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1Electrical and Computer EngineeringElectrical and Computer Engineering
Cam ProctorRamsey Khudairi
Tom GilbertChad Young
Project OrionTekBand
2Electrical and Computer Engineering
Outline
Motivation Design Band & Mold Microcontroller Bluetooth Battery Memory Q&A
3Electrical and Computer Engineering
Motivation – Cellular Phone Interface
Call, Text, & Emergency Notification• Uses:
• During Meetings• In Class• On the Road
• Will lead to: • Safer Driving• Less Interruptions
4Electrical and Computer Engineering
Motivation – Wireless Storage
Wireless Data Storage• Uses:
• On the run• During group projects
• Will lead to: • Protection from Identity Theft• Fewer lost files• Greater Convenience
5Electrical and Computer Engineering
Design
Goals:• Interface with Cell Phone to alert user of calls and
messages• Interface with PC to program the band• Interface with PC as wireless storage device• Maintain Fashion & Style
Our wristband will contain:• Microcontroller• Bluetooth module• MicroSD card• Lithium ion battery
6Electrical and Computer Engineering
Durability Elasticity Degradation Cost
Urethane Rubber high low none second least expensive
Latex Rubber low high rots from long exposure to
sweat
least expensive
Silicone Rubber high high none most expensive
The Band-Materials
7Electrical and Computer Engineering
The Band-Construction
• Target Size: 200mm x 5mm x 22mm• Two-Part Silicone Rubber
– 1:1 Ratio – Pour in mold– Cure time of a few hours
• Can be bought at any local craft store• ~$20/lb.
8Electrical and Computer Engineering
The Mold
• Silicone– Rubber-To-Rubber mold release
• Master mold – Mold poured around wooden band
• Other options– Putty– www.amazingmoldputty.com
10Electrical and Computer Engineering
Microcontroller Considerations
Form factor• Must be small enough to fit inside band
Low power• Running continuously
Interface with peripherals• I/O for user control• Interface with Bluetooth
module• Read/Write to storage
media
11Electrical and Computer Engineering
Microcontroller Capabilities
I/O• 3 pins to drive single tri-color LED• Possible analog inputs for gyro, microphone, etc.
SPI (Serial Peripheral Interface)• Read/Write MicroSD card• Communicate with Bluetooth module (KC-21)
UART (Universal asynchronous receiver/transmitter)• Data transfer from Bluetooth module (KC-21, BTM-182)
12Electrical and Computer Engineering
Microcontroller SolutionsPIC16F1827 (Microchip)
PIC16F1824 (Microchip)
PIC16F1938 (Microchip)
C8051F531A-IM (Silicon Laboratories)
ATTINY2313-20MU-ND (Atmel)
SPI 2 1 1 1 1
USART 1 1 1 1 1
I/O Pins 16 (18 pin) 12 (14 pin) 25 (28 pin) 16 (20 pin) 18 (20 pin)
ADC 10 bit 10 bit 10 bit 12 bit n/a
Program Memory
7kB, flash 7kB, flash 28kB, flash 8kB, flash 2kB, flash
Size 4x4mm 3x3mm 4x4mm 4x4mm 4x4mm
Power 30nA standby, 100μA @1MHz
20nA standby typical, 600nA operational
60nAStandby, 150μA @1MHz
.1mA operational
<.1μA standby, 230μA @ 1MHz
Cost $1.75 $1.40 $2.25 $2.55 $2.65
13Electrical and Computer Engineering
Best Candidates
PIC16F1827 (Microchip)• Good middle ground• 2 SPI ports• Low power• Small size, multiple chips…
PIC16F1938 (Microchip)• Large program memory• Small form factor• Higher cost• Greater power consumption, critical
14Electrical and Computer Engineering
PIC16F1827 (Microchip)• Appears to be the ideal candidate
• Low power and cost• Small size, possibility for >1 chip in bracelet• 2 SPI ports and USART
• Start with this chip, others as fallback• Middle of the road – good starting point
Selecting a Microcontroller
16Electrical and Computer Engineering
Bluetooth modules
Module Dimensions Power Transmit Rate Range CostLMX9830* 9x6x.86mm 65mA 0.704Mbps 10m 17.15
WRL-09913 1.4x2.5cm 58mA 0.704Mbps 10m 18.95
KC-21 27x15x2.5mm 90mA 3Mbps 20m 36.00
CSR1000** 5x5x0.6mm 60mA 24Mbps 50m NA
* Does not come with an antenna** Not yet available on the market
17Electrical and Computer Engineering
Battery Considerations
Form factor• Small enough to fit inside band (< 20mm wide x 2mm thick)
Capacity: 100mAh• Approx. 100mA during read/write to MicroSD• Approx. 90mA during Bluetooth transmit
Must be rechargeable• Wireless Charging
Strategy: Multiple Small Batteries
18Electrical and Computer Engineering
Battery Options
Coin Cell:
Thin Film Surface Mount:
Module Voltage Capacity Dimensions Cost
ML-2020/F1AN 3.0V 45mAh 20mm diam x 2mm thick $2.68
ML 1220/F1AN 3.0V 17mAh 12.5mm diam x 2mm thick $2.38
MS920SE-FL27E 3.1V 11mAh 9.5mm diam x 2mm thick $2.05
MS621FE 3.0V 5mAh 6.8mm diam x 1.5mm thick $0.94
Module Voltage Capacity Dimensions Cost
CBC050-M8C-TR1 3.8V 50uAh 8mm x 8mm ultrathin $3.82
19Electrical and Computer Engineering
Battery Form Factor Considerations
50mm(1/4 of total band length)
ML6216.8mm5mAh
MS920SE9.5mm11mAh
MS920SE12mm17mAh
CBC0508mm50uAh
ML202020mm45mAh
20mm
20Electrical and Computer Engineering
4GB Memory – Possible Add-on
MicroSD• Small – 11mm X 15mm X 1mm• Voltage Range: 2.7 – 3.6V• Clock Rate: 0 – 25MHz• Supports Serial Peripheral Interface (SPI)• Assuming 25MHz clock, Read/Write time: 40s/Gb• Power:
• Sleep – 150uA max• Read – 100mA max• Write – 100mA max
• Cost: $3 - $5• Performance: -25oC to 85oC
21Electrical and Computer Engineering
MicroSD Communication
Serial Peripheral Interface (SPI) protocol• Data clocked with clock signal (SCK)• Clock signal controls when data is changed and read• SPI is Sychronous
• Data rate will change to accommodate changing clock rate
• SSP or MSSP module in PICmicro device allows SPI
Pin # Name Type Description
1 RSV Disconnected
2 CS Input Chip Select
3 DI Input Data In
4 Vdd Supply Supply Voltage
5 SCLK Input Clock
6 Vss Supply Supply Ground
7 DO Output Data Out
8 RSV Disconnected
22Electrical and Computer Engineering
TimelineOct 17-23 Oct 24 - 30 Oct 31 - 6 Nov 7 - 13 Nov 14 - 20 Nov 21 - 27 Nov 28 - 4
Battery - Tom
Purchase
Test & Reconsider Components
Integrate
Microcontroller - Cam
Purchase
Test & Reconsider Components
Integrate
Bluetooth - Chad
Purchase
Test & Reconsider Components
Integrate
Band Construction - Ramsey
Purchase Supplies
Build Protype Band
Test & Evaluate
Construct Prototype Mold
Memory - Tom & Ramsey
Purchase Card
Test Power Consumption
Integrage or Eval Other Options
MDR
23Electrical and Computer Engineering
Budget
Band Construction• Supplies for 10 Bands & Mold: $60• Rubber to rubber mold release: $10• 100 Magnets: $20• Total: $90
Bluetooth• Module: $40• Development Kit: $100-$150 (depending on module)• Total: $140-$190
Microcontroller• Module: $1.20• Breakout Board & Dev Kit: $165
MicroSD• Module: $3-$5
24Electrical and Computer Engineering
Conclusion
Our wristband will contain:• Microcontroller• Bluetooth module• microSD card
The final product will:• Interface with Cell Phone to alert user of calls and messages• Interface with PC to program alert preferences• Possible Addition: Interface with PC as wireless storage device
Key constraints: Power and Size
Deliverables by MDR:• Prototype of electronics working on board• Prototype wristband w/o HW