° °

♦

♦ ±

♦

♦

♦ Ω Ω

♦

♦

♦

♦

♦

♦

♦

♦

♦

♦

________________________________________________________________ Maxim Integrated Products 1

MAX15041

IN

INPUT12V

BSTOUTPUT

1.8V AT 3A

LX

PGND

FB

COMP

EN

VDD

PGOOD

PGOOD SS

SGND

19-4815; Rev 2; 9/10

PART TEMP RANGEPIN-

PACKAGETOP

MARK

MAX15041ETE+ -40°C to +85°C 16 TQFN-EP* AGV

*

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS(VIN = 12V, CVDD = 1μF, CIN = 22μF, TA = TJ = -40°C to +85°C, typical values are at TA = +25°C, unless otherwise noted.) (Note 3)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functionaloperation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure toabsolute maximum rating conditions for extended periods may affect device reliability.

Note 1: LX has internal clamp diodes to PGND and IN. Applications that forward bias these diodes should take care not to exceedthe IC’s package power dissipation.

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to china.maxim-ic.com/thermal-tutorial.

IN to SGND.............................................................-0.3V to +30VEN to SGND.................................................-0.3V to (VIN + 0.3V)LX to PGND ................................-0.3V to min (+30V, VIN + 0.3V)LX to PGND .....................-1V to min (+30V, VIN + 0.3V) for 50nsPGOOD to SGND .....................................................-0.3V to +6VVDD to SGND............................................................-0.3V to +6VCOMP, FB, SS to SGND..............-0.3V to min (+6V, VDD + 0.3V)BST to LX .................................................................-0.3V to +6VBST to SGND .........................................................-0.3V to +36VSGND to PGND ....................................................-0.3V to +0.3VLX Current (Note 1) ....................................................-5A to +8AConverter Output Short-Circuit Duration ...................Continuous

Continuous Power Dissipation (TA = +70°C)16-Pin TQFN (derate 14.7mW/°C above +70°C)Multilayer Board .........................................................1666mW

Package Thermal Resistance (Note 2)θJA.................................................................................48°C/WθJC ..................................................................................7°C/W

Operating Temperature Range ..........................-40°C to +85°CJunction Temperature .....................................................+150°CStorage Temperature Range ............................-65°C to +150°CLead Temperature (soldering, 10s) .................................+300°CSoldering Temperature (reflow) .......................................+260°C

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

STEP-DOWN CONVERTER

Input-Voltage Range VIN 4.5 28 V

Quiescent Current IIN Not switching 2.1 4 mA

VEN = 0V, VDD regulated by internalLDO

2 12Shutdown Input Supply Current

VEN = 0V, VIN = VDD = 5V 18 28

μA

ENABLE INPUT

EN Shutdown Threshold Voltage VEN_SHDN VEN rising 1.4 V

EN Shutdown Voltage Hysteresis VEN_HYST 100 mV

VEN_LOCK VEN rising 1.7 1.95 2.15 VEN Lockout Threshold Voltage

VEN_LOCK_HYST 100 mV

EN Input Current IEN VEN = 2.9V 2 5.3 9 μA

POWER-GOOD OUTPUT

PGOOD Threshold VPGOOD_TH VFB rising 540 560 584 mV

PGOOD Threshold Hysteresis VPGOOD_HYST 15 mV

PGOOD Output Low Voltage VPGOOD_OL IPGOOD = 5mA, VFB = 0.5V 35 100 mV

PGOOD Leakage Current IPGOOD VPGOOD = 5V, VFB = 0.7V 10 nA

ERROR AMPLIFIER

Error AmplifierTransconductance

gMV 1.6 mS

Error Amplifier Voltage Gain AVEA 90 dB

FB Set-Point Accuracy VFB 600 606 612 mV

VFB = 0.5V -100 +100FB Input Bias Current IFB

VFB = 0.7V -100 +100nA

_______________________________________________________________________________________ 3

Note 3: Specifications are 100% production tested at TA = +25°C. Limits over the operating temperature range are guaranteed bydesign and characterization.

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

SS Current ISS VSS = 0.45V, sourcing 4.5 5 5.5 μA

SS Discharge Resistance RSS ISS = 10mA, sinking, VEN = 1.6V 6 Ω

SS Prebiased Mode Stop Voltage 0.65 V

Current Sense to COMPTransconductance

GMOD 9 S

COMP Clamp Low VFB = 0.7V 0.68 V

PWM Compensation Ramp Valley 830 mV

PWM CLOCK

Switching Frequency fSW 315 350 385 kHz

Maximum Duty Cycle D 90 %

Minimum Controllable On-Time 150 ns

INTERNAL LDO OUTPUT (VDD)

VDD Output Voltage VDD IVDD = 1mA to 25mA, VIN = 6.5V 4.75 5.1 5.5 V

VDD Short-Circuit Current VIN = 6.5V 30 80 mA

LDO Dropout Voltage IVDD = 25mA, VDD drops by -2% 250 600 mV

VDD Undervoltage LockoutThreshold

VUVLO_TH VDD rising 4 4.25 V

VDD Undervoltage LockoutHysteresis

VUVLO_HYST 150 mV

POWER SWITCH

High-side switch, ILX = 1A 170 305LX On-Resistance

Low-side switch, ILX = 1A 105 175mΩ

High-Side Switch SourceCurrent-Limit Threshold

5 6 7.2 A

Low-Side Switch SinkCurrent-Limit Threshold

-3 A

VBST = 33V, VIN = VLX = 28V 10LX Leakage Current

VBST = 5V, VIN = 28V, VLX = 0V 10nA

BST Leakage Current VBST = 33V, VIN = VLX = 28V 10 nA

THERMAL SHUTDOWN

Thermal-Shutdown Threshold Rising +155 °C

Thermal-Shutdown Hysteresis 20 °C

HICCUP PROTECTION

Blanking Time16 x Soft-Start Time

ELECTRICAL CHARACTERISTICS (continued)(VIN = 12V, CVDD = 1μF, CIN = 22μF, TA = TJ = -40°C to +85°C, typical values are at TA = +25°C, unless otherwise noted.) (Note 3)

4 _______________________________________________________________________________________

EFFICIENCY vs. LOAD CURRENTM

AX15

041

toc0

1

LOAD CURRENT (A)

EFFI

CIEN

CY (%

)

2.52.01.51.00.5

55

60

65

70

75

80

85

90

95

100

500 3.0

VOUT = 5.0V

VOUT = 3.3V

VOUT = 2.5V

VOUT = 1.8V

VOUT = 1.2V

VIN = 12V

EFFICIENCY vs. LOAD CURRENT

MAX

1504

1 to

c02

LOAD CURRENT (A)

EFFI

CIEN

CY (%

)

2.52.01.51.00.5

55

60

65

70

75

80

85

90

95

100

500 3.0

VOUT = 3.3V

VOUT = 2.5V

VOUT = 1.8V

VOUT = 1.2V

VIN = 5V

OUTPUT-VOLTAGE REGULATIONvs. LOAD CURRENT

MAX

1504

1 to

c03

LOAD CURRENT (A)

OUTP

UT-V

OLTA

GE R

EGUL

ATIO

N (%

)

2.52.01.51.00.5

-1.0

-0.8

-0.6

-0.4

-0.2

0

0.2

-1.20 3.0

LOAD-TRANSIENT WAVEFORMSMAX15041 toc04

VOUTAC-COUPLED200mV/div

ILOAD2A/div

VPGOOD5V/div

200μs/div

NORMALIZED OUTPUT VOLTAGEvs. TEMPERATURE

TEMPERATURE (NC)

NORM

ALIZ

ED O

UTPU

T VO

LTAG

E

603510-15

0.996

0.997

0.998

0.999

1.000

1.001

1.002

0.995-40 85

MAX

1504

1 to

c05

ILOAD = 0A

NORMALIZED OUTPUT VOLTAGEvs. TEMPERATURE

MAX

1504

1 to

c06

TEMPERATURE (NC)

NORM

ALIZ

ED O

UTPU

T VO

LTAG

E

603510-15

0.994

0.996

0.998

1.000

1.002

1.004

0.992-40 85

ILOAD = 2A

(VIN = 12V, VOUT = 3.3V, CVDD = 1μF, CIN = 22μF, TA = +25°C, circuit of Figure 3 (see Table 1 for values), unless otherwise specified.)

FB SET POINT vs.TEMPERATURE

MAX

1504

1 to

c07

TEMPERATURE (NC)

FB S

ET P

OINT

(mV)

603510-15

602

604

606

608

610

600-40 85

SWITCHING FREQUENCYvs. INPUT VOLTAGE

MAX

1504

1 to

c08

INPUT VOLTAGE (V)

FREQ

UENC

Y (k

Hz)

325

335

345

355

365

375

385

3152520151050

TA = +85NC

TA = +25NC

TA = -40NC

_______________________________________________________________________________________ 5

INPUT SUPPLY CURRENTvs. INPUT VOLTAGE

MAX

1504

1 to

c09

INPUT VOLTAGE (V)

INPU

T SU

PPLY

CUR

RENT

(mA)

252015105

11

12

13

14

15

16

100

L = 4.7FHILOAD = 0A

SHUTDOWN CURRENTvs. INPUT VOLTAGE

MAX

1504

1 to

c10

INPUT VOLTAGE (V)

SHUT

DOW

N CU

RREN

T (F

A)

1

2

3

4

5

6

7

8

9

10

02520151050

SHUTDOWN CURRENTvs. TEMPERATURE

MAX

1504

1 to

c11

TEMPERATURE (NC)

SHUT

DOW

N CU

RREN

T (F

A)

603510-15

1.5

2.0

2.5

3.0

3.5

4.0

1.0-40 85

SHUTDOWN WAVEFORMSMAX15041 toc12

VOUT2V/div

VEN5V/div

IL2A/div

VPGOOD5V/div

100μs/div

OUTPUT SHORT-CIRCUIT WAVEFORMSMAX15041 toc13

IIN5A/div

VOUT2V/div

IL5A/div

VSS2V/div

10ms/div

SWITCHING WAVEFORMSMAX15041 toc14

IL2A/div

VLX10V/div

VOUTAC-COUPLED50mV/div

1μs/div

(VIN = 12V, VOUT = 3.3V, CVDD = 1μF, CIN = 22μF, TA = +25°C, circuit of Figure 3 (see Table 1 for values), unless otherwise specified.)

SOFT-START WAVEFORMSMAX15041 toc15

IL2A/div

VEN5V/div

VOUT2V/div

VPGOOD5V/div

400μs/div

6 _______________________________________________________________________________________

(VIN = 12V, VOUT = 3.3V, CVDD = 1μF, CIN = 22μF, TA = +25°C, circuit of Figure 3 (see Table 1 for values), unless otherwise specified.)

STARTUP INTO PREBIASED OUTPUTMAX15041 toc17

IL2A/div

VEN5V/div

VOUT2V/div

IOUT2A/div

400μs/div

STARTUP INTO PREBIASED OUTPUTMAX15041 toc18

IL5A/div

VEN5V/div

VOUT2V/div

IOUT5A/div

400μs/div

MAXIMUM LOAD CURRENTvs. AMBIENT TEMPERATURE

MAX

1504

1 to

c19

AMBIENT TEMPERATURE (NC)

MAX

IMUM

LOA

D CU

RREN

T (A

)

75655545352515

2.2

2.4

2.6

2.8

3.0

3.2

2.05 85

VIN = 5VTJ P +150NC

VOUT = 1.8V

VOUT = 2.5V

VOUT = 3.3V

VOUT = 1.2V

SOFT-START TIMEvs. CAPACITANCE

MAX

1504

1 to

c16

CSS (nF)

SOFT

-STA

RT T

IME

(ms)

10010

1

10

100

1000

0.11 1000

_______________________________________________________________________________________ 7

(VIN = 12V, VOUT = 3.3V, CVDD = 1μF, CIN = 22μF, TA = +25°C, circuit of Figure 3 (see Table 1 for values), unless otherwise specified.)

DEVICE POWER DISSIPATIONvs. LOAD CURRENT

MAX

1504

1 to

c22

LOAD CURRENT (A)

POW

ER D

ISSI

PATI

ON (W

)

2.52.01.51.00.5

0.5

1.0

1.5

2.0

2.5

3.0

00 3.0

VOUT = 3.3V

VOUT = 2.5V

VOUT = 1.8V

VOUT = 1.2V

VIN = 12V

DEVICE POWER DISSIPATIONvs. LOAD CURRENT

MAX

1504

1 to

c23

LOAD CURRENT (A)

POW

ER D

ISSI

PATI

ON (W

)

2.52.01.51.00.5

0.5

1.0

1.5

2.0

2.5

3.0

00 3.0

VOUT = 3.3V

VOUT = 2.5V

VOUT = 1.8V

VOUT = 1.2V

VIN = 5V

MAXIMUM LOAD CURRENTvs. AMBIENT TEMPERATURE

MAX

1504

1 to

c20

AMBIENT TEMPERATURE (NC)

MAX

IMUM

LOA

D CU

RREN

T (A

)

75655545352515

2.2

2.4

2.6

2.8

3.0

3.2

2.05 85

VIN = 12VTJ P +150NC

VOUT = 1.2V

VOUT = 1.8V

VOUT = 2.5V

VOUT = 3.3V

MAXIMUM LOAD CURRENTvs. AMBIENT TEMPERATURE

MAX

1504

1 to

c21

AMBIENT TEMPERATURE (NC)M

AXIM

UM L

OAD

CURR

ENT

(A)

75655545352515

2.2

2.4

2.6

2.8

3.0

3.2

2.05 85

VIN = 28VTJ P +150NC

VOUT = 1.8V

VOUT = 2.5V

VOUT = 3.3V

VOUT = 1.2V

8 _______________________________________________________________________________________

15

16

14

13

*EXPOSED PAD, CONNECT TO SGND.

*EP

6

5

7

PGOO

D

COM

P

8

V DD

LX BST

LX

1 2

PGND

4

12 11 9

IN

IN +

I.C.

SGND

SS

FB

MAX15041

ENLX

3

10

PGND

TQFN

TOP VIEW

1 VDD

2 PGOOD

3 EN

4 COMP

5 FB

6 SS

7 SGND

8 I.C.

9 BST

10, 11, 12 LX

13, 14 PGND

15, 16 IN

— EP

μ

μ

_______________________________________________________________________________________ 9

ENABLE CONTROLAND THERMAL

SHUTDOWN

CONTROLLOGIC ANDSINK LIMIT

5V LDO

UVLOCOMPARATOR

CURRENT-SENSE/CURRENT-LIMITAMPLIFIER

4V

VDD

LX

VDD

BIASGENERATOR

0.65V

EN

VOLTAGEREFERENCE

STRONG PREBIASCOMPARATOR

PWMCOMPARATOR

ERRORAMPLIFIER

OSCILLATOR

MAX15041

N

N

PGND

LX

IN

BST

VDD

PGOOD

0.606V

5μA

0.560V RISING,0.545V FALLING POWER-GOOD

COMPARATOR

N

Σ

SS

FB

SS

COMP

SGND

10 ______________________________________________________________________________________

Ω Ω

—

______________________________________________________________________________________ 11

μ

Δ

μ

°

°

Ω ΩΩ

R RVVOUT

FB1 2 1= × −

⎛

⎝⎜⎞

⎠⎟

12 ______________________________________________________________________________________

Δ

VV

R I

IG

R GOUT

COMP

LOAD L

L

MOD

LOAD MOD=×

⎛

⎝⎜⎞

⎠⎟

= ×

V R IOUT LOAD L= ×

I G VL MOD COMP= ×

Rf CESR COUTSW OUT

_ >>× ×

18

Rf CESR COUTSW OUT

_ <<× ×

18

ΔVV

f LVV

ROUTOUT

SW

OUT

INESR COUT=

×× −⎛

⎝⎜⎞

⎠⎟× +1

1_ 88 × ×

⎛

⎝⎜⎞

⎠⎟f CSW OUT

CI

f VVVIN

LOAD

SW IN RIPPLE

OUT

IN=

××

Δ _

I I I I IL PK LOAD L HSCL MIN L SAT_ _ _min( , )= + × <12

Δ

LV

f IVV

OUT

SW L

OUT

IN=

×× −⎛

⎝⎜⎞

⎠⎟Δ1

______________________________________________________________________________________ 13

f f f f fP P Z Z P1 2 1 2 3< < < ≤

fg

Cf

C ESRPMV

A dBC

POUTVEA

1 20 22 10

12

=× ×

=×[ ]π π/ ++( )

=×

=×

=

R

fC R

fC R

f

LOAD

PCC C

ZC C

Z

3 1

2

12

12

1

π π

22π ×C ESROUT

VV

AsC R

sCAg

FB

OUTVEA

C C

CVEA

MV

= ×+( )

⎛⎝⎜

⎞⎠⎟

+

1

11 1

1

⎡

⎣⎢

⎤

⎦⎥ × +( )

× ×+( )

sC R

G RsC ESR

CC C

MOD LOADOUT

ssC ESR ROUT LOAD+( ) +⎡⎣ ⎤⎦1

α =× +( )

+( ) +( ) +⎡⎣ ⎤⎦ ×R sC R

s C C R R s COUT C C

C CC C OUT

1

1 CC CC C OUT

MOD LOADO

C R R

G RsC

|| ||( )( ) +⎡⎣ ⎤⎦

= × ×

1

β UUT

OUT LOAD

ESR

sC ESR R

RR

+( )+( ) +⎡⎣ ⎤⎦

=

1

1

2

1 ++× × ×

RAR

VEA

OUT2α β

L0

QHS

CONTROLLOGIC

VCOMP VOUT

PWMCOMPARATOR

COMP

RCROUTgMV

VIN

POWER MODULATOROUTPUT FILTER

AND LOAD

NOTE: THE GMOD STAGE SHOWN ABOVE MODELS THE AVERAGE CURRENT OFTHE INDUCTOR INJECTED INTO THE OUTPUT LOAD. THIS REPRESENTS ASIMPLIFICATION FOR THE POWER MODULATOR STAGE DRAWN ABOVE.

ERROR AMPLIFIERFEEDBACKDIVIDER

COMPENSATIONRAMP

gMC

DCR

ILQLS

VOUT

VOUT

IL

ESR

COUT

RLOAD

CC

REF *CCC IS OPTIONAL.

ROUT = AVEA/gMV

*CCC

FBR1

R2

GMOD

Σ

14 ______________________________________________________________________________________

ω π

≤

≈

RVV

f C ESR R

g GCOUT

FB

CO OUT LOAD

MV MOD= ×

× × × +( )× ×

2π

RRLOAD

1

12

= × × × ×

×× × ×

VV

g R G R

f C ES

FB

OUTMV C MOD LOAD

CO OUTπ RR RLOAD+( )

1ST ASYMPTOTEVFB x VOUT -1 x 10AVEA[dB]/20 x GMOD x RLOAD

2ND ASYMPTOTEVFB x VOUT -1 x gMV x (CC)-1 x GMOD x RLOAD

3RD ASYMPTOTEVFB x VOUT -1 x gMV x (CC)-1 x GMOD x RLOAD x (COUT(ESR + RLOAD))-1

4TH ASYMPTOTEVFB x VOUT -1 x gMV x RC x GMOD x RLOAD x (COUT(ESR + RLOAD))-1

5TH ASYMPTOTEVFB x VOUT -1 x gMV x RC x GMOD x (ESR || RLOAD)

6TH ASYMPTOTEVFB x VOUT -1 x gMV x (CCC)-1 x GMOD x (ESR || RLOAD)

UNITY

GAIN

RAD/S

3RD POLE(CCCRC)-1

2ND ZERO(COUTESR)-1

1ST ZERO(CCRC)-1

2ND POLE(COUT(ESR + RLOAD))-1

1ST POLEgMV x (10AVEA[dB]/20 CC)-1 CO

______________________________________________________________________________________ 15

μ

°

°

C CV I

I I VSS OUTOUT SS

HSCL MIN OUT FB>> ×

×

− ×( )_

CI t

VSSSS SS

FB=

×

Cf RCCSW C

=× ×

22π

fC R

fP

CC C

SW3

12 2

=×

=π

CC ESR

RCCOUT

C=

×

12

123 2π π×

= = =×C R

f fC ESRCC C

P ZOUT

Cf RCCO C

≥× ×

52π

fC R

fZ

C C

CO1

12 5

=×

≤π

RVV

f Cg GC

OUT

FB

CO OUT

MV MOD= ×

× ×

×

2π

16 ______________________________________________________________________________________

VOUT (V) L (μH) CC (nF) RC (kΩ) R1 and R2

5.0 4.7 8 2.70

3.3 4.7 12 1.80

2.5 3.3 22 1.50

1.8 2.2 33 1.00

1.2 2.2 47 0.68

Select R2 so that:5kΩ ≤ R2 ≤ 50kΩ

Calculate R1 using the equation in theSetting the Output Voltage section.

MAX15041

IN

EN L4.7μH

D

RBST47Ω

INPUT4.5V TO 28V

BST

OUTPUT = 3.3VLX

PGND

FB

COMP

RPU10kΩ

CVDD1μF

CBST10nF

COUT22μF R1

45.3kΩ1%

R210.0kΩ1%

RC1.8kΩ

CC12nF

CCC100pF

CIN47μF

CSS0.01μF

VDD

PGOODPGOOD

SS

I.C. SGND

PROCESS: BiCMOS china.maxim-ic.com/packages

______________________________________________________________________________________ 17

16 TQFN-EP T1633+4 21-0136 90-0031

0 7/09 —

1 3/10 1, 2, 3, 8, 11–14,16, 17

2 9/10 2, 17, 18

18 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600

© 2010 Maxim Integrated Products