1. MIT OpenCourseWare http://ocw.mit.edu 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303) Spring 2008For information about citing these materials or our Terms of Use, visit: http://ocw.mit.edu/terms.

2. Control of ManufacturingProcessesSubject 2.830/6.780/ESD.63Spring 2008 Lecture #2Semiconductor Process Variation February 7, 2008Manufacturing 1 3. Agenda The Semiconductor Fabrication Process Manufacturing process control Types of Variation in Microfabrication Defects vs. parametric variations Temporal variations: wafer to wafer (run to run) Spatial variations: wafer, chip, and feature level Preview of manufacturing control techniques Statistical detection/analysis of variations Characterization/modeling of processes & variation Process optimization & robust design Feedback control of process variationManufacturing 2 4. Semiconductor Fabrication Process, Part 1 R. J. Shutz, in Statistical Case Studies for Industrial Process Improvement, pp. 470-471, SIAM, 1997. Manufacturing Courtesy of the Society for Industrial and Applied Mathematics. Used with permission. 3 5. Semiconductor Fabrication Process, Part 2 R. J. Shutz, in Statistical Case Studies for Industrial Process Improvement, pp. 470-471, SIAM, 1997. Manufacturing Courtesy of the Society for Industrial and Applied Mathematics. Used with permission. 4 6. Semiconductor Fabrication Process, Part 3 R. J. Shutz, in Statistical Case Studies for Industrial Process Improvement, pp. 470-471, SIAM, 1997. Manufacturing Courtesy of the Society for Industrial and Applied Mathematics. Used with permission. 5 7. Semiconductor Fabrication Process, Part 4 R. J. Shutz, in Statistical Case Studies for Industrial Process Improvement, pp. 470-471, SIAM, 1997. Manufacturing Courtesy of the Society for Industrial and Applied Mathematics. Used with permission. 6 8. (Semiconductor) ManufacturingProcess ControlImage removed due to copyright restrictions. Please see Fig.26 in Boning, D. S., et al. A General SemiconductorProcess Modeling Framework. IEEE Transactions onSemiconductor Manufacturing 5 (November 1992): 266-280. Manufacturing 7 9. Agenda The Semiconductor Fabrication Process Manufacturing process control Types of Variation in Microfabrication Defects vs. parametric variations Temporal variations: wafer to wafer (run to run) Spatial variations: wafer, chip, and feature level Preview of manufacturing control techniques Statistical detection/analysis of variations Characterization/modeling of processes & variation Process optimization & robust design Feedback control of process variationManufacturing 8 10. Defect vs. Parametric Variation Manufacturing 9 11. Yield & Variation from Defects Electrical test measure shorts in teststructures for different spacings between patterned lines (at or near the design rule or DRfeature size) measure opens in other teststructuresImages removed due to copyright restrictions. Please see: Hess, Christopher. "Test Structures for Circuit Yield Assessmentand Modeling." IEEE International Symposium on Quality Electronics Design, 2003.Manufacturing Hess, ISQED 2003 Tutorial10 12. Manufacturing 11 13. Manufacturing 12 14. Temporal VariationManufacturing 13 15. Manufacturing 14 16. Manufacturing 15 17. Spatial Variation Wafer scale Chip scale Feature scale Manufacturing 16 18. Manufacturing 17 19. Manufacturing 18 20. Manufacturing 19 21. Manufacturing 20 22. Manufacturing 21 23. Manufacturing 22 24. Manufacturing 23 25. Manufacturing 24 26. Manufacturing 25 27. Manufacturing 26 28. Manufacturing 27 29. Modeling of Processes and Variation Empirical modeling Physical modelingManufacturing 28 30. Manufacturing 29 31. Manufacturing 30 32. Manufacturing 31 33. Manufacturing 32 34. Manufacturing 33 35. Manufacturing 34 36. Manufacturing 35 37. Manufacturing 36 38. Manufacturing 37 39. Manufacturing 38 40. Manufacturing 39 41. Process Optimization &Robust DesignManufacturing 40 42. Manufacturing 41 43. Image removed due to copyright restrictions. Please see Fig. 7 in Lakshminarayanan, S., et al. Design Rule Methodology to Improve the Manufacturability of the Copper CMP Process. Proceedings of the IEEE International Interconnect Technology Conference (2002): 99-101. Manufacturing 42 44. Feedback Control of VariationManufacturing43 45. The General Process Control ProblemDesired Product ProductCONTROLLERCONTROLLER EQUIPMENTMATERIAL Equipment loopMaterial loop Process output loop Control of Equipment:Control of Material Control of Product: Forces, Strains Geometry VelocitiesStresses andTemperatures, ...Temperatures, Properties Pressures, ... Manufacturing44 46. Manufacturing 45 47. Manufacturing 46 48. Manufacturing 47 49. Manufacturing 48 50. Manufacturing 49 51. Manufacturing 50 52. Manufacturing 51 53. Manufacturing 52 54. Manufacturing 53 55. Manufacturing 54 56. Summary The Semiconductor Fabrication Process Manufacturing process control Types of Variation in Microfabrication Defects vs. parametric variations Temporal variations: wafer to wafer (run to run) Spatial variations: wafer, chip, and feature level Preview of manufacturing control techniques Statistical detection/analysis of variations Characterization/modeling of processes & variation Process optimization & robust design Feedback control of process variationManufacturing 55