M53 · SAC305 3000cyc.SSAC305 3000cyc.AC305 3000cyc. SAC305 M53 Initial stage Temperature cycle Crack has grown during soldering

Sh-Semi12-01E

Headquarters:Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan Phone:(81)3-3888-5151, Fax:(81)3-3870-3032 www.senju-m.co.jp

Sh-Semi12-01E

M53

□ Ensures strength even on a small surface

Surface area (mm2)

□ Comparison of thermal fatigue resistance using a chip capacitorShear strength (N)

□ Comparison of cross sectional photographs

3000cyc

Chip

ChipChip

3000cyc

Chip

□ Comparison of thermal fatigue resistance using a chip resistor Using a 3216 chip resistor and a large-sized pattern Using a 3216 chip resistor and a medium-sized pattern

Using a 3216 chip resistor and small-, medium- and large-sized patterns

M53 series solder paste that is capable of being applied tosmall-sized and lightweight on-board products

●

●

●

Features

Exhibits superior thermal fatigue resistance and maintains high bond strength even under severe environmentsPrevents crack propagation due to thermal fatigue and maintains electrical conductivity after long term useEnsures high quality even in products with small-sized and lightweight designs having small land areas

Shear strength (N)

□ Comparison of thermal fatigue resistance using a chip capacitor□ Comparison of thermal fatigue resistance using a chip resistorUsing a 3216 chip resistor and a large-sized pattern Using a 3216 chip resistor and a medium-sized pattern

● Ensures high quality even in products with small-sized and lightweight designs having small land areas

Specifications

Larger structurecompared to that of

SAC305

Shear strength (N)

Temperature cycle (cyc.)M53 containing Bi and In exhibits a much lower decrease in

strength compared to SAC305

90

80

70

60

50

40

30

20

10

0

M53M53M53

TCT;-40/+124℃(30min)

450040003500300025002000150010005000

SAC305SAC305SAC305

Temperature cycle (cyc.)M53 containing Bi and In maintains superior shear strength

compared to SAC305

TCT;-40/+124℃(30min)

3500300025002000150010005000

70.0

60.0

50.0

40.0

30.0

20.0

10.0

0

M53M53M53

SAC305SAC305SAC305

1

L M S

TCT;-40/+125℃（30min)15225335

90.0

80.0

70.0

60.0

50.0

40.0

30.0

20.0

10.0

0.0

M53 InM53 InM53 In

M53 3000cyc.M53 3000cyc.M53 3000cyc.

SAC305 3000cyc.SAC305 3000cyc.

SAC305 InSAC305 InSAC305 In

SAC305 3000cyc.SAC305 3000cyc.SAC305 3000cyc.

SAC305 M53

Initial stage

Temperaturecycle

Crack has grownduring soldering

Solder alloy with greater strength and stress relaxation properties

Temperaturecycle

No cracks

Initialstage

Sh-Semi12-02E


Sh-Semi12-02E

●

●

"ES-100SA" which prevents whiskers due to corrosion Patent: 4325746

ES-100SA

●

Specifications

Whisker

□ Prevention of Sn corrosion by "ES-100SA" flux containing a corrosion inhibitor

□ Prevention of corrosion product generation by the corrosion inhibitor

□ Prevention of whisker generation by the corrosion inhibitor

85℃ 85%RH 1000h

The absorption film protects Sn from corrosivesubstances such as O, Br, Cl,organic acids and oxygen.

Solder (Sn)

Br,CIO

O,Br,CI□ Whiskers due to corrosion

Corrosion (oxidation) → Volume expansion → Generation of internal stress Whisker

Solder (Sn) Solder (Sn) Solder (Sn)

Internalstress

Corrosion(oxidation)

85℃ 85%RH 1000h

Number of whiskers

Conventional product

10

9

8

7

6

5

4

3

2

1

010-20 20-30 30-40 50-6040-50 60-70 70-80 80-90

ES-100SA

Whisker

Sn corrosion

□ Whiskers due to corrosion

Whisker length (μm)

Prevents whiskers that are generated due to corrosion under high temperature, high humidity environments ・The corrosion inhibitor added to the flux adheres to the solder surface and prevents oxidation under high temperature, high humidity environments

・Ensures solder wettability, while reducing whisker-causing halogen

・A flux containing an oxidation inhibitor that reduces the generation of whiskers

Suitable for use without cleaning, as the flux residue is noncorrosive and highly reliable

●

ES 100SA which prevents whiskers due to corrosion"ES-100SA" which prevents whiskers due to corrosion Patent: 4325746Patent: 4325746

WhiskerPrevents whiskers that are generated due to corrosion under high temperature, high humidity environments

Features

Br,CIO

Internal stressInternal stressInternal stress Internal stressInternal stressInternal stress

organic acids

The corrosion inhibitor adheres to the solder surface physically or chemically and forms an absorption film, preventing corrosive substances such as Br, Cl, and O from coming into contact with the solder surface.

Absorption film

(hydrophobic group)

(polar group) Mechanism of Sn corrosionprevention by the corrosioninhibitor

Solder

Pad or electrode

Solder

Pad or electrode

Corrosionproduct

Flux not containing a corrosion inhibitor ES-100SA

Sh-Semi12-03E

Sh-Semi12-03E


Solution for problems in power device packaging

Uniform thickness Reduction of voids High-quality alloy

□ Schematic diagram of a power module

HQ

□ Good joints and a reduction of voids were realized by developing Ni balls and a sheet-forming technique

□ Good solder wettability is maintained by preventing surface oxidation through sheet formation using a unique technique.

Crack dueto incline

Solder

"Preform containing Ni balls" that promises excellent heat dissipationcharacteristics in horizontal packaging

●

●

● Prevents cracks due to solder thickness or incline, whilerealizing excellent heat dissipation propertyExhibits an excellent heat dissipation property by ensuringa uniform solder thickness and reducing voids Realizes bare chips without inclines, enabling wire bonding with high reliability

Preform containing Ni balls that promises excellent heat dissipation"Preform containing Ni balls" that promises excellent heat dissipationcharacteristics in horizontal packagingcharacteristics in horizontal packagingh i i i h i l k i

● Prevents cracks due to solder thickness or incline, while

Features

Solder-Ni interface

Unique technique

Void

Prevents generation of solder cracks and exhibits an excellent heat dissipation property

Solution for problems in power device packaging

Uniform thickness Reduction of voids High-quality alloy

□Schematic diagram of a power module

●a uniform solder thickness and reducing voids Realizes bare chips without inclines, enabling wire bonding with high reliability

Specifications

Solder

Semiconductorchip

Insulatingsubstrate

Heat sink

Development of Ni ballswith a uniform sphere diameter

Development of a uniquesheet forming technique

Development of various alloysaccording to purpose

Cracks are generated in thinareas during thermal cycles

Increase of voids↓Deterioration of electrical resistanceand heat dissipation property

Selection of an alloy thatwithstands severe environments

□ Excellent heat dissipation

Chip has an incline, making the solder thickness uneven.

Ni balls secure the standoff height from the substrateto components.

●Without Ni balls

●With Ni balls

Ni ball

Substrate

Chip

Conventionalproduct

HQ(Developedproduct)

Wettability Void

Good wettability Few voids

Material

Conventionalproduct

HQ(Developedproduct)

An alloy layerAn alloy layerisnisn’t formedt formed

An alloy layerAn alloy layeris formedis formed

An alloy layerisn’t formed

An alloy layeris formed

Many voidsMany voids

Few voidsFew voids

Many voids

Few voids

Spherical formSpherical formSpherical form

The air gap in the crack inhibits thermal conductivityand reduces heat dissipation.

Crack due tosolder thinnessPreform

Bare chip

Good heat dissipation

Ni ball

Technique

Sh-Semi12-04E

Sh-Semi12-04E


□ Cracks on flux become the cause of migration

Ion migration

Crack

Water passage in cracksor breakage

Migration

Migration

Short circuit dueto migration

Water passage is formedin cracks or breakage

Water

Voltageapplication

Dewcondensation

Flux residueTemperature

cycle

Cracks or breaking occur

Occurrence of cracksor breakage

Solder

Soldering

Features

●

●

● No cracking of flux residue occurs even under environment with rapid temperature changes, such as in on-board equipment.Flux residue with high adhesiveness and water repellency prevents the occurrence of migration.Excellent for laser soldering, prevents flux spattering peculiar to laser soldering

MACROS

"MACROS" that prevents migration

□ Cracks on flux become the cause of migration

Water passage in cracksFl id

● Excellent for laser soldering, prevents flux spattering peculiar to laser soldering

Specifications

Flux scattering is preventedby viscosity suppression.

Ion migrationIon migrationIon migration

CrackCrackCrackFlux residueFlux residueFlux residue

When condensed water remains,ion migration easily occurs.

1.00E+04

1.00E+06

1.00E+08

1.00E+10

1.00E+12

1.00E+14

0 2 4 6 8 10

MACROS

[Test condition]

Temperature: 121°C

Humidity: 100% RH

Atmospheric pressure: 2 atm

Applied voltage: 50 V

Measuring voltage: 100 V

Measurement time: every 0.5 h

Applied voltage mode: DC

MACROS

□ Comparison of flux scatteringin laser soldering

Insu

latio

n re

sist

ance

[Ω]

Time [h]

□ Provides good break-off, ensuring good drag soldering

MACROS


Substrate only (Blank)



Migration does not occur becausewater does not penetrate easily.

Migration occurs in a short periodof time because water penetrates easily.

MACROS MACROS

□ SMIC has developed MACROS, which prevents the occurrence of cracks in flux residue during temperature cycle tests.

JIS Grade A product

Temperature cycle test ; -30℃/110℃　2000cyc．

No cracks

Cracks

Water drop test 5 V of voltage applied

JIS Grade A product

□ Ion migration did not occur during a water drop test with when using MACROS.

Ion migration occurs at cracks. No cracks or ion migration occur

Sh-Semi12-05E

Sh-Semi12-05E


□ Quality equivalent to that of the M705 series, ensuring high quality with low silver content

□ Approx. 30% reduction in production tact time achieved by the SP series

Production efficiency is increased by shorteningthe reflow time.

M40 & M46

M40 & M46 SP series that enables maximum cost reduction

Achieves high quality with low silver contentAchieves quality characteristics equivalent to those of the M705 series by using lower amounts of precious metals, which are rising in price

Does not require profile changesRealizes packaging under the same conditions as those of the M705 series by lowering the melting point, significantly reducing production costs

Enables high-speed printingRealizes solder paste that withstands high-speed printing through the application of ourexpertise in rheology, making a large contribution to the improvement of production efficiency

Enables short time reflow solderingRealizes short reflow time through our outstanding organic synthesis technology, contributing to a significant improvement of production efficiency

Stable production yieldAchieves high quality through our long-accumulated comprehensive technical capabilities, ensuring a constant high production yield

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M40 & M46 SP series that enables maximum cost reductionM40 & M46 SP series that enables maximum cost reduction

Achieves high quality with low silver contentAchieves quality characteristics equivalent to those of the M705 series by using loweramounts of precious metals, which are rising in price

●

Features

□Quality equivalent to that of the M705 series, ensuring high quality with low silver content

y qy q

Stable production yieldAchieves high quality through our long-accumulated comprehensive technical capabilities, ensuring a constant high productionyield

●

Specifications

External stress

External stress

Ｍ40＆Ｍ46

90

80

70

60

50

40

30

20

10

00 100 200 300 400 500 600 700 800 900

1Ag M401Ag M401Ag M40

0.3Ag M460.3Ag M460.3Ag M46

3Ag M7053Ag M7053Ag M705

0.3Ag SAC03050.3Ag SAC03050.3Ag SAC0305

Temperature cycle condition: -40 - + 85°C　Hold time: 30 minSubstrate surface treatment: Cu + OSP Mounted component: 3216 chip resistor

Temperature cycle (cyc)

Shear strength (N)

Comparison of thermal fatigue resistance of each alloy

□ Achieves high quality through solid solution strengthening

Compensation is made for strength degradation due to decreased Ag by the effect of solid solution strengthening from the addition of Bi and In.

Pure metal (Sn)Defect

Dislocation, deformation

Solid solution strengthening

Suppresses deformationby incorporating foreign atoms

Transfer condition after high speed printing (150 mm/s)

Ensure high quality,even with a short reflow time

Approx. 45% reduction

Conventional product(Print failure is observed in some dots)

SP series(No print failure is observed)

0.4 mm Pitch BGA Opening 200 um/Mask thickness 100 um

Fine powder Printing condition at 150 mm/s

0.4 mm Pitch BGA Opening 200 um/Mask thickness 100 um

High level rheology technology and fine sphericalpowder has enabled high speed printing.

□ The SP series solder paste capable of high speed printing

□ The SP series solder paste capable of short-time reflow solderingRealizes short reflow time through our outstanding

organic synthesis technology

Conventional Pb-free solderProfile for the SP series

Temperature

Time

Chip component Shield case

Ensures sufficient solderability

Ensures sufficient joint performance

Formation of an interface alloy layerProduction tact time (sec)

0 50 100 150 200 250 300 350 400 450

Currentproduct

M40-SPseries

Printing

Mount Reflow

Mount Reflow

Printing tact timeMounting tact time Reflow tact time

Approx. 30%reduction

Sh-Semi12-06E

Sh-Semi12-06E


□ PoP Packaging using NSV300

NSV300

Transfer paste for 3D PoP (Package of Package)packaging M705- NSV300

●

●

●

Possesses excellent transferability and significantly reduces contact non-wet failures in ball-to-ball stackingAccommodates PoP and TMV packaging and realizes excellent solderabilityRobust against warping, achieves higher performance than that of conventional products while being halogen-free

Transfer paste for 3D PoP (Package of Package)Transfer paste for 3D PoP (Package of Package)packaging M705- NSV300packaging M705 NSV300

● Possesses excellent transferability and significantly reduces

Features

● Robust against warping, achieves higher performance than that of conventional products while being halogen-free

Specifications

Solves contact non-wet failures in ball-to-ball stacking

□ NSV300 provides excellent solder transfer in specific amounts

□ Realizes 0% contact non-wet failure rate through the intervention of NSV300

Solder paste

Flux

Heating

Heating

Joint with flux intervention Contact non-wet failure rate = 2%

Joint with NSV intervention Contact non-wet failure rate = 0%

Transfer1 Transfer2 Transfer3

Transfer1 Transfer2 Transfer3 Mount JointPrint

Mount JointPrint

Insufficient solder amount

Conventionalproduct

Contact non-wetfailures are observed

NSV300Contact non-wet

failures are ignificantly reduced

NSV300intervention

Fluxintervention

Solder printing paste lacking transferability

NSV300 with excellent transferability

Sufficient solder amount

Contact non-wet pastContact non-wet pastContact non-wet past

Sh-Semi12-07E

Sh-Semi12-07E


□ Automatically mounts chip solder, which melts simultaneously with solder paste

□ For reinforcement of reflow solder joints of through-hole components

□ For joint reinforcement of large components

Air enters when the suction ace is curved,weakening the suction force.

No air enters when the suctionface is flat and the suction face is strong.

Printing Joint with an insufficientamount of solder

Chip solder

"Chip solder" for lands where a lack of solder is anticipatedChip solder for lands where a lack of solder is anticipated"Chip solder" for lands where a lack of solder is anticipated

Features

●

●

●

They come in tape and reel packaging which allows simultaneous automatic placement on surface mount devices.Melts in tandem with solder paste, requiring no additional solderingProvides an appropriate amount of solder to ensure high connection reliability

□ Automatically mounts chip solder, which melts simultaneously with solder paste

y py □ For joint reinforcement of large components

● Provides an appropriate amount of solder to ensure high connection reliability

Specifications

y

Solder pasteprinting

Componentmounting

Reflow Chip solder

Chip soldermounting


Componentmounting

Reflow

Componentmounting

Land Solder paste


LargeLargecomponentcomponentLarge

component

Chip solder

Solderingcomplete

Solder is supplemented with chip solder Solder is supplemented with chip solder

□ For joint reinforcement of shield cases

l

±0.05

±0.05

±0.1

±0.1

±0.1

0402

05025

0603

1005

1608

±0.05

±0.05

±0.1

±0.1

±0.1

w

±0.05

±0.05

±0.05

±0.05

±0.05

t

□ Improves mounting precision by smoothing the suction face

Chip solder

Air Air

Chip solder witha smoothsuction face

Smoothing of thesuction face

Improvement ofmounting precision

* Smooth suction face design is available in sizes smaller than the 0603-size type* Patent pending

□ Chip solder dimension tolerance(unit: mm)

Conventional methodJoint with an insufficientamount of solder

Solder

Shield case

Solderpaste

Printing + mounting Joint with a sufficientamount of solder

SolderChipsolder

Shield caseJoint with a sufficientamount of solder

Conventional method

Solder paste Inserted component

Printing ReflowPrinting Joint with an insufficient amount of solder

Joint with aninsufficient amount

of solder

Chip solder Solder paste Inserted component

Printing + mountingSolder paste

Printing + mounting Reflow Joint with a sufficientamount of solder

Joint with a sufficientamount of solder

Reflow

Reflow

Solderpaste

The 0402 size type is available for those devices where minimal solder connection is expected.

Sh-Semi12-08E

Sh-Semi12-08E


µ

µ

□ Composition

M61

M61 solder ball with high drop impact resistance

●

●

●

Solder balls with excellent drop impact resistance Accommodates fine pitch connections, high density connections, and high-quality packagingAccommodates every type of surface treatment material

M61 solder ball with high drop impact resistanceM61 solder ball with high drop impact resistance

● S ld b ll ith ll t d i t i t

Features

□ Composition

●connections, and high-quality packagingAccommodates every type of surface treatment material

Specifications

Productname Alloy composition

Meltingtemperature(℃)

Solid phase Liquid phase

For products with high risk of being dropped, such as mobile devices

The diffusion layer has been made thin,fine and smooth by adding Ni.

Cumulative failure InIn (1/[1-F(t)])

Ag content : %

Sn-3.0AgSn-1.0Ag

2.3%

□ Aims to achieve the stress absorption effect of bulk solder through material softening

Eutectic phase (Ag3Sn Cu6Sn5 compound)Vickers hardness (0.49 N/30 sec)

Hard

Soft

20

17.5

15

12.5

10

7.5

50 1 2 3 4 5

Sn phase

Strength

Ag concentrationLow High

M61

M705

□ Fracture surface observation

M705 fractures at the joint interface,and M61 fractures within the bulk solder

Drop NumberDrop Number Drop Number

Electrolytic Ni/Au Electroless Ni/Pd/AuCu-OSP

After 10 drops After 5 dropsAfter 20 drops

Electrolytic Ni/Au Electroless Ni/Pd/AuCu-OSP

After 170 drops After 330 dropsAfter 120 drops

Ｍ705（Sn-3.0Ag-0.5Cu）Ｍ61（Sn-1.0Ag-0.75Cu-0.07Ni）

Thick diffusionThick diffusionlayerlayerThick diffusionlayer

M61M61M61Thin and smoothThin and smoothdiffusion layerdiffusion layerThin and smoothdiffusion layer

M61M61M61

Thick diffusionThick diffusionlayerlayerThick diffusionlayer

M705

M705M705M705

Large diffusionLarge diffusionlayerlayerLarge diffusionlayer

□ Concentration of stress is avoided through property modification of the joint interface by adding elements and optimizing the amount to be added.

Reflow Cooling

Diffusionvelocity(vector)

Cu(PCB Side)

PKG Side(Cu,Ni/Au etc..) PKG Side(Cu,Ni/Au etc..)

Cu(PCB Side)

PKG Side(Cu,Ni/Au etc..)

Cu(PCB Side)

Sn

Cu

Ni

Schematic diagram of the joint process

□ Drop test resultSurface treatment: electrolytic Ni/Au PKG surface treatment: Cu-OSP PKG surface treatment: electroless Ni/Pd/Au

Cumulative failure (t)(%)





The year 2003 The year 2013

Sh-Semi12-09E

Sh-Semi12-09E


Cu Cored Balls, Copper Balls

Dreamlike innovation for 3D packagingDreamlike innovation for 3D packagingDreamlike innovation for 3D packaging

Features

●

●

●

Ensures standoff height in 3D packagingFeatures tight spherical diameter tolerance and high sphericity, while realizing highly reliable 3D packaging Promises high electrical conductivity and electromigration resistance resistance

Specifications

Cu core ball (spacer)

□ Cu cored solder balls ensure space and accommodate small pitches

PCB

SolderThe solder meltsand forms a joint.

The shape of thecopper ismaintained.

Copper ball

Flux

Mounting Reflow

PCB PCB

□ The solder forms a joint, and the copper ball secures a consistent height.

□ Specifications

PKG

PCBPCB

PKG

PCB

PKG

Solder ball

Cu cored ball

Superior electromagneticresistance

Secures adequate space

Inclination

Short

PCB

PKG

Cu has good thermalconductivity.

PCB

PKG

PCB

PKG

Electromigration Securing of spaceHeat

dissipation

Bump

Shear tool

300um/s

12

10

8

6

4

2

0

7.247.287.24

□ The same shear strength as that of a BGA solder ball

(Unit: N)

Cu core + flux Cu core + M705 M705 ball

Cu ballCu ball

Solder platingSolder plating

Cu ball

Solder plating

□ Cu cored balls allow for easy 3D packaging

A certain amount of space issecured by the Cu balls

Space for components is secured.

Cu: melted and spheroidized

Ni: electrolytic plating

Solder: electrolytic plating

Documents

M53 · SAC305 3000cyc.SSAC305 3000cyc.AC305 3000cyc. SAC305 M53 Initial stage Temperature cycle Crack has grown during soldering