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Part 22016
NEWLY DEVELOPEDPRODUCTS of 2016NEWLY DEVELOPEDPRODUCTS of 2016NEWLY DEVELOPEDPRODUCTS of
NASA LOW OUTGASSING
Supreme 3HTND-2CCMToughened one component
epoxy for chip coating applications
EP30-2LBOptically clear, roomtemperature curing epoxy blocksUV light and transmits visible light
Blocks UV light from 200-400 nm
EP41S-5 Solvent resistant adhesive withstandsmethylene chloride, alcohols and fuels
IDEAL for TAMPER PROOFING
EP3HTS-LOOne part, silver filled epoxy passesNASA low outgassing requirements
EXCELLENT ELECTRICAL CONDUCTIVITY
EP3HTS-LOOne part, silver filled epoxy passesNASA low outgassing requirements
UV22DC80Nanosilica filled adhesive features dual curingmechanism using both UV light and heat
CAN BE CURED AT 80°C
CONTACT USCONTACT USCONTACT US+1.201.343.8983
main@masterbond.com
www.masterbond.com
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