ALLTEQ INDUSTRIESALLTEQ INDUSTRIES

COCO22 Micro-Cleaning Micro-Cleaning

Advanced COAdvanced CO22 Micro-Clean SystemMicro-Clean System

Before After

Advanced COAdvanced CO22 Cleaning, used and Cleaning, used and proven in numerous high tech proven in numerous high tech

industries, is now available as a industries, is now available as a back-end cleaning solution. back-end cleaning solution.

The Future of IC cleaningThe Future of IC cleaning

Standalone ToolStandalone Tool

Allteq has developed a systemAllteq has developed a systemspecifically to CO2 clean devices specifically to CO2 clean devices

on leadframe strips from on leadframe strips from industry standard magazines.industry standard magazines.

A clean semiconductor A clean semiconductor device, free of particulate device, free of particulate contamination, is more contamination, is more

important today than ever important today than ever before.before.

FAQ:FAQ: What is COWhat is CO22 Micro-Cleaning? Micro-Cleaning? What can be removed? What can be removed? How does it work?How does it work? Where can it be used?Where can it be used? Will it damage my parts?Will it damage my parts? Will it improve my yield?Will it improve my yield?

Lets review!Lets review!

Advanced Carbon Dioxide Micro-Advanced Carbon Dioxide Micro-CleaningCleaning

Advanced Carbon Dioxide (COAdvanced Carbon Dioxide (CO22) Micro Cleaning is a ) Micro Cleaning is a

nondestructive, nonabrasive, residue-free, and environmentally nondestructive, nonabrasive, residue-free, and environmentally friendly –cleaning process which uses no harmful chemicals.friendly –cleaning process which uses no harmful chemicals.

The Advanced COThe Advanced CO22 Micro Cleaning process removes micron and Micro Cleaning process removes micron and submicron sized particulates, hydrocarbon-based contamination submicron sized particulates, hydrocarbon-based contamination and stains.and stains.

The cleaning process is based upon the expansion of gaseous The cleaning process is based upon the expansion of gaseous carbon dioxide through an orifice. This expansion leads to the carbon dioxide through an orifice. This expansion leads to the formation of (size/mass controlled) dry ice cleaning particles formation of (size/mass controlled) dry ice cleaning particles which are injected into a heated propellant gas. Upon contact which are injected into a heated propellant gas. Upon contact with a dirty surface, the dry ice particles removes particles by with a dirty surface, the dry ice particles removes particles by both liquid washing and physical scouring action.both liquid washing and physical scouring action.

Advanced Carbon Dioxide / Dry Ice Cleaning can be used for Advanced Carbon Dioxide / Dry Ice Cleaning can be used for either initial or final cleaning, and for numerous critical and non-either initial or final cleaning, and for numerous critical and non-critical cleaning applications throughout the semiconductor critical cleaning applications throughout the semiconductor assembly manufacturing processassembly manufacturing process

SolventSolventOzone DepletingOzone Depleting

PotentialPotential(ODP)(ODP)

OSHAOSHAPELPEL

(ppm)(ppm)VOCVOC

Carbon DioxideCarbon Dioxide NoneNone 5,0005,000 NoNoIsopropyl AlcoholIsopropyl Alcohol ~0~0 400400 YesYes

AcetoneAcetone ~0~0 10001000 NoNoTrichloroethyleneTrichloroethylene ~0~0 5050 YesYes

1,1,1-Trichloroethane1,1,1-Trichloroethane 0.150.15 350350 YesYesn-Propyl Bromiden-Propyl Bromide ~0~0 100100 YesYes

        CO2 is non-toxic, non-flammable and non-corrosive.Recycled CO2 is exempt from the EPA Global Warming legislation.

CO2 “snow” particles are too small and can’t deliver the shear stress required to dislodge resistive contaminants.

CO2 snow sprays are too dense and cold (- 80 F), which tends to shield/freeze surface contamination (“Igloo Effect”).

CO2 snow sprays discharge at a high pressure (800+ psi) that can damage structures at close proximity (needed for cleaning effectiveness with small particles).

CO2 composite spray technology is better suitedto the contact cleaning task…Why ?

Conventional Snow CleaningConventional Snow Cleaning

• Structure - molecular crystal, angular, octahedron• Solvency – hydrocarbon-like, 22 MPa1/2

• Impact Phenomenon – ablation and phase change (solid->gas, solid->liquid- >gas)• Chemistry – can be modified with plasmas, liquids, solids, vapor-phase additives• Compressibility - incompressible• Density - 1.6 g/cm3

• Hardness – 0.3 Hm (8 Hv)• Particle Size – < 0.5 microns to > 500 microns, range adjustable (coarse/fine)• Impact Stress - up to 60 MPa (8,700 psi)

Solid Carbon DioxideSolid Carbon DioxideSEM

Photomicrograph

1 μm

CO2 COMPOSITE SPRAYCLEANING ENERGY

FINE

MEDIUM

COARSE

IMPACT SHEAR STRESS(MPa)

0.1 1 60

Shaved Ice andPellets

(100 - 500 MPa)

500

100

10

ULTRAFINE1

10

PAR

TIC

LE R

AN

GE

(mic

rons

)

CO2 Composite Sprays(0.01 - 60 MPa)

SnowSprays

(0.01 - 2 MPa)

Control ParametersCO2 Particle Size

CO2 Particle DensityPropellant Pressure

Propellant Temperature

F = m x

Impact !∆t∆v

Adjustable compositions of lean (high freq. impacts) energetic CO2 particles (size control) and heated propellant gas…at low spray pressures (10 -120 psi).

FirstFirst…Particle Size and Density…Particle Size and Density

SecondSecond…Spray Control…Spray ControlGas

Particle SizeChemistry

Spray DensityTemperature

PressureDistance/Angle

Time

(Propulsion/Heating)

Additive(s)(Chemical/Physical)

CO2

ChemicalThermal

Mechanical

Spray Pressure/Temp: 40 psi / 120 C Cleaning Time/Distance: 30 seconds / 1.5 inchesChemistry: CDA, Fine CO2 Particles

CO2 Spray Cleaning Parameters

Spray Pressure/Temp: 40 psi / 120 C Cleaning Time/Distance: 30 seconds / 1.5 inchesChemistry: CDA, Fine CO2 Particles

CO2 Spray Cleaning Parameters

ThirdThird…Process Enhancement Tool…Process Enhancement Tool

Existing Cleaning and Inspection Process

CO2 composite sprays easily adapt to and augment an existing cleaning technologies such as air blown ionization to increase overall cleaning process efficiency and effectiveness ….

Composite sprays are additive without being mechanically destructive (energy control)…

FINE SOLIDS ENTRAINED

IN COLD HIGH

VELOCITY CO2 GAS

SIZE-CONTROLLEDSOLIDS ENTRAINED

IN HEATED, VELOCITY-

CONTROLLEDAIR

HotCDA

LiquidCO2

Convergent-DivergentNozzle

SNOW SPRAYS

COMPOSITE SPRAYS

LiquidCO2

Coaxial or CoandaMixing Nozzle

Additive(s)

COCO22 Composite Spray Technology Composite Spray Technology(Conventional)

LEADFRAME

CO2 Composite Spray

Cleaning Head

Vacuum Head

Ionizing Head

The ProcessThe Process

LEADFRAME

Vacuum Head

Ionizing Head

The ProcessThe ProcessContamination Removal

Mechanical AblationChemical Solubility

CLEAN CONTACT SURFACE

ContaminantsFiltered from

Air

CO2 Composite Spray

Cleaning Head

Surface Impact

Metal Oxides, Particles, Fibers,Thin Films

(2-Phase Flow)

AdjustableParticle Size,Velocity,

and Spray Density

DIRTY CONTACT SURFACE

AIR

CO2

75-300 m/s

COCO22 Cleaning Heads Cleaning Heads

• Capillary condensation for particle size control• Micro-metered mass flow for precise spray density control• Clean hot propellant gas for pressure and temperature control• Coaxial and Coanda composite spray nozzles• Chemical co-solvents easily employed• Hybrid CO2 composite spray treatments - Microabrasives, Laser, Atmospheric Plasma, Ionization, Brush

Coaxial

Coanda

Hybrid

ApplicationsApplications Contamination removal from leadframes, Contamination removal from leadframes,

substrates etc. before die attachsubstrates etc. before die attach Particle and stain removal from the die Particle and stain removal from the die

surfacesurface Cleaning optics, i.e., coated lenses, laser Cleaning optics, i.e., coated lenses, laser

optics, CCD’s, camera modules, LED’s…optics, CCD’s, camera modules, LED’s… Removing particles from microelectronic Removing particles from microelectronic

and hybrid circuits before sealing or and hybrid circuits before sealing or encapsulationencapsulation

Clean Product before or after:Clean Product before or after:

Die Attach Die Attach Wire Bond Wire Bond Under-fill processUnder-fill process Die CoatingDie Coating Inspection Inspection Sealing, Molding or Encapsulation…Sealing, Molding or Encapsulation…

Before

GN2

Composite Spray

CMOS Surface80 x

Magnification

Clean Product before or after:Clean Product before or after:

Remove Harmful Microscopic Remove Harmful Microscopic Particulates from your PackagesParticulates from your Packages

Dust ParticulatesDust Particulates Human Skin ParticlesHuman Skin Particles Microscopic Fibers and Lint’sMicroscopic Fibers and Lint’s Air-born Contamination Air-born Contamination Microscopic Packing MaterialMicroscopic Packing Material Machine Generated ParticlesMachine Generated Particles Microscopic Silicon ParticlesMicroscopic Silicon Particles

Will it Damage my PartsWill it Damage my Parts ? ?

Any process in the Any process in the assembly of semiconductor assembly of semiconductor devices can damage devices can damage product. COproduct. CO22 / Dry Ice / Dry Ice Cleaning is no exception. Cleaning is no exception. But, Advanced COBut, Advanced CO22 Cleaning provides Cleaning provides controlcontrol. . Set up correctly and Set up correctly and monitored as you would monitored as you would any other process, the any other process, the cleaning can only benefit cleaning can only benefit your process. your process.

Will it increase my yields?Will it increase my yields? Chances are yes.Chances are yes. If you are having any issues If you are having any issues

with particulate contamination with particulate contamination causing any yield lose the causing any yield lose the Allteq COAllteq CO22 Micro Cleaning Micro Cleaning system will improve your system will improve your yields.yields.

Obviously if you are running at Obviously if you are running at 99.8 - 99.9% yields with no 99.8 - 99.9% yields with no defects due to contamination defects due to contamination the system will most likely not the system will most likely not help.help.

Yield improvement varies from Yield improvement varies from customer to customer and customer to customer and from product to product. If, from product to product. If, and how, it will help will be and how, it will help will be established by you in your established by you in your manufacturing facility.manufacturing facility.

ALLTEQ COALLTEQ CO22 / Dry Ice Cleaner / Dry Ice Cleaner Single Magazine in/out ElevatorSingle Magazine in/out Elevator Allteq Lead-frame IndexerAllteq Lead-frame Indexer Fully Programmable AutomationFully Programmable Automation Cleaning AreaCleaning Area

• Co2 Cleaning HeadsCo2 Cleaning Heads• Ionizing HeadsIonizing Heads• Vacuum Exhaust System Vacuum Exhaust System • Hepa Filter SystemHepa Filter System

Contact InformationContact Information

Phil DaviesPhil Davies

Allteq Industries, Inc.Allteq Industries, Inc.335 Lindbergh Ave335 Lindbergh AveLivermore, CA 94507 USALivermore, CA 94507 USA

pdavies@allteq.compdavies@allteq.com