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IEEE Catalog Number: ISBN:
CFP1359B-POD 978-1-4799-0666-6
2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2013)
Taipei, Taiwan 22-25 October 2013
SESSION 3: Advanced Packaging IChair: Shih-kang Lin (National Cheng Kung University)Co-Chair: Cheng-En Ho (Yuan Ze University )
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Topic Lead Author
EU083-1 �������������������������������������������������������������������
����������������������������� 31
Rami Haidar
�!"#$�% Heat-Resistance Study of Thermal Release Tape 35 Chieh-Yuan Chi
INDEX
Sessions
978-1-4799-0666-6/13 $31.00 © 2013 IEEE 15
����&'��$*������������������������������Chair: T.M. Lee (ITRI)Co-Chair: Jenn-Ming Song (National Chung Hsing University)
PaperCode
Topic Lead Author
AS052-1 A Novel and Green Electroless Copper 39 Andy Chow
AS050-1 The Evolution of organic solderability preservative process in printed circuit board application 43
Kti Ho Tong
TW087-1 �������������+��������������������������,��/���������'������&����6�����Applications 47
Tao-Chi Liu
978-1-4799-0666-6/13 $31.00 © 2013 IEEE 16
SESSION 7: 3D Integration IChair: Shin Hua Chao (ASE)Co-Chair: Tao-Chih Chang (ITRI)
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Topic Lead Author
AS081-1 300 mm Wafer 3D Integration Technology using Hybrid Wafer Bonding 51 Kazuyuki Hozawa
TW028-1 �����������'������������������;���������&���;�����/�������������
SESSION 8: Thermal Management IChair: Chien-Yuh Yang (National Central University)Co-Chair: Shung-Wen Kang (Tamkang University)
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Topic Lead Author
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SESSION 9: Modeling, Simulation & Design IChair: M. Y. Tsai (Chang Gung University)Co-Chair: Yu-Po Wang (SPIL)
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Topic Lead Author
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SESSION 10: Green Materials & ProcessQ��*�}��������~��;�Co-Chair: LC Chen (DuPont Taiwan Co., Ltd)
PaperCode
Topic Lead Author
�!%$^�% +�����x��������`����������������]��+�����������F�������������;�]�Dielectric Properties 109
�������������
TW098-1 ��&��;���F&��{;����Q+����'F�V;�&'���'F���Q+&�/�'&�&Q�F���F����
���Q'��VQ�&
SESSION 12: Advanced Packaging IIChair: Hsiang-Chen Hsu (I-Shou University)Co-Chair: K. M. Chen (UMC)
PaperCode
Topic Lead Author
AS058-1 �����������������{����������������������������{�����;��������6������`���������Element Analysis 120
Nobuhiro Anzai
TW036-1 /����F���������������������������`�������������������� 124 Cheng Kai Chung
TW109-1 ����Q�&
SESSION 13: Interconnections & NanotechnologyChair: De-Shin Liu (Nationnal Chung Cheng University)Co-Chair: Chih Chen (National Chiao Tung Univ)
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Topic Lead Author
AS008-1 Effects of Wire Type and Mold Compound on Wearout Reliability of Semiconductor ������������{/������� 144
Gan Chong Leong
�!"%$�% �������������������������������������&������������� 149 CHIA YEN LEE
TW127-1 �����������������������������������!���{����������������&/{� 152 Huang-Kang Tseng
TW132-2 An Investigation on Nanoscale Bondability between Cu-Al Intermetallic Compound 158 HSIANG-CHEN HSU
TW152-1 +������������������������!��������+�����x������&Q�������� 162 Hsing-Hua TSAI
978-1-4799-0666-6/13 $31.00 © 2013 IEEE 22
����&'��%$*�������������������������&&Chair: Tz-Cheng Chiu (National Cheng Kung University)Co-Chair: Yu-Jung Huang ( I-Shou University)
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Topic Lead Author
TW132-3 ���������������������������������F�$��Q{��������]��Q��`��+�����������
SESSION 15: Test & QualityChair: Jeffrey Lee (IST-Integrated Service Technology Inc.)Co-Chair: Jerry Huang (Tripod Technology Co.)
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Topic Lead Author
AS070-1 F��������Q�������������������������Q�66���Q�����;����������������}������;x���Using Permanent Magnet 186
Naoya Tada
978-1-4799-0666-6/13 $31.00 © 2013 IEEE 24
SESSION 17: 3D Integration IIChair: R. S. LEE (ITRI)Co-Chair: Chang-Chun Lee (Chung Yuan Christian University)
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Topic Lead Author
�V"?$�% �{F&Q�&'���;�Q�F&Q;�Q+FQ��F&>�&'�����F�;&{&;&����V��'���F�&;;��;�Q�F'�;�������F���Q'���F��+F'V/+��&;&Q'��
SESSION 18: LED & Thermal ManagementChair: Jen-Dong Hwang (TTMA) Co-Chair: Chien-Yuh Yang (National Central University)
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Topic Lead Author
AS101-1 ����������+����6������6������������]������'�����]������������������������ 211 Risako Kibushi
�!""$�% The Analysis of the Thermal Resistance Structure of LEDs by Measuring Its Transient ���6��������
SESSION 19: Modeling, Simulation & Design IIIChair: Tz-Cheng Chiu (National Cheng Kung University)Co-Chair: Ben-Je Lwo (National Defense University)
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Topic Lead Author
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SESSION 20: HDI & EmbeddedChair: Eric Hsu (Nan Ya PCB Corp)Co-Chair: Anderson Cheng (ITEQ)
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Topic Lead Author
V�"$q�% &��������������������������������+���������&���������������������������Additive processing 241
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TW157-1 �����������Q�66����������6������������������+�&��������������66������ 245 Ming-Yao Yen
978-1-4799-0666-6/13 $31.00 © 2013 IEEE 28
POSTER (PCB)
POSTER (PACKAGING)
Venue: 5F, Taipei Nangang Exhibition Center, Taipei, Taiwan
PaperCode
Topic Lead Author
TW006-1 Thermal Stability of Hydrogen Annealed Aluminum Doped Zinc Oxide Films Investigated by Thermal Desorption Spectroscopy
Shang-Chou Chang
TW009-1 Nugget Shape Control in Resistance Spot Welding P. S. Wei
TW011-1 WiFi SiP Module Using IPD Rx Balun Applications Hin-Han Chuang
TW031-1 Novel Assembly Framework of Bi-Layered Molding Materials for 3D-ICs Packaging Lee Chang-Chun
TW042-1 Electrical Model Analysis and Measurement of TSV to TSV Coupling Capacitance Yang Shiuan-hau
TW061-1 CU WIRE HAST FAIL MECHANISM INVESTIGATION FOR BGA PACKAGE Chih Hung Chang
TW062-1 Cu wire Development for Thin QFN Package using Die Attach Film (DAF) Ho-Chin Hsieh
TW069-1 Film Over Wire (FOW) Selection for Copper Wire Application Ming-Wei Lee
TW078-1 Molded Underfill for Flip Chip Package Chen Yu-Kai
TW079-1 Study on thermal conductive BN/VGCF/polyimide resin composites Chin Si-Yi
TW095-1 Effects of Annealing on Sn Whisker Formation: Role of Cu Alloy Seed Layer Wahyu Diyatmika
TW097-1 TSV-less BSI-CIS Wafer-Level Package and Stacked CIS Module Zhi-Cheng Hsiao
TW107-1 UNDERFILL ADHESION ENHANCEMENT VIA OPTIMIZATION OF PLASMA TREATMENT FOR 3DIC
Chi Tung Yeh
TW115-1 Fabrication of Robust Polyaniline Thin Film Electrodes on the Surface of Elastomeric Poly(dimethylsiloxane) for Polymeric MEMS Applications
Kuan-Hsun Li
TW115-2 Investigating the Influence of Various Organosilanized Substrates and Dopant Species on the Properties of Transparent Polypyrrole Thin Films Deposited on Glass Surfaces
Kuan-Hsun Li
TW144-1 High Thermal Conductivity Underfill study for fine pitch Cu pillar bump Huang Huei-Nuan
TW084-1 Cu Pillar Bump-on-Trace (BoT) Design for Ultra Low-K Packaging Harold Wu
TW084-2 Bill of Material and Geometry on FCBGA Packaging Warpage Impacts Harold Wu
TW158-1 The Improvement of Thermoelectric Element and People’s Livelihood Applications Kuen-Shan Jaw
AS051-1 Characterization and performance study of packaged micropump for drug delivery Vinaya kumar K.B
AS073-1 Packaging of Polyvinylidene fluoride nasal sensor for biomedical applications Roopa Manjunatha
978-1-4799-0666-6/13 $31.00 © 2013 IEEE 30