olta
ge(V
)
Peak to Peak Voltage: ~11.2V/5606V
4
6
8
10Peak to Peak Voltage: ~1.04V/511V
ltage
(V)
-4.0x10-7 -2.0x10-7 0.0 2.0x10-7 4.0x10-7-2
0
2Vo
Time(sec)-4.0x10-7 -2.0x10-7 0.0 2.0x10-7 4.0x10-7
-2
0
2Vo
Time(sec) -4.0x10-7 -2.0x10-7 0.0 2.0x10-7 4.0x10-7-2
0
2Vo
Ti ( )
Pulse Injected GDT MSF+GDT+MOV
12 2V/6000V 11 2V/5606V 1 04V/511V
Time(sec) Time(sec) Time(sec)
12.2V/6000V 11.2V/5606V 1.04V/511V
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Chang Gung UniversityChang Gung UniversitySurge pulse absorption
characteristic
Surge Pulse Injected Residual Voltage: GDT Residual Voltage: GDT+MSF+MOV
MSF+GDT+MOVSurge Pulse Injected GDT MSF+GDT+MOV
4 KV 688V 396V
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Chang Gung UniversityChang Gung University Conclusion
The semiconductor process compatible MSFconfiguration is successfully fabricated andconfiguration is successfully fabricated andcharacterized in this study.
The EMP protection behaviors are also detailed The EMP protection behaviors are also detailedand proven.
The results showed that 6 KV ESD pulse and 4KV The results showed that 6 KV ESD pulse and 4KVSurge pulse input could be attenuated to a valueless than 600V and 400V respectively, which meetth VG96903’ i tthe VG96903’s requirement.
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Chang Gung UniversityChang Gung University
Thanks for your kind attention!!
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