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Dicing Die Bonding

Wire Bonding

Forming & Marking

Molding

The wafer isseparated intochips by adiamond grind-stone. A fullyautomatic dic-ingsaw is used fordicing.

The separatedIC chip (die) isbonded into thecenter of alead frame orpackage.

The pads on theIC chip andadjoiningterminals on thelead frame areconnected, one-by-one, with goldwire.

The chip is sealed with amacro-molecule plastic, likeepoxy resin, thus finishing theplastic package container.

The lead frame is cut,and leads are bent thusforming the package.The manufacturer‘sname and modelnumber are stamped ontop.

Chip Epoxy Resin ChipChipChip Gold Wire

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2005

2008

2011

2014

Low Cost Cost (Cents/pin)

0.34-0.77

0.29-0.66

0.25-0.57

0.22-0.49

0.19-0.42

Power (Watts)

2.0

2.4

2.5

2.6

2.7

I/O count

101-365

109-395

160-580

201-730

254-920

Performance (MHz)

100

100

125

125

150

High Performance Cost (Cents/pin)

2.66

2.28

1.95

1.68

1.44

Power (Watts)

129

160

170

174

183

I/O count

2248

3158

4437

6234

8758

Performance (MHz)

800

1000

1250

1500

1800

PACKAGING ROADMAP

M/7/(5.1?(

Challenges in Packaging for the industry- Roadmap topics

!  Process Integration - Both front end and back end processes

!  Device scaling !  Electrical issues- signal integrity; RF and analog/mixed !  Photolithography- bigger challenge to Moore’s law !  Masks and light source for patterning !  New materials- high conductivity and low dielectric permittivity

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